CN216210885U

CN216210885U - Hardware temperature control device for computer

Info

Publication number: CN216210885U
Application number: CN202122500130.XU
Authority: CN
Inventors: 刘举; 颜李婵; 秦威
Original assignee: Guangzhou University of Science and Technology
Current assignee: Guangzhou University of Science and Technology
Priority date: 2021-10-18
Filing date: 2021-10-18
Publication date: 2022-04-05
Anticipated expiration: 2031-10-18

Abstract

The utility model discloses a hardware temperature control device for a computer, which comprises a mainboard, wherein the top of the mainboard is provided with a mounting rack, a CPU chip is placed in the mounting rack, the top of the mounting rack is provided with a heat dissipation plate, the bottom of the heat dissipation plate is provided with a first heat conduction layer, the top of the heat dissipation plate is fixedly connected with a heat dissipation net sheet, two ends of the heat dissipation plate are fixedly connected with mounting blocks, the bottoms of the mounting blocks are fixedly connected with clamping blocks, and inner grooves are formed in the clamping blocks. According to the utility model, through the matching arrangement of the structures such as the mounting block, the clamping block, the positioning block, the mounting seat, the slot, the positioning groove, the inserting plate, the fixing block, the pressing block and the adjusting screw rod, the heat dissipation structure can be rapidly mounted conveniently and stably, so that stable heat dissipation work can be carried out, meanwhile, the disassembly work can be conveniently carried out, the use is very flexible, the operation is simple, the damage to the main board equipment is small, the operation is time-saving and labor-saving, and the overall safety is high.

Description

Hardware temperature control device for computer

Technical Field

The utility model relates to the technical field of computer accessories, in particular to a hardware temperature control device for a computer.

Background

Computer hardware refers to the general name of various physical devices composed of electronic, mechanical and photoelectric elements in a computer system, and the physical devices form an organic whole according to the requirements of the system structure to provide a material basis for the operation of computer software, the computer hardware is also numerous, and hardware equipment can generate heat during operation, such as a CPU (central processing unit), a mainboard and the like, and has certain requirements for a hardware temperature control device for the computer in order to carry out heat dissipation protection on the hardware equipment;

the hardware temperature control device for the existing computer is mostly a single radiator installed on a CPU, the radiating mode is single, stable and comprehensive radiating cannot be achieved, meanwhile, the conventional radiator is mostly fixedly installed through screws, the installation mode is very troublesome in operation and easy to slide due to long-term use, installation and disassembly are easy to occur due to the installation mode, and the stability of the structure is reduced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art and provides a hardware temperature control device for a computer.

In order to achieve the purpose, the utility model adopts the following technical scheme: a hardware temperature control device for a computer comprises a mainboard, wherein a mounting frame is arranged at the top of the mainboard, a CPU chip is placed in the mounting frame, a heat dissipation plate is arranged at the top of the mounting frame, a first heat conduction layer is arranged at the bottom of the heat dissipation plate, a heat dissipation net piece is fixedly connected to the top of the heat dissipation plate, mounting blocks are fixedly connected to two ends of the heat dissipation plate, a clamping block is fixedly connected to the bottom of each mounting block, an inner groove is formed in each clamping block, a movable block and a first spring are respectively arranged in each inner groove, a positioning block is fixedly connected to one side of the outer surface of each movable block, mounting seats are respectively arranged at positions, located on two sides of the mounting frame, of the bottom of the mainboard, a slot is formed in the top of each mounting seat, a positioning groove communicated with the slot is formed in one side of the outer surface of each mounting seat, and a heat dissipation frame is arranged at a position, corresponding to the bottom of the mainboard, which corresponds to the mounting frame, the both ends fixedly connected with picture peg of heat dissipation frame, the equal fixedly connected with in bottom both sides of mainboard is the fixed block of L type, be provided with fixed pipe in the heat dissipation frame, and it has the second heat-conducting layer to be located fixed outside of tubes surface packing in the heat dissipation frame, the bottom fixedly connected with liquid reserve tank of heat dissipation frame, be provided with the delivery pump in the liquid reserve tank, the output of delivery pump is provided with the conveyer pipe with fixed pipe one end intercommunication, the fixed pipe other end is provided with the circulating pipe with the liquid reserve tank intercommunication.

As a further description of the above technical solution:

the top of mounting bracket is provided with the notch, the notch is passed to the bottom of heating panel, and the bottom of heating panel passes through the top laminating of first heat-conducting layer with the CPU chip.

As a further description of the above technical solution:

the first heat conduction layer and the second heat conduction layer are both made of heat conduction silicone grease.

As a further description of the above technical solution:

the radiating net sheet is a rhombic mesh structure formed by combining a plurality of aluminum sheets in a staggered manner.

As a further description of the above technical solution:

the slot is internally nested and slidably connected with a movable plate, and a second spring is connected between the bottom of the movable plate and the bottom of the inner wall of the slot.

As a further description of the above technical solution:

the fixture block and the slot are arranged in a nested matching manner, the positioning block and the positioning groove are arranged in a nested matching manner, and an inclined plane is arranged on one side of the bottom of the positioning block.

As a further description of the above technical solution:

the picture peg sets up for the cooperation of pegging graft with the fixed block, the bottom is provided with the compact heap in the fixed block, and is provided with the thread groove on the fixed block, thread groove female connection has adjusting screw, adjusting screw's top is rotated with the bottom of compact heap and is connected.

As a further description of the above technical solution:

the fixed pipe is made of a metal pipe.

The utility model has the following beneficial effects:

the hardware temperature control device for the computer can conduct and radiate heat generated by a CPU chip during working through the matching arrangement of the heat radiating plate, the first heat conducting layer and the heat radiating net sheet structure, thereby realizing the heat radiating effect, can conduct and radiate the heat generated by the CPU chip on a mainboard and other parts on the mainboard through the matching arrangement of the heat radiating frame, the fixing pipe, the second heat conducting layer, the liquid storage tank, the conveying pump and other structures, can realize deep heat radiating work by the whole structure, can effectively play a role in protecting computer equipment, and can ensure that the heat radiating structure can be conveniently and stably and quickly installed through the matching arrangement of the structures such as the installation block, the clamping block, the positioning block, the installation seat, the slot, the positioning groove, the plugboard, the fixing block, the compression block, the adjusting screw rod and the like, thereby being capable of carrying out stable heat radiating work and being convenient to disassemble, the use is very nimble, easy operation, and it is little to mainboard equipment damage, operation labour saving and time saving, overall security is high.

Drawings

FIG. 1 is a schematic diagram of an overall structure of a hardware temperature control device for a computer according to the present invention;

FIG. 2 is a front view of a hardware temperature control device for a computer according to the present invention;

fig. 3 is an enlarged view of a portion a in fig. 2 of a hardware temperature control device for a computer according to the present invention.

Illustration of the drawings:

1. a main board; 2. a mounting frame; 3. a CPU chip; 4. a heat dissipation plate; 5. a first thermally conductive layer; 6. a heat dissipation mesh sheet; 7. mounting blocks; 8. a clamping block; 9. an inner tank; 10. a movable block; 11. a first spring; 12. positioning blocks; 13. a mounting seat; 14. a slot; 15. a movable plate; 16. a second spring; 17. positioning a groove; 18. a heat dissipation frame; 19. inserting plates; 20. a fixed block; 21. a compression block; 22. a thread groove; 23. adjusting the screw rod; 24. a fixed tube; 25. a second thermally conductive layer; 26. a liquid storage tank; 27. a delivery pump; 28. a delivery pipe; 29. a circulation pipe.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-3, one embodiment of the present invention is provided: a hardware temperature control device for a computer comprises a main board 1, wherein the top of the main board 1 is provided with a mounting frame 2, a CPU chip 3 is arranged in the mounting frame 2, the top of the mounting frame 2 is provided with a heat dissipation plate 4, the bottom of the heat dissipation plate 4 is provided with a first heat conduction layer 5, the top of the heat dissipation plate 4 is fixedly connected with a heat dissipation net sheet 6, both ends of the heat dissipation plate 4 are fixedly connected with mounting blocks 7, the bottom of the mounting blocks 7 is fixedly connected with clamping blocks 8, an inner groove 9 is arranged in the clamping blocks 8, a movable block 10 and a first spring 11 are respectively arranged in the inner groove 9, one side of the outer surface of the movable block 10 is fixedly connected with a positioning block 12, mounting seats 13 are respectively arranged at positions of the bottom of the main board 1, which are positioned at both sides of the mounting frame 2, the top of each mounting seat 13 is provided with a slot 14, one side of the outer surface of each mounting seat 13 is provided with a positioning groove 17 communicated with the slot 14, and a heat dissipation frame 18 is arranged at a position, which corresponds to the bottom of the main board 1 and the mounting frame 2, both ends fixedly connected with picture peg 19 of heat dissipation frame 18, the equal fixedly connected with in bottom both sides of mainboard 1 is the fixed block 20 of L type, be provided with fixed pipe 24 in the heat dissipation frame 18, and it has second heat-conducting layer 25 to be located fixed pipe 24 surface packing in the heat dissipation frame 18, the bottom fixedly connected with liquid reserve tank 26 of heat dissipation frame 18, be provided with delivery pump 27 in the liquid reserve tank 26, delivery pump 27's output is provided with the conveyer pipe 28 with fixed pipe 24 one end intercommunication, the fixed pipe 24 other end is provided with the circulating pipe 29 with liquid reserve tank 26 intercommunication.

In the further scheme, the top of mounting bracket 2 is provided with the notch, and the notch is passed to the bottom of heating panel 4, and the bottom of heating panel 4 is laminated through the top of first heat-conducting layer 5 with CPU chip 3, can guarantee through the setting of structure that heat radiation structure can be stable take away the heat that CPU chip 3 during operation produced to play the heat dissipation guard action to the structure.

In a further scheme, the first heat conduction layer 5 and the second heat conduction layer 25 are both made of heat conduction silicone grease which has good heat conduction performance, so that a good heat dissipation effect can be achieved.

In the further scheme, radiator mesh 6 is the rhombus mesh column structure that forms after the crisscross combination of a plurality of aluminum sheets, and the setting of net sheet structure can effectively promote thermal divergent speed, and the fan structure in the cooperation computer can effectively make the air current pass to take away the heat, promote the radiating efficiency.

In the further scheme, nested sliding connection has the fly leaf 15 in the slot 14, is connected with the second spring 16 between the bottom of fly leaf 15 and the slot 14 inner wall bottom, can play the guard action to slot 14 between installation heating panel 4 through the setting of structure, avoids impurity to drop, leads to subsequent installation to have the inconvenience, also conveniently opens the dismantlement back at location structure simultaneously, but pop out voluntarily, and it is nimble convenient to use.

In the further scheme, fixture block 8 and slot 14 set up for nested cooperation, and locating piece 12 sets up for nested cooperation with constant head tank 17, and bottom one side of locating piece 12 is provided with the inclined plane, can guarantee through the setting of structure that whole heating panel 4 can carry out accurate location installation work, also can carry out convenient dismantlement operation simultaneously, use nimble convenience very, operation labour saving and time saving.

In the further scheme, picture peg 19 and fixed block 20 set up for the cooperation of pegging graft, and the bottom is provided with compact heap 21 in the fixed block 20, and is provided with thread groove 22 on the fixed block 20, and thread groove 22 internal thread is connected with adjusting screw 23, and adjusting screw 23's top is rotated with the bottom of compact heap 21 and is connected, can guarantee through the setting of structure that can make the stable laminating of heat dissipation frame 18 fix in mainboard 1 bottom to can carry out stable heat conduction heat dissipation work.

In a further scheme, the fixing tube 24 is made of a metal tube, and the metal tube has good heat exchange performance, so that heat dissipation can be stably performed.

The working principle is as follows: when the hardware temperature control device for the computer is used, the first heat conduction layer 5 at the bottom of the heat dissipation plate 4 is contacted with the top of the CPU chip 3, the two clamping blocks 8 are clamped into the slot 14 and push the movable plate 15 to compress the second spring 16, after the clamping blocks 8 are clamped into the slot 14, the first spring 11 is reset, the movable block 10 is pushed to drive the positioning block 12 to be clamped into the positioning groove 17, so that the installation work of the heat dissipation plate 4 can be completed, when the heat dissipation plate is disassembled, the positioning block 12 is pressed to compress the first spring 11 and leave the positioning groove 17, so that the positioning structure can be opened, the disassembly is convenient, when the CPU chip 3 works, the generated heat is conducted to the heat dissipation plate 4 through the first heat conduction layer 5 and then conducted to the heat dissipation net sheet 6 to be dissipated, the plug board 19 on the heat dissipation frame 18 is inserted into the fixing block 20, the adjusting screw 23 is rotated, the adjusting screw 23 drives the pressing block 21 to press the plug board 19 to the bottom of the mainboard 1, thereby make heat dissipation frame 18 can hug closely mainboard 1 bottom, the heat that the during operation of CPU chip 3 produced is partly conducted on mainboard 1, the heat of mainboard 1 then conducts on heat dissipation frame 18, the heat of heat dissipation frame 18 conducts on fixed tube 24 through second heat-conducting layer 25, delivery pump 27 carries the coolant liquid in the liquid reserve tank 26 and gets into in the fixed tube 24, carry out heat transfer work, the coolant liquid after the heat transfer gets into the liquid reserve tank 26 again, from this can circulate heat transfer heat dissipation work.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the utility model.

Claims

1. The utility model provides a hardware temperature control device for computer, includes mainboard (1), its characterized in that: the heat dissipation structure is characterized in that a mounting frame (2) is arranged at the top of the mainboard (1), a CPU chip (3) is placed in the mounting frame (2), a heat dissipation plate (4) is arranged at the top of the mounting frame (2), a first heat conduction layer (5) is arranged at the bottom of the heat dissipation plate (4), a heat dissipation net piece (6) is fixedly connected to the top of the heat dissipation plate (4), mounting blocks (7) are fixedly connected to two ends of the heat dissipation plate (4), clamping blocks (8) are fixedly connected to the bottoms of the mounting blocks (7), inner grooves (9) are formed in the clamping blocks (8), movable blocks (10) and first springs (11) are respectively arranged in the inner grooves (9), positioning blocks (12) are fixedly connected to one side of the outer surfaces of the movable blocks (10), mounting seats (13) are respectively arranged at positions, located at two sides of the mounting frame (2), and slots (14) are arranged at the top of the mounting seats (13), and one side of the outer surface of the mounting seat (13) is provided with a positioning groove (17) communicated with the slot (14), a heat dissipation frame (18) is arranged at the bottom of the main board (1) corresponding to the mounting frame (2), plug boards (19) are fixedly connected at two ends of the heat dissipation frame (18), L-shaped fixing blocks (20) are fixedly connected at two sides of the bottom of the main board (1), a fixing pipe (24) is arranged in the heat dissipation frame (18), and the outer surface of the fixed tube (24) in the heat dissipation frame (18) is filled with a second heat conduction layer (25), a liquid storage tank (26) is fixedly connected to the bottom of the heat dissipation frame (18), a delivery pump (27) is arranged in the liquid storage tank (26), the output end of the delivery pump (27) is provided with a delivery pipe (28) communicated with one end of the fixed pipe (24), the other end of the fixed pipe (24) is provided with a circulating pipe (29) communicated with the liquid storage tank (26).

2. The hardware temperature control device for computer according to claim 1, wherein: the top of mounting bracket (2) is provided with the notch, the notch is passed to the bottom of heating panel (4), and the top laminating of first heat-conducting layer (5) and CPU chip (3) is passed through to the bottom of heating panel (4).

3. The hardware temperature control device for computer according to claim 1, wherein: the first heat conduction layer (5) and the second heat conduction layer (25) are both made of heat conduction silicone grease.

4. The hardware temperature control device for computer according to claim 1, wherein: the radiating net piece (6) is a rhombic mesh structure formed by combining a plurality of aluminum sheets in a staggered manner.

5. The hardware temperature control device for computer according to claim 1, wherein: a movable plate (15) is connected in the slot (14) in a nested and sliding mode, and a second spring (16) is connected between the bottom of the movable plate (15) and the bottom of the inner wall of the slot (14).

6. The hardware temperature control device for computer according to claim 1, wherein: the clamping block (8) and the slot (14) are arranged in a nested matching mode, the positioning block (12) and the positioning groove (17) are arranged in a nested matching mode, and an inclined plane is arranged on one side of the bottom of the positioning block (12).

7. The hardware temperature control device for computer according to claim 1, wherein: picture peg (19) and fixed block (20) set up for pegging graft cooperation, the bottom is provided with compact heap (21) in fixed block (20), and is provided with thread groove (22) on fixed block (20), thread groove (22) female connection has adjusting screw (23), the top of adjusting screw (23) is rotated with the bottom of compact heap (21) and is connected.

8. The hardware temperature control device for computer according to claim 1, wherein: the fixing tube (24) is made of a metal tube.