201040994 六、發明說明： 【發明所屬之技術領域】 —種堆疊式線圈以及製造該堆疊式線圈的方法，特別是指一種利 用至少一片狀基板鋪設線路而形成的線圈，以及一種形成該線圈的製 造方法》 【先前技術】201040994 VI. Description of the Invention: [Technical Field of the Invention] A stacked coil and a method of manufacturing the same, in particular, a coil formed by laying a circuit with at least one piece of substrate, and a coil forming the coil Manufacturing Method》 [Prior Art]
GG
各種電氣用品中大量的使用各類的線圈，纏繞的線圈可應用於電 感器、遽波器、變壓器等等利用電磁感應原理之元件。而習知的電感 如中華民國專利公告第460027號「具多空氣隙之電感」，該案所揭示 的電感由一線架、一鐵芯組以及繞線於該線架上的線圈所構成，該先 前專利為常見的習知電感，故其原理就不再贅述。但由於鐵芯組與線 架需佔用一定的體積，不便使用於薄型、小型化的產品。 為了適用於小型化產品，另一型態的電感亦不斷發展，如中華民 國專利證書第顧2757號「大電流電祕構改良」，透過_多邊形磁棒 纏繞螺旋線圈’兩者由一中空的磁框覆蓋後由一接著劑將該多邊形 磁棒固定於4磁框中。此型的電感結構可大幅縮小電感之體積與高 度因此可叹置於小型化產品中。為了要進一步降低電感的高度，後 來更將線圈改為扁平狀，如中華民國專利證書第黯細號的「扁平 ^線圈之電^」’其中該電感器是由—導磁座以及—線圈組所構成， 、中線圈組是由扁平圈繞式導電線材形成，在該输創作的圖中可見 j作糊扁平圏繞轉電線材可令整體的高度更低，更.薄型化 用雷翁錢到薄型化的效果，更從扁平式關發展為利 侧22號「平㈤^銅喊為繞線_技術，如巾華民目專利公告第 侧22说千面電路板式 電感或變壓器是由多居―㈣及其^方法」猶案揭不了 夕騎刷電路板所構成，該印刷電路板於至少-表 3 201040994 面上形成有銅線路可視為鱗，各騎刷電路板姐壓合，並使銅線 路電性連接，構成-次繞組與二次繞组。在其可見，每一印刷 電路板只在-表面上鋪設銅線路，為了使上下相對壓合的銅線路得以 電性連接’ 每-_板上的崎路雜料有麵的差異， 一個電感或變壓器就必須使用多種相異銅線路圖案的印刷電路板堆叠 而成k成&树間與製4；成本的浪費，且不便於隨錢更電感或變 壓器的繞圈數。 雖利用印猶路娜舞成賴Μ公開之技術，但習知堆疊式 線圈的多個_電路板鋪設多個相異崎路祕造成成本上升。再 者’由於印猶路板_、祕是贱設計祕搭崎應的銅線 路，因此不利用變更繞圈數，因此仍有待改善。 【發明内容】 有鐘於前述習知技術，本案之目的在於提供一種線圈結構，以求 達到善用印刷電路板面積且降低大量生產的時間與成本，再更進一步 具有便於改變繞圈數的優點。 本案為-種堆疊式線_及製_堆疊式賴的方法，其令該堆 叠式線圈係由複數線圖案的基板堆叠而成，該堆叠式線圈包括 至少一内層基板、-上層基板以及一下層基板，其中該内層基板分別 在—第一表面以及一第二表面鋪設電性連接的一第一導線圖案與—第 =導線圖案，且相異内層基板之間電性連接。該上層基板與下層基板 分別設一第三導線圖案與一第四導線圖案，並且該上、下層基板分別 覆蓋於該内層基板的外緣，該第三、第四導線_與該内層基板電性 連接，藉此可相互電性連接而等效形成導通的線圈，該第三、第四導 線圖案再各自設有一外部連接端點與其他元件連接。藉此該堆疊式線 圈可善用印刷電路板的面積，並且由於複數内層基板的兩表面均鋪設 相同的第一導線圖案或第二導線圖案，使得製備該内層基板的成本降 201040994 低、速度加快，並且得依據需求而增減内層基板堆疊之數量而改變繞 圈數。 綜上所述’本案至少具有以下之優點： 1. 善用内層基板的兩表面鋪設銅線，在相同繞圈數下可減少厚度、 減少印刷電路板的成本。 2. 複數基板的同側採用相同的導線圖案，利於大量生產並改善了生 產速度。 3·可依據需求而增減内層基板堆疊之數量而改變繞圈數。 【實施方式】 ® 本案為-種堆疊式線圈以及製造該堆疊式線圈的方法，以下先行 揭示該堆疊式線圈的結構，本案之第一個實施例請先行參閱圖i與圖 2，圖1與圖2為所示為第一個實施例於不同視角的分解圖。該堆疊式 線圈包含至少一内層基板2 ’以及分別覆蓋於該内層基板2上、下外緣 的-上層基板1與-下層基板3。該内層基板2具有相對的—第—表面 以及-第二表面’而每一内層基板2的第一表面上鋪設相同的第一導 線圖案22 ’第二表面鋪設相同的第二導線圖案23，該第一導線圖案u 與第二導線圖案23各別具有一電接點222、232以及一第二端點221、 © 23卜其中第一導線圖案22與第二導線圖案23的第二端點如、231 電性連接，當該堆疊式線圏只包含一片内層基板2時，該片内層基板2 的電接點222、232與該上層基板卜下層基板3電性連接，其中該内 層基板2與該上、下層基板卜3電性連接之方式稍後再詳述。當該堆 疊式線圈包含複數内層基板2時，該電接點從、232則電性連接相鄰 的内層基板2或上、下層基板卜3 (最外層的内層基板2各有一面與 該上、下層基板1、3相鄰）。 同樣請參閲圖1與圖2，同一内層基板2上第…第二導線圖宰 22、23電性連接的方式可見於圖丨、圖2，該⑽基板2設—貫孔％， 5 201040994 利用-導電填充物25裝設於該貫孔24巾以電性連接該第―、第二導 線圖案22、23的第二端點221、23卜且如圖}、2中所示，該導轉 充物25可為-金屬端子。而相_層基板2之_連接關係請參閱圖 3-i與圖3-2,其中為確保該内層基板2表面的第一、第二導線圖案η、 23不會與另-導_案接觸而短路，該⑽基板2會在表面上塗佈一 絕緣層4 ’令兩内層基板2之間由該絕緣層4區隔，而該絕緣層*具有 -缺口對齊該電接點222，該缺口中先行錫珠5〇，當另一_ 基板2疊上並-起送進迴焊爐後，該錫珠％麻融填滿該缺口而形二 -導電層51並令該第-導線圖案22之電接點222與另一内層基板2 的電接點232電性連接’使相鄰内層基板2之第一、第二導線圖案η、 23等效形成-串聯的繞線。在堆疊多個内層基板2後，多個内 2的上端設置該上層基板卜該上層基板丨的下表面鋪設—第三導ς 案12 ’多個内層基板2的下端設置該下層基板3，該下層基板3具有 一上表面铺設一第四導線圖案32’該第三導線圖案12以及該第四導線 圖案32皆具有—電接點122、從，該第三導線圖案12的電接點122 與相鄰内層基板2的第-導線圖案22的電接點從電性連接；該第四 導線圖案32的電接點322與相鄰内層基板2的第二導線圖案 接點232電性連接’使該第三、第四導線圖案12、與該第一二 導線圖案22、23等效形成—串聯的、賴^至此，上述之上層基板1、 =基:2、下層基板3層疊形成一線圈組’該上、下層基板卜3的 、四導電圖案丨2’可為相同或不相同，該上層基板1與下層 f具有外部連接端點321作為該線亂组輸入或輸出的端點， 二Γ接端點121'321可依客戶需求而延伸出一金屬接腳，或者該 ^接祕m、321可延伸其接觸面至侧緣或外緣，形成一表面黏 ^ ) §樣。再者’該上層基板卜内層基板2、下層基板3可 各開設-開口 [2卜31預留給—_穿過。 201040994 該堆疊式線圈的另一實施例請參閱圖4與圖5,該實施例揭示内層 基板2的第一導線圖案22與第二導線圖案23可透過一導電夾片60接 觸而導通’如圖4所示，該導電夾片60具有兩接點6〇1，且彎折而適 於夾持該内層基板2 ’夾持該内層基板2兩接點6〇1分別接觸兩第二端 點22卜231 ’進而形成導通路徑。而實際形成多個内層基板2堆疊可 借助一治具6，請參閱圖5，圖5中可見一治具6設有複數個夾槽，每 一夾槽内容置一導電失片60 (如圖4所示的導電夾片60)，當内層基 板2插入該導電夾片60兩臂之間後，該内層基板2可受導電夾片6〇 固定’且該内層基板2的第一導線圖案22、第二導線圖案23藉由該導 電夾片60而電性連接，並藉該治具6使相鄰的内層基板2具有區隔之 空間。 上述結構可透過以下的製造方法來形成：（a)製備一個以上的基 板組，其中該基板組包含至少一片内層基板2c(b)依選定的繞圈數而 決定所需堆疊的基板組數量，並由一基板組重覆堆疊且電性連接另一 基板組直藝合蚊之級減量。（e)在前—步麟刺複數基板 組外緣分猶接-上層基板丨以及—τ層基板3，並且該上層基板i 與下層基板3雜連接賴絲板組。其巾製倾⑽基板2是在一 印刷電路板之-表面佈線設置複數個間_第—導線贿22，在另一 表面的對應位置佈線設置複數個間隔的第二導線圖案23，其中設置該 第導線圖案22與第二導線圖案23時，各在該第一導線圖案22與第 二導線圖案23上設至少-電接點222、232與一第二端點功、说。 並依導線難為單仙㈣具有—第—導_案η與第二導線圖案 23的複數内層基板2，並令複數内層基板2電性連接形成該基板組。 而該上、下層基板丨、3亦是以相似的程序產生，與内層基板2的差別 在於該上、下層基板丨、3僅在—表面上鋪設該第三導案U與第 四導電圖案32 ’而非内層基板2的雙面佈線^上述的過程中，設置導 7 201040994 線圖案之前或之後皆可預先在複數成形_層基板 2與上、下層基板 1、3上設-開口 2卜1卜3卜以預留鐵芯穿過之空間。 上述方法的實施π意圖請參閱圖6，在製備複數内層基板2後，設 定三片内層基板2相互電性連接而形成一基板、组2〇 (此處為一舉例， 該基板組20可包含-片，或者多片内層基板2)，假設客戶訂製的線圈 繞圈數經估算後使用兩基板組2〇堆叠，並配合上、下層基板卜3即 足夠。而兩基板組20與上、下層基板卜3可視焊接器材或熱度而決 定是否要-起送人迴焊爐⑴或者可分錢行，先將__基板組 20送入迴焊爐中焊接，再重複焊接其他基板組2〇或上、下層基板卜 3。在圖6中之基板組2〇與上、下層基板丨、3 一次或多次焊接後即形 成整體之堆疊式_，舞#式_可再依客戶f求秘伸出接 裝設鐵芯。 上述之堆疊錢_及轉造該堆疊式_的方法至 以下優點： 、 1. 内層基板2兩個表面上都鋪設了導電線路，不僅善用了該内層基 板2的面積’在同樣的繞酿下該堆疊式線圈之厚度較薄，在相同的 厚度下可提供近兩倍的繞圈數。 2. 由於複數内層基板2的同一侧都印刷相同的導電線路，因此可如 前述製造方法所述’峰少的成本大量且快速的生產勒層基板2。 3. 再如前述製造方法’基板組2G _量可隨客戶料而不斷堆疊 ^層基板2且-次或分為多次的焊接絲，由於導電圖案是被 可以不斷堆疊且電性連接的，故内層基板2可隨時 雖然本發日狀較趙_揭露如上，然錢翻崎定ς發明， 任何熟習此祕者，林雜本·之精神和範㈣，㈣作之 更動與潤飾’皆應涵蓋於本發日种，因此本發明之 後附 之申請專利範騎界定者為準。 _ «視_ 201040994 .㈣述’樓㈣知之卿增遠上遽功效, ^性及進步性之蚊m料读件，纽 准本件㈣專利帽案4 出申 【圖式簡單說明】 m喼便。 η 應巳充分符合新 ，想請貴顿 Ο 圖1為本案第一實施例分解圖（一）。圖2為本案第一實施例分解圖（二）。 圖3-1為兩内層基板連接之示意圖㈠。 圖3-2為兩内層基板連接之示意圖（二）。 圖4為本案另—實施例之·連接示意圖。 圖5為本案另-實施例剖面示意圖。圖6為多個基板峰疊的示意圖。【主要元件符號說明】A large number of coils are used in various electrical appliances, and the wound coils can be applied to components using electromagnetic induction principles such as inductors, choppers, transformers, and the like. The conventional inductor is, for example, the Republic of China Patent Publication No. 460027 "Inductance with multiple air gaps". The inductance disclosed in the present case is composed of a wire frame, a core group and a coil wound on the wire frame. The prior patents are common conventional inductors, so the principle will not be described again. However, since the iron core group and the wire frame need to occupy a certain volume, it is inconvenient to use for a thin and small product. In order to be suitable for miniaturized products, another type of inductance has been continuously developed. For example, the Republic of China Patent Certificate No. 2757 "High Current Electric Structure Improvement", through a _ polygonal magnetic rod wound spiral coil 'both by a hollow After the magnetic frame is covered, the polygonal magnetic bar is fixed in the 4 magnetic frame by an adhesive. This type of inductive structure can greatly reduce the size and height of the inductor, so it can be placed in a miniaturized product. In order to further reduce the height of the inductor, the coil is later changed to a flat shape, such as the "flat ^ coil electric ^" of the Republic of China Patent Certificate No. ', where the inductor is composed of - the magnetic base and the coil set The middle coil group is formed by a flat coil-wound conductive wire. In the figure of the creation, it can be seen that the paste is flat and twisted, and the electric wire can make the overall height lower, and the thinner type can be used for the León money. To the effect of thinning, it has developed from the flat type to the side of the 22nd "flat (five) ^ copper shouting for winding _ technology, such as the towel Huaminu patent announcement side 22 said thousands of circuit board inductors or transformers are from more The residence-(four) and its method can not be used to form a circuit board. The printed circuit board can be seen as a scale on at least the surface of the 201040994 surface, and each of the rider boards is pressed and pressed. The copper lines are electrically connected to form a secondary winding and a secondary winding. In it, it can be seen that each printed circuit board only lays copper lines on the surface, in order to make the copper lines of the upper and lower press-fits electrically connected to each other. Transformers must use a variety of printed circuit boards with different copper circuit patterns to form a stack of & inter-tree and system 4; cost waste, and it is not convenient to more inductance or transformer windings. Although the use of Indoluna dances into Lai's open technology, it is known that the stacking of multiple coils of a plurality of boards is costly. Furthermore, because the Indian road plate _, the secret is the design of the secret copper line, it is not necessary to change the number of turns, so there is still room for improvement. SUMMARY OF THE INVENTION In the prior art, the purpose of the present invention is to provide a coil structure for achieving the use of a printed circuit board area and reducing the time and cost of mass production, and further having the advantage of facilitating the change of the number of turns. . The present invention is a method of stacking a wire and stacking a stack, wherein the stacked coil is formed by stacking substrates of a plurality of line patterns, the stacked coil including at least one inner substrate, an upper substrate, and a lower layer. The substrate, wherein the inner substrate is electrically connected to the first surface and the second surface, respectively, and a first conductive pattern and a first conductive pattern are electrically connected. The upper substrate and the lower substrate are respectively provided with a third conductive pattern and a fourth conductive pattern, and the upper and lower substrates respectively cover the outer edge of the inner substrate, and the third and fourth conductive lines are electrically connected to the inner substrate. The connections are electrically connected to each other to form an electrically conductive coil, and the third and fourth conductor patterns are each provided with an external connection terminal to be connected to other components. Therefore, the stacked coil can make good use of the area of the printed circuit board, and since the same first conductive pattern or the second conductive pattern is laid on both surfaces of the plurality of inner substrates, the cost of preparing the inner substrate is reduced by 201040994, and the speed is accelerated. And it is necessary to increase or decrease the number of inner substrate stacks according to the demand and change the number of turns. In summary, the present invention has at least the following advantages: 1. The copper wire is laid on both surfaces of the inner substrate, and the thickness can be reduced and the cost of the printed circuit board can be reduced under the same number of turns. 2. The same conductor pattern is used on the same side of the multiple substrates, which facilitates mass production and improves production speed. 3. The number of windings can be changed by increasing or decreasing the number of inner substrate stacks according to requirements. [Embodiment] ® The present invention is a stacked coil and a method for manufacturing the stacked coil. The structure of the stacked coil is disclosed in the following. For the first embodiment of the present application, please refer to FIG. 1 and FIG. 2, FIG. 1 and FIG. Figure 2 is an exploded view showing the first embodiment at different viewing angles. The stacked coil includes at least one inner substrate 2' and an upper substrate 1 and a lower substrate 3 covering the upper and lower outer edges of the inner substrate 2, respectively. The inner substrate 2 has opposite first surface and second surface ', and the same first conductive pattern 22' is laid on the first surface of each inner substrate 2; the second surface is laid with the same second conductive pattern 23, The first wire pattern u and the second wire pattern 23 respectively have an electrical contact 222, 232 and a second end point 221, wherein the second end point of the first wire pattern 22 and the second wire pattern 23 is The electrical connection 222, 232 of the inner substrate 2 is electrically connected to the upper substrate 3, wherein the inner substrate 2 and the inner substrate 2 are electrically connected to each other. The manner in which the upper and lower substrates are electrically connected will be described in detail later. When the stacked coil includes a plurality of inner substrates 2, the electrical contacts are electrically connected to the adjacent inner substrate 2 or the upper and lower substrates 3 (the outermost inner substrate 2 has one side and the upper side, The lower substrates 1, 3 are adjacent). Referring to FIG. 1 and FIG. 2 , the second electrical wiring of the second inner conductor 2 on the same inner substrate 2 can be seen in FIG. 2 and FIG. 2 , and the (10) substrate 2 is provided with a through hole %, 5 201040994. The conductive pad 25 is mounted on the through hole 24 to electrically connect the second end points 221, 23 of the first and second wire patterns 22, 23 and is as shown in FIG. The turn 25 can be a metal terminal. For the connection relationship of the phase substrate 2, please refer to FIG. 3-i and FIG. 3-2, in order to ensure that the first and second wire patterns η, 23 on the surface of the inner substrate 2 are not in contact with the other. In the case of a short circuit, the (10) substrate 2 is coated with an insulating layer 4 ′ on the surface, so that the two inner substrate 2 are separated by the insulating layer 4, and the insulating layer* has a notch aligned with the electrical contact 222. After the other _ substrate 2 is stacked and fed into the reflow furnace, the solder ball fills the gap and forms the second conductive layer 51 and causes the first-conductor pattern 22 The electrical contacts 222 are electrically connected to the electrical contacts 232 of the other inner substrate 2 to make the first and second conductive patterns η, 23 of the adjacent inner substrate 2 equivalently form a series-connected winding. After stacking the plurality of inner substrate 2, the upper substrate of the plurality of inner portions 2 is provided with the lower surface of the upper substrate —. The third conductive film 12 is disposed at the lower end of the plurality of inner substrate 2, and the lower substrate 3 is disposed. The lower substrate 3 has an upper surface and a fourth conductive pattern 32 ′. The third conductive pattern 12 and the fourth conductive pattern 32 both have an electrical contact 122 and an electrical contact 122 of the third conductive pattern 12 . The electrical contacts of the first conductor pattern 22 of the adjacent inner substrate 2 are electrically connected; the electrical contacts 322 of the fourth conductor pattern 32 are electrically connected to the second conductor pattern contacts 232 of the adjacent inner substrate 2 The third and fourth conductive patterns 12 are formed in a series-equal manner with the first two-conductor patterns 22 and 23, and the upper substrate 1, the base: 2, and the lower substrate 3 are laminated to form a coil. The group of the upper and lower substrates 3, the four conductive patterns 丨2' may be the same or different, and the upper substrate 1 and the lower layer f have external connection terminals 321 as the end points of the input or output of the line group, The connection end point 121'321 can extend a metal pin according to customer requirements Or the access secret ^ m, 321 can extend to the side contact surface or outer edge, forming a sticky surface ^) § like. Furthermore, the upper substrate, the inner substrate 2, and the lower substrate 3 can be opened and opened. 201040994 Another embodiment of the stacked coil is shown in FIG. 4 and FIG. 5. The embodiment discloses that the first conductive pattern 22 of the inner substrate 2 and the second conductive pattern 23 are electrically connected to each other through a conductive clip 60. As shown in FIG. 4, the conductive clip 60 has two contacts 6〇1 and is bent to clamp the inner substrate 2'. The inner substrate 2 is clamped. The two contacts 6〇1 respectively contact the two second ends 22 231' further forms a conduction path. The actual formation of a plurality of inner substrate 2 stacks can be performed by means of a jig 6. Referring to FIG. 5, it can be seen that a jig 6 is provided with a plurality of clamping slots, and each of the clamping slots is provided with a conductive missing piece 60 (as shown in the figure). 4, the conductive clip 60), after the inner substrate 2 is inserted between the arms of the conductive clip 60, the inner substrate 2 can be fixed by the conductive clip 6' and the first conductive pattern 22 of the inner substrate 2 The second wire pattern 23 is electrically connected by the conductive clip 60, and the adjacent inner substrate 2 has a space for partitioning by the jig 6. The above structure can be formed by the following manufacturing method: (a) preparing one or more substrate groups, wherein the substrate group includes at least one inner substrate 2c (b) determining the number of substrate groups to be stacked according to the selected number of turns, And the stacking is repeated by one substrate group and electrically connected to another substrate group to reduce the level of the mosquito. (e) The outer edge of the front-step lining substrate group is connected to the upper substrate 丨 and the τ layer substrate 3, and the upper substrate i and the lower substrate 3 are connected to the ray plate group. The towel tilting (10) substrate 2 is provided with a plurality of inter-wires 22 on a surface of the printed circuit board, and a plurality of spaced second wire patterns 23 are disposed at corresponding positions on the other surface. In the case of the first wire pattern 22 and the second wire pattern 23, at least the electrical contacts 222, 232 and a second terminal are provided on the first wire pattern 22 and the second wire pattern 23, respectively. And the plurality of inner substrate 2 having the first and second conductive patterns 23 and the plurality of inner substrate 2 are electrically connected to each other to form the substrate group. The upper and lower substrates 丨, 3 are also produced by a similar procedure, and the difference from the inner substrate 2 is that the upper and lower substrates 丨, 3 are only laid on the surface of the third guide U and the fourth conductive pattern 32. 'The double-sided wiring of the inner substrate 2 is not provided. In the above process, before or after the line pattern of the guide line 2010 201004994, the plurality of forming substrates 1 and the upper and lower substrates 1 and 3 may be provided in advance - the opening 2 Bu 3 Bu to reserve the space through which the iron core passes. For the implementation of the above method, please refer to FIG. 6. After preparing the plurality of inner substrate 2, three inner substrate 2 are electrically connected to each other to form a substrate and a group 2 (here, for example, the substrate group 20 may include - Sheet, or a plurality of inner substrate 2), assuming that the number of coils customized by the customer is estimated to be stacked using two substrate groups 2, and it is sufficient to match the upper and lower substrates. And the two substrate groups 20 and the upper and lower substrates, 3 visual welding equipment or heat determine whether to send the reflow furnace (1) or can be divided into money, first send the __ substrate group 20 into the reflow furnace for welding, The other substrate group 2 〇 or the upper and lower substrate 卜 3 are repeatedly soldered. In Fig. 6, the substrate group 2〇 and the upper and lower substrates 丨, 3 are welded one or more times to form an integral stacked type _, and the dance type _ can be extended to the user to provide a core. The above-mentioned stacking money_and the method of converting the stacked type_ have the following advantages: 1. The conductive substrate is laid on both surfaces of the inner substrate 2, and the area of the inner substrate 2 is not only utilized in the same winding The stacked coils are thinner in thickness and provide nearly twice the number of turns at the same thickness. 2. Since the same conductive line is printed on the same side of the plurality of inner substrate 2, the layered substrate 2 can be mass-produced in a large amount and at a low cost as described in the foregoing manufacturing method. 3. As in the foregoing manufacturing method, the substrate group 2G_ can be continuously stacked with the customer substrate and the soldering wire is divided into multiple times or divided into multiple times. Since the conductive patterns are continuously stacked and electrically connected, Therefore, the inner substrate 2 can be exposed at any time, although the hair is more like Zhao _ exposes the above, but the money is turned into an invention. Anyone who is familiar with this secret, Lin Zaoben's spirit and fan (4), (4) make changes and retouching' should cover It is to be taken on the date of this issue, and therefore the patent application is bound by the definition of the patent application. _ «视_ 201040994 . (d) 〗 〖Floor (four) Zhizhi Qing Zengyuan Shangyu effect, ^ sexual and progressive mosquito m material reading, New Zealand standard (four) patent cap case 4 out of the application [simplified diagram] m喼. η should be fully in line with the new one, and I would like to ask for it. Figure 1 is an exploded view of the first embodiment of the case (1). Figure 2 is an exploded view (2) of the first embodiment of the present invention. Figure 3-1 is a schematic view of the connection of two inner substrates (1). Figure 3-2 is a schematic view of the connection of two inner substrates (2). Fig. 4 is a schematic view showing the connection of another embodiment of the present invention. Figure 5 is a cross-sectional view showing another embodiment of the present invention. Figure 6 is a schematic illustration of a plurality of substrate peak stacks. [Main component symbol description]
...上層基板 11 .. •·..開口 12 ·. ....第三導線圖案 121 ·. •.·.外部連接端點 122 .. •···電接點 20 .. •···基板組 2 .. ....内層基板 21 ·. •·.·開口 22 ·. ....第一導線圖案 221 .. ....第二端點 222 . · ’ ‘ .·電接點 23 .. ....第二導線圖案 231 .. ....第二端點 232 · · • ·.，電接點 9 201040994 24 · · · • · ·貫孔 25 · · · •··導電填充物 3 · · · •··下層基板 31 · · · • ••開 口 32 · · · • ··第四導線圖案 321 ... •••外部連接端點 322 ·· · ...電接點 4 · · · ..·絕緣層 50 · ·. • · ·錫珠 51 · · · ...導電層 6 · · · • · ·治具 60 · · · •••導電夾片 601 ... • ••接點 10...upper substrate 11 .. •·.. opening 12 ·.....third wire pattern 121 ·..... external connection terminal 122 .. •···electrical contact 20 .. •· ·································································· Electrical contact 23 .. .... second wire pattern 231 .. .... second end point 232 · · · ·, electric contact 9 201040994 24 · · · · · · through hole 25 · · · •···················································································· .. Electrical Contact 4 · · · · Insulation 50 · · · · · · Tin Bead 51 · · · ... Conductive Layer 6 · · · · · · Fixture 60 · · · ••• Conductive Clip Sheet 601 ... • •• Contact 10