CN216066928U - Polishing and grinding device for chip production - Google Patents
Polishing and grinding device for chip production Download PDFInfo
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- CN216066928U CN216066928U CN202121933232.4U CN202121933232U CN216066928U CN 216066928 U CN216066928 U CN 216066928U CN 202121933232 U CN202121933232 U CN 202121933232U CN 216066928 U CN216066928 U CN 216066928U
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Abstract
The utility model discloses a polishing and grinding device for chip production, which relates to the technical field of polishing and grinding and comprises a grinder, a rotating machine, a polishing disc and a placing workbench, wherein the rotating machine is fixedly arranged on the top surface of the grinder, the polishing disc is fixedly connected to the output end of the rotating machine, the placing workbench is arranged on the outer surface of the grinder, and a fixed block is fixedly connected to the surface of the polishing disc. According to the utility model, the chip is placed on the outer surface of the placing plate, the L-shaped fixing plate is pushed by matching with the pushing rod, the L-shaped fixing plate is placed at the bottom of the chip, the polishing disc is pressed downwards to polish the chip, and the bottom of the chip is buffered by matching with the elastic wire.
Description
Technical Field
The utility model relates to the technical field of polishing and grinding, in particular to a polishing and grinding device for chip production.
Background
The polishing device is one of surface modification technologies, and generally refers to a processing method for changing physical properties of a material surface by friction with a rough object, and the purpose of the processing method is to obtain a specific surface roughness. The following problems exist in the prior art:
1. the chip is formed by stacking and compressing a plurality of layers of high-precision chips, a protective layer is required on the outer surface of the chip, and the protective layer on the surface has certain roughness and inconsistent thickness during sealing, so that the problem of poor heat dissipation inside the chip is caused;
2. because the inside of chip belongs to high-accuracy material, lead to the chip when polishing, the problem that the inside of chip can't oppress.
SUMMERY OF THE UTILITY MODEL
The utility model provides a polishing and grinding device for chip production, which aims to have the characteristic of polishing and grinding the surface of a chip and solve the problem that a protective layer on the surface has certain roughness and inconsistent thickness, so that the heat dissipation performance in the chip is poor; wherein another kind of purpose is in order to solve and to lead to the chip when polishing, and the inside problem that can't oppress of chip to reach when polishing, carry out the effect of protecting to the surface of chip.
In order to solve the technical problems, the technical scheme adopted by the utility model is as follows:
the polishing and grinding device for chip production comprises a grinder, a rotating machine, a polishing disc and a placing workbench, wherein the rotating machine is fixedly mounted on the top surface of the grinder, the polishing disc is fixedly connected to the output end of the rotating machine, and the placing workbench is arranged on the outer surface of the grinder.
The polishing device is characterized in that a fixed block is fixedly connected to the surface of the polishing disc, a dust collector is fixedly connected to the outer surface of the polishing disc, an arc-shaped suction port is fixedly connected to a suction port of the dust collector, and a polishing liquid bottle is fixedly connected to the top of the inner surface of the polishing disc.
The technical scheme of the utility model is further improved as follows: the lower surface of the polishing disc is fixedly connected with a grinding disc, and one end of the polishing liquid bottle extends to the surface of the grinding disc.
The technical scheme of the utility model is further improved as follows: fixedly connected with pneumatic pump on placing the both sides surface of workstation, fixedly connected with angle adjustment pump on placing the top surface of workstation, one of pneumatic pump and angle adjustment pump serves fixedly connected with roof, be provided with the fixed bed on the surface of roof.
The technical scheme of the utility model is further improved as follows: the outer surface of the fixing layer is provided with an empty groove, an elastic wire is fixedly connected to the outer surface of the empty groove, one end of the elastic wire is fixedly connected with a placing plate, a soft block is fixedly connected to the outer surface of the placing plate, a push rod is connected to the outer surface of the empty groove in a sliding mode, and one end of the push rod is fixedly connected with an L-shaped fixing plate.
The technical scheme of the utility model is further improved as follows: fixedly connected with diamond of polishing on the surface of mill, be provided with the weeping mouth on the central point of mill puts, fixedly connected with polishing stone on the surface of mill, be provided with the chip removal notch on the surface of mill.
The technical scheme of the utility model is further improved as follows: the polishing device is characterized in that a lower pressing column is connected to the inner surface of the polishing liquid bottle in a sliding mode, polishing liquid is filled in the polishing liquid bottle, and a dripping and leaking pipe is fixedly connected to the bottom of the polishing liquid bottle.
Due to the adoption of the technical scheme, compared with the prior art, the utility model has the technical progress that:
1. the utility model provides a polishing and grinding device for chip production, which adopts a polishing disk, a polishing rhombohedral block, a weeping hole, a polishing stone, a chip removal notch and an arc-shaped suction port, polishes the surface of a chip through the polishing disk, polishes the positions of a plurality of convex thorns and rough burrs on the surface by using the polishing rhombohedral block, discharges the polished convex thorns by using the chip removal notch, collects the scraps through matching with the arc-shaped suction port, drips the polished surface of the chip through the weeping hole, and polishes the surface of the chip by matching with the polishing stone.
2. The utility model provides a polishing and grinding device for chip production, which adopts a polishing and grinding disc, an elastic thread, a placing plate, a pushing rod and an L-shaped fixing plate in a matching manner, a chip is placed on the outer surface of the placing plate, the L-shaped fixing plate is pushed by matching with the pushing rod, the L-shaped fixing plate is placed at the bottom of the chip, the polishing and grinding disc is pressed downwards to grind the chip, and the elastic thread is matched to buffer the bottom of the chip.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the polishing pad of the present invention;
FIG. 3 is a schematic view of the abrasive disc construction of the present invention;
FIG. 4 is a schematic view of a placement table according to the present invention;
FIG. 5 is a schematic view of a fixing layer structure according to the present invention;
FIG. 6 is a schematic view of the structure of the polishing solution of the present invention.
In the figure: 1. a sander;
2. rotating the machine;
3. polishing the polishing disc; 31. a fixed block; 32. a vacuum cleaner; 33. an arc-shaped suction port; 34. a polishing solution bottle; 341. pressing the column; 342. polishing solution; 343. a drip pipe;
35. a grinding disc; 351. polishing the diamond blocks; 352. a drip opening; 353. polishing stones; 354. a chip removal notch;
4. placing a workbench; 41. a pneumatic pump; 42. an angle adjusting pump; 43. a top plate; 44. a fixed layer; 441. stretch yarn; 442. placing the plate; 443. a push rod; 444. an L-shaped fixing plate.
Detailed Description
The present invention will be described in further detail with reference to the following examples:
example 1
As shown in fig. 1-6, the utility model provides a polishing and grinding device for chip production, which comprises a grinder 1, a rotating machine 2, a polishing and grinding disc 3 and a placing table 4, wherein the rotating machine 2 is fixedly installed on the top surface of the grinder 1, the polishing and grinding disc 3 is fixedly connected to the output end of the rotating machine 2, and the placing table 4 is arranged on the outer surface of the grinder 1.
In this embodiment, the surface of the chip is fixed by the placing table 4, and the polishing disc 3 is rotated by the rotating machine 2, so as to polish and polish the surface of the chip.
As shown in fig. 1 to 6, in the present embodiment, it is preferable that a pneumatic pump 41 is fixedly connected to outer surfaces of both sides of the placing table 4, an angle adjusting pump 42 is fixedly connected to a top surface of the placing table 4, a top plate 43 is fixedly connected to one end of the pneumatic pump 41 and the angle adjusting pump 42, a fixing layer 44 is disposed on an outer surface of the top plate 43, a surface of the chip is fixed by the fixing layer 44, and the pneumatic pump 41 and the angle adjusting pump 42 are matched to buffer and fix a position during the polishing process.
As shown in fig. 1 to 6, preferably, a lower pressing column 341 is slidably connected to an inner surface of the polishing solution bottle 34, the polishing solution bottle 34 is filled with the polishing solution 342, a dropping pipe 343 is fixedly connected to a bottom of the polishing solution bottle 34, and the polishing solution 342 inside the polishing solution bottle 34 is pushed out from the dropping pipe 343 by pressing down the polishing solution bottle 34 through the lower pressing column 341.
Example 2
As shown in fig. 1 to 6, on the basis of embodiment 1, the present invention provides the following technical solutions: preferably, the fixed block 31 is fixedly connected to the surface of the polishing disc 3, the dust collector 32 is fixedly connected to the outer surface of the polishing disc 3, the arc suction port 33 is fixedly connected to the suction port of the dust collector 32, the polishing liquid bottle 34 is fixedly connected to the top of the inner surface of the polishing disc 3, the grinding disc 35 is fixedly connected to the lower surface of the polishing disc 3, one end of the polishing liquid bottle 34 extends to the surface of the grinding disc 35, the diamond block 351 for polishing is fixedly connected to the outer surface of the grinding disc 35, the drip port 352 is arranged at the center of the grinding disc 35, the polishing stone 353 is fixedly connected to the outer surface of the grinding disc 35, and the chip removal notch 354 is arranged on the outer surface of the grinding disc 35.
In this embodiment, polish the surface of chip through burnishing and polishing dish 3, utilize the rhombus piece 351 of polishing to polish some burs on the surface, the place of coarse is polished, the bur of polishing down uses chip removal notch 354 to discharge away, cooperation arc suction inlet 33 is collected the piece, rethread drip 352 carries out the dropping liquid to the chip surface after polishing, deuterogamy polishing stone 353 polishes the chip surface, has reached the effect of polishing the surface of chip.
Example 3
As shown in fig. 1 to 6, on the basis of embodiment 1, the present invention provides the following technical solutions: preferably, a hollow groove is formed on the outer surface of the fixing layer 44, an elastic thread 441 is fixedly connected to the outer surface of the hollow groove, a placing plate 442 is fixedly connected to one end of the elastic thread 441, a soft block is fixedly connected to the outer surface of the placing plate 442, a pushing rod 443 is slidably connected to the outer surface of the hollow groove, and an L-shaped fixing plate 444 is fixedly connected to one end of the pushing rod 443.
In this embodiment, put the chip on the surface of placing board 442, cooperate catch bar 443 to promote L type fixed plate 444, put the bottom of chip with L type fixed plate 444, push down polishing dish 3 of polishing and polish the chip, cooperate stretch yarn 441 to cushion the bottom of chip to reach when polishing, protect the effect on the surface of chip.
The working principle of the polishing and grinding device for producing the chip is described in detail below.
As shown in fig. 1 to 6, the chip is placed on the outer surface of the placement plate 442, the L-shaped fixing plate 444 is pushed by the pushing rod 443, the L-shaped fixing plate 444 is placed at the bottom of the chip, the polishing disc 3 is rotated by the rotating machine 2, the chip surface is polished at some convex thorns and rough places by the polishing diamond 351, the polished convex thorns are discharged by the chip discharge notch 354, the chips are collected by the arc suction port 33, the polished chip surface is dripped by the dripping port 352, the chip surface is polished by the polishing stone 353, and the shake in the polishing process is corrected in position by the pneumatic pump 41 and the angle adjusting pump 42.
The present invention has been described in general terms in the foregoing, but it will be apparent to those skilled in the art that modifications and improvements can be made thereto based on the present invention. Therefore, modifications or improvements are within the scope of the utility model without departing from the spirit of the inventive concept.
Claims (6)
1. The utility model provides a chip production is with polishing grinding device, includes sander (1), rotates machine (2), polishes polishing disk (3) and places workstation (4), its characterized in that: a rotating machine (2) is fixedly arranged on the top surface of the sander (1), a sanding polishing disc (3) is fixedly connected to the output end of the rotating machine (2), and a placing workbench (4) is arranged on the outer surface of the sander (1);
the polishing disc is characterized in that a fixed block (31) is fixedly connected to the surface of the polishing disc (3), a dust collector (32) is fixedly connected to the outer surface of the polishing disc (3), an air suction opening of the dust collector (32) is fixedly connected with an arc suction opening (33), and a polishing liquid bottle (34) is fixedly connected to the top of the inner surface of the polishing disc (3).
2. The polishing and grinding device for chip production according to claim 1, wherein: the lower surface of the grinding and polishing disc (3) is fixedly connected with a grinding disc (35), and one end of the polishing liquid bottle (34) extends to the surface of the grinding disc (35).
3. The polishing and grinding device for chip production according to claim 1, wherein: fixedly connected with pneumatic pump (41) on the both sides surface of placing workstation (4), fixedly connected with angle adjusting pump (42) on the top surface of placing workstation (4), fixedly connected with roof (43) is served to one of pneumatic pump (41) and angle adjusting pump (42), be provided with fixed bed (44) on the surface of roof (43).
4. The polishing and grinding device for chip production as claimed in claim 3, wherein: the outer surface of the fixing layer (44) is provided with a hollow groove, an elastic thread (441) is fixedly connected to the outer surface of the hollow groove, one end of the elastic thread (441) is fixedly connected with a placing plate (442), a soft block is fixedly connected to the outer surface of the placing plate (442), the outer surface of the hollow groove is slidably connected with a push rod (443), and one end of the push rod (443) is fixedly connected with an L-shaped fixing plate (444).
5. The polishing and grinding device for chip production as claimed in claim 2, wherein: fixedly connected with diamond (351) of polishing on the surface of mill (35), be provided with drip opening (352) on the central point of mill (35), fixedly connected with polishing stone (353) on the surface of mill (35), be provided with chip removal notch (354) on the surface of mill (35).
6. The polishing and grinding device for chip production according to claim 1, wherein: the polishing device is characterized in that a lower pressing column (341) is connected to the inner surface of the polishing liquid bottle (34) in a sliding mode, polishing liquid (342) is filled in the polishing liquid bottle (34), and a dripping and leaking pipe (343) is fixedly connected to the bottom of the polishing liquid bottle (34).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121933232.4U CN216066928U (en) | 2021-08-17 | 2021-08-17 | Polishing and grinding device for chip production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121933232.4U CN216066928U (en) | 2021-08-17 | 2021-08-17 | Polishing and grinding device for chip production |
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| Publication Number | Publication Date |
|---|---|
| CN216066928U true CN216066928U (en) | 2022-03-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121933232.4U Active CN216066928U (en) | 2021-08-17 | 2021-08-17 | Polishing and grinding device for chip production |
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| CN (1) | CN216066928U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115319563A (en) * | 2022-08-30 | 2022-11-11 | 上海积塔半导体有限公司 | Fixing device and chip polishing method |
-
2021
- 2021-08-17 CN CN202121933232.4U patent/CN216066928U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115319563A (en) * | 2022-08-30 | 2022-11-11 | 上海积塔半导体有限公司 | Fixing device and chip polishing method |
| CN115319563B (en) * | 2022-08-30 | 2024-01-19 | 上海积塔半导体有限公司 | Fixing device and chip polishing method |
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Effective date of registration: 20221108 Address after: 644000 No.7, north section of Yibin Port Road, shaping street, Lingang Economic Development Zone, Yibin City, Sichuan Province Patentee after: Yibin Zhuobong Technology Co.,Ltd. Address before: 448000 group 3, Tandian village, Shuangxi street, Zhanghe new area, Jingmen City, Hubei Province Patentee before: Cai Mingyu |
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| TR01 | Transfer of patent right |