CN216118354U

CN216118354U - Projection equipment and projection optical machine and heat dissipation structure thereof

Info

Publication number: CN216118354U
Application number: CN202121906589.3U
Authority: CN
Inventors: 周强; 张聪; 胡震宇
Original assignee: Shenzhen Huole Science and Technology Development Co Ltd
Current assignee: Shenzhen Huole Science and Technology Development Co Ltd
Priority date: 2021-08-13
Filing date: 2021-08-13
Publication date: 2022-03-22
Anticipated expiration: 2031-08-13

Abstract

The embodiment of the disclosure discloses a projection device and a projection optical machine and a heat dissipation structure thereof. The heat dissipation structure comprises a light machine shell, a heat dissipation assembly and a heat conduction layer. The light engine housing comprises a bottom plate. The heat dissipation assembly is connected to the outer side face of the bottom plate and used for guiding out heat in the optical machine shell. The heat conducting layer is arranged on the bottom plate of the optical machine shell, so that heat in the optical machine shell is uniformly distributed. This is disclosed through set up multiple radiating piece on the bottom plate of projection equipment's ray apparatus casing with optical assembly's in the ray apparatus heat in time derive to solve the problem that the projection precision variation that leads to because the temperature height. The heat-conducting layer can make the heat in the casing distribute evenly, is favorable to evenly scattering the heat in the optical assembly, then is exporting the heat in the casing through the radiator unit to optical assembly setting.

Description

Projection equipment and projection optical machine and heat dissipation structure thereof

Technical Field

The disclosure relates to the field of display, in particular to a projection device and a projection optical machine and a heat dissipation structure thereof.

Background

After the optical machine of the projection device operates for a period of time, a large amount of heat can be generated in the optical machine, the heat is accumulated in optical components comprising prisms and the like, the optical components can be deformed, and therefore the optical path can be deviated and a focus leakage situation can occur. The interior of the existing optical machine on the market generally depends on the self heat dissipation of the optical component. However, the optical-mechanical housing is usually made of plastic material, and the optical components such as the prism are fixed on the bottom plate of the optical-mechanical housing, so the heat dissipation effect is poor.

SUMMERY OF THE UTILITY MODEL

The embodiment of the disclosure provides a projection device, a projection optical machine and a heat dissipation structure thereof, which can solve the technical problem of poor projection precision caused by poor heat dissipation effect of the projection device in the prior art.

The embodiment of the disclosure provides a heat dissipation structure, which comprises an optical machine shell, a heat dissipation assembly and a heat conduction layer. The optical machine shell comprises a bottom plate, and the inner side surface of the bottom plate is used for being connected with the optical assembly. The heat dissipation assembly is connected to the outer side face of the bottom plate and used for guiding out heat in the optical machine shell. The heat conducting layer is arranged on the bottom plate of the optical machine shell, so that heat in the optical machine shell is uniformly distributed.

Optionally, the heat conducting layer is arranged on the inner side surface and is used for being connected with an optical component; and/or the heat conduction layer is arranged on the outer side surface and is connected with the heat dissipation assembly.

Optionally, the heat conducting sheet is disposed between the bottom plate and the heat dissipation assembly, and a plastic heat transfer layer is further disposed between the heat dissipation assembly and the heat conducting layer.

Optionally, the heat dissipation assembly includes a heat conductive plate and a plurality of fins. The heat conducting plate is connected to the outer side face of the bottom plate. The fins are arranged on one surface of the heat-conducting plate, which is deviated from the optical machine shell, at intervals, and are arranged at included angles with the heat-conducting plate to form a plurality of air channels.

Optionally, the heat dissipation assembly further includes a heat dissipation fan, the heat dissipation fan is disposed at an end of the fin away from the heat conducting plate, and is connected and fixed with the optical machine housing, so that air is sucked from two ends of the air duct and then discharged by the heat dissipation fan.

Optionally, the heat radiation structure further comprises a fastener, the heat conduction plate and the bottom plate are both provided with mounting holes, and the fastener fastens the heat radiation assembly and the optical machine shell through the mounting holes.

Optionally, the heat conducting layer comprises a plurality of heat conducting fins arranged in a stacked manner.

Optionally, the thermally conductive sheet layer comprises at least one of a graphite layer or a graphene layer.

Correspondingly, the embodiment of the disclosure further provides a projection light machine, which includes an optical assembly and the heat dissipation structure as described above. The optical assembly is connected with the heat dissipation structure.

Correspondingly, the embodiment of the disclosure further provides a projection device, which includes a housing and the projection light machine as described above. The shell is internally provided with a containing cavity, and the projection optical machine is arranged in the containing cavity.

In the embodiment of the disclosure, the plurality of heat dissipation pieces are arranged on the bottom plate which is provided with the optical assembly in the projection optical machine in the projection equipment to lead out the heat in the projection optical machine in time, so that the problem of poor projection precision caused by high temperature is solved. Wherein, the heat-conducting layer can make the heat in the casing disperse evenly, is favorable to in time scattering the heat in the optical assembly evenly, then just right the heat-radiating component that optical assembly set up exports the heat in the casing. Simultaneously, set up heat radiation structure on the bottom plate that is connected with optical assembly, also be favorable to in time deriving the optical assembly's that the heat silts up the most in the projection light machine heat, and then promote whole heat radiation structure's radiating effect.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a projection apparatus provided in an embodiment of the present disclosure.

Fig. 2 is an exploded view of a projection light engine provided in an embodiment of the disclosure.

Fig. 3 is a perspective view of a heat dissipation structure provided by an embodiment of the present disclosure.

Fig. 4 is a schematic structural diagram of a heat conductive layer provided in an embodiment of the present disclosure.

Fig. 5 is a schematic structural diagram of a heat conductive layer provided by yet another embodiment of the present disclosure.

Fig. 6 is a cross-sectional view of a projector light engine according to an embodiment of the disclosure.

Fig. 7 is a cross-sectional view of another angle of the light engine of the projector provided in fig. 6 of the present disclosure.

Fig. 8 is a cross-sectional view of a light engine for projection provided in another embodiment of the present disclosure.

Description of reference numerals:

10. a projection light machine; 20. a housing; 11. a heat dissipation structure; 12. an optical component; 21. an accommodating chamber; 22. heat dissipation holes; 100. a light machine shell; 300. a heat dissipating component; 400. a heat conductive layer; 500. a moldable heat transfer layer; 110. a base plate; 120. a side plate; 111. a first mounting hole; 310. a heat sink; 320. a heat radiation fan; 311. a heat conducting plate; 312. a fin; 313. an air duct; 314. a second mounting hole; 321. a third mounting hole; 410. a heat conductive sheet; 420. an adhesive layer; 401. a graphite layer; 402. a graphene layer.

Detailed Description

The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure. Furthermore, it should be understood that the detailed description and specific examples, while indicating the present disclosure, are given by way of illustration and explanation only, and are not intended to limit the present disclosure. In the present disclosure, unless otherwise specified, use of the directional terms "upper" and "lower" generally refer to upper and lower, and specifically to the orientation of the drawing figures in the drawings, in the actual use or operating condition of the device; while "inner" and "outer" are with respect to the outline of the device.

The embodiments of the present disclosure provide a projection apparatus, a projection optical machine thereof, and a heat dissipation structure, which are described in detail below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.

The present disclosure provides a projection device that can be adapted for use in home, education, work, and outdoor scenarios. Referring to fig. 1, the projection apparatus includes a projector 10 and a housing 20. The housing 20 has a receiving cavity 21 therein, and the projection optical device 10 is received in the receiving cavity 21. The housing 20 is further provided with heat dissipation holes 22 for timely dissipating heat at the projector 10 of the housing 20.

Referring to fig. 2 and fig. 3, the optical projection engine 10 includes a heat dissipation structure 11 and an optical assembly 12. An optical assembly 12 is coupled to the heat dissipating structure 11 and includes optical elements such as lenses, prisms, etc.

The heat dissipation structure 11 includes an optical housing 100, and a heat dissipation assembly 300 and a heat conductive layer 400 disposed on the optical housing 100. The optical-mechanical housing 100 includes a bottom plate 110 and a side plate 120 surrounding the inner edge of the bottom plate 110. The optical assembly 12 is attached to the inner side of the bottom plate 110, wherein part of the optical elements in the optical assembly 12 are also attached to the side plate 120. The heat sink assembly 300 is connected to the outer side of the bottom plate 110 to conduct heat away from the optical housing 100. The heat conducting layer 400 is laid on the bottom plate 110 of the opto-mechanical housing 100 to uniformly distribute heat in the opto-mechanical housing 100.

Specifically, when the optical assembly 12 is configured as a prism, the heat dissipation assembly 300 and the heat conductive layer 400 are preferably disposed in the hot area around the prism where off light and stray light are irradiated, so as to take away heat in time and avoid heat accumulation. In this embodiment, the heat sink 300 is disposed opposite to the optical component 12, and the thermal region is disposed at the position of the heat sink 300.

The heat conductive layer 400 may be bonded to the bottom plate 110, or may be connected in other ways.

Meanwhile, referring to fig. 4, the heat conductive layer 400 may include a plurality of heat conductive sheets 410 stacked from the surface of the bottom plate 110 facing away from the bottom plate 110 and an adhesive layer 420 for adhering the heat conductive sheets 410 together. The thickness of each thermally conductive sheet 410 and the thickness of each adhesive layer 420 may be about 0.02 mm, such as 0.01 mm and 0.025 mm. The layer-by-layer stacking can increase the thickness of the whole heat conducting layer 400, and the thicker the heat conducting layer 400 is, the more heat can be absorbed, the more uniform the heat distribution is, and the better the heat dissipation effect is. Typically, the thickness of the heat conductive layer 400 is within 0.2 mm, so as to prevent the heat conductive layer 400 from being too thick and occupying too much space in the accommodating cavity 21, and in practical applications, the thickness is typically between 0.025 mm and 0.125 mm.

Meanwhile, the heat conducting layer 400 may also use only a single heat conducting sheet 410 with a larger thickness, for example, a single heat conducting sheet 410 with a thickness of 0.2 mm, so as to achieve a better heat dissipation effect. A plurality of heat conduction sheets 410 with a large thickness may be used, which not only reduces the number of layers of the stacked structure in the heat conduction layer 400, but also achieves a better heat dissipation effect.

Referring to fig. 5, the heat conductive layer 400 may be made of graphite and/or graphene, and may form a graphite layer 401 and/or a graphene layer 402. Graphite and graphene have good thermal conductivity.

Meanwhile, the heat conductive layer 400 may be bonded to the inner side surface of the bottom plate 110, may be bonded to the outer side surface of the bottom plate 110, and may be bonded to both the inner side surface and the outer side surface of the bottom plate 110. When the heat conductive layer 400 is adhered to the inner side surface of the bottom plate 110, it can directly contact with the optical component 12, which is beneficial to guiding out the heat in the optical component 12 in time and ensuring more uniform heat distribution. When the heat conductive layer 400 is adhered to the outer side of the bottom plate 110, it is located outside the optical engine housing 100, so that the heat inside the projection optical engine 10, especially inside the optical assembly 12, can be transferred to the outside of the optical engine, and the heat can be discharged. When the heat conductive layer 400 is adhered to the inner side and the outer side of the bottom plate 110, it not only ensures that the heat is distributed more uniformly around the bottom plate 110, but also increases the efficiency of guiding the heat out of the optical engine housing 100. In the embodiments of the present disclosure, as shown in fig. 3, the heat conductive layer 400 is attached to the outer side of the bottom plate 110.

When the heat conductive layer 400 is attached to the outer side of the bottom plate 110, the heat dissipation assembly 300 is mounted on the side of the heat conductive layer 400 away from the bottom plate 110, and a plastic heat transfer layer 500 is further disposed between the heat dissipation assembly 300 and the heat conductive layer 400. The plastic heat transfer layer 500 is a layer of paste-like heat conductive material, such as silicone grease, heat conductive paste, etc., and is filled in the gap between the heat dissipation assembly 300 and the heat conductive layer 400 to increase the contact area between the heat dissipation assembly 300 and the heat conductive layer 400, thereby increasing the heat dissipation efficiency of the heat dissipation assembly 300 and the heat conductive layer 400.

Meanwhile, when the heat conducting sheet 410 is attached to the inner side surface of the bottom plate 110, the heat dissipation assembly 300 may directly contact with the bottom plate 110, and the plastic heat transfer layer 500 may be filled between the heat dissipation assembly 300 and the bottom plate 110 to increase the heat dissipation efficiency of the heat dissipation assembly 300.

Referring to fig. 6 to 8, in some embodiments of the present disclosure, the heat dissipation assembly 300 only includes the heat sink 310, and in other embodiments of the present disclosure, the heat dissipation assembly 300 includes the heat dissipation fan 320 and the heat sink 310.

The heat sink 310 is connected to the outer side surface of the bottom plate 110 and disposed opposite to the optical assembly 12, and the connection manner of the heat sink and the bottom plate 110 may be clamping, bonding, fastening, or the like. In the present disclosure, a fastening connection is exemplified.

The heat sink 310 includes a heat conductive plate 311 and a plurality of fins 312. The heat-conducting plate 311 is fastened to the outer side surface of the bottom plate 110, and the specific connection manner is that the four corners of the heat-conducting plate 311 and the corresponding positions of the bottom plate 110 are provided with mounting holes, which are the first mounting hole 111 and the second mounting hole 314 respectively, and the fastener passes through the first mounting hole 111 and the second mounting hole 314, and fastens the heat sink 310 and the optical engine housing 100 together. Meanwhile, to prevent the fastener from blocking the light path, neither the first mounting hole 111 nor the second mounting hole 314 coincides with the projection light path on the base plate 110. Further, the first mounting hole 111 and the second mounting hole 314 may be disposed opposite to the optical component 12, so that the fastening member is directly attached to the bottom surface of the optical component 12, and further, heat in the optical component 12 may be timely conducted out through the fastening member, thereby increasing the overall heat dissipation efficiency of the heat dissipation structure 11. The heat conductive plate 311 is also attached to the heat conductive layer 400, and the plastic heat conductive layer 500 is filled between the bottom plate 110 and the heat conductive layer 400. The fins 312 are arranged at intervals on the side of the heat conducting plate 311 away from the bottom plate 110, and form an included angle with the heat conducting plate 311 to form a plurality of air channels 313. In particular, in the present embodiment, each of the fins 312 is connected to the bottom plate 110 perpendicularly and parallel to each other, forming a plurality of air channels 313 with uniform width and parallel to each other. In other embodiments, the fins 312 may be spaced around the center of the thermal plate 311 or arranged in other ways. The heat sink 310 can effectively dissipate heat in the optical housing 100, and the fins 312 erected on the heat conducting plate 311 increase heat exchange area, thereby increasing heat exchange efficiency and facilitating heat dissipation.

In some embodiments of the present disclosure, as shown in fig. 6 and 7, the heat dissipation fan 320 may be disposed on a side of the fin 312 away from the heat conductive plate 311, and the heat dissipation fan 320 may also be provided with third mounting holes 321 corresponding to the first mounting hole 111 and the second mounting hole 314. The fastening member passes through the first, second and third mounting

holes

111, 314 and 321 to fasten the heat dissipation fan 320, the heat sink 310 and the base plate 110 together. As shown in fig. 7, in which the dashed arrows represent the flow direction of air, when the heat dissipation fan 320 is operated, air can be sucked from both ends of the air duct 313 and exhausted in a direction away from the heat sink 310 after passing through the fan blades. The addition of the fan increases the air flow rate at the position of the heat sink 310, so that hot air in the air duct 313 can be discharged in time, and cold air outside the air duct 313 can enter in time, thereby increasing the heat dissipation efficiency of the heat sink 310 and further reducing the temperature at the position of the optical component 12.

In other embodiments of the present disclosure, referring to fig. 8, the heat dissipation fan 320 may be further disposed on one side of the heat sink 310 and directly faces one end of the air duct 313. At this time, the heat dissipation fan 320 is attached to the heat conductive layer 400 and connected to the outer side surface of the base plate 110. When the heat dissipation fan 320 is operated, as shown in fig. 8, wherein the dashed arrow represents the flow direction of air, air can be sucked from the end of the air duct 313 far from the fan, pass through the air duct 313, enter the fan from the end near the fan, and finally be discharged in the direction far from the heat sink 310. The fan is arranged at the discharge end of the air duct 313, so that the wind speed at the discharge end of the air duct 313 can be kept at a high speed, the problem of insufficient wind at the discharge end of the air duct 313 is solved, the air flow rate in the air duct 313 is increased, hot air in the air duct 313 can be discharged in time, cold air outside the air duct 313 can enter in time, the heat dissipation efficiency of the heat sink 310 is increased, and the temperature at the optical component 12 is further reduced.

In other embodiments of the present disclosure, the heat dissipation fan 320 may be disposed opposite to the optical component 12 and directly contact the heat conductive layer 400, so as to directly extract the heat conducted by the heat conductive layer 400 through the flowing air, and also increase the heat dissipation efficiency of the heat sink 310 and reduce the temperature at the optical component 12.

The projection device, the optical projector thereof and the heat dissipation structure provided by the embodiment of the disclosure are described in detail above, and a specific example is applied in the description to explain the principle and the implementation of the disclosure, and the description of the embodiment is only used to help understand the method and the core idea of the disclosure; meanwhile, for those skilled in the art, according to the idea of the present disclosure, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present description should not be construed as a limitation to the present disclosure.

Claims

1. A heat dissipation structure, comprising:

the optical machine shell comprises a bottom plate;

the heat dissipation assembly is connected to the outer side face of the bottom plate and used for guiding out heat in the optical machine shell;

the heat conducting layer is arranged on the bottom plate of the optical machine shell so as to enable heat in the optical machine shell to be uniformly distributed.

2. The heat dissipation structure of claim 1, wherein the thermally conductive layer is disposed on an inner side of the base plate and is adapted to be connected to an optical component; and/or the presence of a gas in the gas,

the heat conducting layer is arranged on the outer side face and connected with the heat radiating assembly.

3. The heat dissipating structure of claim 2, wherein the heat conductive layer is disposed between the outer side of the base plate and the heat dissipating component, and a plastic heat transfer layer is disposed between the heat dissipating component and the heat conductive layer.

4. The heat dissipation structure of claim 1, wherein the heat dissipation assembly comprises:

the heat conducting plate is connected to the outer side face of the bottom plate;

the fins are arranged on one surface of the heat-conducting plate, which is deviated from the bottom plate, at intervals and are arranged at included angles with the heat-conducting plate to form a plurality of air channels.

5. The heat dissipation structure of claim 4, wherein the heat dissipation assembly further comprises:

and the heat radiation fan is arranged on one side of the fins, which is deviated from the heat conducting plate, and is fixedly connected with the optical machine shell so as to suck air from two ends of the air channel and then discharge the air by the heat radiation fan.

6. The heat dissipation structure of claim 1, further comprising a fastener, wherein the heat dissipation assembly and the bottom plate are both provided with mounting holes, and the fastener fastens the heat dissipation assembly and the optical-mechanical housing through the mounting holes.

7. The heat dissipation structure of claim 1, wherein the thermally conductive layer comprises a plurality of thermally conductive sheets arranged in a stack.

8. The light engine of claim 1, wherein the thermally conductive sheet layer comprises at least one of a graphite layer or a graphene layer.

9. A projection light engine, comprising:

the heat dissipation structure as recited in any one of claims 1 to 8;

and the optical assembly is connected with the heat dissipation structure.

10. A projection device, comprising:

a housing having a receiving chamber therein;

the light engine of claim 9, disposed within the cavity.