CN101509141A - Method for electroplating tin-copper - Google Patents
Method for electroplating tin-copper Download PDFInfo
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- CN101509141A CN101509141A CNA2008102343693A CN200810234369A CN101509141A CN 101509141 A CN101509141 A CN 101509141A CN A2008102343693 A CNA2008102343693 A CN A2008102343693A CN 200810234369 A CN200810234369 A CN 200810234369A CN 101509141 A CN101509141 A CN 101509141A
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Abstract
A method for electroplating a tin copper metal layer is characterized in that the formulation of the electroplating liquid is: in terms of mass volume ratio, 30-80g/l of tin methyl sulphonate and 0.5-3g/l of copper methyl sulphonate; in terms of volume ratio, 50-250ml/l of methyl sulfoacid, 30-80ml/l of additive SNC21 (produced by Germany Schlotter), 50-200ml/l of additive SNC22 (produced by Germany Schlotter), 5-15ml/l of additive SNC23 (produced by Germany Schlotter), and the balance of water; the current density of the electroplating solution is 10-20 ampere/square decimeter, the temperature is 35-65 DEG C, and the electroplating period is 1.5-2.5min. The cathode board in the electroplating tank which contains the electroplating solution servers as a conveying steel band, and the electroplated item has equal or similar distance with the two anode boards. The tin copper metal layer prepared by the method has uniform thickness, evenly distributed copper component, and excellent weldability.
Description
Technical field:
Present technique relates to the method for composite electroplated metal level, relates in particular to the method for the composite electroplated metal level of unicircuit outer lead pin.
Background technology:
Tin copper electroplating technology is widely used in pcb board (printed circuit board), the IC unicircuit is electroplated, compare with plumbous plating of tin, the plating of tin copper is nontoxic, corrodibility is low and coating is bright, weldability is good, characteristics such as wastewater treatment is simple are that the our times various countries are devoted to promote and system is electroplated in the environmental protection used.Tin copper electro-coppering composition is 1～3%, and wherein the homogeneity of thickness of coating is the important indicator that influences quality product, and tin copper of the present invention is electroplated the problem in uneven thickness that solved.
At present, the rack plating mode is generally adopted in the galvanized production of tin copper, and its method mainly is to adopt low current density to electroplate for a long time, and for example current density is 1～3 ampere/square decimeter, and electroplating time is about 20 minutes.Because Anode-cathode Distance is bigger in the coating bath of rack plating mode, electroplated spare uses hanging basket suspension on negative electrode, make electroplated spare the surface everywhere and the distance between the anode different, the maximum about 300mm of distance, the minimum about 280mm of distance, so make electric current distribution irregular, cause the skewness of bismuth composition in electrolytic coating thickness and the tin bismuth electrolytic coating, as shown in Figure 1.
Summary of the invention:
The above-mentioned non-uniformity problem that the present invention is directed to tin copper electrolytic coating in the prior art has carried out research to be improved, a kind of method of electroplating tin-copper layer is provided, the galvanized tin copper metal layer of this method can satisfy uniformity requirement, and technology is simple, low cost of manufacture, and electroplating velocity is fast.
In order to achieve the above object, the present invention is achieved through the following technical solutions:
A kind of method of electroplating tin-copper layer, wherein the prescription of electroplate liquid is: contain tin methane sulfonate 30～80g/l, copper methanesulfonate 0.5～3g/l by mass volume ratio respectively; Contain methylsulphonic acid 50～250ml/l, additive SNC21 (German Shi Luote company produce) 30～80ml/l, additive SNC22 (German Shi Luote company produce) 50～200ml/l, additive SNC23 (German Shi Luote company produce) 5～15ml/l respectively by volume; Surplus is a water.
Carrying out the electroplating technique condition with described electroplate liquid is: current density is 10～20 amperes/square decimeter, and temperature is 35～65 ℃, and electroplating time is 1.5～2.5 minutes.
The negative plate of placing in the plating tank of above-mentioned electroplate liquid is the transmission steel band, and between two positive plates, plated item is fixed on the described transmission steel band, and plated item equates or close apart from the distance of two positive plates.
Described two positive plates are respectively sheet tin, and described sheet tin is of a size of: long 500 millimeters, wide 30 millimeters, high 100 millimeters.
The transfer rate of described transmission steel band is 4.5～5.5 meters/minute.
The present invention has overcome the deficiency of conventional art, has the following advantages:
1.. the prescription of electroplate liquid and electroplating technical conditions among employing the present invention, the tin copper metal layer thickness that obtains is even, and copper component is evenly distributed, and has good weldability.
2. the present invention is used for the outer lead of unicircuit, and the electroplating tin-copper layer substitutes tin lead metal layer in the prior art, has avoided Lead contamination, reaches environmental requirement.
3. technology is simple, adopts the high current density short period of time to electroplate, and electroplating velocity is fast, the production efficiency height.
4. adopt suitable additive, the product compact crystallization, whisker is less than 40um.
Description of drawings
Fig. 1 is that electroplated spare uses hanging basket suspension in the synoptic diagram of the enterprising electroplating of negative electrode in the prior art;
Fig. 2 attaches the synoptic diagram that is fixed in the enterprising electroplating of negative electrode for plated item among the present invention.
Embodiment:
The present invention further specifies by following examples.
The method of this electroplating tin-copper layer comprises operations such as pre-treatment, plating, aftertreatment.Concrete technical process is as follows:
Material loading → electrolytic degreasing → washing → activation (descaling) → washing → preimpregnation → tin copper plating → washing → neutralization → hot water wash → oven dry → blanking
Concrete processing step is as follows:
1. pre-treatment: comprise electrolytic degreasing, activation, three operations of preimpregnation, purpose is that the grease of the galvanized product surface of needs and oxide removal is clean.
Used chemical and processing condition see Table 1:
| Operation | Chemical | Concentration | Temperature | Electric current |
| Electrolytic degreasing | FR-200M (main component potassium hydroxide) | 100～300g/l | 30～60℃ | 200～500 amperes |
| Activation | Activated acids (main component sulfuric acid) | 30～70ml/l | Room temperature | Do not have |
| Preimpregnation | Methylsulphonic acid | 50～150ml/l | Room temperature | Voltage: 1～5 volt |
FR-200M is a kind of commodity electrolytic degreasing liquid in the last table, and its main component is a potassium hydroxide.The effect of preimpregnation is before plating electroplated spare reactivate is removed surface oxide layer in the last table.
2. tin copper is electroplated
It is a kind of electrochemical process that tin copper is electroplated, and also is a kind of redox processes, and its reaction is as follows:
Anode Sn-2e → Sn
2+Cu-2e → Cu
2+Oxidizing reaction
Negative electrode Sn
2++ 2e → Sn Cu
2++ 2e → Cu reduction reaction
3. aftertreatment
Neutralization: the acidic solution of product surface is removed totally, and in 30 seconds treatment times, chemical medicinal liquid is the solution of alkalescence.
Used chemical and processing condition see Table 2:
| Operation | Chemical | Concentration | Temperature |
| Neutralization | Sodium phosphate | 20～40g/l | 30～60℃ |
Now the goods of three batches of electroplateds being carried out the galvanized embodiment of tin copper metal layer describes:
Embodiment 1
Get the goods (outer lead of TSOP48 package of ic) of 50 electroplateds, attach with spring pinchcock as Fig. 2 and be fixed on the cathode transport steel band, this steel band equates apart from the distance of two positive plates, all is 100mm, sees Fig. 2.The material of positive plate is a sheet tin, and size is respectively: long 500 millimeters, wide 30 millimeters, high 100 millimeters.
Cathode transport steel band speed: 4.5m/min.
The prescription of electroplate liquid, electroplating technology step and processing condition such as following table.
Additive SNC21 can prevent that low current density district covering power from reducing in the plating solution formula of last table; The SNC22 additive can be avoided the Bivalent Tin oxidation, prevents the replacement(metathesis)reaction of copper and anode tin; The SNC23 additive can make the coating light, and crystallization is careful.
Get 10 of the lead-in wire electroplated samples of the ic shell in hanging basket mid-way, the content of test tin copper thickness of plating layer and copper component, 3 points of test are tested 30 points altogether on the lead-in wire of every ic shell.Wherein the content of tin copper thickness of plating layer and copper component adopts the X-Ray surveying instrument that German Fischer company produces, model: XULM-XYM, standard sample of photo model: 603-001.
Its take off data is as follows:
In the last table, CPK (process capability index) value is the inhomogeneity expression value of electrolytic coating, and its standard value is an industry recognised standard value greater than 1.67.
Embodiment 2:
Cathode transport steel band speed: 5m/min.
The prescription of electroplate liquid, electroplating technology step and processing condition such as following table, other process explanation are with embodiment 1.
Its take off data is as follows:
Embodiment 3
Cathode transport steel band speed: 5.5m/min.
The prescription of electroplate liquid, electroplating technology step and processing condition such as following table, other process explanation are with embodiment 1.
Its take off data is as follows:
By the foregoing description data as seen, the product plating thickness of electroplating out through the inventive method is even, and copper component content is even.
Claims (5)
1. the method for an electroplating tin-copper layer is characterized in that wherein the prescription of electroplate liquid is: contain tin methane sulfonate 30～80g/l, copper methanesulfonate 0.5～3g/l by mass volume ratio respectively; Contain methylsulphonic acid 50～250ml/l, additive SNC21 (German Shi Luote company produce) 30～80ml/l, additive SNC22 (German Shi Luote company produce) 50～200ml/l, additive SNC23 (German Shi Luote company produce) 5～15ml/l respectively by volume; Surplus is a water.
2. the method for electroplating tin-copper layer according to claim 1 is characterized in that carrying out galvanized current density with described electroplate liquid is 10～20 amperes/square decimeter, and temperature is 35～65 ℃, and electroplating time is 1.5～2.5 minutes.
3. the method for electroplating tin-copper layer according to claim 1, it is characterized in that: the negative plate of placing in the plating tank of above-mentioned electroplate liquid is the transmission steel band, described transmission steel band is between two positive plates, plated item is fixed on the described transmission steel band, and plated item is equal or close apart from the distance of two positive plates.
4. the method for electroplating tin-copper layer according to claim 3 is characterized in that: described two positive plates are respectively sheet tin, and described sheet tin is of a size of: long 500 millimeters, wide 30 millimeters, high 100 millimeters.
5. the method for electroplating tin-copper layer according to claim 3 is characterized in that: the transfer rate of described transmission steel band is 4.5～5.5 meters/minute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102343693A CN101509141A (en) | 2008-11-19 | 2008-11-19 | Method for electroplating tin-copper |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102343693A CN101509141A (en) | 2008-11-19 | 2008-11-19 | Method for electroplating tin-copper |
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| CN101509141A true CN101509141A (en) | 2009-08-19 |
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| CNA2008102343693A Pending CN101509141A (en) | 2008-11-19 | 2008-11-19 | Method for electroplating tin-copper |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102242383A (en) * | 2011-06-30 | 2011-11-16 | 上海华友金镀微电子有限公司 | Post-processing method for electroplating of solar welding strip |
| CN108103540A (en) * | 2018-01-24 | 2018-06-01 | 永星化工(上海)有限公司 | Tin alloy electric plating liquid |
-
2008
- 2008-11-19 CN CNA2008102343693A patent/CN101509141A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102242383A (en) * | 2011-06-30 | 2011-11-16 | 上海华友金镀微电子有限公司 | Post-processing method for electroplating of solar welding strip |
| CN102242383B (en) * | 2011-06-30 | 2014-04-16 | 上海华友金裕微电子有限公司 | Post-processing method for electroplating of solar welding strip |
| CN108103540A (en) * | 2018-01-24 | 2018-06-01 | 永星化工(上海)有限公司 | Tin alloy electric plating liquid |
| CN108103540B (en) * | 2018-01-24 | 2020-01-07 | 永星化工(上海)有限公司 | Tin alloy electroplating solution |
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Open date: 20090819 |