200847859 九、發明說明： 【發明所屬之技術領域】 本發明係一種電子組件，尤其是一種平面變壓器或平 面電感，本發明之電子組件具有至少一個核心及至少一個 有配備電子元件的主要印刷電路板。 【先前技術】 本發明的電子組件特別是指一種平面變壓器或平面電 感。由於電子器材的發展趨勢是體積變得愈來愈小，因此 平面變壓器在供電及信號傳輸等領域的重要性也日益上 升。平面變壓器和傳統變壓器一樣都具有一個初級繞組及 至少一個次級繞組，而且初級繞組及次級繞組經由一個由 一頂部及一底部構成之核心（例如鐵氧體核心）電感耦合。 設置在變壓器中的初級繞組及次級繞組被此是電絕緣的。 和傳統變壓器不一樣的地方是，平面變壓器是將繞組製作 成以平面方式位於印刷電路板上的印刷導線。平面變壓器 的特徵是效率很高及功率密度很高。可傳輸的功率範圍從 數瓦到數仟瓦。由於變壓比大、具有許多繞組、電壓負載 或電流負載很高、以及繞組的線圈間距很大或印刷導線的 寬度很大，因此這一類平面變壓器具有以下的缺點是需要 使用複雜且昂貴的多層印刷電路板’因爲只有多層印刷電 路板能夠在變壓器涵蓋的範圍內具有足夠的有效印刷電路 板面積。 【發明內容】 本發明之目的是提出一種電子組件’相較於傳統電子 200847859 組件，本發明之電子組件不但成本較低，而且佔用的空間 也比較小。 爲達到上述目的，本發明提出一種電子組件，尤其是 一種平面變壓器或平面電感，此種電子組件具有至少一個 核心及至少一個有配備電子元件的主要印刷電路板，其中 主要印刷電路板具有至少一個次要印刷電路板，而且主要 印刷電路板及次要印刷電路板均具有設置在核心區域的由 印刷導線構成的繞組/線圈。變壓器的繞組是由設置在主要 印刷電路板及至少一個次要印刷電路板的線圈構成。本發 明之各種有利的實施方式記載於附屬申請專利項目中。 本發明的方法是在核心的自由斷面配置多個印刷電路 板，其中有一個是主要印刷電路板。例如可以用一個其上 另外設有一個雙層次要印刷電路板的雙層主要印刷電路板 來取代在兩個半核心之間單獨設置一個多層印刷電路板 (例如4層印刷電路板）的作法。這樣就不必使用成本較高 的多層印刷電路板。爲了降低平面變壓器的製造成本，現 有技術的作法是僅在鐵氧體核心中設置一個比主要印刷電 路板小的多層印刷電路板作爲次要印刷電路板，並由這個 次要印刷電路板與鐵氧體核心構成平面變壓器。然後將由 位於核心內的多層印刷電路板構成的平面變壓器像一般的 電子組件一樣安裝在主要印刷電路板。這樣作爲電路元件 之載體的主要印刷電路板就可以用成本較低的印刷電路板 (例如雙層印刷電路板）。這種傳統平面變壓器的缺點是總 體積較大，而且安裝很費事。相較於現有技術，本發明的 200847859 ， 平面電子組件的主要印刷電路板及至少一個次要印刷電路 板有部分區段是設置在核心內，因此不但結構較爲緊密， 所佔用的空間也比較小。爲了構成不同的電路，主要印刷 電路板可以搭備不同的次要印刷電路板，因此可以在不需 更改主要印刷電路板的情況下構成不同的電路。也就是說 雖然只有單獨一個主要印刷電路板，但是可以在這個主要 印刷電路板上安裝不同的次要印刷電路板。應用於構成不 同電路之次要印刷電路板不僅可以在構造上有所不同，數 • 量也可以不一樣。例如應用在電燈技術上可以用較低的成 本爲不同的電燈製造出以相同之電路設計爲基礎的不同的 電子鎭流器（EVG)。例如安裝在汽車上的含汞放電燈及不含 汞放電燈所使用的電子鎭流器。 核心最好是具有一個頂部，該頂部與底部構成一個至 少能夠容納主要印刷電路板及至少一個次要印刷電路板之 部分區段的間隙。所使用的核心最好是一種鐵氧體核心。 另外一個優點是，當主要印刷電路板及/或次要印刷電 ^ 路板被設計成雙層印刷電路板時，更能降低成本。200847859 IX. The invention relates to: an electronic component, in particular a planar transformer or a planar inductor, the electronic component of the invention having at least one core and at least one main printed circuit board equipped with electronic components . [Prior Art] The electronic component of the present invention particularly refers to a planar transformer or planar inductor. As the trend of electronic equipment is getting smaller and smaller, the importance of planar transformers in the fields of power supply and signal transmission is also increasing. A planar transformer, like a conventional transformer, has a primary winding and at least one secondary winding, and the primary and secondary windings are inductively coupled via a core (e.g., a ferrite core) formed by a top and a bottom. The primary winding and the secondary winding disposed in the transformer are electrically insulated. Unlike conventional transformers, planar transformers are printed conductors that are fabricated in a planar manner on a printed circuit board. Planar transformers are characterized by high efficiency and high power density. The power that can be transmitted ranges from a few watts to a few watts. Due to the large transformer ratio, many windings, high voltage loads or current loads, and large coil spacing or large printed conductor widths, this type of planar transformer has the disadvantage of requiring complex and expensive multilayers. Printed circuit board 'because only multilayer printed circuit boards have enough effective printed circuit board area within the range covered by the transformer. SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component 'as compared to the conventional electronic 200847859 component. The electronic component of the present invention is not only low in cost but also takes up less space. In order to achieve the above object, the present invention provides an electronic component, in particular a planar transformer or a planar inductor, the electronic component having at least one core and at least one main printed circuit board having electronic components, wherein the main printed circuit board has at least one The secondary printed circuit board, and the primary printed circuit board and the secondary printed circuit board each have windings/coils formed of printed wires disposed in the core region. The windings of the transformer are comprised of coils disposed on a primary printed circuit board and at least one secondary printed circuit board. Various advantageous embodiments of the invention are described in the dependent patent application. The method of the present invention is to arrange a plurality of printed circuit boards in a free section of the core, one of which is the main printed circuit board. For example, a double-layer main printed circuit board on which a double-layer printed circuit board is additionally provided can be used instead of separately providing a multilayer printed circuit board (for example, a 4-layer printed circuit board) between the two half cores. . This eliminates the need for costly multilayer printed circuit boards. In order to reduce the manufacturing cost of the planar transformer, it is a prior art practice to provide only a multilayer printed circuit board smaller than the main printed circuit board in the ferrite core as the secondary printed circuit board, and the secondary printed circuit board and the iron The oxygen core constitutes a planar transformer. A planar transformer composed of a multilayer printed circuit board located in the core is then mounted on the main printed circuit board like a general electronic component. Thus, the main printed circuit board which is the carrier of the circuit component can be used with a lower cost printed circuit board (e.g., a double layer printed circuit board). The disadvantage of this conventional planar transformer is that the total volume is large and the installation is laborious. Compared with the prior art, the 200847859 of the present invention, the main printed circuit board of the planar electronic component and the at least one secondary printed circuit board have partial sections disposed in the core, so that the structure is relatively tight and the occupied space is also compared. small. In order to form different circuits, the main printed circuit board can be equipped with different secondary printed circuit boards, so that different circuits can be constructed without changing the main printed circuit board. This means that although there is only one single printed circuit board, different secondary printed circuit boards can be mounted on this main printed circuit board. Secondary printed circuit boards that are used to form different circuits can be constructed differently, and the number can vary. For example, the application of electric lamp technology can produce different electronic chokes (EVG) based on the same circuit design with lower cost for different lamps. For example, mercury-containing discharge lamps installed in automobiles and electronic chokes used in mercury-free discharge lamps. Preferably, the core has a top portion that defines a gap that is at least capable of accommodating portions of the primary printed circuit board and at least one of the secondary printed circuit boards. The core used is preferably a ferrite core. Another advantage is that when the primary printed circuit board and/or the secondary printed circuit board are designed as a two-layer printed circuit board, the cost can be further reduced.
本發明的一種有利的實施方式是將由多個具有絕緣裝 置之次要印刷電路板構成的一個堆疊設置在主要印刷電路 板上。例如絕緣裝置可以是不導電的塗漆層、絕緣紙、及/ 或絕緣膜。 I 如果是以絕緣薄膜作爲絕緣裝置’絕緣薄膜的兩面最 好都具有一個黏著區，以供次要印刷電路板彼此及/或主要 印刷電路板形成機械固定。使印刷電路板彼此形成機械固 200847859 定有助於簡化電子組件的安裝工作。 本發明的一種在製造上非常有利的實施方式是利用焊 接使印刷電路板彼此連接在一起。次要印刷電路板最好具 有至少一個供焊接在主要印刷電路板及/或另外一個次要 印刷電路板上之用的焊接墊。最好是將焊接墊設置在次要 印刷電路板的底面，而且可以和其他電子元件一樣經由焊 接墊以表面黏著（SMD)的方式將次要印刷電路板黏著在主 要印刷電路板的頂面上，然後再焊接在一起。如果要將多 個印刷電路板安裝在主要印刷電路板的一個面上，這些次 要印刷電路板可以經由其頂面及底面上的焊接墊彼此連接 在一起。各印刷電路板的絕緣裝置在有焊接墊的位置是中 斷的。 根據另外一種實施方式，主要印刷電路板的至少一個 次要印刷電路板是經由焊接的銷釘、鉚釘連接、或壓焊等 方式與主要印刷電路板及/或另外一個次要印刷電路板連 接在一起。 最好是將電流負載較大的繞組設置在主要印刷電路板 上，以避免強電流通過主要印刷電路板及次要印刷電路板 之間的連接元件/連接位置。如果次要電壓大於主電壓，則 最好是將初級繞組（輸入繞組）設置在主要印刷電路板上， 以及將次級繞組（輸出繞組）設置在次要印刷電路板上。 本發明的一種有利的實施方式是將漏電感需保持在非 常小的程度的繞組（尤其是閉變流器或通量變流器-變壓器 的初級繞組）設置在主要印刷電路板上。 200847859 由於平面變壓器的構造特別緊密，因此很適合應用在 汽車上，例如作爲電子高壓放電燈的鎭流器。 本發明的解決方案也可以應用於平面電感’在這種情 況下，電感的繞組最好是由主要印刷電路板及至少一個次 要印刷電路板的部分繞組所構成。也就是說，電感的繞組 被分散在多個印刷電路板上，而且主要印刷電路板也包括 在內。 【實施方式】 第1圖顯示平面變壓器（1)的一個縱斷面。平面變壓器 (1)主要是由一個核心（2)、一個供電子元件（未在第1圖中 繪出）安裝於其上之主要印刷電路板（4)、以及一個次要印刷 電路板（6)所構成，其中主要印刷電路板（4)及次要印刷電路 板（6)的部分區段被核心（2)環繞住。核心（2)是一種鐵氧體核 心。核心（2)分爲頂部（8)及底部（1 0)，且頂部（8)及底部（1 0) 之間形成一個至少能夠容納主要印刷電路板（4)及次要印 刷電路板（6)之部分區段的間隙（12)。因此無需使用成本較 高的多層印刷電路板。例如可以將一個雙層次要印刷電路 板（6)設置在一個雙層主要印刷電路板（4)上，以取代一個單 獨的4層印刷電路板。本發明的一種有利的實施方式（未繪 製在圖式中）是使用成本較低之層數較少的多層印刷電路 板，例如以兩個4層印刷電路板（其中一個作爲主要印刷電 路板，另外一個作爲次要印刷電路板），取代一個8層印刷 電路板。 平面變壓器（1)的構造特別緊密，因此很適合應用在汽 200847859 車上，例如作爲電子高壓放電燈的鎭流器。由於主要印刷 電路板（4)可以搭備不同的次要印刷電路板（16)，以構成不 同的電路，因此可以在不需更改主要印刷電路板（4)的情況 下構成不同的電路。因此可以用較低的成本爲不同的燈製 造出以相同之電路設計爲基礎的不同的電子鎭流器。 主要印刷電路板（4)及次要印刷電路板（6)均具有由印 刷導線（未在圖式中繪出）構成的繞組這些繞組構成平面變 壓器（1)的初級繞組及次級繞組。在本實施例中，次要印刷 • 電路板（6)是經由焊接的銷釘（18)與主要印刷電路板（4)連 接。除了可以將銷釘（18)焊接在印刷電路板（4，6)之上外， 另外一種可行的方式是利用壓入技術將將銷釘（1 8)壓入印 刷電路板（4，6)。這種技術是將彈性或剛性銷釘壓到印刷 電路板（4，6)上的公差很小且金屬化的鑽孔中。經由金屬 的塑性變形不需焊接即可產生很確實的導電連接。最好是 將電流負載較大的繞組設置在主要印刷電路板（4)上，這樣 強電流就不會通過主要印刷電路板（4)及次要印刷電路板 ^ (6)之間的銷釘（18)。例如基於這個原因，最好是將由汽車 之車用電源供應電流的初級繞組（輸入繞組）設置在主要印 刷電路板（4)上，以及將次級繞組（輸出繞組）設置在次要印 刷電路板（6)上。因此最好是將漏電感需保持在非常小的程 度的繞組，尤其是閉塞變流器或通量變流器-變壓器的初級 繞組，設置在主要印刷電路板（4)上。 根據本發明的一種未在圖式中繪出的平面變壓器（1) 的實施例，主要印刷電路板（4)是經由壓焊連接（例如經由接 -10- 200847859 合線）與次要印刷電路板（6)連接。 根據本發明的另外一種未在圖式中繪出的平面變壓器 (1)的實施例，主要印刷電路板（4)是經由鉚釘與次要印刷電 路板（6)連接。 主要印刷電路板（4)經由一絕緣薄膜與次要印刷電路 板（6)絕緣。一種有利的方式是絕緣薄膜（20)的兩面都具有 一個能夠在次要印刷電路板（6)及主要印刷電路板（4)之間 形成機械固定黏著區。另外一種可行的方式是以一個不導 電的塗漆層或絕緣紙作爲絕緣裝置。例如可以將多個由厚 度100/zm且兩面均具有一厚度35/zm之銅層及塗有絕緣 漆之FR4核心構成的雙層印刷電路板（4，6)堆疊在一起。 從第la圖顯示一個平面變壓器（1)的縱斷面圖可以看 出，平面變壓器（1)的3個具有絕緣裝置的雙層次要印刷電 路板（6，6a，6b)構成一個安裝在主要印刷電路板（4)之頂面 (1 4)上的堆疊。次要印刷電路板（6 a，6 b)的厚度小於次要印 刷電路板（6)的厚度。另外一種可行的方式是在主要印刷電 路板（4)的兩面均安裝一個次要印刷電路板（6)，或是安裝一 個由次要印刷電路板（6，6a ’ 6b)構成的堆疊。堆疊內的次 要印刷電路板（6，6a，6b)可以選擇用焊接及/或壓焊及/或 鉚釘方式彼此連接。同樣的’在製造平面變壓器時也可以 選擇用焊接及/或壓焊及/或鉚釘方式將整個疊與主要印刷 電路板（4)連接。焊接及/或壓焊及/或鉚釘方式形成的連接 可以確保各個印刷電路板彼此的機械連接及導電連接。另 外一種可行方式是在製造平面變壓器（1)時，可以在主要印 200847859 刷電路板（4)的底面（16)另外安裝一個次要印刷電路板（6c)。 第2圖顯不如第1圖之鐵氧體核心（2)的半核心（8，1 0) 的俯視圖。從第2圖可以看出，鐵氧體核心（2)的半核心（8， 10)是由兩個具有設置在本體（28)上的圓形中心拉桿（22)及 側絕緣壁（外心拉桿）（30)的ER-及/或EQ4亥心段（8，10)所構 成。由於這兩個ER-及/或EQ-核心段（8，10)高度很小，因 此可以使平面變壓器（1)達到特別緊密的結構。如果以一個 I-核心段取代兩個ER-及/或EQ-核心段中的一個核心段，還 ® 可以進一步降低核心段的高度。 在第3圖顯示之本發明的平面變壓器（1)的實施例中， 印刷電路板（4，6)彼此是以焊接連接。次要印刷電路板（6) 具有多個可焊接在主要印刷電路板（4)上的焊接墊（24)。一 種特別有利的方式是將焊接墊（24)設置在次要印刷電路板 (6)的底面（26)，並和其他電子元件一樣先經由SMD焊接過 程將焊接墊（24)安裝在主要印刷電路板（4)的頂面（14)上，然 後焊接在一起。如果要將多個次要印刷電路板（6)安裝在主 W 要印刷電路板（4)的一個面上，這些次要印刷電路板（6)可以 經由其頂面及底面上的焊接墊（24)彼此連接在一起。印刷 電路板（4，6)的絕緣裝置在有焊接墊（24)的位置是中斷的。 例如在這些位置不會塗上不導電的塗漆層，設置在印刷電 路板（4，6)之間的絕緣薄膜（20)在這些位置也會有裂口。 在第4圖顯示之本發明的平面變壓器（1)的實施例中， 印刷電路板（4，6，6a)彼此是以鉚釘連接。在這個實施例中， 由兩個具有絕緣裝置之雙層次要印刷電路板（6，6a)構成的 -12- 200847859 一個堆疊被設置在主要印刷電路板（4)的頂面（1 4 )上’同時 由兩個鉚釘（32)形成的鉚釘連接使主要印刷電路板（4)與次 要印刷電路板（6，6a)及次要印刷電路板（6’ 6a)彼此形成機 械連接及導電連接。將相同的次要印刷電路板（6 ’ 6a)彼此 並聯及/或串聯及/或與主要印刷電路板（4) ’可以形成許多 不同的電路。由於所使用的是相同的次要印刷電路板（6 ’ 6a)，因此可以降低平面變壓器（1)的製造成本。次要印刷電 路板（6，6a)具有以下之對稱垂直結構： ® 1 5 // m的絕緣漆 70从m的銅層 8 0 /z m的F R 4 -印刷電路板材料 7 0 # m的銅層 15 y m的絕緣漆 主要印刷電路板（4)具有以下之對稱垂直結構：An advantageous embodiment of the invention is to place a stack of a plurality of secondary printed circuit boards having insulating means on the primary printed circuit board. For example, the insulating means may be a non-conductive paint layer, an insulating paper, and/or an insulating film. I If the insulating film is used as the insulating means, both sides of the insulating film preferably have an adhesive area for mechanically fixing the secondary printed circuit boards to each other and/or to the main printed circuit board. Making printed circuit boards form a mechanical solid with each other 200847859 helps to simplify the installation of electronic components. One very advantageous embodiment of the invention is the use of soldering to bond printed circuit boards to each other. Preferably, the secondary printed circuit board has at least one solder pad for soldering to the primary printed circuit board and/or another secondary printed circuit board. Preferably, the solder pad is disposed on the bottom surface of the secondary printed circuit board, and the secondary printed circuit board can be adhered to the top surface of the main printed circuit board by surface bonding (SMD) via solder pads as other electronic components. And then soldered together. If a plurality of printed circuit boards are to be mounted on one side of the main printed circuit board, the secondary printed circuit boards can be connected to each other via solder pads on the top and bottom surfaces thereof. The insulation of each printed circuit board is interrupted at the location where the pads are present. According to another embodiment, at least one of the secondary printed circuit boards of the primary printed circuit board is connected to the primary printed circuit board and/or another secondary printed circuit board via soldered pins, rivets, or pressure bonding. . It is preferable to place a winding having a large current load on the main printed circuit board to avoid a strong current from passing through the connecting member/connection position between the main printed circuit board and the secondary printed circuit board. If the secondary voltage is greater than the main voltage, it is preferable to place the primary winding (input winding) on the primary printed circuit board and the secondary winding (output winding) on the secondary printed circuit board. An advantageous embodiment of the invention is to provide a winding (especially a closed converter or a flux converter - the primary winding of the transformer) whose leakage inductance needs to be kept to a very small extent on the main printed circuit board. 200847859 Due to the extremely tight construction of the planar transformer, it is suitable for use in automobiles, for example as a choke for electronic high-pressure discharge lamps. The solution of the invention can also be applied to planar inductors. In this case, the windings of the inductor are preferably formed by a main printed circuit board and a partial winding of at least one of the secondary printed circuit boards. That is, the windings of the inductor are dispersed on a plurality of printed circuit boards, and the main printed circuit board is also included. [Embodiment] Fig. 1 shows a longitudinal section of a planar transformer (1). The planar transformer (1) is mainly composed of a core (2), a main printed circuit board (4) on which electronic components (not shown in Fig. 1) are mounted, and a secondary printed circuit board (6). It is constructed in which a portion of the main printed circuit board (4) and the secondary printed circuit board (6) are surrounded by the core (2). Core (2) is a ferrite core. The core (2) is divided into a top (8) and a bottom (10), and a top (8) and a bottom (10) form at least one main printed circuit board (4) and a secondary printed circuit board (6). The gap (12) of part of the section. Therefore, it is not necessary to use a relatively high cost multilayer printed circuit board. For example, a two-layer printed circuit board (6) can be placed on a double-layer main printed circuit board (4) to replace a single 4-layer printed circuit board. An advantageous embodiment of the invention (not shown in the drawings) is to use a lower cost multilayer layer printed circuit board, for example in two 4-layer printed circuit boards (one of which is the main printed circuit board, The other is used as a secondary printed circuit board), replacing an 8-layer printed circuit board. The planar transformer (1) is particularly compact and therefore suitable for use in the steam 200847859, for example as a choke for electronic high-pressure discharge lamps. Since the main printed circuit board (4) can be provided with different secondary printed circuit boards (16) to constitute different circuits, it is possible to construct different circuits without changing the main printed circuit board (4). It is therefore possible to produce different electronic chokes based on the same circuit design for different lamps at a lower cost. The primary printed circuit board (4) and the secondary printed circuit board (6) each have windings formed by printed conductors (not shown in the drawings) which form the primary and secondary windings of the planar transformer (1). In the present embodiment, the secondary printing • circuit board (6) is connected to the main printed circuit board (4) via soldered pins (18). In addition to soldering the pins (18) over the printed circuit board (4, 6), another possible way is to press the pins (18) into the printed circuit board (4, 6) using a press-in technique. This technique involves pressing elastic or rigid pins onto the printed circuit board (4, 6) with small tolerances and metallized bores. Plastic deformation through the metal produces a very positive conductive connection without soldering. It is preferable to arrange the winding with a large current load on the main printed circuit board (4) so that a strong current does not pass through the pin between the main printed circuit board (4) and the secondary printed circuit board (6) ( 18). For this reason, for example, it is preferable to set the primary winding (input winding) for supplying current from the vehicle's vehicle power supply to the main printed circuit board (4), and to set the secondary winding (output winding) to the secondary printed circuit board. (6) Upper. It is therefore preferable to keep the leakage inductance to a very small degree of winding, in particular the occlusion converter or the flux converter-transformer primary winding, which is arranged on the main printed circuit board (4). According to an embodiment of the planar transformer (1) not depicted in the drawings, the main printed circuit board (4) is connected via a pressure-welded connection (for example via -10-200847859) and a secondary printed circuit Board (6) is connected. According to another embodiment of the planar transformer (1) not depicted in the drawings, the primary printed circuit board (4) is connected to the secondary printed circuit board (6) via rivets. The main printed circuit board (4) is insulated from the secondary printed circuit board (6) via an insulating film. An advantageous way is that both sides of the insulating film (20) have a mechanically fixed adhesive region between the secondary printed circuit board (6) and the main printed circuit board (4). Another possible way is to use a non-conductive paint layer or insulating paper as the insulation. For example, a plurality of double-layer printed circuit boards (4, 6) composed of a copper layer having a thickness of 100/zm and having a thickness of 35/zm on both sides and an FR4 core coated with an insulating varnish may be stacked. It can be seen from the longitudinal drawing of a planar transformer (1) from Fig. 1 that three planar printed circuit boards (6, 6a, 6b) with insulating means of the planar transformer (1) constitute a mounting. Stacking on the top surface (14) of the main printed circuit board (4). The thickness of the secondary printed circuit board (6 a, 6 b) is less than the thickness of the secondary printed circuit board (6). Another possibility is to install a secondary printed circuit board (6) on both sides of the main printed circuit board (4) or a stack of secondary printed circuit boards (6, 6a '6b). The secondary printed circuit boards (6, 6a, 6b) in the stack may optionally be joined to each other by soldering and/or pressure welding and/or rivets. Similarly, in the manufacture of planar transformers, the entire stack can also be joined to the main printed circuit board (4) by soldering and/or pressure welding and/or riveting. The connection formed by soldering and/or pressure welding and/or riveting ensures a mechanical and electrical connection of the individual printed circuit boards to each other. Another possibility is to additionally install a secondary printed circuit board (6c) on the bottom surface (16) of the main printed circuit board (4) when manufacturing the planar transformer (1). Figure 2 is a top view of the semi-core (8, 1 0) of the ferrite core (2) of Figure 1. As can be seen from Fig. 2, the semi-core (8, 10) of the ferrite core (2) is composed of two circular central tie rods (22) and side insulating walls (outer core) disposed on the body (28). The tie rod) (30) is composed of ER- and/or EQ4 Haixin section (8, 10). Since the height of the two ER- and/or EQ-core segments (8, 10) is small, the planar transformer (1) can be made to have a particularly tight structure. If you replace one of the two ER- and/or EQ-core segments with an I-core segment, you can further reduce the height of the core segment. In the embodiment of the planar transformer (1) of the invention shown in Fig. 3, the printed circuit boards (4, 6) are soldered to each other. The secondary printed circuit board (6) has a plurality of solder pads (24) solderable to the main printed circuit board (4). A particularly advantageous way is to place the solder pads (24) on the bottom surface (26) of the secondary printed circuit board (6) and, like other electronic components, first mount the solder pads (24) on the main printed circuit via the SMD soldering process. The top surface (14) of the plate (4) is then welded together. If a plurality of secondary printed circuit boards (6) are to be mounted on one side of the main W printed circuit board (4), the secondary printed circuit boards (6) may pass through solder pads on the top and bottom surfaces thereof ( 24) Connected to each other. The insulation of the printed circuit board (4, 6) is interrupted at the location with the solder pads (24). For example, at these locations, a non-conductive paint layer is not applied, and the insulating film (20) disposed between the printed circuit boards (4, 6) may also have cracks at these locations. In the embodiment of the planar transformer (1) of the invention shown in Fig. 4, the printed circuit boards (4, 6, 6a) are connected to each other by rivets. In this embodiment, a stack of -12-200847859 consisting of two double-layer printed circuit boards (6, 6a) having insulating means is disposed on the top surface (1 4) of the main printed circuit board (4). The rivet connection formed by the two rivets (32) at the same time makes the main printed circuit board (4) and the secondary printed circuit board (6, 6a) and the secondary printed circuit board (6' 6a) mechanically and electrically connected to each other. connection. The same secondary printed circuit boards (6'6a) can be connected in parallel and/or in series with each other and/or with the main printed circuit board (4)' to form a number of different circuits. Since the same secondary printed circuit board (6' 6a) is used, the manufacturing cost of the planar transformer (1) can be reduced. The secondary printed circuit board (6, 6a) has the following symmetrical vertical structure: ® 1 5 // m of insulating varnish 70 from m of copper layer 8 0 /zm of FR 4 - printed circuit board material 7 0 # m of copper Layer 15 ym insulating varnish The main printed circuit board (4) has the following symmetrical vertical structure:
1 5 μ m的絕緣漆 3 5 // m的銅層 280// m的預浸膠 35从m的銅層 3 6 0 // m的F R 4 -印刷電路板材料 3 5 μ m的銅層 280/z m的預浸膠 35 μ m的銅層 1 5 // πι的絕緣漆 主要印刷電路板（4)承載初級繞組。次要印刷電路板 -13- 200847859 (6，6a)構成次級繞組。次要印刷電路板（6，6a)均具有一個 由兩個分爲兩層的線圈構成的繞組。主要印刷電路板（4)具 有分爲4層的32個線圈。在次要印刷電路板（6，6a)構成的 堆疊及主要印刷電路板（4)之間，也就是在初級繞組及次級 繞組之間，有設置一絕緣薄膜（2 0)。絕緣薄膜（2 0)的厚度最 好是5 0 // m。平面變壓器的一個特徵是模組化的結構，因 爲雖然可以搭配各種不同的次要印刷電路板，但仍能夠在 主要印刷電路板（4)上達到一相同的”軌跡”（Footprint)。整 個堆疊高度相當小的結構是使用一個ER-半核心及一個I-半核心（8，10)。如果是具有多個次要印刷電路板（6，6a)的 結構，則是使用兩個ER半核心。這種平面變壓器（1)主要 是應用在以23 0V之市電運轉的LED照明設備的電子鎭流 器（EVG)，以及應用在充電設備。 在另外一個未在圖式中繪出的具有一個主要印刷電路 板（4)及之前描述之4層結構的實施例中，只有兩個分別在 一面上有一個銅層的次要印刷電路板（6，6a)。這兩個相同 的次要印刷電路板（6, 6 a)具有一如第1圖所示之垂直結構： 25 μ m的絕緣漆 35 μ m的銅層 105 /z m的FR4-印刷電路板材料 主要印刷電路板（4)與次要印刷電路板（6)共同構成變 壓器（1)的初級繞組。次級繞組是由次要印刷電路板（6a)構 成。由於次要印刷電路板（6a)的1〇5 # m厚的FR4核心可以 產生絕緣作用，因此在變壓器（1)的初級面及次級面之間不 -14- 200847859 需另外設置絕緣裝置。整個變壓器（1)既沒有絕緣薄膜，也 沒有絕緣紙。 第5圖顯示的平面變壓器（1)的實施例具有大小不同並 以金字塔狀的方式堆疊在一個主要印刷電路板（4)上的次 要印刷電路板（6，6a，6b)。在次要印刷電路板堆疊及主要 印刷電路板（4)之間有一絕緣薄膜（20)。由於印刷電路板 (4，6)的兩面都沒有塗絕緣漆，因此主要印刷電路板（4)的 頂面（14)及次要印刷電路板（6)的底面（16)之間的絕緣完全 依靠絕緣薄膜（20)。金字塔狀的結構的優點是，部分區段 包藏在內的次要印刷電路板（6a，6b)很容易形成導電接觸。 例如除了以銷釘（18)形成導電接觸外，另外以至少一條接 合線（34)形成導電接觸。 第6圖顯示的平面變壓器（1)的實施例具有大小不同並 以倒金字塔狀的方式堆疊在一個主要印刷電路板（4)上的 次要印刷電路板（6，6a)。在這個實施例中，面積較小的次 要印刷電路板（6)被次要印刷電路板（6a)覆蓋住。次要印刷 電路板（6a)具有足夠的彈性，因此在焊接時能夠朝主要印刷 電路板（4)的方向變形。由於毛細力的關係，焊劑會滲入間 隙或甚至將間隙塡滿，這會使次要印刷電路板（6a)之邊緣部 分的撓曲變大，因而形成很堅固的連接。所以本實施例可 以不必使用銷釘連接。 本發明的電子組件並不僅限於以上描述的平面變壓器 (1 )，而是可以利用本發明的結構方式實現多種不同的電子 組件。本發明的解決方案亦可應用於平面電感。將本發明 -15- 200847859 的結構方式應用於平面電感時，電感的繞組最好是由主要 印刷電路板（4)及至少一個次要印刷電路板（6)的部分繞組 所構成。此外，本發明的範圍亦不限於使用以上描述的核 心形狀，而是可以使用現有技術已知的所有核心形狀或核 / 心形狀的組合。 % 本發明提出的是一種電子組件，尤其是一種平面變壓 器（1)或平面電感，此種電子組件具有至少一個核心（2)及至 少一個有配備電子元件的主要印刷電路板（4)。根據本發 ^ 明，主要印刷電路板（4)具有至少一個次要印刷電路板（6)， 而且主要印刷電路板（4)及次要印刷電路板（6)均具有設置 * 在核心區域的由印刷導線構成的繞組。 _ 【圖式簡單說明】 - 以下配合圖式及實施例對本發明的內容做進一步的說 明。 第1圖：本發明之平面變壓器的第一個實施例的縱斷 面圖。 • 堪 桌la圖：一個具有多個次要印刷電路板的平面變壓器 的縱斷面圖。 第2圖：如第1圖或第2圖之半核心的俯視圖。 第3圖：本發明的一個具有焊接連接之平面變壓器 的實施例的縱斷面圖。 第4圖：本發明的一個具有鉚釘連接之平面變壓器的 實施例的縱斷面圖。 第5圖：一個具有多個不同大小之次要印刷電路板的 -1 6 - 200847859 平面變壓器的實施例的縱斷面圖。 第6圖：一個具有多個不同大小之次要印刷電路板的 平面變壓器的外一個實施例的縱斷面圖。 【主要元件符號說明】 1 平面變壓器 2 核心 4 主要印刷電路板 6 次要印刷電路板1 5 μ m insulating varnish 3 5 // m copper layer 280 / / m prepreg 35 from m copper layer 3 6 0 / m FR 4 - printed circuit board material 3 5 μ m copper layer 280/zm prepreg 35 μm copper layer 1 5 // πι varnish The main printed circuit board (4) carries the primary winding. The secondary printed circuit board -13- 200847859 (6,6a) constitutes the secondary winding. The secondary printed circuit boards (6, 6a) each have a winding consisting of two coils divided into two layers. The main printed circuit board (4) has 32 coils divided into 4 layers. An insulating film (20) is disposed between the stack of the secondary printed circuit boards (6, 6a) and the main printed circuit board (4), that is, between the primary winding and the secondary winding. The thickness of the insulating film (20) is preferably 5 0 // m. One feature of planar transformers is the modular construction, as it can be used with a variety of different secondary printed circuit boards to achieve the same "Footprint" on the primary printed circuit board (4). The entire stack height is quite small using an ER-semi-core and an I-semi-core (8, 10). In the case of a structure with multiple secondary printed circuit boards (6, 6a), two ER semi-cores are used. This planar transformer (1) is mainly used in an electronic choke (EVG) for LED lighting equipment operating at a commercial power of 23 0V, and is applied to a charging device. In another embodiment of a four-layer structure, not depicted in the drawings, having a primary printed circuit board (4) and the previously described four-layer structure, there are only two secondary printed circuit boards each having a copper layer on one side ( 6,6a). The two identical secondary printed circuit boards (6, 6 a) have a vertical structure as shown in Figure 1: 25 μm of insulating varnish 35 μm of copper layer 105 /zm of FR4-printed circuit board material The primary printed circuit board (4) and the secondary printed circuit board (6) together form the primary winding of the transformer (1). The secondary winding is formed by a secondary printed circuit board (6a). Since the 1〇5 #m thick FR4 core of the secondary printed circuit board (6a) can provide insulation, an insulation device is not required between -14-200847859 between the primary side and the secondary side of the transformer (1). The entire transformer (1) has neither an insulating film nor insulating paper. The embodiment of the planar transformer (1) shown in Fig. 5 has secondary printed circuit boards (6, 6a, 6b) of different sizes and stacked in a pyramidal manner on a main printed circuit board (4). An insulating film (20) is disposed between the secondary printed circuit board stack and the main printed circuit board (4). Since the printed circuit boards (4, 6) are not coated with varnish on both sides, the insulation between the top surface (14) of the main printed circuit board (4) and the bottom surface (16) of the secondary printed circuit board (6) is completely Rely on the insulating film (20). The pyramidal structure has the advantage that the secondary printed circuit boards (6a, 6b) contained in the partial sections are easily formed into conductive contacts. For example, in addition to forming a conductive contact with a pin (18), an electrically conductive contact is additionally formed with at least one bonding wire (34). The embodiment of the planar transformer (1) shown in Fig. 6 has secondary printed circuit boards (6, 6a) of different sizes and stacked in an inverted pyramid on a main printed circuit board (4). In this embodiment, the smaller printed secondary printed circuit board (6) is covered by the secondary printed circuit board (6a). The secondary printed circuit board (6a) has sufficient elasticity to be deformed in the direction of the main printed circuit board (4) during soldering. Due to the capillary force, the flux may penetrate into the gap or even fill the gap, which causes the deflection of the edge portion of the secondary printed circuit board (6a) to become large, thereby forming a strong connection. Therefore, this embodiment can be used without having to use a pin connection. The electronic component of the present invention is not limited to the planar transformer (1) described above, but a plurality of different electronic components can be realized by the structural mode of the present invention. The solution of the invention can also be applied to planar inductors. When the construction of the invention -15-200847859 is applied to a planar inductor, the winding of the inductor is preferably formed by a partial printed circuit board (4) and a partial winding of at least one secondary printed circuit board (6). Moreover, the scope of the present invention is not limited to the use of the core shape described above, but a combination of all core shapes or core/heart shapes known in the prior art may be used. % The present invention proposes an electronic component, in particular a planar transformer (1) or planar inductor having at least one core (2) and at least one primary printed circuit board (4) equipped with electronic components. According to the present invention, the primary printed circuit board (4) has at least one secondary printed circuit board (6), and the primary printed circuit board (4) and the secondary printed circuit board (6) each have a setting* in the core area. A winding consisting of printed conductors. _ [Simple description of the drawings] - The contents of the present invention will be further described below with reference to the drawings and the embodiments. Fig. 1 is a longitudinal sectional view showing a first embodiment of the planar transformer of the present invention. • Table la diagram: A longitudinal section of a planar transformer with multiple secondary printed circuit boards. Figure 2: Top view of the half core as in Figure 1 or Figure 2. Fig. 3 is a longitudinal sectional view showing an embodiment of a planar transformer having a welded joint of the present invention. Fig. 4 is a longitudinal sectional view showing an embodiment of a planar transformer having a rivet joint of the present invention. Figure 5: A longitudinal section view of an embodiment of a planar transformer having a plurality of secondary printed circuit boards of different sizes. Figure 6 is a longitudinal cross-sectional view of an outer embodiment of a planar transformer having a plurality of secondary printed circuit boards of different sizes. [Main component symbol description] 1 Planar transformer 2 Core 4 Main printed circuit board 6 Secondary printed circuit board
8 頂部 10 底部 12 間隙 14 頂面 16 底面 18 銷釘 2 0 絕緣薄膜 2 2 中心拉桿 2 4 焊接墊 26 底面 28 本體 30 絕緣壁（外心拉桿） 32 鉚釘 34 接合線8 Top 10 Bottom 12 Clearance 14 Top surface 16 Bottom surface 18 Pins 2 0 Insulating film 2 2 Center tie rod 2 4 Solder pad 26 Bottom surface 28 Body 30 Insulation wall (external tie rod) 32 Rivets 34 Bonding line