CN113092992A - Multi-channel testing device applied to probe station - Google Patents
Multi-channel testing device applied to probe station Download PDFInfo
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- CN113092992A CN113092992A CN202110468798.2A CN202110468798A CN113092992A CN 113092992 A CN113092992 A CN 113092992A CN 202110468798 A CN202110468798 A CN 202110468798A CN 113092992 A CN113092992 A CN 113092992A
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- probe card
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- wafer chuck
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
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- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention relates to a multi-channel testing device applied to a probe station. The microscope displacement table is arranged on the table surface of the workbench, and a probe card overturning displacement table and a wafer chuck mechanism are arranged in an internal working cavity of the workbench; the microscope displacement table comprises a three-axis displacement assembly, and a microscope mechanism is arranged at the front end of the three-axis displacement assembly; the probe card overturning displacement platform comprises a probe card Y-axis displacement assembly and a plurality of probe card X-axis displacement assemblies, and the plurality of probe card X-axis displacement assemblies are arranged on the probe card Y-axis displacement assembly in a sliding mode through the probe card overturning mechanism; a plurality of probe card mechanisms are arranged on the plurality of probe card X-axis displacement assemblies in a sliding manner, and each probe card mechanism comprises a probe card four-axis fine adjustment sliding table and a probe card; the wafer chuck mechanism is arranged below the probe card mechanism. The multi-channel probe card device can be provided with a plurality of groups of probe card mechanisms, and each probe card mechanism can carry out large-stroke quick movement and small-stroke accurate positioning in a three-dimensional space, so that multi-channel test equipment is formed, and the requirements of puncturing chips with different sizes and heights are met.
Description
Technical Field
The invention relates to the technical field of integrated circuit testing, in particular to a multi-channel testing device applied to a probe station.
Background
With the progress of science and technology, related industries have made high demands on the performance of semiconductor integrated circuits. This has greatly facilitated the development of semiconductor integrated circuits, which are currently being developed with the main goal of achieving a high degree of accuracy as a whole, but with increasing production requirements, the manufacturing techniques and processes are much more complex than before. Therefore, in order to effectively monitor whether the integrated circuit meets the predetermined requirements of reliability and stability and reduce the production cost, some methods are necessary to detect the reliability of the integrated circuit to some extent. Reliability plays a very important role in the practical application process. Often times, reliability is used to assess whether a product can perform a particular function under specified conditions and for a specified time.
So far, the reliability detection of semiconductors is carried out by adopting a passive screening method in China, but the passive screening needs huge capital support and personnel maintenance, and the screening mode is more basic and is completed by long-time testing under different environments, so that the whole efficiency is not very high.
In the prior art, chip reliability tests are mainly performed in a specific environment through probes, but because only one or a few Die are tested at each time, the test requirements cannot be met by the existing test equipment and test means based on long-time and ultra-large-batch tests. And along with customer's demand, also can divide the regional different chips of preparation on same wafer, the probe that needs frequently to be changed during the test influences test time and efficiency of software testing.
The test environment provided by the existing test equipment is single, so that the accuracy of the test result is insufficient. Meanwhile, the stability and the adjusting range of the existing testing equipment are small in the testing process, so that the large-batch testing and structure upgrading are not facilitated.
Disclosure of Invention
The invention solves the technical problem of providing a multi-channel testing device which can be simultaneously provided with a plurality of probe cards, wherein each probe card can horizontally and quickly move, can quickly turn over and replace the probe card, and can accurately and finely adjust four shafts for each probe card, thereby forming the multi-channel testing device applied to a probe station.
The technical scheme adopted by the invention for solving the technical problems is as follows:
the utility model provides a be applied to multichannel testing arrangement of probe station, includes the workstation, its characterized in that:
a microscope displacement table is arranged on the table surface of the workbench, and a probe card overturning displacement table and a wafer chuck mechanism are arranged in an inner working cavity of the microscope displacement table;
the microscope displacement table comprises a three-axis displacement assembly, and a microscope mechanism is arranged at the front end of the three-axis displacement assembly;
the probe card overturning displacement platform comprises a probe card Y-axis displacement assembly and a plurality of probe card X-axis displacement assemblies, and the plurality of probe card X-axis displacement assemblies are arranged on the probe card Y-axis displacement assembly in a sliding mode through a probe card overturning mechanism;
a plurality of probe card mechanisms are arranged on the plurality of probe card X-axis displacement assemblies in a sliding manner, and each probe card mechanism comprises a probe card four-axis fine adjustment sliding table and a probe card;
the wafer chuck mechanism is arranged below the probe card mechanism.
Furthermore, the probe card four-axis fine adjustment sliding table comprises a probe card Z-axis fine adjustment sliding table, a probe card X-axis fine adjustment sliding table, a probe card Y-axis fine adjustment sliding table and a probe card theta-axis fine adjustment sliding table; visit card mechanism and slide through visiting the card slider and set up on visiting the slide rail of card X axle displacement subassembly, visit card Z axle fine setting slip table setting and be in visit the rear end of card slider, visit card X axle fine setting slip table sets up visit the rear end of card Z axle fine setting slip table, visit card Y axle fine setting slip table is in through L shape keysets the lower extreme of visiting card X axle fine setting slip table, visit card theta axle fine setting slip table sets up visit the lower extreme of card Y axle fine setting slip table, visit the card sets up through quick detach mechanism visit the front end of card theta axle fine setting slip table.
Further, still be provided with the cable safety cover on the probe card mechanism.
Furthermore, the theta-axis fine adjustment sliding table of the probe card comprises a theta-axis rotating plate and a theta-axis limiting block, the theta-axis rotating plate is arranged at the lower end of the Y-axis fine adjustment sliding table of the probe card through a theta-axis rotating shaft, and the theta-axis limiting block is used for controlling the rotating angle of the theta-axis fine adjustment sliding table of the probe card.
Furthermore, the probe card turnover mechanism comprises a turnover base and a turnover upper plate, the turnover upper plate is rotatably arranged on the turnover base, and the front end and the rear end of the turnover base are respectively provided with a magnetic buckle for adsorbing the turnover upper plate; the lower end of the overturning base is arranged on a slide rail of the probe card Y-axis displacement assembly in a sliding mode through a slide block of the probe card Y-axis displacement assembly, and the upper end of the overturning upper plate is fixed with the slide rail of the probe card X-axis displacement assembly.
Furthermore, the turnover upper plate is an L-shaped turnover upper plate, and the front end of the turnover upper plate is also provided with a turnover handle.
Furthermore, the wafer chuck mechanism comprises a wafer chuck horizontal displacement table, a wafer chuck four-axis fine adjustment assembly and a temperature control wafer chuck assembly; wafer chuck four-axis fine setting subassembly sets up the upper end of wafer chuck horizontal displacement platform, temperature control wafer chuck subassembly sets up the upper end of wafer chuck four-axis fine setting subassembly.
Further, the temperature controlled wafer chuck assembly integrates a vacuum line and a vacuum chuck.
Further, the working chamber is kept apart through the division board and is formed upper and lower work cabin, the division board upper end is provided with the sealed tray of multiunit removal, remove sealed tray and adopt middle trompil to be provided with baffle structure all around, from the top down the middle trompil and the size of the sealed tray of multiunit removal increase in proper order, the trompil cover in the middle of the sealed tray of removal of superiors is in the wafer chuck mechanism, will wafer chuck mechanism keeps apart from top to bottom, and each removes sealed tray relative slip from top to bottom, and the working chamber is kept apart from top to bottom all the time.
Furthermore, an adjusting panel and a front door plate are arranged in front of the workbench.
The invention has the beneficial effects that:
1. the probe card overturning displacement platform is integrated with a plurality of probe card X-axis displacement assemblies, and each probe card X-axis displacement assembly is provided with a plurality of probe card mechanisms, so that the single test quantity can be greatly increased, and the test efficiency is improved. And each probe card mechanism can be provided with different probe cards according to actual test requirements to test chips in different areas in the wafer, so that the test efficiency is further improved, and the test cost is reduced.
2. The probe card overturning displacement platform can quickly overturn a plurality of probe cards on the probe card X-axis displacement assembly through the probe card overturning mechanism obliquely street each probe card X-axis displacement assembly and the probe card Y-axis displacement assembly, so that the probe cards can be quickly replaced, and the use of testers is facilitated.
3. The probe card mechanism drives the probe card to move and rotate freely in space through the matching of the probe card overturning displacement table with a large stroke and the probe card four-axis fine-adjustment sliding table with a small stroke and high precision, so that the rapid movement with the large stroke and the accurate positioning with the small stroke can be realized, the puncture of chips with different sizes and heights can be met, and the single test quantity and efficiency are greatly improved.
4. The microscope mechanism can move freely in the space through the microscope displacement table, is convenient to fix and can be flexibly adjusted, and the microscope mechanism can meet the use requirements of different testers.
5. The wafer chuck mechanism integrates a wafer chuck horizontal displacement table, a wafer chuck four-axis fine adjustment sliding table assembly and a temperature control wafer chuck assembly, the wafer chuck horizontal displacement table with a large stroke and the wafer chuck four-axis fine adjustment sliding table assembly with a small stroke and high precision are matched, the temperature control wafer chuck assembly can move and rotate freely in space, and the rapid movement of the large stroke and the accurate positioning of the small stroke can be realized.
6. The temperature control wafer chuck component adopts a vacuum pipeline and a vacuum sucker, can quickly load a wafer to be tested, and is simpler to operate and more convenient to use. Meanwhile, the integrated temperature control system can meet the requirements of building different temperature environments and simulating different test environments.
7. The inside work cabin of workstation passes through the cooperation of division board and multiunit removal sealing tray, and effectual power unit and the temperature control wafer chuck subassembly with wafer chuck mechanism keep apart each other, and effectual system of avoiding and external environment are to the influence of test result.
Drawings
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a front view of FIG. 1;
FIG. 3 is a perspective view of the structure of FIG. 1, as indicated at 403;
FIG. 4 is a variation of FIG. 3;
FIG. 5 is a perspective view of FIG. 1, labeled 5;
FIG. 6 is a perspective view of the other view of FIG. 5;
FIG. 7 is a perspective view of FIG. 1, as indicated at 6;
FIG. 8 is a top view of the hidden portion of FIG. 1;
labeled as:
1. a workbench 2, a microscope displacement table 3 and a microscope mechanism; 4. a probe card overturning displacement table 5, a probe card mechanism 6, a wafer chuck mechanism 7 and a movable sealing tray;
101. an adjusting panel 102, a front door panel 103 and a separation plate;
201. a microscope Y-axis displacement assembly 202, a microscope X-axis displacement assembly 203 and a microscope Z-axis displacement assembly;
401. the probe card X-axis displacement assembly comprises a probe card Y-axis displacement assembly 402, a probe card X-axis displacement assembly 4021, a probe card sliding block 403, a probe card turnover mechanism 4031, a turnover base 4032, a magnetic buckle 4033, a turnover upper plate 4034, a turnover handle 4035 and a probe card X-axis connection plate;
501. the system comprises a probe card Z-axis fine adjustment sliding table, a probe card X-axis fine adjustment sliding table, a probe card Y-axis fine adjustment sliding table, a cable protection cover, a probe card theta-axis fine adjustment sliding table, a probe card, a 5061, a theta-axis rotating plate, a 5062, a theta-axis rotating shaft, a 5063, a theta-axis limiting block, a 5064 and a theta-axis driving block, wherein the probe card Z-axis fine adjustment sliding table, the probe card X-axis fine adjustment sliding table, 503, an L-;
601. a wafer chuck horizontal displacement platform, 602, a wafer chuck four-axis fine adjustment sliding platform assembly, 603 and a temperature control wafer chuck assembly.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
A multi-channel testing device applied to a probe station is shown in figures 1 and 2 and comprises a workbench 1, wherein a microscope displacement table 2 is arranged on the table surface of the workbench 1, and a probe card overturning displacement table 4 and a wafer chuck mechanism 6 are arranged in the inner working cavity of the workbench. The microscope displacement table 2 comprises a three-axis displacement assembly, a microscope mechanism 3 is arranged at the front end of the microscope displacement table, and the microscope mechanism 3 is driven to move in space through the three-axis displacement assembly. The probe card overturning displacement table 4 comprises a probe card Y-axis displacement assembly 401 and a plurality of probe card X-axis displacement assemblies 402, the plurality of probe card X-axis displacement assemblies 402 are arranged on the probe card Y-axis displacement assembly 401 in a sliding mode through a probe card overturning mechanism 403, a plurality of probe card mechanisms 5 are arranged on the plurality of probe card X-axis displacement assemblies 402 in a sliding mode, and the plurality of probe card mechanisms 5 comprise probe card four-axis fine adjustment sliding tables and probe cards. The wafer Chuck mechanism 6 is arranged below the probe card mechanism 5, the wafer Chuck mechanism 6 is used for fixing a wafer to be tested, and meanwhile, a high-temperature and low-temperature control Chuck (wafer Chuck) is arranged, the temperature control range can be 30-200 ℃, the temperature control precision can reach +/-0.5 ℃, so that different temperature environments can be set up.
By arranging the plurality of probe card mechanisms 5 on each probe card X-axis displacement assembly 402, compared with a probe, the number of single tests is greatly increased, and the probe card mechanisms 5 arranged on each probe card X-axis displacement assembly 402 can be provided with different probe cards according to requirements, so that chips in different areas in a wafer can be tested to form the multi-channel test device. The movement of the probe card mechanism 5 in the horizontal X-axis direction is performed on the probe card X-axis displacement assembly 402, the movement of the probe card X-axis displacement assembly 402 in the horizontal Y-axis direction is performed on the probe card Y-axis displacement assembly 401 through the probe card turnover mechanism 403, so that the probe card mechanism 5 can rapidly move in the horizontal plane, the turnover mechanism 403 can rapidly turn over the probe card X-axis displacement assembly 402 by 90 degrees, the horizontal probe can be vertically turned over by 90 degrees, and the probe card on the probe card mechanism 5 can be rapidly and conveniently performed.
As shown in fig. 1, the three-axis displacement assembly of microscope displacement stage 2 includes a microscope Y-axis displacement assembly 201, a microscope X-axis displacement assembly 202, and a microscope Z-axis displacement assembly 203. Microscope Y-axis displacement assembly 201, microscope X-axis displacement assembly 202, and microscope Z-axis displacement assembly 203 each include cooperating slide rails, slides, and drive assemblies. Slide rails of the microscope Y-axis displacement assembly 201 are vertically fixed on the left side and the right side of a table board of the workbench 1, slide rails of the microscope X-axis displacement assembly 202 are horizontally fixed on a slide block of the microscope Y-axis displacement assembly 201 through an X-axis bridge, the microscope Z-axis displacement assembly 202 is fixed on the slide block of the microscope X-axis displacement assembly 202 through a pneumatic lifting assembly, and meanwhile, the microscope mechanism 3 is guided through a guide screw rod, clamped and fixed through a microscope clamp, and the microscope clamp is fixedly connected with the microscope Z-axis displacement assembly through an adapter plate, so that the microscope Y-axis displacement assembly 201, the microscope X-axis displacement assembly 202 and the microscope Z-axis displacement assembly 203 are matched to drive the microscope mechanism 3 to perform space three-dimensional motion above the probe mechanism 5. The microscope Y-axis displacement assembly 201 and the microscope X-axis displacement assembly 202 preferably adopt an automatic control mode of pneumatic driving or motor driving, the microscope Z-axis displacement assembly 203 preferably adopts a manual control mode of manual adjustment, and the microscope mechanism 3 is accurately controlled to rapidly move and position in a space range through the matching of the above mechanisms so as to acquire a test image of an internal working cavity.
As shown in fig. 1-4, which is a three-dimensional structure diagram of the probe card displacement table 4, the slide rails of the probe card Y-axis displacement assembly 401 are fixed at the left and right sides of the working chamber, and the probe card turning mechanism 403 engages with the probe card Y-axis displacement assembly 401 and the probe card X-axis displacement assembly 402, and simultaneously drives the probe card X-axis displacement assembly 402 to turn by 90 °. As shown in fig. 3, the probe card turning mechanism 403 includes a turning base 4031 and a turning upper plate 4033, the turning upper plate 4033 is rotatably disposed on the turning base 4031 and is rotatably connected to the turning base 4031 through a rotating shaft, and both front and rear ends of the turning base 4031 are provided with a magnetic button 4032 for adsorbing the turning upper plate 4033; the lower end of the turning base 4031 is slidably arranged on a slide rail of the probe card Y-axis displacement assembly 401 through a slide block of the probe card Y-axis displacement assembly 401, and the upper end of the turning upper plate 4033 is fixed with a slide rail of the probe card X-axis displacement assembly 402 through a probe card X-axis connecting plate 4035. The turnover upper plate 4033 is an L-shaped turnover upper plate, and a turnover handle 4034 is further arranged at the front end of the turnover upper plate 4033, as shown in fig. 4, the turnover upper plate 4034 is turned around the rotation shaft by 90 degrees by turning the turnover handle 4034, the magnetic button 4032 at the front end of the turnover base 4031 adsorbs the turnover upper plate 4033, so that the probe card X-axis displacement assembly 402 is driven to turn over by 90 degrees, and a probe card in the probe card mechanism 5 can be rapidly and better probed by the probe card turnover mechanism 403. The probe card turning mechanism 403 is manually turned by the turning handle 4034, and can be driven to turn by the motor control, so that better automation can be realized. Through the cooperation of probe card Y axle displacement assembly 401 and probe card X axle displacement assembly 402, the horizontal migration and the location of realization probe card mechanism 5 that can be quick, the removal stroke is big, stable, and the upset through probe card tilting mechanism 403 can be quick carry out better to the probe card in probe card mechanism 5, and easy operation is convenient, can satisfy different testers's use.
As shown in fig. 5 and 6, which are three-dimensional structural diagrams of the probe card mechanism 5, the probe card mechanism 5 includes a probe card four-axis fine adjustment sliding table and a probe card 507, and the probe card four-axis fine adjustment sliding table includes a probe card Z-axis fine adjustment sliding table 501, a probe card X-axis fine adjustment sliding table 502, a probe card Y-axis fine adjustment sliding table 504, and a probe card θ -axis fine adjustment sliding table 506. The probe card mechanism 5 is arranged on a sliding rail of the probe card X-axis displacement assembly 402 in a sliding mode through the probe card sliding block 4021, the probe card Z-axis fine adjustment sliding table 501 is fixedly arranged at the rear end of the probe card sliding block 4021 through an adapter plate, the probe card X-axis fine adjustment sliding table 502 is fixedly arranged at the rear end of the probe card Z-axis fine adjustment sliding table 501 through the adapter plate, the probe card Y-axis fine adjustment sliding table 504 is fixedly arranged at the lower end of the probe card X-axis fine adjustment sliding table 502 through an L-shaped adapter plate, the probe card theta-axis fine adjustment sliding table 506 is arranged at the lower end of the probe card Y-axis fine adjustment sliding table 504, and the probe card 507 is arranged at the front end of the probe card theta-. Probe card theta axle fine setting slip table 506 can drive probe card 507 and rotate and carry out angle modulation, probe card Z axle fine setting slip table 501, probe card X axle fine setting slip table 502 and probe card Y axle fine setting slip table 504 cooperate each other and drive probe card 507 and move in X \ Y \ Z axle three-dimensional space, thereby constitute probe card four axle fine setting slip table, fine setting slip table has the advantage of little stroke high accuracy, probe card displacement platform 4 through aforementioned big stroke cooperates, constitute the second grade linkage, thereby reduce the use degree of difficulty, very big improvement tester's efficiency. And the probe card mechanism drives the probe card to move and rotate freely in space through the matching of the probe card overturning displacement table with large stroke and the probe card four-axis fine-adjustment sliding table with small stroke and high precision, so that the rapid movement with large stroke and the accurate positioning with small stroke can be realized, the puncture of chips with different sizes and heights can be met, and the single test quantity and efficiency are greatly improved.
As shown in fig. 5, a cable protection cover 505 is further disposed at the rear end of the probe card mechanism 5, and the cable protection cover 505 can arrange the probe card signal cables well, so as to avoid the influence of circuit disorder on the test result.
As shown in fig. 5 and 6, the probe card θ -axis fine adjustment sliding table 506 includes a θ -axis rotation plate 5061 and a θ -axis stopper 5063, the θ -axis rotation plate 5061 is disposed at a lower end of the probe card Y-axis fine adjustment sliding table 504 through a θ -axis rotation shaft 5062, and the θ -axis stopper controls a rotation angle of the probe card θ -axis fine adjustment sliding table 506 by limiting a movement distance of the θ -axis drive block 5064.
As shown in fig. 7, which is a perspective view of the wafer chuck mechanism 6, the wafer chuck mechanism 6 includes a wafer chuck horizontal displacement stage 601, a wafer chuck four-axis fine adjustment assembly 602, and a temperature-controlled wafer chuck assembly 603. A wafer chuck four-axis fine tuning assembly 602 is disposed at the upper end of the wafer chuck horizontal displacement table 601, and a temperature controlled wafer chuck assembly 603 is disposed at the upper end of the wafer chuck four-axis fine tuning assembly 602. The wafer chuck horizontal displacement table 602 can realize the rapid movement and positioning of the wafer chuck mechanism 6 on the horizontal plane, and the movement is large and can be flexibly adjusted; the wafer chuck four-axis fine adjustment assembly 602 employs an X-axis fine adjustment sliding table, a Y-axis fine adjustment sliding table, a Z-axis fine adjustment sliding table, and a θ -axis fine adjustment sliding table which are mutually matched, so as to drive the temperature control wafer chuck 603 to move and rotate freely in a three-dimensional space. The temperature-controlled wafer chuck assembly 603 integrates a vacuum line and a vacuum chuck, and a wafer to be tested is fixed on the temperature-controlled wafer chuck assembly 603 by vacuum suction.
In the invention, the microscope mechanism 3 is driven by the microscope displacement table 2 and can be moved and positioned quickly. The probe card mechanism 5 can realize the fast moving and the accurate positioning of the probe card through the large stroke of the probe card displacement table 4 and the small stroke high-precision combination of the probe card four-axis fine adjustment sliding table, and meanwhile, can realize the fast and better probe card 507 through the fast overturning of the probe card overturning mechanism 403. The wafer chuck mechanism 6 is also integrated with a large-stroke wafer chuck horizontal displacement table 601 and a small-stroke wafer chuck four-axis fine adjustment assembly 602, so that the wafer to be tested can be rapidly moved and accurately positioned. By arranging the plurality of probe card mechanisms, the number of single tests is achieved, the test precision is high, the test efficiency is greatly improved, and the test cost is reduced.
As shown in fig. 1, in the multichannel testing apparatus for 12-inch wafers, three sets of probe card X-axis displacement assemblies 402 are provided, two probe card mechanisms 5 are provided on the front and rear sets, three probe card mechanisms 5 are provided on the middle set, and 8 probe card mechanisms are provided in total, and the probe card on each probe card mechanism 5 is provided with different probe cards for testing according to the testing requirements. Three probe card mechanisms 5 can be arranged on the front group and the rear group, 12 probe cards can be arranged at the maximum, each probe card can be rapidly moved and positioned in a four-axis fine adjustment mode in a large horizontal stroke, the puncture needles of chips with different sizes and heights can be met, the single test quantity is greatly increased, and the test efficiency is improved.
As shown in fig. 1, an adjusting panel 101 and a front door panel 102 are further disposed in front of the workbench 1, and the front panel 102 can be quickly opened by a front door lock handle and a lock catch.
As shown in fig. 8, the working chamber inside the working platform 1 is separated by the partition plate 103 to form an upper working chamber and a lower working chamber, the temperature controlled wafer chuck assembly 603 of the wafer chuck mechanism 6 is placed in the upper working chamber, the wafer chuck four-axis fine tuning assembly 602 is placed in the lower working chamber, the upper end of the partition plate 103 is provided with a plurality of sets of movable sealing trays 7, the movable sealing trays 7 are provided with baffles around the middle opening, the middle openings and the sizes of the plurality of sets of movable sealing trays 7 from top to bottom are sequentially increased, the middle opening of the uppermost movable sealing tray 7 is sealed with the wafer chuck mechanism 6 to separate the temperature controlled wafer chuck assembly 603 from the wafer chuck four-axis fine tuning assembly 602, the baffles around the movable sealing tray 7 are used for controlling the moving distance of the movable sealing trays to prevent the movable sealing trays from moving excessively, when the wafer chuck horizontal displacement platform 601 and the wafer chuck four-axis fine tuning assembly 602 drive the temperature, the upper movable sealing tray 7 and the lower movable sealing tray 7 slide relatively, and the upper working chamber and the lower working chamber are always isolated from each other, so that the influence of a system and an external environment on a test result can be effectively avoided.
In the invention, the X axis, the Y axis, the Z axis and the theta axis are in opposite directions.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A multi-channel testing device applied to a probe station comprises a workbench (1), and is characterized in that:
a microscope displacement table (2) is arranged on the table surface of the workbench (1), and a probe card overturning displacement table (4) and a wafer chuck mechanism (6) are arranged in the inner working cavity of the microscope displacement table;
the microscope displacement table (2) comprises a three-axis displacement assembly, and the front end of the three-axis displacement assembly is provided with a microscope mechanism (3);
the probe card overturning displacement table (4) comprises a probe card Y-axis displacement assembly (401) and a plurality of probe card X-axis displacement assemblies (402), and the plurality of probe card X-axis displacement assemblies (402) are arranged on the probe card Y-axis displacement assembly (401) in a sliding mode through a probe card overturning mechanism (403);
a plurality of probe card mechanisms (5) are arranged on the plurality of probe card X-axis displacement assemblies (402) in a sliding manner, and each probe card mechanism (5) comprises a probe card four-axis fine adjustment sliding table and a probe card;
the wafer chuck mechanism (6) is arranged below the probe card mechanism (5).
2. A multi-channel test apparatus applied to a probe station as claimed in claim 1, wherein: the probe card four-axis fine adjustment sliding table comprises a probe card Z-axis fine adjustment sliding table (501), a probe card X-axis fine adjustment sliding table (502), a probe card Y-axis fine adjustment sliding table (504) and a probe card theta-axis fine adjustment sliding table (506); visit card mechanism (5) and slide through visiting card slider (4021) and set up on the slide rail of visiting card X axle displacement subassembly (402), visit card Z axle fine setting slip table (501) set up the rear end of visiting card slider (4021), visit card X axle fine setting slip table (502) set up the rear end of visiting card Z axle fine setting slip table (501), visit card Y axle fine setting slip table (504) are in through the setting of L shape keysets the lower extreme of visiting card X axle fine setting slip table (502), visit card theta axle fine setting slip table (506) set up the lower extreme of visiting card Y axle fine setting slip table (504), visit card (507) set up through quick detach mechanism the front end of visiting card theta axle fine setting slip table (506).
3. A multi-channel test apparatus applied to a probe station as claimed in claim 2, wherein: and a cable protective cover (505) is further arranged on the probe card mechanism (5).
4. A multi-channel test apparatus applied to a probe station as claimed in claim 2, wherein: the theta-axis fine adjustment sliding table (506) of the probe card comprises a theta-axis rotating plate and a theta-axis limiting block, the theta-axis rotating plate is arranged at the lower end of the Y-axis fine adjustment sliding table (504) of the probe card through the theta-axis rotating shaft, and the theta-axis limiting block is used for controlling the rotating angle of the theta-axis fine adjustment sliding table (506) of the probe card.
5. A multi-channel test apparatus applied to a probe station as claimed in claim 1, wherein: the probe card turnover mechanism (403) comprises a turnover base (4031) and a turnover upper plate (4033), wherein the turnover upper plate (4033) is rotatably arranged on the turnover base (4031), and the front end and the rear end of the turnover base (4031) are respectively provided with a magnetic button (4032) for adsorbing the turnover upper plate (4033); the lower end of the overturning base (4031) is arranged on a slide rail of the probe card Y-axis displacement assembly in a sliding mode through a slide block of the probe card Y-axis displacement assembly, and the upper end of the overturning upper plate (4033) is fixed with the slide rail of the probe card X-axis displacement assembly (402).
6. A multi-channel test device for use with a probe card station as claimed in claim 5, wherein: the turnover upper plate (4033) is an L-shaped turnover upper plate, and the front end of the turnover upper plate is also provided with a turnover handle (4034).
7. A multi-channel test device for use with a probe card station as claimed in claim 1, wherein: the wafer chuck mechanism (6) comprises a wafer chuck horizontal displacement table (601), a wafer chuck four-axis fine adjustment assembly (602) and a temperature control wafer chuck assembly (603); wafer chuck four-axis fine tuning subassembly (602) sets up the upper end of wafer chuck horizontal displacement platform (601), temperature control wafer chuck subassembly (603) set up the upper end of wafer chuck four-axis fine tuning subassembly (602).
8. A multi-channel test apparatus applied to a probe station as claimed in claim 7, wherein: the temperature controlled wafer chuck assembly (603) integrates a vacuum line and a vacuum chuck.
9. A multi-channel test apparatus for use in a probe station as claimed in any one of claims 1 to 8, wherein: working chamber keeps apart through division board (103) and forms about the work cabin, division board (103) upper end is provided with multiunit removal sealing tray (7), it is provided with baffle structure all around to remove opening in the middle of sealing tray (7) adoption, and from the top down the middle trompil and the size of multiunit removal sealing tray (7) increase in proper order, and the trompil cover is in the middle of the removal sealing tray of superiors on wafer chuck mechanism (6), will wafer chuck mechanism (6) keep apart from top to bottom, and each removes sealing tray (7) relative slip from top to bottom, and working chamber mutual isolation keeps down throughout.
10. A multi-channel test apparatus applied to a probe station as claimed in claim 9, wherein: the front of the workbench (1) is also provided with an adjusting panel (101) and a front door panel (102).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110468798.2A CN113092992A (en) | 2021-04-28 | 2021-04-28 | Multi-channel testing device applied to probe station |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110468798.2A CN113092992A (en) | 2021-04-28 | 2021-04-28 | Multi-channel testing device applied to probe station |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113488403A (en) * | 2021-08-27 | 2021-10-08 | 乐山希尔电子股份有限公司 | Method for automatically testing wafer based on turntable type testing machine |
| CN113702815A (en) * | 2021-10-26 | 2021-11-26 | 常州东村电子有限公司 | Multi-point intelligent detection device and use method |
| IT202100020321A1 (en) * | 2021-07-29 | 2023-01-29 | Spea Spa | AUTOMATIC MACHINE FOR TESTING SEMICONDUCTOR WAFERS |
| CN115656755A (en) * | 2022-10-19 | 2023-01-31 | 上海柯舜科技有限公司 | Vacuum probe station |
-
2021
- 2021-04-28 CN CN202110468798.2A patent/CN113092992A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT202100020321A1 (en) * | 2021-07-29 | 2023-01-29 | Spea Spa | AUTOMATIC MACHINE FOR TESTING SEMICONDUCTOR WAFERS |
| WO2023007415A1 (en) * | 2021-07-29 | 2023-02-02 | Spea S.P.A. | Wafer prober |
| CN113488403A (en) * | 2021-08-27 | 2021-10-08 | 乐山希尔电子股份有限公司 | Method for automatically testing wafer based on turntable type testing machine |
| CN113488403B (en) * | 2021-08-27 | 2022-01-11 | 乐山希尔电子股份有限公司 | Method for automatically testing wafer based on turntable type testing machine |
| CN113702815A (en) * | 2021-10-26 | 2021-11-26 | 常州东村电子有限公司 | Multi-point intelligent detection device and use method |
| CN115656755A (en) * | 2022-10-19 | 2023-01-31 | 上海柯舜科技有限公司 | Vacuum probe station |
| CN115656755B (en) * | 2022-10-19 | 2023-11-28 | 上海柯舜科技有限公司 | Vacuum probe table |
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