CN216084850U

CN216084850U - Film removing equipment for thinned semiconductor wafer

Info

Publication number: CN216084850U
Application number: CN202122580409.3U
Authority: CN
Inventors: 张健
Original assignee: Shanghai Rongjing Semiconductor Technology Co ltd
Current assignee: Shanghai Rongjing Semiconductor Technology Co ltd
Priority date: 2021-10-26
Filing date: 2021-10-26
Publication date: 2022-03-18
Anticipated expiration: 2031-10-26

Abstract

The utility model discloses film removing equipment for thinned semiconductor wafers, which relates to the technical field of wafer film removing and comprises a bottom plate, wherein the upper surface of the bottom plate is fixedly connected with two symmetrical supporting vertical rods, a movable cross rod is arranged above the supporting vertical rods, the upper surface of the movable cross rod is provided with a through groove, an extrusion mechanism is arranged between each supporting vertical rod and the movable cross rod, two symmetrical limiting mechanisms are arranged below the movable cross rod, a fixed clamping plate is fixedly connected between the two supporting vertical rods, and a movable clamping plate is arranged between the two supporting vertical rods. According to the utility model, through the arrangement of the bottom plate, the supporting vertical rods, the movable cross rod, the through groove, the fixed clamping plate, the limiting mechanism and the movable clamping plate, when the wafer is inserted between the fixed clamping plate and the movable clamping plate, the limiting mechanism can play a limiting effect on the wafer, so that the wafer can be always positioned between the fixed clamping plate and the movable clamping plate.

Description

Film removing equipment for thinned semiconductor wafer

Technical Field

The utility model relates to the technical field of wafer film removing, in particular to film removing equipment for thinned semiconductor wafers.

Background

The basic wafer processing step is that the wafer is cleaned properly and then sent to a thermal furnace, a silicon dioxide layer with a thickness of about several hundred is formed on the surface of the wafer in an oxygen-containing environment in a heating oxidation mode, then a silicon nitride layer with a thickness of about 1000A to 2000A is deposited on the silicon dioxide which is just grown in a chemical vapor deposition mode, then the whole wafer is subjected to a photolithography process, a layer of photoresist is coated on the wafer, and then the pattern on the photomask is transferred to the photoresist. Then, an etching technique is used to remove the portion of the silicon nitride layer that is not protected by the photoresist, and the portion of the desired circuit pattern is left.

In patent No. CN106340486A, a wafer holding apparatus is disclosed, which comprises: a first clamping member having a first clamping end and a first movable end; a second clamping member having a second clamping end and a second movable end; the driving piece is arranged to synchronously drive the first movable end and the second movable end to move in the opposite direction or in the opposite direction, wherein the first clamping end and the second clamping end are oppositely arranged to clamp the wafer. Through setting up first holder and second holder, two clamping ends can the simultaneous movement centre gripping wafer to can avoid wafer and other surface to contact, can avoid the wearing and tearing on wafer surface, can improve the quality of wafer.

However, in the above patent, when the film is removed from the wafer, the wafer is easy to fall off, the clamping and fixing effect on the wafer is not good, and the wafer is easy to be damaged; therefore, the film removing equipment for the thinned semiconductor wafer is provided to solve the problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to make up the defects of the prior art and provides film removing equipment for thinned semiconductor wafers.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a striping equipment after semiconductor wafer attenuate, includes the bottom plate, the last fixed surface of bottom plate is connected with two symmetrical support montants, the top of supporting the montant is equipped with removes the horizontal pole, remove the upper surface of horizontal pole and seted up logical groove, every support the montant and remove and all be equipped with extrusion mechanism between the horizontal pole, the below of removing the horizontal pole is equipped with two symmetrical stop gear, two support the fixed grip block of fixedly connected with between the montant, two it is equipped with the removal grip block to support between the montant, the equal fixedly connected with slider in both ends of removing the grip block, two support the side that the montant is close to each other and all seted up the spout, two the slider is sliding connection in the inside of two spouts respectively, the top of bottom plate is equipped with supporting mechanism.

Furthermore, the extrusion mechanism is including fixing the slide bar one in the removal horizontal pole bottom surface and seting up support the cavity of montant upper surface, the draw-in groove has been seted up to the inner wall of cavity, the interior diapire fixedly connected with spring two of cavity.

Further, the upper end of the second spring is fixedly connected with a second sliding rod, the upper end of the second sliding rod is fixedly connected with a fixed block, a groove body is formed in the outer surface of the first sliding rod, and a clamping block is slidably connected inside the groove body.

Furthermore, one end of the clamping block, which is located inside the groove body, is fixedly connected with a first spring, one end of the first spring, which is far away from the clamping block, is fixedly connected with the inner wall of the groove body, and the clamping block is matched with the clamping groove.

Furthermore, stop gear is including fixing the connecting plate in the removal horizontal pole bottom surface, the bottom fixedly connected with fixed plate of connecting plate, the surface sliding connection of fixed plate has the movable block.

Furthermore, the movable block runs through the fixed plate, the outer fixed surface of fixed plate is connected with fixed frame, the movable block is close to the one end fixedly connected with pull pole of fixed frame.

Furthermore, the pull rod runs through the fixed frame and is connected with the fixed frame in a sliding mode, and a spring III is sleeved on the outer surface, located between the movable block and the fixed frame, of the pull rod.

Furthermore, the supporting mechanism comprises a fixed cylinder fixedly connected to the upper surface of the bottom plate, an insertion rod is connected to the inside of the fixed cylinder in a sliding mode, a spring IV is fixedly connected to the bottom surface of the insertion rod, and the bottom surface of the spring IV is fixedly connected with the inner wall of the fixed cylinder.

Compared with the prior art, the film removing equipment for thinned semiconductor wafers has the following beneficial effects:

1. according to the utility model, through the arrangement of the bottom plate, the supporting vertical rods, the movable cross rod, the through groove, the fixed clamping plate, the limiting mechanism and the movable clamping plate, when the wafer is inserted between the fixed clamping plate and the movable clamping plate, the limiting mechanism can play a limiting effect on the wafer, so that the wafer can be always positioned between the fixed clamping plate and the movable clamping plate.

2. Through the setting of extrusion mechanism and support montant, through pressing down and removing the horizontal pole, extrusion mechanism carries on spacingly to removing the horizontal pole afterwards, and then can fix the wafer between fixed grip block and removal grip block, and support mechanism can play ascending holding power to removing the grip block this moment, has further strengthened the fixed effect of centre gripping to the wafer.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic view showing the left side view of the fixing plate and the fixing frame according to the present invention;

FIG. 3 is a schematic view of the internal structure of the fixing cylinder according to the present invention;

FIG. 4 is a schematic view of the internal structure of the vertical support post of the present invention;

FIG. 5 is an enlarged view of the structure at A in FIG. 1 according to the present invention.

In the figure: 1. a base plate; 2. supporting the vertical rod; 3. moving the cross bar; 4. a through groove; 5. an extrusion mechanism; 51. a first sliding rod; 52. a cavity; 53. a clamping block; 54. a trough body; 55. a first spring; 56. a second spring; 57. a second sliding rod; 58. a fixed block; 59. a card slot; 6. fixing the clamping plate; 7. a limiting mechanism; 71. a connecting plate; 72. a movable block; 73. a fixing frame; 74. a pull rod; 75. a third spring; 76. a fixing plate; 8. moving the clamping plate; 9. a chute; 10. a slider; 11. a support mechanism; 110. a fixed cylinder; 111. inserting a rod; 112. and a fourth spring.

Detailed Description

The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the utility model.

The embodiment provides a film removing device for thinned semiconductor wafers, which can achieve a good clamping and fixing effect on the wafers, can prevent the wafers from falling off during film removing operation, and cannot damage the wafers due to the falling off of the wafers.

Referring to fig. 1-5, a stripping device after thinning a semiconductor wafer comprises a base plate 1, wherein two symmetrical supporting vertical rods 2 are fixedly connected to the upper surface of the base plate 1, a movable cross rod 3 is arranged above the supporting vertical rods 2, a through groove 4 is formed in the upper surface of the movable cross rod 3, and the through groove 4 is arranged to facilitate the wafer to pass through the through groove 4.

An extrusion mechanism 5 is arranged between each supporting vertical rod 2 and the movable cross rod 3, the extrusion mechanism 5 comprises a first sliding rod 51 fixed on the bottom surface of the movable cross rod 3 and a cavity 52 formed in the upper surface of the supporting vertical rod 2, and the first sliding rod 51 can slide in the cavity 52.

A clamping groove 59 is formed in the inner wall of the cavity 52, a second spring 56 is fixedly connected to the inner bottom wall of the cavity 52, a second sliding rod 57 is fixedly connected to the upper end of the second spring 56, and the second sliding rod 57 can slide up and down in the cavity 52.

The upper end of the second sliding rod 57 is fixedly connected with a fixing block 58, the outer surface of the first sliding rod 51 is provided with a groove 54, the inside of the groove 54 is slidably connected with a clamping block 53, one end of the clamping block 53, which is located inside the groove 54, is fixedly connected with a first spring 55, one end of the first spring 55, which is far away from the clamping block 53, is fixedly connected with the inner wall of the groove 54, and the clamping block 53 is matched with the clamping groove 59.

When the first sliding rod 51 is extruded downwards, the first sliding rod 51 moves downwards to extrude the fixing block 58, the fixing block 58 pushes the second sliding rod 57 downwards, the second sliding rod 57 extrudes the second spring 56 downwards, the second spring 56 contracts at the moment, when the clamping block 53 moves to the position of the clamping groove 59, the first spring 55 extends to insert the clamping block 53 into the clamping groove 59, and then the first sliding rod 51 can be limited, so that the movable cross rod 3 can be limited.

Two symmetrical limiting mechanisms 7 are arranged below the movable cross rod 3, each limiting mechanism 7 comprises a connecting plate 71 fixed to the bottom surface of the corresponding movable cross rod 3, each connecting plate 71 is in an L shape, a fixed plate 76 is fixedly connected to the bottom end of each connecting plate 71, a movable block 72 is connected to the outer surface of each fixed plate 76 in a sliding mode, and one end, far away from the corresponding fixed frame 73, of each movable block 72 is an inclined surface.

The movable block 72 runs through the fixed plate 76, the fixed frame 73 is fixedly connected to the outer surface of the fixed plate 76, the one end fixedly connected with pull rod 74 that the movable block 72 is close to the fixed frame 73, the pull rod 74 runs through the fixed frame 73 and is in sliding connection with the fixed frame 73, and the outer surface cover that the pull rod 74 is located between the movable block 72 and the fixed frame 73 is equipped with three springs 75.

Need place the wafer between two support montants 2, press the wafer downwards through leading to groove 4, when the wafer contacts the movable block 72 between two fixed plates 76, can extrude movable block 72, the inclined plane of movable block 72 is fixed with the soft layer, prevent to cause the damage to the wafer surface, at this moment, movable block 72 can remove to the inside of fixed frame 73, when the wafer removed to the below of movable block 72, three 75 resets and release movable block 72, can carry out spacingly to the top of wafer through the bottom surface of movable block 72 this moment.

Two support and support fixed grip block 6 of fixedly connected with between the montant 2, two are equipped with between the montant 2 and remove grip block 8, can play the spacing effect of centre gripping to the wafer through fixed grip block 6 and removal grip block 8, the equal fixedly connected with slider 10 in both ends of removing grip block 8, spout 9 has all been seted up to two sides that support montant 2 and be close to each other, two sliders 10 are sliding connection respectively in the inside of two spout 9, when pushing down the wafer through stop gear 7, can make the wafer be in between fixed grip block 6 and the removal grip block 8.

The supporting mechanism 11 is arranged above the bottom plate 1, the supporting mechanism 11 comprises a fixed cylinder 110 fixedly connected to the upper surface of the bottom plate 1, an insertion rod 111 is slidably connected to the inside of the fixed cylinder 110, a spring four 112 is fixedly connected to the bottom surface of the insertion rod 111, and the bottom surface of the spring four 112 is fixedly connected to the inner wall of the fixed cylinder 110.

When the limiting mechanism 7 downwardly presses the wafer, the wafer downwardly presses the spring four 112 through the movable clamping plate 8, and the spring four 112 has a reaction force and upwardly supports the wafer, so that the wafer can be fixed inside the fixed clamping plate 6 and the movable clamping plate 8.

The working principle is as follows: when the wafer is required to be fixed, the wafer is pressed downwards through the through groove 4, when the wafer descends below the movable block 72, the bottom surface of the movable block 72 can limit the wafer, then the movable cross rod 3 is pressed downwards, the movable cross rod 3 descends to drive the sliding rod I51 to descend, the sliding rod I51 descends to downwards extrude the sliding rod II 57, the spring II 56 contracts at the moment, when the clamping block 53 descends to the position of the clamping groove 59, the clamping block 53 is clamped into the clamping groove 59 to limit the sliding rod I51, the wafer is located inside the movable clamping plate 8 at the moment, the spring IV 112 can play an upward supporting force for the wafer, a good clamping effect can be achieved for the wafer, the risk that the wafer drops during film removing operation can be avoided, and the wafer cannot be damaged during the film removing process.

The present invention is not limited to the above preferred embodiments, and any modifications, equivalent replacements, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a striping equipment after semiconductor wafer attenuate, includes bottom plate (1), its characterized in that: the upper surface of the bottom plate (1) is fixedly connected with two symmetrical supporting vertical rods (2), a movable transverse rod (3) is arranged above the supporting vertical rods (2), the upper surface of the movable transverse rod (3) is provided with a through groove (4), an extrusion mechanism (5) is arranged between each supporting vertical rod (2) and the movable transverse rod (3), two symmetrical limiting mechanisms (7) are arranged below the movable transverse rod (3), a fixed clamping plate (6) is fixedly connected between the two supporting vertical rods (2), a movable clamping plate (8) is arranged between the two supporting vertical rods (2), two sliding blocks (10) are fixedly connected at two ends of the movable clamping plate (8), sliding grooves (9) are formed in one side surface of the two supporting vertical rods (2) close to each other, and the two sliding blocks (10) are respectively connected inside the two sliding grooves (9) in a sliding manner, and a supporting mechanism (11) is arranged above the bottom plate (1).

2. The stripping apparatus according to claim 1, wherein: extrusion mechanism (5) including fix slide bar (51) in removal horizontal pole (3) bottom surface and set up support cavity (52) of montant (2) upper surface, draw-in groove (59) have been seted up to the inner wall of cavity (52), the interior diapire fixedly connected with spring two (56) of cavity (52).

3. The stripping apparatus according to claim 2, wherein: the upper end of the second spring (56) is fixedly connected with a second sliding rod (57), the upper end of the second sliding rod (57) is fixedly connected with a fixing block (58), a groove body (54) is formed in the outer surface of the first sliding rod (51), and a clamping block (53) is slidably connected inside the groove body (54).

4. The stripping apparatus according to claim 3, wherein: one end, located inside the groove body (54), of the clamping block (53) is fixedly connected with a first spring (55), one end, far away from the clamping block (53), of the first spring (55) is fixedly connected with the inner wall of the groove body (54), and the clamping block (53) is matched with the clamping groove (59).

5. The stripping apparatus according to claim 1, wherein: the limiting mechanism (7) comprises a connecting plate (71) fixed on the bottom surface of the movable cross rod (3), a fixing plate (76) is fixedly connected to the bottom end of the connecting plate (71), and a movable block (72) is connected to the outer surface of the fixing plate (76) in a sliding mode.

6. The stripping apparatus according to claim 5, wherein: the movable block (72) penetrates through the fixed plate (76), the fixed frame (73) is fixedly connected to the outer surface of the fixed plate (76), and the drawing rod (74) is fixedly connected to one end, close to the fixed frame (73), of the movable block (72).

7. The stripping apparatus according to claim 6, wherein: the drawing rod (74) penetrates through the fixed frame (73) and is in sliding connection with the fixed frame (73), and a spring III (75) is sleeved on the outer surface, located between the movable block (72) and the fixed frame (73), of the drawing rod (74).

8. The stripping apparatus according to claim 1, wherein: the supporting mechanism (11) comprises a fixed cylinder (110) fixedly connected to the upper surface of the bottom plate (1), an insertion rod (111) is slidably connected to the inside of the fixed cylinder (110), a spring four (112) is fixedly connected to the bottom surface of the insertion rod (111), and the bottom surface of the spring four (112) is fixedly connected to the inner wall of the fixed cylinder (110).