CN216152754U - Cutting machine main roll and cutting machine - Google Patents
Cutting machine main roll and cutting machine Download PDFInfo
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- CN216152754U CN216152754U CN202121772842.0U CN202121772842U CN216152754U CN 216152754 U CN216152754 U CN 216152754U CN 202121772842 U CN202121772842 U CN 202121772842U CN 216152754 U CN216152754 U CN 216152754U
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Abstract
The utility model provides a cutting machine main roller and a cutting machine, and relates to the technical field of photovoltaics. The cutting machine main roller comprises a roller body, and a plurality of wire grooves for winding cutting wires are formed in the side surface of the roller body at intervals from the wire inlet end of the roller body to the wire outlet end of the roller body; the depth of the wire groove at the wire inlet end is greater than that of the wire groove at the wire outlet end. Because the depth of the wire groove at the inlet end of the roller body is greater than that of the wire groove at the outlet end, in the main roller mechanism of the cutting machine, the length of the cutting line at the outlet end between two opposite main rollers is greater than that of the cutting line at the inlet end, so that the cutting line at the outlet end can be stretched, and the tension of the cutting line at the outlet end can be improved.
Description
Technical Field
The utility model relates to the technical field of photovoltaics, in particular to a cutting machine main roller and a cutting machine.
Background
In the manufacturing process of the photovoltaic module, firstly, a silicon rod is cut by using a cutting machine to obtain a silicon wafer, and then the silicon wafer is processed and assembled to obtain the photovoltaic module capable of being used for power generation.
The main roller mechanism in the cutting machine comprises two main rollers which are oppositely arranged, and cutting wires for cutting the silicon rods are wound on the two main rollers to form a cutting wire net. In the silicon wafer cutting process, the main roller drives the cutting line to run between the wire inlet end and the wire outlet end of the main roller, and the silicon rod is fed to the cutting line net to complete cutting of the silicon rod entering the cutting line net. The cutting line is subject to deformation and wear during the cutting process, and therefore, as the cutting line travels from the incoming end to the outgoing end, the deformation and wear of the cutting line results in insufficient tension in the cutting line at the outgoing end.
SUMMERY OF THE UTILITY MODEL
The utility model provides a cutting machine main roller and a cutting machine, and aims to solve the problem that the tension of a wire outlet end in a main roller mechanism of the cutting machine is insufficient.
In a first aspect, an embodiment of the present application provides a cutting machine main roller, including:
the side surface of the roller body is provided with a plurality of wire grooves for winding cutting wires at intervals from the wire inlet end of the roller body to the wire outlet end of the roller body;
the depth of the wire groove at the wire inlet end is greater than that of the wire groove at the wire outlet end.
Optionally, the depths of the plurality of wire grooves are sequentially decreased from the wire inlet end to the wire outlet end.
Optionally, the roller body is divided into a plurality of roller body segments from the inlet end to the outlet end;
the incoming line roller body section is positioned at the incoming line end, and the outgoing line roller body section is positioned at the outgoing line end; the depth of the wire grooves of the wire inlet roller body sections is greater than that of the wire grooves of the wire outlet roller body sections;
wherein the depth of the wire grooves in each roller body segment is the same.
Optionally, the depths of the wire grooves of the plurality of roller body segments are sequentially decreased from the wire inlet end to the wire outlet end.
Optionally, a difference between the depth of the wire groove at the incoming wire end and the depth of the wire groove at the outgoing wire end is not less than 0.1 mm and not more than 1 mm.
Optionally, the diameter of the roller body at the inlet end is smaller than the diameter of the roller body at the outlet end.
Optionally, the diameter of the roller body increases from the inlet end to the outlet end.
Optionally, the diameter of the incoming line roller body segment is smaller than the diameter of the outgoing line roller body segment; in each of the roller body segments, the diameter of the roller body is constant.
Optionally, the diameters of the plurality of roller body segments increase sequentially from the inlet end to the outlet end.
In a second aspect, embodiments of the present application provide a cutting machine including the cutting machine main roller as described above.
In the embodiment of the application, the main roller of the cutting machine comprises a roller body, and a plurality of wire grooves for winding cutting wires are formed in the side surface of the roller body at intervals from the wire inlet end of the roller body to the wire outlet end of the roller body; the depth of the wire groove at the wire inlet end is greater than that of the wire groove at the wire outlet end. Because the depth of the wire groove at the inlet end of the roller body is greater than that of the wire groove at the outlet end, in the main roller mechanism of the cutting machine, the length of the cutting line at the outlet end between two opposite main rollers is greater than that of the cutting line at the inlet end, so that the cutting line at the outlet end can be stretched, and the tension of the cutting line at the outlet end can be improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments of the present application will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 illustrates a front view of a main roller of a cutting machine according to an embodiment of the present application;
FIG. 2 is a top view of a main roller mechanism in a cutting machine according to an embodiment of the present disclosure;
FIG. 3 shows a front view of another main roller of the cutting machine provided by the embodiment of the application;
FIG. 4 shows a front view of a further cutter main roller provided by an embodiment of the present application;
FIG. 5 is a top view of a main roller mechanism in another cutting machine provided in an embodiment of the present application;
fig. 6 shows a front view of a main roller of another cutting machine provided in the embodiments of the present application.
Description of reference numerals:
100-roll, 101-wire chase, 102-axis, 200-cut line, 301-first roll segment, 302-second roll segment, 303-third roll segment.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, which shows a front view of a main roller of a cutting machine provided by an embodiment of the present application, the main roller of the cutting machine includes a roller body 100, and a plurality of wire slots 101 for winding cutting wires are formed at intervals from an incoming line end of the roller body to an outgoing line end of the roller body on a side surface of the roller body; the depth of the wire groove at the wire inlet end is greater than that of the wire groove at the wire outlet end.
In one embodiment, the roller body 100 may be a cylinder, with one end of the roller body being used for incoming lines, which is the incoming line end of the roller body, and the other end being used for outgoing lines, which is the outgoing line end of the roller body, when the roller body is installed in a cutting machine. In the process of cutting the silicon wafer, the wire inlet end is matched with a pay-off wheel in a cutting machine, the wire outlet end is matched with a take-up wheel in the cutting machine, a cutting wire (the cutting wire can be a diamond wire) enters the wire inlet end from the pay-off wheel, is wound on the surface of a roller body, and then enters the take-up wheel from the wire outlet end. As shown in fig. 1, the left end of the roller body in fig. 1 is a wire inlet end, the right end is a wire outlet end, a plurality of wire slots 101 are sequentially arranged on the side surface of the cylinder from left to right at intervals, and the wire slots may be V-shaped slots shown in fig. 1, or U-shaped slots or trapezoidal slots, or wire slots with other shapes. In the main roller shown in fig. 1, the depth H1 of the wire groove at the left end of the roller body is greater than the depth H2 of the wire groove at the right end of the roller body, that is, the depth of the wire groove at the incoming end is greater than the depth of the wire groove at the outgoing end, so that the distance L1 between the bottom of the wire groove at the incoming end and the roller body axis 102 is less than the distance L2 between the bottom of the wire groove at the outgoing end and the roller body axis 102. The specific value of the groove depth may be set according to the requirement, which is not limited in this embodiment.
As shown in fig. 2, fig. 2 is a top view of a main roller mechanism in a cutting machine provided by an embodiment of the present application, in the main roller mechanism of the cutting machine, two main rollers 100 are arranged in parallel or approximately in parallel, incoming line ends of the two main rollers 100 are opposite, outgoing line ends of the two main rollers are opposite, and a cutting line 200 is wound on the two main rollers. In the process of cutting the silicon wafer, the cutting wire 200 enters the two roller bodies 100 from the wire inlet end and is wound on the side surfaces of the two roller bodies to form a cutting wire net. The silicon rod is clamped by a clamping mechanism in the cutting machine and fed to the plane where the cutting wire net is located, the main roller rotates under the action of the driving mechanism to drive the cutting wire to run, and when the silicon rod enters the cutting wire net, the silicon rod is cut into a plurality of silicon wafers by the cutting wire net. Since the depth of the wire groove at the incoming end is greater than that of the wire groove at the outgoing end, the winding distance of the cutting wire at the incoming end between the two opposite main rollers is a first distance L3 shown in FIG. 2, the winding distance of the outgoing end is a second distance L4 shown in FIG. 2, and the first distance L3 is smaller than the second distance L4. During the silicon wafer cutting process, the cutting line gradually moves from the incoming end to the outgoing end, i.e. from the left end to the right end in fig. 2, and the cutting line becomes loose due to abrasion. In the running process of the cutting line, the winding distance of the cutting line is changed from small L3 to large L4, the cutting line at the outlet end can be stretched to a certain extent, and the tension of the cutting line at the outlet end is increased. In practical application, the tension of the cutting line at the outlet end can be compensated through different groove depth differences aiming at the tension insufficiency of the outlet end caused by different cutting lines or cutting processes.
Optionally, a difference between the depth of the wire groove at the incoming wire end and the depth of the wire groove at the outgoing wire end is not less than 0.1 mm and not more than 1 mm.
In one embodiment, the difference between the depth of the slot at the incoming end and the depth of the slot at the outgoing end may be set to be greater than or equal to 0.1 mm and less than or equal to 1 mm. As shown in figure 1, the depth of the wire groove at the wire inlet end is H1, and the depth of the wire groove at the wire outlet end is H2, so that the depth is more than or equal to 0.1 (H1-H2) and less than or equal to 1. Wherein (H1-H2) can be any value between 0.1 mm and 1 mm, such as 0.1 mm, 0.2 mm, 0.4 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, and 1 mm. In combination with the above example, when the value of (H1-H2) is small, the difference between L4 and L3 is small, and the cutting line at the outlet end can be stretched to a small extent, and the tension of the cutting line can be compensated by a small amplitude. On the contrary, when the value of (H1-H2) is larger, the difference between L4 and L3 is larger, and the cutting line at the outlet end can be stretched to a larger extent, so as to greatly compensate the tension of the cutting line. The specific values of (H1-H2) may be set as desired, and this embodiment does not limit this.
In the embodiment of the application, when the difference between the depth of the wire groove at the incoming line end and the depth of the wire groove at the outgoing line end is greater than or equal to 0.1 mm and less than or equal to 1 mm, the situation that the difference between the depth of the wire groove at the incoming line end and the depth of the wire groove at the outgoing line end is too large can be avoided, and meanwhile, the cutting line at the outgoing line end can be ensured to have enough tension in the silicon wafer cutting process.
Optionally, the depths of the plurality of wire grooves are sequentially decreased from the wire inlet end to the wire outlet end.
In one embodiment, the depths of the plurality of wire grooves on the side surface of the roller body are gradually reduced from the wire inlet end to the wire outlet end. With reference to the above example, if the side surface of the roller body is provided with N wire grooves, the difference V between two adjacent wire grooves is (H1-H2) ÷ (N-1). From the wire inlet end to the wire outlet end, the depth of the wire groove on the left side is larger than that of the wire groove on the right side between two adjacent wire grooves.
In this application embodiment, the degree of depth of a plurality of wire casings is decreased progressively from the inlet wire end to the outlet wire end in proper order, in the cutting process, can increase the tension of cutting line gradually from the inlet wire end to the outlet wire end to can be more stable cut the silicon rod. In practical application, the depth of the wire groove can be specifically set according to requirements, and only the depth of the wire groove at the wire outlet end needs to be smaller than that of the wire groove at the wire inlet end.
The depth of the wire grooves is gradually reduced from the wire inlet end to the wire outlet end, so that the tension of the cutting wires can be gradually increased. Table 1 shows the torque and the wire bow values at different positions of the wire net for cutting arranged in the main roller mechanism composed of the main rollers having the same depth of the wire grooves, and table 2 shows the torque and the wire bow values at different positions of the wire net for cutting arranged in the main roller mechanism composed of the main rollers having the sequentially decreasing depth of the wire grooves. The cutting position is the depth position of the silicon rod entering the cutting wire net, the wire arch refers to the deformation of the cutting wire net in the cutting process, different deformations can be represented through the numerical value of the wire arch, and the tension of the cutting wire net is relatively reflected, namely the smaller the wire arch is, the larger the tension of the cutting wire net is. The head wire bow is the wire bow of the cutting wire net at the wire inlet end, the tail wire bow is the wire bow at the wire outlet end, and the middle wire bow is the wire bow of the cutting wire net at the middle position between the wire inlet end and the wire outlet end. The torque is the driving torque of the main roller motor, and the larger the torque is, the larger the force required by the motor to drive the main roller to operate is, so that the smaller the wire mesh tension is.
TABLE 1
TABLE 2
Comparing the values in the third, fourth and fifth columns of table 1, it can be seen that in the cutting wire net, the line bow increases gradually from the head to the tail, indicating that the deformation of the cutting wire becomes larger gradually, reflecting that the tension of the cutting wire in the cutting wire net decreases gradually from the inlet end to the outlet end. Further, as can be seen by combining numerical values in the first row and the second row in table 1, in the silicon wafer cutting process, the depth positions of the silicon rod entering the cutting wire net are sequentially 20 mm, 60 mm, 100 mm, 120 mm, 180 mm and 213 mm, as the depth of the silicon rod entering the cutting wire net is gradually increased, the wire arch values at the head, the middle and the tail are gradually increased, the torque of the motor is also gradually increased, and it is reflected that the greater the depth of the silicon rod entering the cutting wire net is, the greater the deformation of the cutting wire from the wire inlet end to the wire outlet end is, and the tension of the cutting wire is gradually reduced.
Comparing the values at the same positions in table 1 and table 2, it can be seen that the main roller mechanism composed of the main rollers with gradually decreasing slot depths has a higher tension of the cutting wire net than the main roller mechanism composed of the main rollers with unchanged slot depths, and especially at the tail of the wire bow, i.e. the wire outlet end, the main rollers with gradually decreasing slot depths have a more obvious compensation effect on the tension. For example, at the cutting position 213 mm, the bow value of the tail in table 1 is 14, the torque is 44, and the bow value of the tail in table 2 is 11, the torque is 40, which clearly reflects that the main roller mechanism corresponding to table 2 has smaller deformation of the cutting line at the outlet end and larger tension than the main roller mechanism corresponding to table 1. Similarly, at the cutting position of 100 mm, the bow value of the tail portion in table 1 is 8, the torque is 43, while the bow value of the tail portion in table 2 is 6, and the torque is 38, which clearly reflects that the deformation of the cutting line at the wire outlet end of the main roller mechanism corresponding to table 2 is smaller and the tension is larger than that of the main roller mechanism corresponding to table 1. Similarly, combining table 1 and table 2, it can be seen that, in the middle of the wire bow, the main roller with the gradually decreasing depth of the wire chase can also reduce the deformation of the cutting wire and compensate the tension of the cutting wire, compared to the main roller mechanism with the unchanged depth of the wire chase.
In this application embodiment, the degree of depth of a plurality of wire casings is decreased progressively from the inlet wire end to the outlet wire end in proper order, in the cutting process, can increase the tension of cutting line gradually from the inlet wire end to the outlet wire end to can be more stable cut the silicon rod. In practical application, the depth of the wire groove can be specifically set according to requirements, and only the depth of the wire groove at the wire outlet end needs to be smaller than that of the wire groove at the wire inlet end.
In summary, in the embodiment, the main roller of the cutting machine includes a roller body, and a plurality of wire slots for winding the cutting wires are formed at intervals from the wire inlet end of the roller body to the wire outlet end of the roller body on the side surface of the roller body; the depth of the wire groove at the wire inlet end is greater than that of the wire groove at the wire outlet end. Because the depth of the wire groove at the inlet end of the roller body is greater than that of the wire groove at the outlet end, in the main roller mechanism of the cutting machine, the length of the cutting line at the outlet end between two opposite main rollers is greater than that of the cutting line at the inlet end, so that the cutting line at the outlet end can be stretched, and the tension of the cutting line at the outlet end can be improved.
Optionally, the roller body is divided into a plurality of roller body segments from the wire inlet end to the wire outlet end; the incoming line roller body section is positioned at the incoming line end, and the outgoing line roller body section is positioned at the outgoing line end; the depth of the wire groove of the wire inlet roller body section is greater than that of the wire groove of the wire outlet roller body section; wherein the depth of the wire grooves in each roller body segment is the same.
As shown in fig. 3, fig. 3 illustrates a front view of another main roller of a cutting machine according to an embodiment of the present application, a roller body is sequentially divided into a first roller body segment 301, a second roller body segment 302, and a third roller body segment 303 from an incoming line end to an outgoing line end, the first roller body segment 301 is an incoming line roller body segment located at the incoming line end, and the third roller body segment 303 is an outgoing line roller body segment located at the outgoing line end. In the first, second, and third roller segments 301, 302, and 303, the wire groove depth in the first roller segment 301 is H3, the wire groove depth in the second roller segment 302 is H4, and the wire groove depth in the third roller segment 303 is H5. The depth H3 of the wire chase in the first roller section 301 is greater than the depth H5 of the wire chase in the third roller section 303.
Optionally, the depths of the wire grooves of the roller body segments are sequentially decreased from the wire inlet end to the wire outlet end.
In one embodiment, the depths of the wire grooves of the roller body sections are gradually reduced from the wire inlet end to the wire outlet end. As shown in fig. 3, the wire groove depth H3 of the first roller section 301 is greater than the wire groove depth H4 of the second roller section 302, the wire groove depth H4 of the second roller section 302 is greater than the wire groove depth H5 of the third roller section 303, and H3, H4, and H5 are gradually decreased. For example, if H3 is X greater than H4, then H4 is X greater than H5, and X can be any number between 0.1 and 1, such as 0.1, 0.3, 0.4, 0.5, 0.8, 0.9, and 1 millimeter. The distance between the bottom of the wire groove in the first roller section 301 and the axis 102 is L5, the distance between the bottom of the wire groove in the second roller section 302 and the axis 102 is L6, and the distance between the bottom of the wire groove in the third roller section 303 and the axis 102 is L7, and since H3, H4 and H5 are gradually decreased, L5, L6 and L7 are gradually increased. Further, in the main roller mechanism, the winding distance of the cutting wire may be gradually increased from the first roller section 301 to the third roller section 303, the stretching degree of the cutting wire may be gradually increased, and the tension of the cutting wire may be gradually changed.
Wherein, the roll body also can be divided into 2 roll body segmentations, 4 roll body segmentations or 5 roll body segmentations, and the concrete quantity of roll body segmentation can specifically set up according to the demand. The lengths of the plurality of roller body segments may be the same or different, and this embodiment is not limited thereto.
In this application embodiment, the roll body is divided into a plurality of roll body segments, and the wire casing degree of depth that is arranged in the roll body segment of inlet wire end is greater than the wire casing degree of depth that is arranged in the roll body segment of outlet wire end, and in silicon chip cutting process, can increase the tension of the line of cut of outlet wire end, can guarantee simultaneously in every roll body segment, can carry out the cutting of the same degree to the silicon rod.
Optionally, the diameter of the incoming line roller body segment is smaller than the diameter of the outgoing line roller body segment; in each roller section, the diameter of the roller is constant.
Optionally, the diameters of the plurality of roller body segments increase sequentially from the inlet end to the outlet end.
As shown in fig. 4, fig. 4 shows a front view of a main roller of a cutting machine provided in an embodiment of the present application, the roller body is divided into a first roller section 301, a second roller section 302 and a third roller section 303, and a diameter D1 of the in-line roller section (the in-line roller section, i.e., the first roller section 301) is smaller than a diameter D3 of the out-line roller section (the out-line roller section, i.e., the third roller section 303). As shown in fig. 5, fig. 5 is a top view of another cutting machine provided by the embodiment of the present application, and in conjunction with fig. 4, the axes of two main rollers 100 are parallel or nearly parallel, and when the diameter of the incoming-line roller section 301 is smaller than that of the outgoing-line roller section 303, the difference between the first distance L3 and the second distance L4 can be further increased, so that the cutting line can be further stretched at the outgoing end to compensate for the tension of the cutting line. In the process of cutting the silicon wafer, the cutting line gradually runs from the wire inlet end to the wire outlet end, the winding distance of the cutting line is changed from L3 to be larger L4, the cutting line at the wire outlet end can be stretched, and the tension of the cutting line at the wire outlet end is increased. Therefore, when the diameter of the outlet end is larger than that of the inlet end, the winding distance L4 of the outlet end can be further increased, and the tension of the outlet end can be further compensated. In practical application, the tension of the cutting line at the outlet end can be compensated through different diameter differences aiming at the tension insufficiency of the outlet end caused by different cutting lines or cutting processes.
In one embodiment, the diameters of roller section 301, roller section 302, and roller section 303 increase in sequence, and as shown in FIG. 4, if diameter D1 of roller section 301 is X smaller than the diameter point of roller section 302, diameter D2 of roller section 302 is Y smaller than diameter D3 of roller section 303, and X is equal to Y, such that the diameters between roller section 301, roller section 302, and roller section 303 increase in sequence. In practical application, X and Y may be the same or different, that is, the diameters of the roller body segments from the inlet end to the outlet end may or may not be gradually increased.
In this application embodiment, the roll body is divided into a plurality of roll body segments, and from the leading-out end to the leading-in end, the diameter of the leading-in roll body segment is less than the diameter of the leading-out roll body segment, and in the silicon wafer cutting process, the tension of the cutting line at the leading-out end can be further increased. When the length of the cutting line between the main rollers from the wire inlet end to the wire outlet end is gradually increased, the tension of the cutting line can be gradually increased from the wire inlet end to the wire outlet end, and the silicon rod can be better cut by the cutting line.
Optionally, the roller body has a smaller diameter at the inlet end than at the outlet end.
Optionally, the diameter of the roller body increases from the inlet end to the outlet end.
As shown in fig. 6, fig. 6 shows a front view of a main roller of another cutting machine provided in an embodiment of the present application, a roller body may be in a circular truncated cone shape, a diameter D4 of an incoming line end is smaller than a diameter D5 of an outgoing line end, and the diameter of the roller body gradually increases from the incoming line end to the outgoing line end, so that the roller body is in a circular truncated cone shape. With the above example, the groove depth of the incoming line end is greater than the groove depth of the outgoing line end, so that the winding distance of the cutting line at the outgoing line end is greater than the winding distance of the incoming line end. When the diameter of the wire outlet end is larger than that of the wire inlet end, the winding distance of the wire outlet end can be further increased, and therefore the tension of the wire outlet end can be further compensated.
In the embodiment of the application, as the diameter of the wire inlet end of the roller body is smaller than that of the wire outlet end, the tension of the cutting wire of the wire outlet end can be further increased in the main roller mechanism. When the diameter of the main roller is gradually increased from the wire inlet end to the wire outlet end, the tension of the cutting wire can be gradually increased from the wire inlet end to the wire outlet end, and the cutting wire can be used for better cutting the silicon rod.
The embodiment of the application also provides a cutting machine for cutting the silicon wafer, which comprises the main roller.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the utility model as defined in the appended claims.
Claims (10)
1. A main roller of a cutting machine, comprising:
the side surface of the roller body is provided with a plurality of wire grooves for winding cutting wires at intervals from the wire inlet end of the roller body to the wire outlet end of the roller body;
the depth of the wire groove at the wire inlet end is greater than that of the wire groove at the wire outlet end.
2. The main roller of cutting machine according to claim 1, characterized in that the depths of the plurality of wire grooves are sequentially decreased from the wire inlet end to the wire outlet end.
3. The cutter main roll according to claim 1, wherein the roll body is divided into a plurality of roll body segments from the inlet end to the outlet end;
the incoming line roller body section is positioned at the incoming line end, and the outgoing line roller body section is positioned at the outgoing line end; the depth of the wire grooves of the wire inlet roller body sections is greater than that of the wire grooves of the wire outlet roller body sections;
wherein the depth of the wire grooves in each roller body segment is the same.
4. The cutter main roller according to claim 3, wherein the groove depths of the plurality of roller body segments decrease sequentially from the inlet end to the outlet end.
5. The main roller of a cutting machine according to claim 1, characterized in that the difference between the depth of the wire groove of the incoming end and the depth of the wire groove of the outgoing end is not less than 0.1 mm and not more than 1 mm.
6. The cutter main roller according to claim 1 or 2, wherein the roller body has a smaller diameter at the inlet end than at the outlet end.
7. The slitter main roller according to claim 6, wherein a diameter of the roller body increases from the inlet end to the outlet end.
8. The cutter main roll of claim 3, wherein the diameter of the in-line roll body segment is smaller than the diameter of the out-line roll body segment; in each of the roller body segments, the diameter of the roller body is constant.
9. The cutter main roll according to claim 8, wherein diameters of the plurality of roll body segments increase sequentially from the line inlet end to the line outlet end.
10. A cutting machine comprising the cutter main roller according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121772842.0U CN216152754U (en) | 2021-07-30 | 2021-07-30 | Cutting machine main roll and cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121772842.0U CN216152754U (en) | 2021-07-30 | 2021-07-30 | Cutting machine main roll and cutting machine |
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| Publication Number | Publication Date |
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| CN216152754U true CN216152754U (en) | 2022-04-01 |
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| CN202121772842.0U Active CN216152754U (en) | 2021-07-30 | 2021-07-30 | Cutting machine main roll and cutting machine |
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| GR01 | Patent grant |