CN216080728U

CN216080728U - Chip air-drying box

Info

Publication number: CN216080728U
Application number: CN202122874851.7U
Authority: CN
Inventors: 吴乔
Original assignee: Sichuan Qihang Yingchuang Technology Co ltd
Current assignee: Sichuan Qihang Yingchuang Technology Co ltd
Priority date: 2021-11-23
Filing date: 2021-11-23
Publication date: 2022-03-18
Anticipated expiration: 2031-11-23

Abstract

The utility model discloses a chip air drying box, and relates to the technical field of electronic device production; the adopted technical scheme is as follows: the utility model provides a chip air-drying box, includes the box, the box is adapted to fan and heating element, the interval has the polylith baffle in the box, the baffle is used for placing the chip, the baffle will the box inner chamber is separated for a plurality of air-drying chambers from top to bottom, and is a plurality of the air-drying chamber communicates in proper order, and each the inlet end in air-drying chamber is located with the end branch of giving vent to anger box length direction's both sides. According to the utility model, the air heated by the heating element in the box body can be sequentially input into each air drying cavity through the air pressure fan so as to air-dry the chips in each air drying cavity, and the high-temperature air entering the air drying cavities flows from one end to the other end of the air drying cavities, so that the uniformity of the air flowing in the box body can be ensured, the chips placed in the box body can be quickly air-dried, and the air drying efficiency of the chips is improved.

Description

Chip air-drying box

Technical Field

The utility model relates to the technical field of electronic device production, in particular to a chip air drying box.

Background

In the production process of some functional chips, such as microwave chips, radio frequency chips and other functional chips, the chips need to be cleaned, and then high-temperature air boxes are adopted for air drying. The existing air drying box for air drying the chips is mostly provided with a floor type placing rack in a box body, and gas in the fan circulating box is used for transferring heat of a heating part to the chips. But building formula rack middle part component is more for the interval between the component is flowed away from in a large amount of follow of circulating fan output, and is sheltered from the regional temperature rise of air current by the component and slower, needs longer time to air-dry the chip in the box, and the air-dried efficiency of chip is low.

SUMMERY OF THE UTILITY MODEL

Aiming at the technical problem that a chip placing component in the existing chip air drying box shields air flow; the utility model provides a chip air drying box which can ensure the uniformity of air flowing in a box body so as to quickly air-dry a chip placed in the box body, thereby improving the air-drying efficiency of the chip.

The utility model is realized by the following technical scheme:

the utility model provides a chip air-drying box, includes the box, the box is adapted to fan and heating element, the interval has the polylith baffle in the box, the baffle is used for placing the chip, the baffle will the box inner chamber is separated for a plurality of air-drying chambers from top to bottom, and is a plurality of the air-drying chamber communicates in proper order, and each the inlet end in air-drying chamber is located with the end branch of giving vent to anger box length direction's both sides.

When the air drying box is used, the chips are directly placed on the partition plate, or the placing containers for placing the chips or the chip placing containers are placed on the partition plate through the tray, then the box doors matched with the box body are closed, and because the air drying cavities are sequentially communicated, air heated by the heating elements in the box body can be sequentially input into the air drying cavities through the air pressure fan so as to air dry the chips in the air drying cavities.

Wherein, the inlet end in each air-dry chamber and the both sides of locating box length direction separately of the end of giving vent to anger for the high-temperature gas that gets into the air-dry intracavity flows to the other end from the one end in air-dry chamber, then flows to the end of giving vent to anger from the inlet end in next air-dry chamber, thereby makes high-temperature gas can carry out abundant air-drying to all chips in the box. Therefore, the chip air drying box provided by the utility model can ensure the uniformity of air flowing in the box body so as to quickly air-dry the chips placed in the box body, thereby improving the efficiency of air-drying the chips.

In an optional embodiment, each partition plate is provided with a vent hole at one side, two adjacent air drying cavities are communicated through the vent holes, the two adjacent air drying cavities are communicated through the vent holes in the partition plates, and compared with a structure that the side walls of the box body are provided with communicated circulation holes, the structure is simpler.

In an alternative embodiment, the vent hole is a long hole extending along the width direction of the box body, so that the vent hole has sufficient flow capacity and the influence on the flow of high-temperature gas is avoided.

In an optional embodiment, a heating cavity is arranged at the lower end of the box body, the heating element and the fan are located in the heating cavity, the heating element is located between the air outlet of the fan and the air inlet end of the air drying cavity at the bottom end, and the air inlet end of the fan is communicated with the air outlet end of the air drying cavity at the top end, so that air in the box body is circulated through the fan, and the utilization rate of heat of the heating element is improved.

In an optional embodiment, a side wall of the box body is provided with a backflow channel, and the air inlet end of the fan is communicated with the air outlet end of the air drying cavity at the top end through the backflow channel, so that the air output by the fan can flow through all cavities in the box body.

In an optional embodiment, a deflection section is arranged in the middle of the backflow channel, and the deflection section is an S-shaped flow channel which is horizontally arranged, so that water drops generated after the gas in the backflow channel is cooled are collected through the deflection section, the water drops generated by condensation are prevented from entering the box body again to be evaporated and absorb heat, and the utilization rate of heat of the heating element is further improved.

In an optional embodiment, a liquid outlet is arranged at the bottom of the baffling section, and the liquid outlet is matched with a liquid outlet plug so as to drain accumulated water in the baffling section.

In an alternative embodiment, the heating element is a resistance heating wire to ensure that the heat generated by the heating element can be timely taken away by the gas flowing in the box body.

In an optional embodiment, the inner side wall of the box body is covered with a heat insulation layer so as to reduce the quantity of heat in the box body which is dissipated outwards.

The utility model has the following beneficial effects:

according to the chip air drying box provided by the utility model, the plurality of air drying cavities are sequentially communicated, air heated by the heating element in the box body can be sequentially input into each air drying cavity through the fan to air-dry the chips in each air drying cavity, the air inlet end and the air outlet end of each air drying cavity are respectively arranged on two sides of the length direction of the box body, so that high-temperature air entering the air drying cavities flows from one end to the other end of each air drying cavity and then flows from the air inlet end to the air outlet end of the next air drying cavity, therefore, the high-temperature air can fully air-dry all the chips in the box body, the uniformity of air flowing in the box body can be ensured, the chips placed in the box body can be quickly air-dried, and the air-drying efficiency of the chips is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

Fig. 1 is a schematic structural view of a chip air-drying box according to an embodiment of the utility model.

Reference numerals:

1-box body, 11-air drying cavity, 12-heating cavity, 13-reflux channel, 14-liquid discharge plug, 15-heat insulation layer, 2-fan, 3-heating element, 4-partition plate and 41-vent hole.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the embodiments of the present application, the terms "central," "upper," "lower," "left," "right," "vertical," "longitudinal," "lateral," "horizontal," "inner," "outer," "front," "rear," "top," "bottom," and the like refer to orientations or positional relationships that are conventionally used in the manufacture of the present application, or that are routinely understood by those of ordinary skill in the art, but are merely used to facilitate the description and to simplify the description and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be considered limiting of the present application.

In the description of the present invention, unless otherwise expressly specified or limited, the terms "disposed," "open," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

Examples

With reference to fig. 1, this embodiment provides a chip air-drying box, including box 1, box 1 is fit with fan 2 and heating element 3, there are polylith baffle 4 at the interval in the box 1, baffle 4 is used for placing the chip, baffle 4 will the box 1 inner chamber is separated for a plurality of air-drying chamber 11 from top to bottom, and is a plurality of air-drying chamber 11 communicates in proper order, and each air inlet end and the end branch of giving vent to anger of air-drying chamber 11 are located box 1 length direction's both sides.

Specifically, each partition plate 4 is provided with a vent hole 41 on one side, the two adjacent air drying cavities 11 are communicated through the vent holes 41 on the partition plate 4, and the structure is simpler than that of communicating and circulating through the side wall of the box body 1.

Preferably, the vent hole 41 is a long hole extending along the width direction of the case 1 to ensure sufficient flow capacity of the vent hole 41 and avoid affecting the flow of the high-temperature gas.

Wherein, 1 lower extreme of box is equipped with heating chamber 12, heating element 3 with fan 2 is located in heating chamber 12, heating element 3 is located between 2 gas outlets of fan and the bottom air-dry chamber 11 inlet end, 2 inlet ends of fan and top air-dry chamber 11 end intercommunication of giving vent to anger to through the gas in the 2 circulation boxes of fan 1, in order to improve the thermal utilization ratio of heating element 3.

Specifically, a backflow channel 13 is arranged on one side wall of the box body 1, and the air inlet end of the fan 2 is communicated with the air outlet end of the air drying cavity 11 on the top end through the backflow channel 13, so that the air output by the fan 2 can flow through all cavities in the box body 1.

Preferably, the middle part of the backflow channel 13 is provided with a baffling section, the baffling section is an S-shaped flow channel which is horizontally arranged, so that water drops generated after gas in the backflow channel 13 is cooled are collected through the baffling section, the water drops generated by condensation are prevented from entering the box body 1 again to be evaporated and absorb heat, and the heat utilization rate of the heating element 3 is further improved.

Correspondingly, the bottom of the baffling section is provided with a liquid outlet, and the liquid outlet is matched with a liquid outlet plug 14 so as to discharge accumulated water in the baffling section.

In this embodiment, the heating element 3 is a resistance heating wire to ensure that the heat generated by the heating element 3 can be taken away by the gas flowing in the box 1 in time.

Further, the inner side wall of the box body 1 is covered with a heat insulation layer 15 to reduce the amount of heat in the box body 1 dissipating outwards.

During the use, directly place the chip on baffle 4 or will place placing the ware of chip, perhaps place the ware through the tray with chip or chip and place on baffle 4, then close the chamber door of box 1 adaptation, because a plurality of air-dry chambeies 11 communicate in proper order, the accessible wind pressure fan with the gas after heating element 3 in the box 1, in order to air-dry the chip in each air-dry chamber 11 to inputing in proper order.

Wherein, the inlet end of each air-drying cavity 11 and the both sides of 1 length direction of box are located to the end branch of giving vent to anger for the high-temperature gas that enters into in the air-drying cavity 11 flows to the other end from the one end of air-drying cavity 11, then flows to the end of giving vent to anger from the inlet end of next air-drying cavity 11, thereby makes high-temperature gas carry out abundant air-drying to all chips in the box 1. Therefore, the chip air-drying box provided by the embodiment can ensure the uniformity of gas flowing in the box body 1 so as to quickly air-dry the chips placed in the box body 1, thereby improving the efficiency of air-drying the chips.

The foregoing is only a preferred embodiment of the present invention, and the present invention is not limited thereto in any way, and any simple modification, equivalent replacement and improvement made to the above embodiment within the spirit and principle of the present invention still fall within the protection scope of the present invention.

Claims

1. The utility model provides a chip air-drying box, includes box (1), its characterized in that, box (1) is fit with fan (2) and heating element (3), the interval has polylith baffle (4) in box (1), baffle (4) are used for placing the chip, baffle (4) will box (1) inner chamber is separated for a plurality of air-drying chamber (11), and is a plurality of air-drying chamber (11) communicate in proper order, and each the inlet end in air-drying chamber (11) is located with the end branch of giving vent to anger box (1) length direction's both sides.

2. The chip air-drying box according to claim 1, characterized in that one side of each partition (4) is provided with a vent hole (41), and two adjacent air-drying cavities (11) are communicated through the vent holes (41).

3. The chip air-drying box according to claim 2, characterized in that the vent hole (41) is a long hole extending in the width direction of the box body (1).

4. The chip air-drying box according to claim 1, characterized in that the lower end of the box body (1) is provided with a heating cavity (12), the heating element (3) and the fan (2) are positioned in the heating cavity (12), the heating element (3) is positioned between the air outlet of the fan (2) and the air inlet of the air-drying cavity (11) at the bottom end, and the air inlet of the fan (2) is communicated with the air outlet of the air-drying cavity (11) at the top end.

5. The chip air-drying box according to claim 4, characterized in that a side wall of the box body (1) is provided with a return channel (13), and an air inlet end of the fan (2) is communicated with an air outlet end of the air-drying cavity (11) at the top end through the return channel (13).

6. The chip air-drying box of claim 5, characterized in that the middle of the return channel (13) is provided with a deflection section, and the deflection section is a flat S-shaped flow channel.

7. The chip air-drying box of claim 6, characterized in that the bottom of the baffling section is provided with a liquid outlet, and the liquid outlet is adapted with a liquid outlet plug (14).

8. Chip air-drying box according to any of claims 1-7, characterized in that the heating element (3) is a resistance heating wire.

9. Chip air-drying box according to claim 8, characterized in that the inner side walls of the box (1) are covered with an insulating layer (15).