CN216122928U

CN216122928U - Heating thick film and heating device

Info

Publication number: CN216122928U
Application number: CN202121770080.0U
Authority: CN
Inventors: 胡志升; 胡旭
Original assignee: Hunan Ruisente Electronic Technology Co ltd
Current assignee: Hunan Ruisente Electronic Technology Co ltd
Priority date: 2021-07-30
Filing date: 2021-07-30
Publication date: 2022-03-22
Anticipated expiration: 2031-07-30

Abstract

The application discloses heating thick film and heating device. Heating the thick film comprises: a substrate base material; an insulating layer; arranged on one surface of the substrate base material; the heating coil is distributed on the insulating layer in a surrounding manner, the cross section area of a lead of the heating coil is gradually increased along the direction of the edge of the substrate towards the center, and the electrical resistivity of the lead is the same; and the packaging layer is arranged on the substrate and covers the heating coil. The heating uniformity of the heating thick film can be improved by reducing the difference of the heating value of the edge part and the central part.

Description

Heating thick film and heating device

Technical Field

The application relates to the thick film heating field, still relates to a heating thick film and heating device.

Background

The heating thick film is prepared by mixing superconductive ceramic material micropowder and organic binding solvent into paste slurry, printing the slurry on a substrate in the form of circuit wiring or pattern by using a specific technology, and sintering by a heat treatment process. The existing heating thick film mainly tends to be heated rapidly, the heating power is large, but the development of uniform heating function is less, which leads to the problem that the heating is not uniform easily.

SUMMERY OF THE UTILITY MODEL

In view of the above technical problems, embodiments of the present application provide a heating thick film and a heating device for improving the uniformity of heating the heating thick film.

In a first aspect, embodiments of the present application provide a heated thick film comprising:

a substrate base material;

an insulating layer; arranged on one surface of the substrate base material;

the heating coil is distributed on the insulating layer in a surrounding manner, the cross section area of a lead of the heating coil is gradually increased along the direction of the edge of the substrate towards the center, and the electrical resistivity of the lead is the same;

and the packaging layer is arranged on the substrate and covers the heating coil.

Optionally, the heat generating coil includes a first coil and a second coil, the first coil and the second coil being non-overlapping in a direction perpendicular to the substrate base material.

Optionally, the first coil and the second coil are disposed on the same radius of the heat generating coil.

Alternatively, the cross-sectional areas of the wires of the first coil and the second coil are equal on the same radius of the heat generating coil.

Optionally, the heating thick film further comprises a plurality of first conductive pads and second conductive pads, the first conductive pads are connected to two ends of the first coil, and the second conductive pads are connected to two ends of the second coil.

Optionally, one of the first conductive pads and one of the second conductive pads are electrically connected.

Optionally, the heating thick film further comprises a temperature controller, wherein one of the first conductive pads and one of the second conductive pads are respectively connected to two pins of the temperature controller and are selectively electrically conducted through the temperature controller.

Optionally, the first conductive pads connected to both ends of the first coil are both power input ends of the first coil, and the second conductive pads connected to both ends of the second coil are both power input ends of the second coil.

Optionally, the substrate base material comprises a metal base plate.

In a second aspect, embodiments of the present application provide a heating device comprising a heated thick film as described above.

As described above, in the thick film heating and heating apparatus according to the embodiment of the present invention, the cross-sectional area of the lead of the heat generating coil is gradually increased and the resistivity is the same in the direction toward the center of the edge of the substrate, the heat generating amount of the heat generating coil closer to the center is larger, the heat generating amount of the heat generating coil closer to the edge is smaller, the heat generating coils at the edge are denser, the distribution area is larger, the difference in the heat generating amount from the center can be reduced, the heating uniformity of the thick film heating can be improved, the heat at the center can be transferred toward the edge, and the heating uniformity of the thick film heating can be improved.

Drawings

FIG. 1 is a schematic diagram of a heated thick film according to an embodiment of the present application;

fig. 2 is a schematic partial cross-sectional view of the heated thick film shown in fig. 1 taken along the direction a-a'.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described below in detail with reference to specific embodiments and accompanying drawings. It is to be understood that the embodiments described below are only some embodiments of the present application, and not all embodiments. In the following embodiments and technical features thereof, all of which are described below may be combined with each other without conflict, and also belong to the technical solutions of the present application.

Fig. 1 is a schematic structural view of a heated thick film according to an embodiment of the present application. Referring to fig. 1 and 2, a heating thick film 10 includes a substrate 11, an insulating layer 12, a heating coil 13 and a packaging layer 14.

The insulating layer 12 is disposed on one surface of the substrate base 11, for example, the insulating layer 12 is disposed on the upper surface of the substrate base 11, and may completely cover the upper surface of the substrate base 11. The insulating layer 12 is used to prevent the first coil 131 and the second coil 132 from being electrically connected to the substrate 11 made of a conductive material. The insulating layer 12 may be formed directly on the base substrate 11 by a film formation method such as sputtering using an insulating material, or the insulating layer 12 may be attached to the base substrate 11 by an adhesive.

The heating coil 13 is circumferentially distributed on the insulating layer 12, and the cross-sectional area of the wire of the heating coil 113 is gradually increased along the direction from the edge of the substrate 11 to the center, and the resistivity is the same.

The sealing layer 14 is disposed on the substrate 11 and covers the heat generating coil 13.

The wire cross-sectional area means the thickness of the wire in the heat-generating coil 13, that is, the thickness of the individual wires of the heat-generating coil 113 gradually becomes thicker in the direction from the edge toward the center of the substrate base 11.

According to the joule law relation 1-1 and the resistance and heat quantity relation 1-2, it can be known that the resistance and the cross-sectional area of the wire in the heating coil 13 are in inverse proportion, and the resistance and the heat quantity of the wire are in inverse proportion, so that the heat quantity and the cross-sectional area can be calculated to be in direct proportion.

Q-U2/R-t relation 1-1

R ═ rho L/S relation 1-2

Wherein Q represents heat in joules (J); u represents a voltage in volts (V); r represents resistance in ohms (Ω); t represents time in seconds(s). ρ represents the resistivity of the wire in the heat generating coil 13, S represents the cross-sectional area of the wire, and L represents the length of the wire.

When the heat generating coils 13 having the same resistivity are applied with the same voltage, the heat generating coils 13 closer to the center portion generate a larger amount of heat, the heat generating coils 13 closer to the edge portion generate a smaller amount of heat, the heat generating coils 13 at the edge portion are denser, the distribution area is larger, and the difference between the heat generating amount and the heat generating amount at the center portion can be reduced, thereby improving the heating uniformity of the thick film 10, and the heat at the center portion can be transferred toward the edge portion, and the heating uniformity of the thick film 10 can also be improved.

As shown in fig. 1, the central portion of the heating coil 13 may be provided with a blank area, and the blank area is understood to be an area where no conductive wire is provided. For example, the central portion of the substrate 11 is provided with a clearance area, in which other accessories such as a cutter can be placed, and the heating coil 13 is disposed around the clearance area and is circumferentially distributed on the insulating layer 12 of the substrate 11. Since the heat generation coil 13 does not generate heat in the central portion, the difference in the amount of heat generation between the central portion and the edge portion can also be reduced, thereby further contributing to improvement in the uniformity of heating of the heated thick film 10.

The substrate base material 11 may be a plate body having a certain thickness. The shape of the substrate base 11 (for example, a shape in a plan view or an orthographic shape) is not limited, and may be, for example, a circular shape, a rectangular shape, or a polygonal shape, and may be designed to suit the structure of the heating thick film 10. In addition, according to the design requirement of the heating thick film 10, other structural properties of the substrate base material 11 can also be designed adaptively, for example, when the heating thick film 10 needs to have higher structural strength, the substrate base material 11 can be a metal plate, such as a stainless steel plate or other material plate with better structural strength; for another example, the substrate 11 may be an integrally press-molded structure, and in order to adapt to the temperature required for sintering in step S13, the substrate 11 may be a high-temperature-resistant substrate, and the structure and shape of the substrate 11 are not greatly changed during the sintering process.

In some embodiments, the heat generating coil 13 may be formed by winding a whole wire. The surrounding shape and manner of the heat generating coil 13 are not limited in the embodiments of the present application. Taking the circular substrate 11 shown in fig. 1 as an example, the cross-sectional area of the wire of the heat generating coil 13 is equal on the same radius of the heat generating coil 13 (the same turn of the heat generating coil 13 may be used for substrate 11 of other shapes), and the amount of heat generated by the wire in the heat generating coil 13 is equal on the same radius.

In other embodiments, the heat generating coil 13 may be formed by co-winding at least two wires. Still taking the circular substrate base material 11 shown in fig. 1 as an example, the heat generating coil 13 includes a first coil 131 and a second coil 132, and the first coil 131 and the second coil 132 may be respectively disposed around the shape of the substrate base material 11 in a direction perpendicular to the substrate base material 11, and the first coil 131 and the second coil 132 are not overlapped. Alternatively, both the first coil 131 and the second coil 132 may be disposed on the same radius of the heat-generating coil 13 (for other shapes of the substrate 11, the same turn of the heat-generating coil 13 may be used) to increase the layout area of the heat-generating coil 13 on the substrate 11, which is beneficial to increase the heating efficiency.

Alternatively, the cross-sectional areas of the wires of the first coil 131 and the second coil 132 are equal on the same radius of the heat generation coil 13, where the amounts of heat generation of the wires in the first coil 131 and the second coil 132 are equal on the same radius of the heat generation coil 13.

In addition, the first coil 131 and the second coil 132 serve as heating sources, and individual control of heating power is realized by intelligently adjusting respective heat generation. For example, when the initial water temperature is low, the water close to the heating source is not easily vaporized, and the two sets of coils can be operated simultaneously, and when the water is heated to a certain temperature, only the first coil 131 with a large layout area can be operated, and the rate of vaporization of the water close to the heating source is reduced, and when the water is reheated to a high certain temperature, only the second coil 132 with a small thickness can be operated, and the rate of vaporization of the water close to the heating source is reduced again. In this way, the rate at which water approaching the heating source is vaporized is lower during the entire heating process, which is beneficial to reducing the noise generated during boiling.

In order to avoid the conductive connection being affected by the rupture at the bending position when the heat generating coil 13 is arranged around the ring, the heat generating coil 13 (for example, at least one of the first coil 131 and the second coil 132) may be provided with a reinforcing member, each reinforcing member is disposed at the connection position of two adjacent turns of the conductive wire, the structural strength of the reinforcing member is higher than that of any turn of the heat generating coil 13, and the conductive performance of the reinforcing member is equal to or higher than that of any turn, so as to ensure stable electrical connection between turns of the heat generating coil 13.

To achieve this, please refer to fig. 1 again, the heating thick film 10 may further be provided with a plurality of conductive pads 15 for connecting the heating coil 13 with electricity.

In some embodiments, the heating thick film 10 includes a plurality of first and second conductive pads, for example, two first

conductive pads

151a, 151b and two second

conductive pads

152a, 152b shown in fig. 1, wherein one first conductive pad 151a and one second conductive pad 152a are disposed adjacent to each other, the other first conductive pad 151b and the other second conductive pad 152b are disposed adjacent to each other, two ends of the first coil 131 are respectively connected to the first conductive pad 151a and the first conductive pad 151b, and two ends of the second coil 132 are respectively connected to the second conductive pad 152a and the second conductive pad 152 b.

Alternatively, the first

conductive pads

151a and 151b connected to both ends of the first coil 131 are both power input terminals of the first coil 131, and the second

conductive pads

152a and 152b connected to both ends of the second coil 132 are both power input terminals of the second coil 132. Alternatively, the heating thick film 10 further includes a temperature controller (not shown), wherein one of the first conductive pads 151b and one of the second conductive pads 152b are respectively connected to two pins of the temperature controller and are selectively electrically conducted through the temperature controller. The temperature controller may detect a current heating temperature, and is configured to maintain electrical conduction between the first conductive pad 151b and the second conductive pad 152b when the current heating temperature does not reach a preset temperature, the first conductive pad 151a and the second conductive pad 152a serve as power input terminals of the heat generating coil 13, and when the current heating temperature reaches or exceeds the preset temperature, the electrical conduction between the first conductive pad 151b and the second conductive pad 152b is disconnected, the heat generating coil 13 is no longer powered, and the heating of the heating thick film 10 is stopped.

Alternatively, the heating of the thick film 10 may not be provided with a temperature controller, and herein, one of the first conductive pads 151b and one of the second conductive pads 152b may also be electrically conducted.

Embodiments of the present application also provide a heating apparatus including the heating thick film 10 of any of the above embodiments, thereby having corresponding advantageous effects of the heating thick film 10.

The heating device may be embodied in various specific forms, including but not limited to: electric heating kettle, soybean milk machine, milk heating equipment, heat preservation box, etc.

It should be understood that the above-mentioned embodiments are only some examples of the present application, and not intended to limit the scope of the present application, and all equivalent structural changes made by using the contents of the present specification and the attached drawings are included in the scope of the present application.

Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element, and that elements, features, or elements having the same designation in different embodiments may or may not have the same meaning as that of the other elements, and that the particular meaning will be determined by its interpretation in the particular embodiment or by its context in further embodiments.

In addition, in the description of the embodiments of the present application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing technical solutions and simplifying the description of the respective embodiments of the present application, and do not indicate or imply that a device or an element must have a specific orientation, be configured and operated in a specific orientation, and thus, cannot be construed as limiting the present application.

Although the terms "first, second, third, etc. are used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well. The terms "or" and/or "are to be construed as inclusive or meaning any one or any combination. An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.

Claims

1. A heated thick film, comprising:

a substrate base material;

an insulating layer; the substrate is arranged on one surface of the substrate base material;

the heating coils are distributed on the insulating layer in a surrounding mode, the cross section area of the conducting wire of each heating coil is gradually increased along the direction of the edge of the substrate base material towards the center, and the electrical resistivity of the conducting wire of each heating coil is the same;

and the packaging layer is arranged on the substrate base material and covers the heating coil.

2. The heated thick film of claim 1, wherein the heat generating coil comprises a first coil and a second coil that are non-overlapping in a direction perpendicular to the substrate base.

3. The heated thick film of claim 2, wherein the first coil and the second coil are disposed on the same radius of the heat generating coil.

4. The heated thick film of claim 3, wherein the first coil and the second coil have equal wire cross-sectional areas on the same radius of the heat generating coil.

5. The heated thick film of claim 3, further comprising a plurality of first and second electrically conductive pads, said first electrically conductive pad being connected to both ends of said first coil, said second electrically conductive pad being connected to both ends of said second coil.

6. The heated thick film of claim 5, wherein one of the first electrically conductive pads is in electrical communication with one of the second electrically conductive pads.

7. The heated thick film of claim 6, further comprising a temperature controller, wherein said one of said first conductive pads and said one of said second conductive pads are connected to two pins of said temperature controller, respectively, and are selectively electrically conductive through said temperature controller.

8. The heated thick film of claim 6 wherein the first electrically conductive pads connected to both ends of the first coil are both power input terminals of the first coil and the second electrically conductive pads connected to both ends of the second coil are both power input terminals of the second coil.

9. The heated thick film of claim 1, wherein the substrate base comprises a metal base plate.

10. A heating device, wherein said heating device comprises a heated thick film according to any one of claims 1 to 9.