CN216209669U

CN216209669U - Baffle device and automatic testing arrangement of oven

Info

Publication number: CN216209669U
Application number: CN202122578344.9U
Authority: CN
Inventors: 白云
Original assignee: Xi'an Yunkewo Electronic Technology Co ltd
Current assignee: Xi'an Yunkewo Electronic Technology Co ltd
Priority date: 2021-10-26
Filing date: 2021-10-26
Publication date: 2022-04-05
Anticipated expiration: 2031-10-26

Abstract

The embodiment of the disclosure provides a baffle device of an oven and an automatic testing device, and relates to the technical field of integrated circuit testing. The baffle plate device of the oven comprises a driving plate, a plurality of driven plates arranged on the driving plate, a driver for driving the driving plate to move towards a first direction, and a guide structure for controlling the driven plates to move towards a second direction; the driving plate is provided with a plurality of first through holes, and the number and the positions of the first through holes correspond to those of the driven plate respectively. The main baffle plate in the baffle plate device of the oven provided by the embodiment of the disclosure can mainly just block gaps outside the movement range of the probe rod, and the driven baffle plate can just block gaps inside the movement range of the probe rod.

Description

Baffle device and automatic testing arrangement of oven

Technical Field

The disclosure relates to the technical field of integrated circuit testing, in particular to a baffle device of an oven and an automatic testing device.

Background

In recent years, electronic components are becoming more and more localized and the production volume is increasing year by year in accordance with the change in international environment. Along with the improvement of productivity, the automation degree of each production link is required to be higher and higher. In the industries of military industry, petroleum and the like, the high-temperature and low-temperature testing and screening processes of electronic elements are weak links for restricting the productivity.

The testing of electronic components is further classified into three-temperature testing, i.e., high-temperature, low-temperature, and normal-temperature. The mature automatic test equipment in the market is usually used for normal temperature test, cannot test in high temperature (above 125 ℃) and low temperature (below minus 60 ℃), and requires that the test tool and the execution mechanism of the test must endure high and low temperatures, such as electronic components, control systems, wires, transmission, execution and motors, in order to complete the test in the high temperature and low temperature environment. At present, three-temperature testing of electronic components basically depends on manual testing for high and low temperature testing, and there are two testing methods: 1. manually installing the circuits on the element adapter, leading the circuits to a testing tool by using a long wire for testing, placing each circuit in a high-temperature and low-temperature environment for a certain time, placing the circuit for a certain time after the target temperature is reached, generally more than 40min, starting the test, and taking out the long wire from a high-temperature box and a low-temperature box to replace the circuit after each test of one circuit. 2. In order to improve the testing efficiency, after the environmental temperature reaches the required temperature, the circuit is placed for more than 40min, the circuit is directly taken out from the high-low or high-temperature environment and immediately placed on an adapter which is required for testing, and the test is out of specification and inaccurate in test data.

In summary, due to the influence of the high and low temperature environments on the stability and reliability of the components, the automatic test equipment cannot be applied to the high and low temperature environments, and currently, no related test equipment can automatically complete the circuit test in the high and low temperature environments.

Although the circuit can be tested in a high-temperature and low-temperature environment, the efficiency is extremely low, the clamping, taking and placing of the circuit occupy more than half of the whole testing time, the mode of manual testing cannot meet the requirement of increasing yield, artificial errors such as misoperation, mistesting and misjudgment often exist, and data are recorded while testing in the testing process. Compared with a normal temperature test, the high and low temperature environment can cause scalding or frostbite and the like to an operator, and the operator must take protective measures.

Aiming at the problems that the conventional automatic test equipment for the hybrid integrated circuit under the high and low temperature environment is unavailable, the manual test efficiency is low and other problems exist, the research on the automatic test equipment for the hybrid integrated circuit under the high and low temperature environment is significant, the problem from inexistence can be solved, the leap of the test efficiency quality is realized, and the research on the automatic test equipment is required to research on an oven for placing electronic elements or integrated circuits and a baffle device of the oven.

SUMMERY OF THE UTILITY MODEL

The purpose of the present disclosure is to overcome the disadvantages of the prior art, and to provide a baffle device of an oven and an automatic testing device, which are simple in structure and low in cost.

According to a first aspect of the embodiments of the present disclosure, a baffle device of an oven is provided, where the baffle device of the oven includes a driving plate, a plurality of driven plates disposed on the driving plate, a driver for driving the driving plate to move in a first direction, and a guide structure for controlling the driven plates to move in a second direction;

the driving plate is provided with a plurality of first through holes, and the number and the positions of the first through holes correspond to those of the driven plate respectively.

In one embodiment, the oven baffle apparatus further comprises a connecting plate;

the driving plate is connected with the driver through the connecting plate.

In one embodiment, the guide structure comprises a guide rail, a plurality of sliding blocks arranged on the guide rail, and a buffer structure arranged between each driven plate;

the number and the positions of the sliders correspond to those of the driven plates, respectively.

In one embodiment, each driven plate is provided with a guide rail through hole, and the guide rail connects the driven plate to the guide rail through hole.

In one embodiment, the buffer structure includes a spring holder, and springs disposed at both ends of the spring holder, and the driven plate is positioned at a predetermined position by the springs.

In one embodiment, the actuator is a pneumatic cylinder.

In one embodiment, the cylinder is provided with a fixing hole, and a connecting piece penetrates through the fixing hole to fix the cylinder on the side wall of the oven.

In one embodiment, each driven plate is provided with a second through hole, and the second through hole is covered with a silica gel plate.

In one embodiment, the first direction is a horizontal direction and the second direction is a vertical direction.

According to a second aspect of embodiments of the present disclosure, there is provided an automatic testing device comprising an oven and a baffle device of the oven;

the oven comprises a shell, a detection device and a discharge table arranged in the shell; the detection device comprises a probe rod and a detector arranged on the probe rod; the shell is provided with a first through hole, one end of the probe rod extends out of the shell through the first through hole, and the detector is arranged in the shell;

the baffle device of the oven is arranged outside the oven and close to the first through hole;

the baffle device of the oven is the above baffle device of the oven.

The implementation of the present disclosure includes the following technical effects:

in the embodiment of the disclosure, because the oven contains a plurality of layers of trays, the probe rod also has a plurality of working positions, and each working position probe rod moves up and down at a small distance to realize the test of the circuit. When the probe rod is located at one working position, the other three working positions are vacant, and because the high-temperature environment in the high-temperature oven is communicated with the external normal-temperature environment, the high-temperature atmosphere in the high-temperature oven is seriously influenced, the vacant working positions are required to be shielded, and gaps generated by the up-and-down movement of the probe in the working positions are also required to be shielded. The main baffle plate in the embodiment of the disclosure can just block gaps outside the movement range of the probe rod, and the driven baffle plate can just block gaps inside the movement range of the probe rod.

Drawings

Fig. 1 is a schematic structural diagram of a baffle device of an oven of the present disclosure.

Fig. 2 is a plan view of a baffle device of the oven of the present disclosure.

The method comprises the following steps of 1-driving plate, 2-driven plate, 3-driver, 4-guiding structure, 5-connecting plate, 6-buffering structure, 21-silica gel plate, 41-guide rail, 42-sliding block, 61-spring clamping seat and 62-spring.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

As shown in fig. 1 and 2, the baffle device of the oven includes a driving plate 1, a plurality of driven plates 2 disposed on the driving plate 1, a driver 3 for driving the driving plate 1 to move in a first direction, and a guide structure 4 for controlling the driven plates 2 to move in a second direction;

the driving plate 1 is provided with a plurality of first through holes, and the number and the positions of the first through holes correspond to those of the driven plates 2 respectively.

Optionally, the first direction is a horizontal direction, and the second direction is a vertical direction.

Preferably, as shown in fig. 1 and 2, the oven baffle device further comprises a connecting plate 5;

the driving plate 1 is connected with the driver 3 through the connecting plate 5;

the guide structure 4 comprises a guide rail 41, a plurality of sliding blocks 42 arranged on the guide rail 41, and a buffer structure 6 arranged between each driven plate 2;

the number and the positions of the sliders 42 correspond to those of the driven plates 2, respectively;

each driven plate 2 is provided with a guide rail through hole, and the guide rail 41 connects the driven plate 2 to the guide rail 41 through the guide rail through hole.

In the embodiment of the disclosure, the driver and the driving plate are connected by the connecting plate, the driven plate is guaranteed to move only in the vertical direction by the guide rail and the sliding block, the buffer effect can be achieved in the process that the driven plate moves up and down by the buffer structure, and meanwhile, the driven plate can be limited.

Preferably, as shown in fig. 1 and 2, the buffer structure 6 includes a spring holder 61, and springs 62 disposed at two ends of the spring holder 61, and the driven plate 2 is positioned at a preset position by the springs 62.

Preferably, a second through hole is formed in the driven plate 2, and a silicon plate 21 covers the second through hole.

In the embodiment of the disclosure, because the silica gel plate is very thin, the probe rod can pull the silica gel plate to enter the oven when testing.

Preferably, the actuator is a pneumatic cylinder.

In the embodiment of the disclosure, the air cylinder is selected as the driver because the air cylinder has a simple structure and is easy to control.

It should be noted that the present invention mainly takes a high temperature environment as an example, and a low temperature environment is similar, only a temperature environment box needs to be changed, and the main structure and the working mode are not changed, so that the baffle device of the oven provided by the embodiment of the present disclosure can also be used for low temperature testing of an integrated circuit.

The embodiment of the disclosure also provides an automatic testing device, which comprises an oven and a baffle device of the oven;

the baffle device of the oven is the above baffle device of the oven.

The following describes a working process of the baffle device of the oven according to the embodiment of the present disclosure, taking an example in which the driver is an air cylinder, the tray is four layers, and the environment of the oven is a high temperature environment.

Manually placing the circuit in a pit position of the feeding tray according to a certain direction to form 4 layers of feeding trays, and aligning the U-shaped slot opening of the feeding tray to the stepped rotating shaft to insert from the side. Rotating rotary platform to initial position, opening under the drive of cylinder main baffle among the oven baffle device, vertical actuating mechanism drives the probe and rises to upper most work position, and horizontal actuating mechanism drives inside the probe stretches into the high temperature oven from the side rectangular hole of high temperature oven, reaches the first test point of blowing tray and stops, and oven baffle device closes simultaneously. The vertical driving mechanism drives the probe to move downwards to contact with the circuit and then stops, the test system collects required test parameters, and the vertical driving mechanism drives the probe to lift up after the test is finished. After the rotary platform is controlled to rotate by a division angle, the vertical driving mechanism drives the probe to move downwards to contact with a second circuit and then stops, the test system collects required test parameters, and after the test is finished, the vertical driving mechanism drives the probe to lift up … … until the last circuit of the first circle on the discharging tray is finished. And the horizontal driving mechanism drives the probe to continuously move towards the inside of the high-temperature oven, the probe reaches the second test point of the discharging tray and stops, the rotating platform is controlled to rotate to the initial position, the vertical driving mechanism drives the probe to downwards move to contact with the circuit to complete the test … … until the test of the second circle of circuit is completed, and the like, so that the test of all circles of circuits on the discharging tray is completed. In the testing process of the same discharging tray circuit, the probe rod moves up and down, the independent driven baffle plates can move up and down along with the probe rod, the independent driven baffle plates of the rest three idle working positions are kept in a balance position under the action of the springs, and the position of the probe rod is blocked by the elastic silica gel plate.

After testing of all circuits in the first tray on the top is completed, the air cylinder drives the main baffle to be opened, the horizontal driving mechanism drives the probes to move out of the side long holes of the high-temperature oven, the vertical driving mechanism drives the probes to descend to the second working position, then the horizontal driving mechanism drives the probes to enter the high-temperature oven, testing … … of all circuits on the second discharging tray is continuously completed, and testing of all circuits in the four discharging trays is completed. And after the circuit test is finished, the probe is moved out, and the rotary platform is reset. And manually taking down the four material trays, analyzing the test parameters of the circuit by a test system in the circuit test process, recording the circuit position with functional problems or the test parameters out of tolerance in a Map, manually removing the circuit with problems from the material trays according to the position in the Map, and entering the next procedure for qualified circuits.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. The baffle plate device of the oven is characterized by comprising a driving plate, a plurality of driven plates arranged on the driving plate, a driver for driving the driving plate to move towards a first direction and a guide structure for controlling the driven plates to move towards a second direction;

2. The oven baffle device of claim 1, further comprising a connecting plate;

the driving plate is connected with the driver through the connecting plate.

3. The oven baffle device of claim 1 or 2 wherein the guide structure comprises a guide rail, a plurality of sliders disposed on the guide rail, and a buffer structure disposed between each of the driven plates;

4. The oven baffle device of claim 3 wherein each driven plate is provided with a guide rail through hole, and the guide rail connects the driven plate to the guide rail through hole.

5. The oven baffle device of claim 3 wherein the buffer structure comprises a spring seat and springs disposed at both ends of the spring seat, and the driven plate is positioned at a predetermined position by the springs.

6. The baffle device of the oven according to claim 1 or 2, characterized in that the drive is a pneumatic cylinder.

7. The oven baffle device of claim 6, wherein the cylinder is provided with a fixing hole, and a connecting piece penetrates through the fixing hole to fix the cylinder on the side wall of the oven.

8. The oven baffle device of claim 1 or 2, wherein each driven plate is provided with a second through hole, and the second through holes are covered with a silicon plate.

9. The oven baffle device of claim 1 or 2, wherein the first direction is a horizontal direction and the second direction is a vertical direction.

10. An automatic testing device is characterized by comprising an oven and a baffle device of the oven;

the oven baffle device is as claimed in any one of claims 1 to 9.