CN216162903U - Static eliminating device for semiconductor production - Google Patents

Static eliminating device for semiconductor production Download PDF

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Publication number
CN216162903U
CN216162903U CN202122070930.2U CN202122070930U CN216162903U CN 216162903 U CN216162903 U CN 216162903U CN 202122070930 U CN202122070930 U CN 202122070930U CN 216162903 U CN216162903 U CN 216162903U
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frame
plate
semiconductor production
fixedly provided
holes
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CN202122070930.2U
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Chinese (zh)
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杨洁
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Shanghai Hongke Semiconductor Technology Co ltd
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Individual
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Abstract

The utility model belongs to the technical field of semiconductor production, and particularly relates to an electrostatic elimination device for semiconductor production, which aims at solving the problems that the existing electrostatic elimination equipment for semiconductor production is complex in operation steps, poor in electrostatic elimination effect and easy to generate dust residue. The utility model drives the two blowing fan blades to do circular motion and autorotation simultaneously to blow and clean the dust with static electricity on the semiconductor, and simultaneously drives the air outlet fan blades to rotate to collect and process the dust, and can control the conductive plate to be in contact with the semiconductor to release the static electricity, thereby improving the static electricity elimination efficiency.

Description

Static eliminating device for semiconductor production
Technical Field
The utility model relates to the technical field of semiconductor production, in particular to a static electricity eliminating device for semiconductor production.
Background
The semiconductor is a material that can produce the chip, semiconductor chip extensively applies to present chip production trade, in order to prevent that the chip from being damaged by static, the workshop of producing the chip now can carry out dustproof processing, but difficult avoid having the dust and get into the workshop, because the appearance of chip is less, the dust of static electrification adsorbs on the chip easily, and the surface of chip has a lot of wiring, the dust of static electrification punctures the chip easily at the more static of chip surface accumulation, cause the chip to destroy at last and scrap.
The prior static eliminating equipment for semiconductor production has complex operation steps, poor static eliminating effect and easy generation of dust residue, so the static eliminating device for semiconductor production is provided for solving the problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects of complex operation steps, poor static elimination effect and easy generation of dust residue of the conventional static elimination equipment for semiconductor production.
In order to achieve the purpose, the utility model adopts the following technical scheme:
an electrostatic elimination device for semiconductor production comprises a bottom frame, wherein a placing screen plate is fixedly installed in the bottom frame, a cylinder is fixedly installed on one side of the top of the bottom frame, a transverse plate is fixedly installed on the output end of the cylinder, two installation plates are fixedly installed at the bottom of the transverse plate, the same current conducting plate is fixedly installed at the bottoms of the two installation plates, a plurality of through holes are formed in the top of the current conducting plate, a conductor wire is fixedly installed on one side of the top of the current conducting plate, two installation holes are formed in the top of the transverse plate, a rotating shaft is rotatably installed in the two installation holes, a rotating frame is fixedly installed at the bottom end of the rotating shaft, vertical holes are formed in two sides of the top of the rotating frame, vertical shafts are rotatably installed in the two vertical holes, a blowing fan blade and a pinion are fixedly installed at the bottom end and the top end of each vertical shaft, an inner toothed ring and a connecting plate are fixedly installed at the bottom of the transverse plate, and a round frame is fixedly installed at the bottom of the connecting plate, two pinions all mesh with interior ring gear mutually, and diaphragm top fixed mounting has a motor, fixedly connected with cross axle on the motor output shaft, and fixed mounting has a second bevel gear on the cross axle, and first bevel gear meshes with the second bevel gear mutually, and the one end fixed mounting of cross axle has first band pulley, fixed mounting has the installation pole on the top inner wall of circle frame, and the bottom fixed mounting of installation pole has the sleeve, and the pivot is installed to the sleeve internal rotation, and the both ends of pivot are fixed mounting respectively has air-out flabellum and second band pulley, and same belt is installed in the transmission on first band pulley and the second band pulley.
Preferably, the bottom of one side of underframe has seted up the air outlet, the outside activity of circle frame has cup jointed a lid section of thick bamboo, and the ventilation hole has been seted up to one side of a lid section of thick bamboo, and fixed mounting has the dust screen in the ventilation hole.
Preferably, a plurality of threaded holes are formed in the outer side of the cover cylinder, bolt rods are connected to the threaded holes in a threaded mode, a plurality of clamping grooves are formed in the outer side of the circular frame, and the bolt rods are movably clamped in the corresponding clamping grooves respectively.
Preferably, a guide plate is fixedly mounted on the other side of the top of the bottom frame, and the transverse plate is sleeved with the outer side of the guide plate in a sliding mode.
Preferably, a plurality of air inlet holes are formed in the top of the rotating frame and are evenly distributed at equal intervals.
Preferably, a positioning plate is fixedly mounted on one side of the top of the transverse plate and rotatably sleeved on the outer side of the transverse shaft.
According to the static eliminating device for semiconductor production, semiconductors are flatly laid on the top of a placing screen plate, a motor and a cylinder are started, an output end of the cylinder drives a transverse plate to move downwards, an output shaft of the motor drives a transverse shaft to rotate, a second bevel gear of the transverse shaft is meshed with a first bevel gear to drive a rotating shaft and a rotating frame to rotate, the rotating frame drives a vertical shaft and a small gear to perform circular motion, and an inner gear ring drives two blowing fan blades to perform circular motion through meshing with the two small gears and simultaneously performs self-rotation to blow and clean dust with static electricity on the semiconductors;
according to the static eliminating device for semiconductor production, the fan blades are driven to rotate through belt transmission of the first belt wheel and the second belt wheel while the cross shaft rotates, so that air and dust in the bottom frame are sucked into the circular frame, the dust filtering net filters and collects the dust, the transverse plate drives the conductive plate to move downwards through the mounting plate to be in contact with a semiconductor, static charges on the semiconductor are led out and released, and the static eliminating effect is achieved;
the utility model has reasonable structural design, drives the two blowing fan blades to do circular motion and autorotation to blow and clean the dust with static electricity on the semiconductor, simultaneously drives the air outlet fan blades to rotate to collect and process the dust, can control the conductive plate to contact with the semiconductor to release the static electricity, improves the static electricity elimination efficiency and has high reliability.
Drawings
FIG. 1 is a schematic perspective view of an electrostatic elimination apparatus for semiconductor manufacturing according to the present invention;
FIG. 2 is a schematic cross-sectional view of an electrostatic elimination apparatus for semiconductor manufacturing according to the present invention;
FIG. 3 is a schematic structural diagram of part A of an electrostatic elimination device for semiconductor manufacturing according to the present invention;
fig. 4 is a top view of an electrostatic elimination device for semiconductor manufacturing according to the present invention.
In the figure: 1. a bottom frame; 2. a transverse plate; 3. a conductive plate; 4. frame turning; 5. a rotating shaft; 6. a first bevel gear; 7. a second bevel gear; 8. a motor; 9. an inner gear ring; 10. an air inlet hole; 11. a first pulley; 12. a second pulley; 13. a horizontal axis; 14. a sleeve; 15. an air outlet fan blade; 16. a round frame; 17. a cover cylinder; 18. a dust filter screen; 19. a conductive wire; 20. placing a screen plate; 21. a pinion gear; 22. a blower blade; 23. a cylinder; 24. a vertical axis.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-4, an electrostatic eliminating device for semiconductor production comprises a bottom frame 1, a placing screen plate 20 is fixedly installed in the bottom frame 1, an air cylinder 23 is fixedly installed on one side of the top of the bottom frame 1, a transverse plate 2 is fixedly installed on the output end of the air cylinder 23, two mounting plates are fixedly installed on the bottom of the transverse plate 2, the same conductive plate 3 is fixedly installed on the bottoms of the two mounting plates, a plurality of through holes are formed in the top of the conductive plate 3, a conductive wire 19 is fixedly installed on one side of the top of the conductive plate 3, two mounting holes are formed in the top of the transverse plate 2, a rotating shaft 5 is rotatably installed in the two mounting holes, a rotating frame 4 is fixedly installed at the bottom end of the rotating shaft 5, vertical holes are formed in both sides of the top of the rotating frame 4, vertical shafts 24 are rotatably installed in the two vertical holes, and blowing fan blades 22 and a pinion 21 are fixedly installed at the bottom end and the top end of the vertical shafts 24 respectively, an inner toothed ring 9 and a connecting plate are fixedly mounted at the bottom of the transverse plate 2, a round frame 16 is fixedly mounted at the bottom of the connecting plate, two small gears 21 are all meshed with the inner toothed ring 9, a motor 8 is fixedly mounted at the top of the transverse plate 2, a transverse shaft 13 is fixedly connected to an output shaft of the motor 8, a second bevel gear 7 is fixedly mounted on the transverse shaft 13, a first bevel gear 6 is meshed with the second bevel gear 7, a first belt pulley 11 is fixedly mounted at one end of the transverse shaft 13, a mounting rod is fixedly mounted on the inner wall of the top of the round frame 16, a sleeve 14 is fixedly mounted at the bottom end of the mounting rod, a rotating shaft is mounted in the sleeve 14 in a rotating manner, an air outlet fan blade 15 and a second belt pulley 12 are fixedly mounted at two ends of the rotating shaft respectively, and the same belt is mounted on the first belt pulley 11 and the second belt pulley 12 in a transmission manner.
In the utility model, an air outlet is arranged at the bottom of one side of the bottom frame 1, a cover cylinder 17 is movably sleeved on the outer side of the round frame 16, a vent hole is arranged at one side of the cover cylinder 17, and a dust filtering net 18 is fixedly arranged in the vent hole for filtering and collecting dust.
In the utility model, a plurality of threaded holes are formed in the outer side of the cover cylinder 17, bolt rods are in threaded connection in the threaded holes, a plurality of clamping grooves are formed in the outer side of the circular frame 16, and the bolt rods are movably clamped in the corresponding clamping grooves respectively, so that the cover cylinder 17 can be conveniently mounted and dismounted.
In the utility model, the other side of the top of the bottom frame 1 is fixedly provided with a guide plate, and the transverse plate 2 is slidably sleeved on the outer side of the guide plate to guide the transverse plate 2.
In the utility model, the top of the rotating frame 4 is provided with a plurality of air inlet holes 10, and the air inlet holes 10 are uniformly distributed at equal intervals, so that the air inlet effect of the rotating frame 4 is ensured.
In the utility model, a positioning plate is fixedly arranged on one side of the top of the transverse plate 2, and the positioning plate is rotatably sleeved on the outer side of the transverse shaft 13 to rotatably position the transverse shaft 13.
In the utility model, when in use, the semiconductor is flatly laid on the top of the placing screen plate 20, the motor 8 and the air cylinder 23 are started, the output end of the air cylinder 23 drives the transverse plate 2 to move downwards, the output shaft of the motor 8 drives the transverse shaft 13 to rotate, the transverse shaft 13 is meshed with the second bevel gear 7 and the first bevel gear 6 to drive the rotating shaft 5 and the rotating frame 4 to rotate, the rotating frame 4 drives the vertical shaft 24 and the pinion 21 to do circular motion, the inner gear ring 9 drives the two blowing fan blades 22 to do circular motion through the meshing with the two pinion 21 and to do self-rotation to blow and clean the dust with static electricity on the semiconductor, and the dust enters the bottom frame 1 through the placing screen plate 20, the transverse shaft 13 drives the air outlet fan blade 15 to rotate through the belt transmission of the first belt wheel 11 and the second belt wheel 12 while rotating, so as to suck the air and the dust in the bottom frame 1 into the circular frame 16, the dust filtering net 18 filters and collects dust, and the transverse plate 2 drives the conductive plate 3 to move downwards through the mounting plate, so that the conductive plate is in contact with the semiconductor, static charges on the semiconductor are led out and released, and the static electricity eliminating effect is achieved.

Claims (6)

1. The utility model provides an electrostatic elimination device for semiconductor production, includes underframe (1), its characterized in that, underframe (1) internal fixation installs places otter board (20), and top one side fixed mounting of underframe (1) has cylinder (23), and fixed mounting has diaphragm (2) on the output of cylinder (23), and the bottom fixed mounting of diaphragm (2) has two mounting panels, and the bottom fixed mounting of two mounting panels has same current conducting plate (3), and the top of current conducting plate (3) has seted up a plurality of through-holes, and top one side fixed mounting of current conducting plate (3) has conductor wire (19), two mounting holes have been seted up at the top of diaphragm (2), and pivot (5) are all installed in two mounting holes rotating, and the bottom fixed mounting of pivot (5) has changeed frame (4), and the top both sides of changeed frame (4) have all seted up vertical hole, and all rotate and install vertical axis (24) in two vertical holes, the bottom end and the top end of a vertical shaft (24) are respectively fixedly provided with a blowing fan blade (22) and a small gear (21), the bottom of a transverse plate (2) is fixedly provided with an inner toothed ring (9) and a connecting plate, the bottom of the connecting plate is fixedly provided with a round frame (16), the two small gears (21) are both meshed with the inner toothed ring (9), the top of the transverse plate (2) is fixedly provided with a motor (8), an output shaft of the motor (8) is fixedly connected with a transverse shaft (13), the transverse shaft (13) is fixedly provided with a second bevel gear (7), a first bevel gear (6) is meshed with the second bevel gear (7), one end of the transverse shaft (13) is fixedly provided with a first belt wheel (11), the inner wall of the top of the round frame (16) is fixedly provided with a mounting rod, the bottom end of the mounting rod is fixedly provided with a sleeve (14), a rotating shaft is rotatably arranged in the sleeve (14), and two ends of the rotating shaft are respectively fixedly provided with an air outlet fan blade (15) and a second belt wheel (12), the first belt wheel (11) and the second belt wheel (12) are provided with the same belt in a transmission way.
2. The static eliminating device for the semiconductor production is characterized in that an air outlet is formed in the bottom of one side of the bottom frame (1), a cover cylinder (17) is movably sleeved on the outer side of the circular frame (16), a vent hole is formed in one side of the cover cylinder (17), and a dust filtering net (18) is fixedly installed in the vent hole.
3. The static eliminating device for the semiconductor production as recited in claim 2, wherein a plurality of threaded holes are formed in the outer side of the cover cylinder (17), a bolt bar is connected to each threaded hole in a threaded manner, a plurality of clamping grooves are formed in the outer side of the circular frame (16), and the bolt bars are movably clamped in the corresponding clamping grooves respectively.
4. The static eliminating device for the semiconductor production as recited in claim 1, wherein a guide plate is fixedly installed on the other side of the top of the bottom frame (1), and the transverse plate (2) is slidably sleeved on the outer side of the guide plate.
5. The static eliminating device for the semiconductor production as recited in claim 1, wherein a plurality of air inlet holes (10) are opened at the top of the rotating frame (4), and the air inlet holes (10) are uniformly arranged at equal intervals.
6. The static electricity eliminating device for the semiconductor production as claimed in claim 1, wherein a positioning plate is fixedly installed on one side of the top of the transverse plate (2), and the positioning plate is rotatably sleeved on the outer side of the transverse shaft (13).
CN202122070930.2U 2021-08-31 2021-08-31 Static eliminating device for semiconductor production Active CN216162903U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122070930.2U CN216162903U (en) 2021-08-31 2021-08-31 Static eliminating device for semiconductor production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122070930.2U CN216162903U (en) 2021-08-31 2021-08-31 Static eliminating device for semiconductor production

Publications (1)

Publication Number Publication Date
CN216162903U true CN216162903U (en) 2022-04-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122070930.2U Active CN216162903U (en) 2021-08-31 2021-08-31 Static eliminating device for semiconductor production

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CN (1) CN216162903U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117174646A (en) * 2023-11-03 2023-12-05 南通莱欧电子科技有限公司 Static eliminating equipment for semiconductor production
CN117746566A (en) * 2024-02-18 2024-03-22 莱芜上业机械设备有限公司 Smoke alarm device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117174646A (en) * 2023-11-03 2023-12-05 南通莱欧电子科技有限公司 Static eliminating equipment for semiconductor production
CN117174646B (en) * 2023-11-03 2024-03-12 南通莱欧电子科技有限公司 Static eliminating equipment for semiconductor production
CN117746566A (en) * 2024-02-18 2024-03-22 莱芜上业机械设备有限公司 Smoke alarm device
CN117746566B (en) * 2024-02-18 2024-05-07 莱芜上业机械设备有限公司 Smoke alarm device

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GR01 Patent grant
GR01 Patent grant
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TR01 Transfer of patent right

Effective date of registration: 20221205

Address after: No. 455, Tianyi Road, Shanghai Qingpu Industrial Park, Qingpu District, Shanghai, 201799

Patentee after: SHANGHAI HONGKE SEMICONDUCTOR TECHNOLOGY Co.,Ltd.

Address before: 610000 No.109, 1st floor, no.230 xiehexia street, Huayang street, Tianfu New District, Chengdu, Sichuan

Patentee before: Yang Jie