CN216192657U

CN216192657U - Vacuum evaporation equipment

Info

Publication number: CN216192657U
Application number: CN202022132157.3U
Authority: CN
Inventors: 李同裕
Original assignee: Yangzhou Jishan Jintian Optoelectronics Technology Co ltd
Current assignee: Yangzhou Jishan Jintian Optoelectronics Technology Co ltd
Priority date: 2020-09-25
Filing date: 2020-09-25
Publication date: 2022-04-05
Anticipated expiration: 2030-09-25

Abstract

The utility model discloses vacuum evaporation equipment, and belongs to the field of vacuum evaporation. It comprises an evaporation chamber; the evaporation device also comprises a plurality of evaporation tables which are arranged at the bottom in the evaporation chamber, the top of each evaporation table is provided with an evaporation source, and evaporation materials of the evaporation sources of different evaporation tables are different; and a plurality of substrates are arranged at the top in the evaporation chamber, and the substrates are arranged above the evaporation table in a surrounding manner. The substrate evaporation device has the advantages that the plurality of substrates are arranged in a surrounding mode and matched with the plurality of evaporation tables, the substrates can be simultaneously evaporated with different materials, and material molecules at the evaporation source evaporation position of the evaporation tables can be received by the substrate towards the surface to be plated of the evaporation tables in a larger area, so that the waste of the materials is reduced, and the substrate evaporation device has the advantages of simple structure, reasonable design and easiness in manufacturing.

Description

Vacuum evaporation equipment

Technical Field

The utility model belongs to the field of vacuum evaporation, and particularly relates to vacuum evaporation equipment.

Background

At present, the evaporation process is widely applied to the coating production process of electronic devices, and the principle is that a source material to be formed into a film is placed in a vacuum environment, the source material is heated to a certain temperature through resistance heating or electron beam heating to be evaporated or sublimated, and the gasified source material is condensed and deposited on the surface of a substrate to be formed into the film so as to complete coating.

Current vacuum evaporation equipment, at the coating by vaporization in-process, there is a large amount of coating by vaporization materials can adhere to on the inner wall of coating by vaporization cavity to cause the waste of material, simultaneously, to the condition of multiple material coating by vaporization simultaneously, it is thinner to appear that the base plate treats the regional coating film of coating by vaporization part easily, leads to product quality to cause the influence.

Through retrieval, the Chinese patent publication number: CN 104451554B; the publication date is as follows: year 2019, month 07, day 02; disclosed are a vacuum evaporation apparatus and a vacuum evaporation method, the vacuum evaporation apparatus including an evaporation chamber and M mutually independent evaporation source devices disposed in the evaporation chamber, M being an integer greater than 1, the evaporation source devices including: a sub-chamber; an evaporation source located within the sub-chamber; a first baffle plate positioned above the evaporation source and capable of blocking the source material of the evaporation source from being discharged; the first crystal oscillator plate is positioned above the first baffle plate; and a second baffle plate located above the first crystal oscillator plate and capable of blocking the source material of the evaporation source from being discharged, wherein the first baffle plate and the second baffle plate are respectively provided with a baffle plate opening corresponding to the evaporation source and used for enabling evaporation materials to pass through. The vacuum evaporation equipment of this application can improve thereby to reducing the waste to the material to the rate of recovery of coating by vaporization material, still can't solve when multiple material is the coating by vaporization simultaneously, the defect that product quality is easily influenced.

In addition, chinese patent publication no: CN 108642453A; the publication date is as follows: 12 days 10 and 2018; disclosed are a vacuum evaporation chamber and a vacuum evaporation apparatus, the vacuum evaporation chamber comprising: the evaporation source is arranged at the bottom in the cavity, the placing mechanism for placing the substrate is arranged at the top of the cavity, the placing mechanism can drive the substrate to rotate, and the rotating axis of the placing mechanism is coaxial with the center of the substrate; the driving end of the rotation driving mechanism is arranged below the placing mechanism and is opposite to the rotation axis of the placing mechanism; the length of the adjusting sheet is less than or equal to half of the diagonal length of the substrate, the adjusting sheet is horizontally arranged below the placing mechanism, one end of the adjusting sheet is connected with the driving end, and the distance between the adjusting sheet and the substrate is within a preset range; wherein, the rotation driving mechanism can drive the adjusting sheet to rotate coaxially with the placing mechanism. Although the device of this application can form even coating film on the base plate, guarantees product quality, can't solve the extravagant problem to the material in the coating by vaporization in-process.

Disclosure of Invention

In order to solve at least one of the above problems, the present invention adopts the following technical solutions.

A vacuum evaporation device comprises a vacuum evaporation device,

an evaporation chamber;

further comprising:

a plurality of evaporation stations are arranged at the bottom in the evaporation chamber, an evaporation source is arranged at the top of each evaporation station, and evaporation materials of the evaporation sources of different evaporation stations are different; and the number of the first and second groups,

the substrate is provided with a plurality of substrates and is arranged at the top in the evaporation chamber, and the substrate is arranged above the evaporation table in a surrounding mode.

Set up many places evaporation plating platform in the evaporation plating cavity, different evaporation plating platforms are responsible for the evaporation plating of different material types, the evaporation plating platform sets up the bottom in the evaporation plating cavity, be close to intermediate position department, furthermore, this scheme has still set up a plurality of base plate, the surrounding type is arranged in evaporation plating bench top, the base plate is arranged in evaporation plating cavity top, through this mode, the evaporation source of evaporation plating platform distributes the material molecule of department can be bigger area and is received by the face of waiting to plate of base plate orientation evaporation plating platform, thereby the waste to the material has been reduced, a plurality of evaporation plating platforms that set up simultaneously can also accomplish the evaporation plating when to different materials.

Furthermore, a hemispherical cover body is arranged outside the evaporation source, a plurality of through holes are formed in the hemispherical cover body, the number of the through holes is the same as that of the substrates, and each through hole is aligned with different substrates to be plated.

Cover outside the evaporation source through the hemisphere cover body, can restrict the evaporation source and outwards disperse the scope of material molecule, the through-hole is seted up to the pertinence simultaneously on the hemisphere cover body, every through-hole all faces just to treat the plating surface to the different base plate, from this, can guarantee via the material molecule that gives out in the through-hole, can move towards the base plate direction to reduce the probability that the material molecule adheres to on the coating by vaporization cavity wall, can regularly collect the recovery to the material of hemisphere cover body internal surface, thereby material saving cost.

Furthermore, an angle limiting cover is sleeved outside each through hole of the hemispherical cover body, and the evaporation source is limited by the opening area of the angle limiting cover through the evaporation area of the through hole on the corresponding substrate.

The angle restriction cover is both ends open-ended cover body, one end is fixed around the through-hole, the other end opening is towards the base plate of through-hole orientation, the material molecule of department of dispersing via the through-hole is along sharp upward movement, under the restriction of angle restriction cover, only the material molecule in the certain limit can pass the opening of angle restriction cover upper end and continue to move until adhering to, therefore, through the opening area who sets up the angle restriction cover, the scope of the material molecule that can effectual control divergence, thereby further ensure that the material molecule can be accurate effectual adhering to on the base plate that corresponds treats the plating surface, through the cooperation of different evaporation bench angle restriction covers, can make the effective accurate corresponding base plate of different material homoenergetic evaporate and plate, and then improve the evaporation quality of product.

Furthermore, the top of the evaporation chamber is provided with a vent hole, the vacuum pump forms a vacuum environment in the evaporation chamber through the vent hole, and the vent holes are provided with a plurality of vent holes which are aligned with different substrates.

In the vacuum evaporation process, the vacuum pump is required to continuously exhaust the evaporation chamber to maintain the vacuum state of the vacuum evaporation process, and when the vacuum pump exhausts, the corresponding vent holes can change in pressure, so that certain disturbance is generated on the air pressure and the concentration of material molecules nearby, therefore, the scheme corresponds to each substrate, the vent holes are arranged on the back of the substrate, the working condition of each substrate in the vacuum evaporation process is the same, and the consistency of the product quality is ensured.

Further, the plurality of substrates are arranged into one substrate which is horizontally arranged and the rest substrates which obliquely surround the substrate.

This scheme base plate arrangement mode can be convenient for correspond the seting up of through-hole orientation position on the hemisphere cover body, and every base plate all is tangent in corresponding through-hole place sphere, and from this, a plurality of base plates arrange the back, are similar hemisphere shape cover in evaporation source top, further ensure the receipt to the coating by vaporization material molecule, improve the utilization ratio of material molecule, reduction in production cost.

Advantageous effects

Compared with the prior art, the utility model has the beneficial effects that:

(1) according to the vacuum evaporation equipment, the plurality of substrates are arranged in a surrounding manner and matched with the plurality of evaporation tables, so that the substrates can be simultaneously evaporated with different materials, and material molecules at the evaporation source emission position of the evaporation tables can be received by the substrates towards the surface to be plated of the evaporation tables in a larger area, so that the waste of the materials is reduced;

(2) according to the vacuum evaporation equipment, the movement range of material molecules in the evaporation process can be limited through the hemispherical cover body and the through holes formed in the hemispherical cover body in a targeted manner, the probability that the material molecules are attached to the wall surface of an evaporation chamber is reduced, and the material on the inner surface of the hemispherical cover body can be collected and recovered regularly, so that the material cost is saved;

(3) according to the vacuum evaporation equipment, the range of the emitted material molecules can be effectively controlled by setting the opening area of the angle limiting cover, so that the material molecules can be further accurately and effectively attached to the corresponding substrate surface to be coated, different materials can be effectively and accurately evaporated on the corresponding substrate through the matching of the angle limiting covers on different evaporation tables, and the evaporation quality of a product is improved;

(4) according to the vacuum evaporation equipment, the back face of each substrate is provided with the vent hole corresponding to each substrate, so that the working conditions of each substrate in the vacuum evaporation process are the same, and the consistency of the product quality is ensured;

(5) according to the vacuum evaporation equipment, the plurality of substrates are covered above the evaporation source in a similar hemispherical shape, so that the molecules of evaporation materials are further received, the utilization rate of the molecules of the materials is improved, and the production cost is reduced;

(6) the utility model has simple structure, reasonable design and easy manufacture.

Drawings

FIG. 1 is a schematic structural diagram of a vacuum evaporation apparatus according to the present invention;

FIG. 2 is a schematic view of a partial structure of a vacuum evaporation apparatus according to the present invention;

FIG. 3 is a cross-sectional view of the angle limiting housing of the present invention;

in the figure:

1. an evaporation chamber; 10. a vent hole;

2. an evaporation station; 20. an evaporation source; 200. a hemispherical cover body; 201. a through hole;

3. an angle limiting cover;

4. a substrate.

Detailed Description

The utility model is further described with reference to specific embodiments and the accompanying drawings.

Example 1

The vacuum evaporation equipment of the embodiment comprises a vacuum evaporation device,

an evaporation chamber 1;

further comprising:

a plurality of evaporation tables 2 are arranged at the bottom in the evaporation chamber 1, an evaporation source 20 is arranged at the top of each evaporation table 2, and evaporation materials of the evaporation sources 20 of different evaporation tables 2 are different; and the number of the first and second groups,

the substrate 4, it has a plurality of, locates the interior top of coating by vaporization cavity 1, and the substrate 4 is located the coating by vaporization platform 2 top of surrounding type.

In the vacuum evaporation process, the material molecule of evaporation source 20 department can use evaporation source 20 as the center, constantly gives off to all around, and at the in-process of giving off, the material molecule generally is linear motion, and current vacuum evaporation equipment is equipped with a base plate 4 in evaporation coating chamber 1 usually and carries out the coating by vaporization, and this just makes a large amount of material molecules can be attached to on 1 inner wall of evaporation coating chamber to cause the waste of coating by vaporization material, to this, the improvement is made to this embodiment:

as shown in fig. 1, this embodiment has set up many places evaporation plating platform 2 in evaporation plating chamber 1, different evaporation plating platform 2 are responsible for the evaporation plating of different material types, evaporation plating platform 2 sets up the bottom in evaporation plating chamber 1, be close to intermediate position department, furthermore, this embodiment has still set up a plurality of base plate 4, the surrounding type is arranged in evaporation plating platform 2 top, base plate 4 arranges in evaporation plating chamber 1 top, and through this mode, the material molecule that evaporation source 20 of evaporation plating platform 2 distributes the department can be received by base plate 4 towards the face of waiting to plate of evaporation plating platform 2 by a large scale, thereby the waste to the material has been reduced, a plurality of evaporation plating platform 2 that set up simultaneously can also accomplish the evaporation plating when to different materials.

Example 2

The vacuum evaporation equipment of the embodiment is further improved on the basis of embodiment 1, a hemispherical cover body 200 is arranged outside the evaporation source 20, a plurality of through holes 201 are formed in the hemispherical cover body 200, the number of the through holes 201 is the same as that of the substrates 4, and each through hole 201 is aligned to different surfaces to be plated of the substrates 4.

As shown in fig. 2 and fig. 3, the hemispherical cover body 200 covers the evaporation source 20, so that the range of the evaporation source 20 for emitting material molecules can be limited, meanwhile, through holes 201 are formed in the hemispherical cover body 200 in a targeted manner, each through hole 201 faces a surface to be coated of a different substrate 4, and therefore, the material molecules emitted through the through holes 201 can move towards the substrate 4, the probability of the material molecules adhering to the wall surface of the evaporation chamber 1 is reduced, and the material on the inner surface of the hemispherical cover body 200 can be collected and recovered periodically, so that the material cost is saved.

Example 3

The vacuum evaporation apparatus of the present embodiment is further improved on the basis of embodiment 2, an angle limiting cover 3 is sleeved outside each through hole 201 of the hemispherical cover body, and the evaporation area of the evaporation source 20 on the corresponding substrate 4 through the through hole 201 is limited by the opening area of the angle limiting cover 3.

As shown in fig. 2 and fig. 3, the angle limiting cover 3 is a cover body with two open ends, one end is fixed around the through hole 201, the other end is open towards the substrate 4 toward the through hole 201, the material molecules scattered by the through hole 201 move upwards along a straight line, only the material molecules in a certain range can pass through the opening at the upper end of the angle limiting cover 3 and continue to move until being attached under the limitation of the angle limiting cover 3, therefore, the range of the scattered material molecules can be effectively controlled by setting the opening area of the angle limiting cover 3, thereby further ensuring that the material molecules can be accurately and effectively attached to the corresponding substrate 4 to-be-plated surface, and through the matching of the angle limiting covers 3 on different evaporation tables 2, different materials can be effectively and accurately evaporated on the corresponding substrate 4, thereby improving the evaporation quality of the product.

Example 4

The vacuum evaporation equipment of this embodiment is further improved on the basis of embodiment 3, and air vent 10 has been seted up at evaporation coating chamber 1 top, and the vacuum pump passes through air vent 10, forms the vacuum environment in evaporation coating chamber 1, and air vent 10 has a plurality of, aligns different base plates 4.

In the vacuum evaporation process, the vacuum pump is required to continuously exhaust the evaporation chamber 1 so as to maintain the vacuum state of the vacuum evaporation process, and when the vacuum pump exhausts, the corresponding vent holes 10 can generate pressure changes, so that certain disturbance is generated on the air pressure and the concentration of material molecules nearby, therefore, the vent holes 10 are arranged on the back of each corresponding substrate 4 in the embodiment, so that the working condition of each substrate 4 in the vacuum evaporation process is the same, and the consistency of the product quality is ensured.

Example 5

The vacuum evaporation apparatus of the present embodiment is further improved from embodiment 4, in which a plurality of substrates 4 are arranged as a substrate 4 horizontally disposed and the other substrates 4 obliquely surrounding the substrate 4.

Because the evaporation source 20 is covered with the hemispherical cover body 200, the arrangement of the substrates 4 in this embodiment can facilitate the opening of the orientation position of the corresponding through hole 201 on the hemispherical cover body 200, and each substrate 4 in this embodiment is tangent to the spherical surface where the corresponding through hole 201 is located, so that the substrates 4 are arranged and covered above the evaporation source 20 in a shape similar to a hemisphere, thereby further ensuring the reception of evaporation material molecules, improving the utilization rate of the material molecules and reducing the production cost.

The examples described herein are merely illustrative of the preferred embodiments of the present invention and do not limit the spirit and scope of the present invention, and various modifications and improvements made to the technical solutions of the present invention by those skilled in the art without departing from the design concept of the present invention shall fall within the protection scope of the present invention.

Claims

1. A vacuum evaporation device comprises a vacuum evaporation device,

an evaporation chamber;

it is characterized by also comprising:

the plurality of substrates are arranged at the top in the evaporation chamber and are arranged above the evaporation table in a surrounding manner;

a hemispherical cover body is arranged outside the evaporation source, a plurality of through holes are formed in the hemispherical cover body, the number of the through holes is the same as that of the substrates, and each through hole is aligned with different surfaces to be plated of the substrates;

an angle limiting cover is sleeved outside each through hole of the hemispherical cover body, and the evaporation area of the evaporation source on the corresponding substrate through the through holes is limited by the opening area of the angle limiting cover;

the top of the evaporation chamber is provided with vent holes, a vacuum pump forms a vacuum environment in the evaporation chamber through the vent holes, and a plurality of vent holes are aligned to different substrates;

the plurality of substrates are arranged into one substrate which is horizontally arranged and the rest substrates which obliquely surround the substrate.