CN216159457U - External condenser of material bucket - Google Patents

External condenser of material bucket Download PDF

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Publication number
CN216159457U
CN216159457U CN202122124302.8U CN202122124302U CN216159457U CN 216159457 U CN216159457 U CN 216159457U CN 202122124302 U CN202122124302 U CN 202122124302U CN 216159457 U CN216159457 U CN 216159457U
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China
Prior art keywords
condenser
pipe
outlet pipe
bottom plate
diaphragm pump
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CN202122124302.8U
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Chinese (zh)
Inventor
佟磊
张来来
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Shandong Brett Ink Co ltd
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Shandong Brett Ink Co ltd
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Priority to CN202122124302.8U priority Critical patent/CN216159457U/en
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Abstract

The utility model relates to the technical field of material tanks, in particular to an external condenser of a material barrel, which comprises a bottom plate, wherein a condenser is fixedly arranged above the right side of the bottom plate, a first condenser inlet pipe is connected with a left pipeline at the upper end of the condenser, a second condenser inlet pipe is connected with the left side of the first condenser inlet pipe through a flange plate, the other end of the second condenser inlet pipe is connected with the output end of a diaphragm pump through a water pipe, the diaphragm pump is fixedly arranged at the upper end of the bottom plate, a water inlet end of the diaphragm pump is connected with a pipeline at the lower end of the material tank through another water pipe, the material tank is fixedly arranged at the left side of the bottom plate, a first condenser outlet pipe is arranged at the lower end of the left side of the condenser, the first condenser outlet pipe is connected with a flange plate on the right side of the second condenser outlet pipe through a flange plate arranged on the left side, a pipeline on the left side of the second condenser outlet pipe is connected with an L-shaped water pipe, and the upper end of the L-shaped water pipe is provided with a rain spray nozzle.

Description

External condenser of material bucket
Technical Field
The utility model relates to the technical field of material boxes, in particular to an external condenser of a material barrel.
Background
In the production process, the material temperature is higher, and the original cooling system of material case can not satisfy the demand of production, and production efficiency is low, seriously influences product quality.
The material case heat sink effect on the market is not obvious, complex operation, is unfavorable for scientific practicality, consequently this practicality is extracted the external condenser of thing storage bucket.
SUMMERY OF THE UTILITY MODEL
The utility model provides a material barrel externally connected with a condenser.
In order to achieve the purpose, the utility model adopts the following technical scheme:
the external condenser of material bucket, including condenser, bottom plate, cooling water inlet, condenser outlet pipe I, condenser outlet pipe II, L type water pipe, diaphragm pump, material case, semiconductor heat sink, rain spray shower nozzle, condenser import pipe II, condenser import pipe I, heat dissipation fan, cooling water outlet, the fixed mounting has the condenser above the bottom plate right side, the left side pipe connection of condenser upper end has condenser import pipe I, condenser import pipe I left side is through ring flange and condenser import pipe II, the condenser import pipe two other ends are through water pipe and diaphragm pump output end connection, the diaphragm pump fixed mounting is in the bottom plate upper end, the diaphragm pump water inlet end is through another water pipe and material case lower extreme pipe connection, material case fixed mounting is in the bottom plate left side, condenser left side lower extreme is equipped with condenser outlet pipe I, the condenser outlet pipe I is connected with a flange plate on the right side of the condenser outlet pipe II through a flange plate arranged on the left side, a pipeline on the left side of the condenser outlet pipe II is connected with an L-shaped water pipe, a rain spray nozzle is installed at the upper end of the L-shaped water pipe, and cooling fin devices are arranged on the outer sides of the condenser outlet pipe I, the condenser outlet pipe II, the condenser inlet pipe II and the condenser inlet pipe I.
And the other side of the left side of the lower end of the condenser is provided with a cooling water inlet.
The semiconductor cooling device is fixedly mounted at the lower end of the left side of the material box, and the heat dissipation fan is fixedly mounted on the left side of the semiconductor cooling device.
And the other side of the upper end of the left side of the condenser is provided with a cooling water outlet.
Has the advantages that: the utility model realizes the quick cooling of liquid by the rain spray nozzle, the semiconductor cooling device and the condenser realize the quick cooling of liquid, and the radiating fin device assists the liquid in cooling. The assembly structure is safe, reliable, convenient, practical, easy to manufacture and low in cost.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
fig. 2 is a schematic perspective view of fig. 1 from another perspective according to the present invention.
In the figure: 1. a condenser; 2. a base plate; 3. a cooling water inlet; 4. a first outlet pipe of the condenser; 5. an outlet pipe II of the condenser; 6. an L-shaped water pipe; 7. a diaphragm pump; 8. a material box; 9. a semiconductor cooling device; 10. a rain sprinkler head; 11. a second condenser inlet pipe; 12. an inlet pipe I of the condenser; 13. a heat dissipation fan; 14. and a cooling water outlet.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Referring to fig. 1-2, the external condenser of the material barrel comprises a condenser 1, a bottom plate 2, a cooling water inlet 3, a condenser outlet pipe I4, a condenser outlet pipe II 5, an L-shaped water pipe 6, a diaphragm pump 7, a material tank 8, a semiconductor cooling device 9, a rain spray nozzle 10, a condenser inlet pipe II 11, a condenser inlet pipe I12, a heat dissipation fan 13 and a cooling water outlet 14, wherein the condenser 1 is fixedly installed above the right side of the bottom plate 2, the condenser inlet pipe I12 is connected to the left side of the upper end of the condenser 1 through a pipeline, the left side of the condenser inlet pipe I12 is connected with the condenser inlet pipe II 11 through a flange plate, the other end of the condenser inlet pipe II 11 is connected with the output end of the diaphragm pump 7 through a water pipe, the diaphragm pump 7 is fixedly installed at the upper end of the bottom plate 2, the water inlet end of the diaphragm pump 7 is connected with the lower end of the material tank 8 through another water pipe, the material box 8 is fixedly installed on the left side of the bottom plate 1, a first condenser outlet pipe 4 is arranged at the lower end of the left side of the condenser 1, the first condenser outlet pipe 4 is connected with a flange plate on the right side of a second condenser outlet pipe 5 through a flange plate arranged on the left side, a pipeline on the left side of the second condenser outlet pipe 5 is connected with an L-shaped water pipe 6, a shower nozzle 10 is installed at the upper end of the L-shaped water pipe 6, and cooling fin devices are arranged on the outer sides of the first condenser outlet pipe 4, the second condenser outlet pipe 5, the second condenser inlet pipe 11 and the first condenser inlet pipe 12.
And the other side of the left side of the lower end of the condenser 1 is provided with a cooling water inlet 3.
The lower end of the left side of the material box 8 is fixedly provided with a semiconductor cooling device 9, and the left side of the semiconductor cooling device 9 is fixedly provided with a heat dissipation fan 13.
And the other side of the upper end of the left side of the condenser 1 is provided with a cooling water outlet 14.
The working principle is as follows: when the material tank 8 is cooled, the input end of the diaphragm pump 7 pumps liquid in the material tank 8 into the condenser inlet pipe two 11 and the condenser inlet pipe one 12 through water pipes, the cooling fins around the inlet pipes are primarily cooled when the liquid passes through the condenser inlet pipe two 11 and the condenser inlet pipe one 12, after the liquid enters the condenser 1, the cooling water inlet 3 enters the condenser 1 through cooling water accessed from the outside to be cooled, the cooling water flows out through the cooling water outlet 14 to be cooled circularly, the liquid passes through the condenser outlet pipe one 4 and the condenser outlet pipe two 5 through water cooling, the same cooling fins are arranged outside the two outlet pipes to cool the liquid again, and finally the liquid is sprayed out through the shower nozzle 10 at the upper end of the L-shaped water pipe 6 to increase the liquid cooling speed, then the semiconductor cooling device 9 is started to cool the material tank 8, and the rear end of the semiconductor cooling device 9 is provided with the cooling fan 13, the back temperature of the semiconductor cooling device 9 is prevented from being too high, and the condenser 1 and the semiconductor cooling device 9 can be used independently.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

Claims (4)

1. The external condenser of material bucket, its characteristic is, including condenser (1), bottom plate (2), condenser outlet pipe one (4), condenser outlet pipe two (5), L type water pipe (6), diaphragm pump (7), material case (8), rain spray shower nozzle (10), condenser import pipe two (11), condenser import pipe one (12), fixed mounting has condenser (1) above the bottom plate (2) right side, condenser import pipe one (12) is connected to the left side pipeline in condenser (1) upper end, condenser import pipe one (12) left side is through ring flange and condenser import pipe two (11), the other end of condenser import pipe two (11) is connected with diaphragm pump (7) output through the water pipe, diaphragm pump (7) fixed mounting is in bottom plate (2) upper end, diaphragm pump (7) water inlet end is through another water pipe and material case (8) lower extreme pipe connection, the material box (8) is fixedly installed on the left side of the bottom plate (2), a first condenser outlet pipe (4) is arranged at the lower end of the left side of the condenser (1), the first condenser outlet pipe (4) is connected with a flange plate on the right side of a second condenser outlet pipe (5) through a flange plate arranged on the left side, a pipeline on the left side of the second condenser outlet pipe (5) is connected with an L-shaped water pipe (6), a shower nozzle (10) is installed at the upper end of the L-shaped water pipe (6), and cooling fin devices are arranged on the outer sides of the first condenser outlet pipe (4), the second condenser outlet pipe (5), the second condenser inlet pipe (11) and the first condenser inlet pipe (12).
2. The external condenser of the material barrel according to claim 1, further comprising a cooling water inlet (3), wherein the other side of the left side of the lower end of the condenser (1) is provided with the cooling water inlet (3).
3. The external condenser of material bucket according to claim 1, characterized in that semiconductor heat sink (9), heat dissipation fan (13), semiconductor heat sink (9) is fixed mounting to material case (8) left side lower extreme, semiconductor heat sink (9) left side fixed mounting has heat dissipation fan (13).
4. The external condenser of the material barrel according to claim 1, further comprising a cooling water outlet (14), wherein the other side of the upper end of the left side of the condenser (1) is provided with the cooling water outlet (14).
CN202122124302.8U 2021-09-04 2021-09-04 External condenser of material bucket Active CN216159457U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122124302.8U CN216159457U (en) 2021-09-04 2021-09-04 External condenser of material bucket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122124302.8U CN216159457U (en) 2021-09-04 2021-09-04 External condenser of material bucket

Publications (1)

Publication Number Publication Date
CN216159457U true CN216159457U (en) 2022-04-01

Family

ID=80842285

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122124302.8U Active CN216159457U (en) 2021-09-04 2021-09-04 External condenser of material bucket

Country Status (1)

Country Link
CN (1) CN216159457U (en)

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