CN216134777U - Circuit board with heat radiation structure - Google Patents

Circuit board with heat radiation structure Download PDF

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Publication number
CN216134777U
CN216134777U CN202122133890.1U CN202122133890U CN216134777U CN 216134777 U CN216134777 U CN 216134777U CN 202122133890 U CN202122133890 U CN 202122133890U CN 216134777 U CN216134777 U CN 216134777U
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CN
China
Prior art keywords
circuit board
heat dissipation
dissipation structure
external
main body
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Active
Application number
CN202122133890.1U
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Chinese (zh)
Inventor
陈小健
陈伟
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Shenzhen Anboli Circuit Co ltd
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Shenzhen Anboli Circuit Co ltd
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Priority to CN202122133890.1U priority Critical patent/CN216134777U/en
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Abstract

The utility model discloses a circuit board with a heat dissipation structure, which comprises an external structure, wherein the internal bottom end of the external structure is provided with the heat dissipation structure; a body disposed at an inner upper end of the outer structure; the heat dissipation structure includes: the embedded groove is arranged at the inner bottom end of the external structure; and the heat radiation fan is arranged at the upper end of the inside of the embedded groove. This circuit board with heat radiation structure, exterior structure uses the casing as main protection piece, settle the circuit board in the casing inboard and protect, make the circuit board be in relative encapsulated situation, reduce external influence, and carry out the circuit of wiring with the circuit board, can pass the perforation groove, carry out electric connection, avoid the circuit winding condition to appear, influence the circulation of air, through cooling fan, with external process filter screen panel air, transmit in the circuit board inboard, and flow from the perforation groove, with the heat that the circuit board produced, together blow off outside the equipment, reach quick radiating effect.

Description

Circuit board with heat radiation structure
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a circuit board with a heat dissipation structure.
Background
The circuit board is also called as a circuit board, and the circuit board enables the circuit to be miniaturized and visualized, plays an important role in the mass production of fixed circuits and the optimization of the layout of electrical appliances, and is a main element in the electronic information manufacturing industry.
When the circuit board on the market is used in production, only be single PCB board, only can play the fixed effect of circuit original paper, the function is comparatively limited, and the circuit board when using, the heat can appear too high, leads to the circuit board condition of burning out, reduces circuit board life to the winding condition can often take place for the connecting wire on the circuit board.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a circuit board with a heat dissipation structure, and aims to solve the problems that when the circuit board in the market proposed in the background art is produced and used, only a single PCB (printed circuit board) is used, only the function of fixing a circuit element can be achieved, the function is limited, when the circuit board is used, the circuit board is burnt due to overhigh heat, the service life of the circuit board is shortened, and the connecting line on the circuit board is often wound.
In order to achieve the purpose, the utility model provides the following technical scheme: a wiring board with a heat dissipation structure, comprising: the heat dissipation structure comprises an external structure, wherein a heat dissipation structure is arranged at the inner bottom end of the external structure;
a body disposed at an inner upper end of the outer structure;
the heat dissipation structure includes: the embedded groove is arranged at the inner bottom end of the external structure;
a heat radiation fan arranged at the inner upper end of the tabling groove;
and the filter screen panel is arranged at the bottom end in the embedding groove.
Preferably, the outer structure comprises:
a housing disposed at an exterior of the outer structure;
a cover plate disposed at an inside of a top end of the case;
the perforation grooves are formed in two sides of the outer part of the shell;
and the sealing strips are arranged on the periphery of the outer part of the cover plate.
Preferably, the housing forms a sealing structure by a sealing strip and a cover plate, and the sealing strip and the cover plate are embedded with each other.
Preferably, the perforation slots are symmetrically distributed along the central axis of the shell, and the perforation slots are arranged at four positions.
Preferably, the body comprises:
a circuit board main body disposed at an inner upper end of the external structure;
the rubber plate is arranged at the bottom of the lower end of the circuit board main body;
a limiting block disposed at an inner lower end of the outer structure.
Preferably, the circuit board main part constitutes the block structure through rubber slab and stopper, and rubber slab and stopper gomphosis department are the slope form.
Preferably, the rubber plates are symmetrically distributed along the central axis of the circuit board main body, and the two groups of rubber plates are arranged.
Preferably, the heat dissipation fan and the external structure form a detachable structure through the embedded groove, and the heat dissipation fan and the filter screen panel are distributed in a parallel shape.
Compared with the prior art, the utility model has the beneficial effects that: this circuit board with heat radiation structure adopts mutually supporting between a plurality of mechanisms, and is functional strong, utilizes external structure, completely cuts off the circuit board, reduces external influence to the circuit board to utilize the fan, with the inside circulation of air of accelerating, with the heat along with air transmission in the circuit board outside, reach radiating effect.
1. According to the utility model, the shell is used as a main protection part in the external structure, the circuit board is arranged on the inner side of the shell for protection, the circuit board is in a relatively sealed state, the influence of the outside is reduced, and the circuit connected with the circuit board can pass through the perforation groove for electrical connection, so that the phenomenon that the circuit is wound to influence the air circulation is avoided.
2. According to the utility model, the circuit board main body utilizes the rubber plate with soft characteristics to clamp the inclined plane at the inner side of the rubber plate with the limiting block, so that the circuit board main body is convenient to mount and place stably, then the outside air passes through the filter screen panel through the cooling fan, is transmitted to the inner side of the circuit board and flows out from the perforated groove, and the heat generated by the circuit board is blown out of equipment together, so that the effect of rapid cooling is achieved.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of the internal structure of the present invention;
FIG. 3 is an enlarged view of a portion A of FIG. 2 according to the present invention.
In the figure: 1. an outer structure; 101. a housing; 102. a cover plate; 103. a perforation slot; 104. a sealing strip; 2. a main body; 201. a circuit board main body; 202. a rubber plate; 203. a limiting block; 3. a heat dissipation structure; 301. a heat radiation fan; 302. a fitting groove; 303. a filter screen panel.
Detailed Description
As shown in fig. 1-2, the present invention provides a technical solution: a wiring board with a heat dissipation structure, comprising: the heat dissipation structure comprises an external structure 1, wherein a heat dissipation structure 3 is arranged at the inner bottom end of the external structure 1; the outer structure 1 includes: a housing 101 disposed at the exterior of the outer structure 1; a cover plate 102 provided at the top end inside of the case 101; perforated slots 103 opened on both sides of the outside of the case 101; and the sealing strip 104 is arranged on the periphery of the outer part of the cover plate 102. The case 101 is configured to have a sealing structure by the sealing tape 104 and the cover plate 102, and the sealing tape 104 and the cover plate 102 are fitted to each other. Perforation groove 103 is the symmetric form along the axis department of casing 101 and distributes, and perforation groove 103 is provided with everywhere, and exterior structure 1 uses casing 101 as main protection piece, settles the circuit board in casing 101 inboard and protects, makes the circuit board be in relative encapsulated situation, reduces external influence, and carries out the circuit of wiring with the circuit board, can pass perforation groove 103, carries out electric connection, avoids the circuit winding condition to appear, influences the circulation of air.
As shown in fig. 3, the present invention provides a technical solution: a circuit board with a heat dissipation structure comprises a main body 2 arranged at the inner upper end of an external structure 1; the main body 2 includes: a circuit board main body 201 provided at an inner upper end of the external structure 1; a rubber plate 202 disposed at the bottom of the lower end of the circuit board main body 201; and a stopper 203 disposed at an inner lower end of the outer structure 1. The circuit board main body 201 is configured to have a snap-fit structure by the rubber plate 202 and the stopper 203, and the fitting portion between the rubber plate 202 and the stopper 203 is inclined. The rubber plates 202 are symmetrically distributed along the central axis of the circuit board main body 201, and two groups of rubber plates 202 are arranged. The heat dissipation structure 3 includes: a fitting groove 302 opened at an inner bottom end of the outer structure 1; a heat radiation fan 301 disposed at an inner upper end of the fitting groove 302; and a filter screen panel 303 provided at the inner bottom end of the fitting groove 302. Radiator fan 301 constitutes detachable construction through gomphosis groove 302 and exterior structure 1, and radiator fan 301 and filter screen panel 303 are the parallel form and distribute, circuit board main part 201 utilizes the softer rubber slab 202 of characteristic, make the inclined plane of the inboard department of rubber slab 202, with stopper 203 carry out the block, guarantee that the convenient installation of circuit board main part 201 places stably, later through radiator fan 301, with external process filter screen panel 303 air, the transmission is inboard in the circuit board, and flow from perforation groove 103, the heat that produces the circuit board, together blow off outside the equipment, reach quick radiating effect.
In summary, when the circuit board with the heat dissipation structure is used, firstly, a user directly utilizes the softer characteristic of the rubber plate 202 to deform the rubber plate 202, then the rubber plate is clamped at the two sides of the limiting block 203, meanwhile, the stable placement of the circuit board main body 201 is ensured, then the connecting lines of the circuit board main body 201 are classified to pass through different perforation slots 103 and electrically connected to the circuit board main body 201, the winding and disorder of the lines are avoided, then the cover plate 102 is fixed at the upper side of the shell 101 to seal the whole circuit board main body 201, when the circuit board main body 201 works, the generated heat is higher, the heat dissipation fan 301 with the model number of TH-620A can be started, the fan blades in the heat dissipation fan 301 are rotated, the outside air is transmitted to the inner side of the circuit board through the filter screen panel 303 and flows out from the perforation slots 103 to generate the heat of the circuit board, the air is blown out of the equipment together, so that the effect of rapid heat dissipation is achieved.

Claims (8)

1. A circuit board with a heat dissipation structure, comprising: the heat dissipation structure comprises an external structure (1), wherein a heat dissipation structure (3) is arranged at the inner bottom end of the external structure (1); a body (2) arranged at an inner upper end of the outer structure (1); the heat dissipation structure (3) includes: a fitting groove (302) that opens at the inner bottom end of the outer structure (1); a heat radiation fan (301) which is provided at the upper end of the inside of the fitting groove (302); and a filter screen panel (303) provided at the inner bottom end of the fitting groove (302).
2. The circuit board with a heat dissipation structure of claim 1, wherein: the outer structure (1) comprises: a housing (101) provided at the exterior of the outer structure (1); a cover plate (102) provided at a tip inside of the case (101); perforated slots (103) which are opened on both sides of the outside of the housing (101); a sealing strip (104) disposed around an exterior of the cover plate (102).
3. The circuit board with a heat dissipation structure of claim 2, wherein: the shell (101) forms a sealing structure through the sealing strip (104) and the cover plate (102), and the sealing strip (104) and the cover plate (102) are mutually embedded.
4. The circuit board with a heat dissipation structure of claim 2, wherein: the perforation grooves (103) are symmetrically distributed along the central axis of the shell (101), and the perforation grooves (103) are arranged at four positions.
5. The circuit board with a heat dissipation structure of claim 1, wherein: the main body (2) comprises:
a circuit board main body (201) provided at an inner upper end of the external structure (1); a rubber plate (202) provided at the bottom of the lower end of the circuit board main body (201); a stop block (203) disposed at an inner lower end of the outer structure (1).
6. The circuit board with a heat dissipation structure of claim 5, wherein: the circuit board main body (201) forms a clamping structure through the rubber plate (202) and the limiting block (203), and the embedded part of the rubber plate (202) and the limiting block (203) is inclined.
7. The circuit board with a heat dissipation structure of claim 5, wherein: the rubber plates (202) are symmetrically distributed along the central axis of the circuit board main body (201), and the rubber plates (202) are provided with two groups.
8. The circuit board with a heat dissipation structure of claim 1, wherein: the heat radiation fan (301) forms a detachable structure with the external structure (1) through the embedded groove (302), and the heat radiation fan (301) and the filter screen panel (303) are distributed in a parallel shape.
CN202122133890.1U 2021-09-06 2021-09-06 Circuit board with heat radiation structure Active CN216134777U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122133890.1U CN216134777U (en) 2021-09-06 2021-09-06 Circuit board with heat radiation structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122133890.1U CN216134777U (en) 2021-09-06 2021-09-06 Circuit board with heat radiation structure

Publications (1)

Publication Number Publication Date
CN216134777U true CN216134777U (en) 2022-03-25

Family

ID=80772689

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122133890.1U Active CN216134777U (en) 2021-09-06 2021-09-06 Circuit board with heat radiation structure

Country Status (1)

Country Link
CN (1) CN216134777U (en)

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