CN216074061U - Welding wire copper plating device - Google Patents
Welding wire copper plating device Download PDFInfo
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- CN216074061U CN216074061U CN202120803679.3U CN202120803679U CN216074061U CN 216074061 U CN216074061 U CN 216074061U CN 202120803679 U CN202120803679 U CN 202120803679U CN 216074061 U CN216074061 U CN 216074061U
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Abstract
The utility model relates to the technical field of welding wire production equipment, in particular to a welding wire copper plating device which comprises an upper tank body and a lower tank body, wherein the upper tank body is arranged above the lower tank body, the upper tank body is communicated with the lower tank body, a copper sulfate solution is filled in the lower tank body, a conveying device for conveying the copper sulfate solution into the upper tank body is arranged on the lower tank body, a material made of copper is arranged in the upper tank body, when the welding wire copper plating device is used, a more environment-friendly and efficient surface copper plating process is adopted, copper is used as a rapid copper plating anode, when one copper ion in the solution obtains electrons at a cathode, one copper atom is changed into the copper ion at the anode, the copper ion enters the solution, only the copper bar is consumed as the anode, the concentration of the solution is almost kept unchanged, the surface copper plating is carried out by using the method, the interatomic combination is realized, and the compactness is higher than that of chemical copper plating, reduce the corrosion influence, can not be because of the production reduction of reasons such as weather, the copper layer cohesion improves, and the copper layer drops.
Description
Technical Field
The utility model relates to the technical field of welding wire production equipment, in particular to a welding wire copper plating device.
Background
The method and practice of electro-coppering of welding wire is currently accomplished in many types of ways, but most of the industry uses electroless copper plating for surface copper plating of welding wire. The chemical surface copper plating of the welding wire is the result of replacing copper ions in copper sulfate solution with iron ions on the surface of the welding wire, and the chemical copper plating is the combination between crystals and has poor compactness. Under the condition of poor compactness, the part exposed with iron is easy to corrode, and particularly in plum rain, the part is contacted with moisture in the air under certain humidity and temperature, so that the surface is rusted. Due to compactness, the bonding force between the surface copper layer and the welding wire blank line is relatively poor, the welding wire with poor bonding force passes through the conductive nozzle in the welding process, the copper layer falls off due to the friction effect, the conductive nozzle is blocked, the wire feeding is not smooth, the electric arc is not stable, and the like, so that the quality problems are caused, the customer is not satisfied, and the risk of poor welding quality is caused. In production, when the machine is stopped due to the reasons of assembling and disassembling of the wire-releasing and wire-dropping spool and the like, a part of welding wires have the defect of copper layer dropping.
In the production process, the electroless copper plating is subjected to water washing, crude alkali, refined alkali, water washing, electric heating acid washing, water washing, activation, copper plating, washing, neutralization, hot water washing, an oven and red oil polishing. In the process, a large amount of chemical sewage and ferrous sulfate are generated, the content of the ferrous sulfate is too high, the copper plating quality is influenced, if the copper plating is to be recycled, the treatment cost is also high, the general method is to replace a new acid solution, the alkaline solution needs to be scrapped and updated, the generated waste acid contains a large amount of ferrous sulfate and sludge, the waste acid needs to be treated by qualified environmental protection departments, and the overall environmental protection cost is very high.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the utility model is as follows: in order to solve the problems that a large amount of sewage is generated by chemical copper plating and the treatment cost is high, the welding wire copper plating device is provided.
The technical scheme adopted by the utility model for solving the technical problems is as follows: the utility model provides a welding wire copper plating equipment, includes upper tank body and lower tank body, upper tank body sets up under in the tank body top, upper tank body and lower intercommunication between the tank body, the tank body is built-in to be equipped with copper sulfate solution down, be provided with on the tank body down and carry the copper sulfate solution to the conveyor in the upper tank body, be provided with the material that the material is copper in the upper tank body, when the welding wire passes through upper tank body and submergence in copper sulfate solution, the material submergence is in copper sulfate solution and with connect positive charge on the material, connect the negative charge on the welding wire, realize carrying out the copper facing to the welding wire.
The utility model adopts a more environment-friendly and efficient surface copper plating process, the anode for fast copper plating uses copper, when a copper ion in the solution obtains an electron at a cathode, one copper atom at the anode can be changed into a copper ion to enter the solution, only a loss is used as an anode copper bar in the process, the concentration of the solution is almost kept unchanged, the surface copper plating is carried out by using the method, the surface copper plating is interatomic combination, the compactness is higher than that of chemical copper plating, the binding force of a copper layer is improved, the corrosion influence is reduced, the production reduction, the copper layer falling or the blockage of a conductive nozzle caused by weather and the like are avoided, the probability of unsmooth wire feeding is greatly reduced, the machine halt has smaller influence on the electrochemical plating and generally cannot fall off, the fast copper plating process is washed by water, electrically heated acid washing, electroplating, water washing, an oven and polishing, the process is reduced, the speed is fast, the loss of the concentration of the solution is less, the solution is replaced when the solution is aged, and the solution can be generally used for a long time, the method has the advantages that sewage discharge is reduced, loss caused by weather influence is avoided, cost for sewage treatment is reduced, and an electroplating brightener is added into an electroplating solution, so that the surface of a copper layer of an electroplated welding wire is brighter, and the surface quality is improved.
Because copper sulfate can form ferrous sulfate with the iron replacement on the welding wire, ferrous sulfate can appear crystallization phenomenon when low temperature, and long-term welding wire department of carrying appears blocking phenomenon, causes surface quality problems such as welding wire scratch, furtherly, upward be provided with gas blowing device on the cell body, gas blowing device is including setting up the plate body in last cell body, set up the passageway that is used for the welding wire to pass through on the plate body, be provided with the mouth of blowing on the plate body, the output and the passageway intercommunication of mouth of blowing, the input and the outside air supply intercommunication of mouth of blowing. Through set up the mouth of blowing with the passageway intercommunication on the plate body, the mouth of blowing is let in high-pressure gas, and gas blows off the adnexed solution on the welding wire, prevents to take the water crystallization, effectively prevents that the jam from appearing in the plate body passageway.
In order to realize the conveying device, further, conveying device includes the delivery pump, the delivery pump sets up under on the cell body, the input setting of delivery pump is in the cell body down, the output setting of delivery pump is on last cell body. The conveying pump is arranged on the lower tank body, and the conveying pump conveys the copper sulfate solution in the lower tank body into the upper tank body and submerges the welding wire, so that the conveying device is realized.
Further, the output of delivery pump is provided with the outer body of intercommunication each other, outer body sets up along welding wire direction of delivery, outer body has seted up the through-flow hole along welding wire direction of delivery, the through-flow hole is located the welding wire top.
Further, the upper groove body is positioned in the lower groove body. The upper tank body is arranged in the lower tank body, so that the upper tank body is communicated with the lower tank body conveniently, a bypass pipe is not needed for communication, the production cost is reduced, and meanwhile, when the copper sulfate solution overflows from the upper tank body, the copper sulfate solution can directly flow into the lower tank body to prevent the copper sulfate solution from leaking outside.
In order to realize that the upper tank body is communicated with the lower tank body, the lower tank body comprises an upper holding tank and a bottom liquid storage tank, the copper sulfate solution is placed in the liquid storage tank, the upper tank body is located in the holding tank, and first holes communicated with each other are formed between the holding tank and the liquid storage tank. The containing tank is arranged on the lower tank body through the upper tank body, the copper sulfate solution is placed in the liquid storage tank, the containing tank and the liquid storage tank are communicated through the first holes, and therefore the upper tank body is communicated with the lower tank body.
In order to better realize the communication between the upper tank body and the lower tank body, a second hole communicated with the accommodating groove is formed in the bottom of the upper tank body. The second hole is formed in the bottom of the upper tank body and located above the first hole, so that a copper sulfate solution in the upper tank body is continuously and circularly conveyed into the lower tank body.
The utility model has the beneficial effects that: when the welding wire copper plating device is used, a more environment-friendly and efficient surface copper plating process is adopted, copper is used for a rapid copper plating anode, when one copper ion in the solution obtains electrons at a cathode, one copper atom at the anode can be changed into a copper ion to enter the solution, only loss is used as an anode copper rod in the process, the concentration of the solution is almost kept unchanged, the surface copper plating is carried out by using the method, the welding wire copper plating device is interatomic combined, the compactness is higher than that of chemical copper plating, the binding force of a copper layer is improved, the corrosion influence is reduced, the production reduction caused by weather and the like, the copper layer falling or the blockage of a conductive nozzle is avoided, the probability of unsmooth wire feeding is greatly reduced, the machine halt has small influence on electrochemical plating, the electrochemical plating cannot generally fall off, the rapid copper plating process is subjected to water washing, electric heating and acid washing, water washing, drying oven and polishing, the process is fast in speed, and the solution concentration loss is less, and is replaced when the solution is aged, generally can use for a long time, reduce sewage discharge to avoid the loss that weather influence caused, and reduce the cost that the processing sewage produced, still add electroplating brightener in the electroplating solution, make the welding wire copper layer surface of electroplating out brighter, improve surface quality, avoided in process of production, chemical copper plating through washing, crude alkali, smart alkali, washing, the washing of electric heat pickling washing, the activation, copper-plating, wash, neutralization, hot water washing, oven, red oil polishing. In the process, a large amount of chemical sewage and ferrous sulfate are generated, and the content of the ferrous sulfate is too high, so that the quality of copper plating is influenced. If the waste water needs to be recycled, the treatment cost is high. The general method is to replace a new acidic solution, the alkaline solution needs to be scrapped and updated, the generated waste acid contains a large amount of ferrous sulfate and sludge, the waste acid needs to be treated by qualified environmental protection departments, and the overall environmental protection cost is very high.
Drawings
The utility model is further illustrated with reference to the following figures and examples.
FIG. 1 is a front view of the present invention;
FIG. 2 is a front view of the air blowing device of the present invention;
FIG. 3 is a plan view of the air blowing device of the present invention.
In the figure: 1. go up cell body, 2, lower cell body, 3, material, 4, plate body, 5, passageway, 6, the mouth of blowing, 7, delivery pump, 8, outer cell body, 9, holding tank, 10, reservoir, 11, first hole, 12, second hole, 13, through-flow hole.
Detailed Description
The utility model is described in more detail below with reference to the following examples:
the present invention is not limited to the following embodiments, and those skilled in the art can implement the present invention in other embodiments according to the disclosure of the present invention, or make simple changes or modifications on the design structure and idea of the present invention, and fall into the protection scope of the present invention. It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
As shown in fig. 1-3, a welding wire copper plating device comprises an upper tank body 1 and a lower tank body 2, wherein the upper tank body 1 is arranged above the lower tank body 2, the upper tank body 1 and the lower tank body 2 are communicated with each other, a copper sulfate solution is filled in the lower tank body 2, a conveying device for conveying the copper sulfate solution into the upper tank body 1 is arranged on the lower tank body 2, a material 3 made of copper is arranged in the upper tank body 1, when a welding wire passes through the upper tank body 1 and is immersed in the copper sulfate solution, the material 3 is immersed in the copper sulfate solution and connects the material 3 with positive charges, and negative charges are connected to the welding wire to realize copper plating of the welding wire.
The welding wire welding device is characterized in that the upper groove body 1 is provided with a blowing device, the blowing device comprises a plate body 4 arranged in the upper groove body 1, a channel 5 used for a welding wire to pass through is formed in the plate body 4, a blowing port 6 is formed in the plate body 4, the output end of the blowing port 6 is communicated with the channel 5, and the input end of the blowing port 6 is communicated with an external air source. The external source here is compressed gas provided by a compressor.
The conveying device comprises a conveying pump 7, the conveying pump 7 is arranged on the lower tank body 2, the input end of the conveying pump 7 is arranged in the lower tank body 2, and the output end of the conveying pump 7 is arranged on the upper tank body 1.
The output of delivery pump 7 is provided with outer body 8 that communicates each other, outer body 8 sets up along welding wire direction of delivery, outer body 8 has seted up through-flow hole 13 along welding wire direction of delivery, through-flow hole 13 is located the welding wire top.
The upper tank body 1 is located in the upper receiving groove 9 of the lower tank body 2.
The lower tank body 2 comprises an upper holding tank 9 and a bottom liquid storage tank 10, the copper sulfate solution is placed in the liquid storage tank 10, the upper tank body 1 is located in the holding tank 9, and first holes 11 which are communicated with each other are formed between the holding tank 9 and the liquid storage tank 10.
And a second hole 12 communicated with the holding tank 9 is formed at the bottom of the upper tank body 1.
When the welding wire copper plating device is used, a welding wire is input into the upper groove body 1 through the channel 5 of the plate body 4 and is immersed in a copper sulfate solution, a conveying pump 7 of the conveying device conveys the copper sulfate solution in the lower groove body 2 to the outer pipe body 8 and flows out of the through-flow hole 13 of the outer pipe body 8 and then enters the upper groove body 1, so that the material 3 is immersed in the copper sulfate solution, the material 3 is connected with an anode, the material 3 is made of copper, the material 3 made of copper generates positive charge, the welding wire is made of iron, a cathode is connected with the welding wire, negative charge is generated on the welding wire, copper is used as a fast copper plating anode, when one copper ion in the solution obtains electrons at a cathode, one copper atom at the anode is changed into a copper ion to enter the solution, only loss is used as an anode copper rod in the process, the concentration of the solution is almost kept unchanged, and surface copper plating is carried out by using the method, simultaneously, ferrous sulfate after welding wire replacement is blown away by the air blowing opening 6 on the plate body 4, so that the welding wire is prevented from being crystallized with water, and the phenomenon of blocking the channel 5 on the plate body 4 is caused, because the conveying pump 7 of the conveying device continuously conveys copper sulfate solution, copper sulfate in the upper groove body 1 enters the accommodating groove 9 through the second hole 12 and enters the liquid storage tank 10 through the first through hole, and thus circular conveying is carried out.
In light of the foregoing description of the preferred embodiment of the present invention, it is to be understood that numerous changes and modifications may be made by those skilled in the art without departing from the spirit and scope of the utility model. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (7)
1. A welding wire copper plating device is characterized in that: including last cell body (1) and lower cell body (2), go up cell body (1) and set up under cell body (2) top, go up and communicate each other between cell body (1) and the lower cell body (2), the built-in copper sulfate solution that is equipped with of cell body (2) down, be provided with on the cell body (2) down and carry the conveyor in last cell body (1) with copper sulfate solution, upward be provided with material (3) that the material is copper in cell body (1), when the welding wire passes through last cell body (1) and submergence in copper sulfate solution, material (3) submergence is in copper sulfate solution and with connecting positive charge on material (3), connect the negative charge on the welding wire, realize coppering to the welding wire.
2. The wire copper plating apparatus according to claim 1, characterized in that: go up and be provided with gas blowing device on cell body (1), gas blowing device is including setting up plate body (4) in last cell body (1), offer passageway (5) that are used for the welding wire to pass through on plate body (4), be provided with on plate body (4) and blow mouth (6), the output and passageway (5) the intercommunication of blowing mouth (6), the input and the outside air supply intercommunication of blowing mouth (6).
3. The wire copper plating apparatus according to claim 1, characterized in that: the conveying device comprises a conveying pump (7), wherein the conveying pump (7) is arranged on the lower tank body (2), the input end of the conveying pump (7) is arranged in the lower tank body (2), and the output end of the conveying pump (7) is arranged on the upper tank body (1).
4. The wire copper plating apparatus according to claim 3, characterized in that: the output of delivery pump (7) is provided with outer body (8) of mutual intercommunication, outer body (8) set up along welding wire direction of delivery, through-flow hole (13) have been seted up along welding wire direction of delivery in outer body (8), through-flow hole (13) are located the welding wire top.
5. The wire copper plating apparatus according to claim 1, characterized in that: the upper tank body (1) is positioned in the lower tank body (2).
6. The wire copper plating apparatus according to claim 5, characterized in that: the lower tank body (2) comprises an upper accommodating tank (9) and a bottom liquid storage tank (10), the copper sulfate solution is placed in the liquid storage tank (10), the upper tank body (1) is located in the accommodating tank (9), and first holes (11) communicated with each other are formed between the accommodating tank (9) and the liquid storage tank (10).
7. The wire copper plating apparatus according to claim 6, characterized in that: and a second hole (12) communicated with the accommodating groove (9) is formed at the bottom of the upper groove body (1).
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CN202120803679.3U CN216074061U (en) | 2021-04-19 | 2021-04-19 | Welding wire copper plating device |
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CN202120803679.3U CN216074061U (en) | 2021-04-19 | 2021-04-19 | Welding wire copper plating device |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114892247A (en) * | 2022-05-26 | 2022-08-12 | 山东聚力焊接材料有限公司 | Welding wire copper plating device, electrode plate manufacturing method and welding wire copper plating method |
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2021
- 2021-04-19 CN CN202120803679.3U patent/CN216074061U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114892247A (en) * | 2022-05-26 | 2022-08-12 | 山东聚力焊接材料有限公司 | Welding wire copper plating device, electrode plate manufacturing method and welding wire copper plating method |
CN114892247B (en) * | 2022-05-26 | 2024-02-09 | 山东聚力焊接材料有限公司 | Welding wire copper plating device, electrode plate manufacturing method and welding wire copper plating method |
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