CN216161729U

CN216161729U - Easy-to-store wear-resistant copper-based gold bonding wire

Info

Publication number: CN216161729U
Application number: CN202121607669.9U
Authority: CN
Inventors: 周钢; 范传勇; 张知行
Original assignee: Shanghang Zijin Jiabo Electronic New Material Technology Co ltd
Current assignee: Shanghang Zijin Jiabo Electronic New Material Technology Co ltd
Priority date: 2021-07-15
Filing date: 2021-07-15
Publication date: 2022-04-01
Anticipated expiration: 2031-07-15

Abstract

An easy-to-store wear-resistant copper-based gold bonding wire relates to the technical field of gold bonding wires. It includes interior alloy silk, easily melt the buffer layer, isolated protective housing, interior alloy silk sets up the inlayer at the easy buffer layer that melts, and easily melt the outside of buffer layer and isolated protective housing's inboard mutual adhesion, isolated protective housing comprises paraffin layer, tin thin layer, aluminum alloy layer, bonding adhesion layer, the lower floor on paraffin layer melts the upper surface that connects to the tin thin layer, and the lower aspect of tin thin layer is connected with the upper aspect of aluminum alloy layer, the lower aspect of aluminum alloy layer is through bonding adhesion layer and the easy buffer layer that melts each other. The utility model has the beneficial effects that: through increasing its isolated protective housing, when depositing for a long time, tin thin layer can protect the bonding gold wire not receive the erosion of steam, air, and the paraffin layer can guarantee that its bonding gold wire is difficult for receiving the friction wearing and tearing when using, and the paraffin layer is very easily clear, does not influence its use of bonding gold wire.

Description

Easy-to-store wear-resistant copper-based gold bonding wire

Technical Field

The utility model relates to the technical field of gold bonding wires, in particular to an easily stored wear-resistant copper-based gold bonding wire.

Background

The bonding gold wire is also called ball bonding gold wire, small balls are burnt out from the end part of the gold wire by flame, and then the bonding gold wire is ball bonded with a chip electrode, and the ball shape of the gold wire directly influences the bonding quality. Generally, the higher the purity of the gold wire, the better the roundness and uniformity of the formed gold ball. 99.999% Au can form a perfect sphere, but the bonding strength is not good. The strength of the gold wire can be improved by adding trace elements, but different influences are generated on the spherical shape of the gold wire, so that the amount of the added elements is small, the high purity of the gold is ensured as much as possible, and the purity of the gold is required to be more than 99.99%.

Although the prior patent technology (patent number is CN201820850109.8) has high use value and good wear resistance, the gold bonding wire is not easy to damage when the product is packaged, the quality of the gold bonding wire is improved, a good insulation effect is achieved, electric leakage is not easy to cause in the using process, the using requirement can be met, but the corrosion resistance is poor, the gold bonding wire is easy to damage when being stored for a long time, is not easy to store for a long time, and is easy to wear in the using process, and the gold bonding wire is easy to use.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an easily stored wear-resistant copper-based bonding gold wire, aiming at the problems that the prior art is poor in corrosion resistance, easy to damage during long-time storage, difficult to store for a long time and easy to wear during use, so that the bonding gold wire is used.

In order to achieve the purpose, the utility model adopts the following technical scheme: the utility model provides an easily deposit wear-resisting copper base gold bonding wire, it includes interior alloy silk 1, easily melts buffer layer 2, isolated protective housing 3, interior alloy silk 1 sets up at the inlayer of easily melting buffer layer 2, and easily melts the outside of buffer layer 2 and the inboard mutual bonding of isolated protective housing 3, isolated protective housing 3 comprises paraffin layer 31, tin thin layer 32, aluminum alloy layer 33, bonding adhesion layer 34, the lower floor of paraffin layer 31 melts to connect to the upper surface of tin thin layer 32, and tin thin layer 32 lower aspect is connected with the upper aspect of aluminum alloy layer 33, and the lower aspect of aluminum alloy layer 33 is through bonding adhesion layer 34 and easily melts buffer layer 2 and adhere to each other.

Further, the thickness of the paraffin layer 31 is equal to that of the tin film layer 32, and the thickness is 0.02mm-0.04 mm.

Further, the easily-melted buffer layer 2 is a low-carbon structural steel layer.

Further, the paraffin layer 31 and the aluminum alloy layer 33 are horizontally parallel to each other.

The working principle of the utility model is as follows: when depositing the gold bonding wire, tin thin layer 32 can completely cut off its steam, corrosion such as air, and aluminium alloy layer 33 then can guarantee the stability of its gold bonding wire, and paraffin layer 31 then can make its gold bonding wire when using, can not receive external wearing and tearing and damage, and when paraffin layer 31 was got rid of to needs, strike off that also can be quick, when using, easily melt buffering colloid 2 also can be quick dissolve to interior alloy silk 1's use.

After the technical scheme is adopted, the utility model has the beneficial effects that: through increasing its isolated protective housing, when depositing for a long time, tin thin layer can protect the bonding gold wire not receive the erosion of steam, air, and the paraffin layer can guarantee that its bonding gold wire is difficult for receiving the friction wearing and tearing when using, and the paraffin layer is very easily clear, does not influence its use of bonding gold wire.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural view of the present invention.

Fig. 2 is a schematic structural view of the insulating protective casing 3 according to the present invention.

Description of reference numerals: the insulation protective coating comprises an inner alloy wire 1, an easily-melted buffer colloid 2, an insulation protective shell 3, a paraffin layer 31, a tin film layer 32, an aluminum alloy layer 33 and an adhesive layer 34.

Detailed Description

Referring to fig. 1 to 2, the technical solution adopted by the present embodiment is: it includes interior alloy silk 1, easily melts buffer layer 2, isolated protective housing 3, interior alloy silk 1 sets up the inlayer of easily melting buffer layer 2, and easily melts the outside of buffer layer 2 and isolated protective housing 3's inboard mutual bonding, isolated protective housing 3 comprises paraffin layer 31, tin thin layer 32, aluminum alloy layer 33, bonding adhesion layer 34, paraffin layer 31's lower floor melts and connects to the upper surface of tin thin layer 32, and tin thin layer 32 lower aspect is connected with aluminum alloy layer 33's upper aspect, and aluminum alloy layer 33's lower aspect is through bonding adhesion layer 34 and easily melts buffer layer 2 and bonds each other.

Paraffin layer 31 equals with tin thin film layer 32's thickness, and thickness is 0.02mm-0.04mm, easily melt buffer layer 2 for in low carbon structure steel class layer, paraffin layer 31 is parallel to each other with aluminium alloy layer 33 level.

The above description is only for the purpose of illustrating the technical solutions of the present invention and not for the purpose of limiting the same, and other modifications or equivalent substitutions made by those skilled in the art to the technical solutions of the present invention should be covered within the scope of the claims of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. An easy-to-store wear-resistant copper-based gold bonding wire is characterized in that: the protective device comprises an inner alloy wire (1), an easily-melted buffer layer (2) and an isolation protective shell (3), wherein the inner alloy wire (1) is arranged in the inner layer of the easily-melted buffer layer (2), and the outer side of the easily-melted buffer layer (2) is mutually bonded with the inner side of the isolation protective shell (3);

isolated protective housing (3) comprises paraffin layer (31), tin thin layer (32), aluminum alloy layer (33), bonding adhesion layer (34), the lower floor of paraffin layer (31) melts the upper surface that connects to tin thin layer (32), and the upper aspect of aspect and aluminum alloy layer (33) is connected under tin thin layer (32), and the lower aspect of aluminum alloy layer (33) is through bonding adhesion layer (34) and easily melt buffer layer (2) and adhere to each other.

2. The easy-to-store wear-resistant copper-based gold bonding wire of claim 1, wherein: the paraffin layer (31) and the tin film layer (32) are equal in thickness, and the thickness is 0.02mm-0.04 mm.

3. The easy-to-store wear-resistant copper-based gold bonding wire of claim 1, wherein: the easily-melted buffer layer (2) is a low-carbon structural steel layer.

4. The easy-to-store wear-resistant copper-based gold bonding wire of claim 1, wherein: the paraffin layer (31) and the aluminum alloy layer (33) are horizontally parallel to each other.