CN216058115U - Shielding case with heat dissipation function - Google Patents
Shielding case with heat dissipation function Download PDFInfo
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- CN216058115U CN216058115U CN202121894502.5U CN202121894502U CN216058115U CN 216058115 U CN216058115 U CN 216058115U CN 202121894502 U CN202121894502 U CN 202121894502U CN 216058115 U CN216058115 U CN 216058115U
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- dissipation function
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Abstract
The utility model discloses a shielding cover with a heat dissipation function, which comprises a cover body, wherein a heat insulation groove is arranged on the upper end surface of the cover body, a round hole is arranged on the upper end surface of the cover body, mounting blocks are fixed at the left and right edges of the front and rear end surfaces of the cover body, threaded holes are arranged at the left and right edges of the upper end surface of the cover body, a protective film is arranged in the inner cavity of the lower end surface of the cover body, and a semiconductor cooling fin is arranged in the cover body. The utility model relates to the technical field of shielding cases with heat dissipation functions. This shield cover with heat dissipation function has solved current shield cover and has dismantled inconvenient, do not have the heat dissipation function, shield cover heat conduction radiating effect is poor, the radiating rate is slow, the high temperature makes shield cover and electron mainboard come unstuck when maintaining, leads to the shield cover can't continue to shield electromagnetic interference's problem for electronic product.
Description
Technical Field
The utility model relates to the technical field of shielding cases with heat dissipation functions, in particular to a shielding case with a heat dissipation function.
Background
Shielding case, english name: the shield cover/case/breaker comprises support legs and a cover body, wherein the support legs are movably connected with the cover body, and the cover body is in a spherical crown shape. The shielding structure is mainly applied to the fields of electronic products such as mobile phones, GPS, televisions, routers and the like, and has the functions of preventing electromagnetic interference (EMI) and shielding elements and LCM on a PCB.
However, most of the shields in use in the market do not have a heat dissipation function, which has some disadvantages, such as: when the electronic mainboard that the shield cover covered when the during operation temperature was too high, because shield cover heat conduction radiating effect is poor, make electronic component lead to the electronic product to damage unable the use because the high temperature, and the shield cover of current heat dissipation function only utilizes the round hole to dispel the heat, lead to the radiating rate slow, make electronic component lead to the electronic product to damage unable the use because the high temperature, and current shield cover utilizes industry glue to install fixedly with electronic component's mainboard, lead to electronic product because long-time use temperature is too high, make shield cover and electronic component's mainboard come unstuck, thereby lead to that the shield cover can't continue to shield electromagnetic interference for electronic product, and dismantle when leading to the maintenance inconvenient.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the utility model provides a shielding case with a heat dissipation function, and solves the problems that the existing shielding case is inconvenient to disassemble and has no heat dissipation function, the shielding case has poor heat conduction and heat dissipation effects, low heat dissipation speed and overhigh temperature, so that the shielding case and an electronic mainboard are degummed, and the shielding case can not continuously shield the electronic product from electromagnetic interference.
(II) technical scheme
In order to achieve the purpose, the utility model is realized by the following technical scheme: the utility model provides a shield cover with heat dissipation function, includes the cover body, cover body up end is provided with the heat sink, cover body up end is provided with the round hole, edge is fixed with the installation piece around the cover body about the terminal surface, edge is provided with the screw hole about cover body up end, cover body down end face inner chamber is provided with the protecting film, cover internal portion is provided with the semiconductor fin.
Preferably, the protective film is made of graphene, transparent insulating double faced adhesive tapes are arranged at the front edge and the rear edge of the lower end face of the protective film, transparent insulating single faced adhesive tapes are arranged on the upper end face of the protective film, and the protective film is fixedly connected with an inner cavity of the lower end face of the cover body through the transparent insulating single faced adhesive tapes.
Preferably, the upper end face of the cover body is fixedly connected with a dust cover through a threaded hole.
Preferably, the semiconductor heat sink is made of copper.
Preferably, the mounting block is provided with a mounting hole on an upper end surface.
Preferably, the cover body forms a shielding cover with a heat dissipation function through the mounting block, the mounting hole, the dust cover, the protective film and the semiconductor heat sink.
(III) advantageous effects
The utility model provides a shielding case with a heat dissipation function. The method has the following beneficial effects:
(1) the shielding cover with the heat dissipation function is characterized in that a worker is fixedly connected with an inner cavity of the lower end face of a cover body through a transparent insulating single-sided adhesive, and then is fixedly connected with an electronic element in an electronic product through a transparent insulating double-sided adhesive at the front edge and the rear edge of the lower end face of the protective film, so that the protective film conducts heat to the electronic element when the electronic element works and protects the electronic element, thereby solving the problem of poor heat conduction and heat dissipation effects of the existing shielding cover, the worker fixedly connects a dust cover with the cover body through an external screw matched with a threaded hole, then conducts heat through the protective film when the electronic element works, discharges hot air of the electronic element into an inner cavity of a heat insulation groove through a round hole, quickly diffuses the hot air in the heat insulation groove, and then dissipates the heat through the dust cover, thereby solving the problem that the existing shielding cover simply dissipates the heat through the round hole, lead to the radiating rate slow, make electronic component lead to the trouble that electronic product damages unable use because the high temperature, personnel make the cover body and electronic component's mainboard fixed connection through the mounting hole cooperation outside gim peg of installation piece up end, then utilize the protecting film, semiconductor fin cooperation heat-proof slot dispels the heat to electronic mainboard, when personnel maintain electronic product, through utilizing the bottle opener to tear down the gim peg and maintain electronic mainboard, thereby avoid the shield cover to utilize industry glue to install with electronic product's mainboard and fix and dismantle inconvenient trouble when leading to the maintenance.
(2) When the electronic product works, the shielding cover with the heat dissipation function transmits the temperature of the electronic element to the semiconductor heat dissipation sheet through the protective film, and then the hot air of the electronic element is discharged into the inner cavity of the heat insulation groove by the round hole for heat dissipation, because the semiconductor radiating fin is made of copper materials, the heat dissipation and cooling of the hot air of the electronic element can be rapidly carried out, the trouble that the electronic element is damaged due to overhigh temperature caused by slow heat dissipation of the electronic element is avoided, personnel can fixedly connect the cover body with the mainboard of the electronic element through the mounting hole on the upper end surface of the mounting block matched with the external fixing bolt, therefore, the problem that the existing shielding case is fixed by mounting the industrial glue and the mainboard of the electronic product, the electronic product is enabled to be degummed due to the fact that the temperature of the shielding case is too high after the shielding case is used for a long time, and the shielding case cannot continue to shield the electronic product from electromagnetic interference is avoided.
Drawings
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is a schematic view of a half-section structure of the mask body of the present invention;
FIG. 3 is a schematic bottom view of the present invention;
fig. 4 is a schematic view of the overall structure of the present invention.
In the figure: 1. a cover body; 2. a heat insulation groove; 3. a circular hole; 4. mounting blocks; 5. mounting holes; 6. a threaded hole; 7. a protective film; 8. a semiconductor heat sink; 9. a dust cover.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution:
the first embodiment is as follows:
a shielding cover with a heat dissipation function comprises a cover body 1, wherein a heat insulation groove 2 is arranged on the upper end face of the cover body 1, a round hole 3 is arranged on the upper end face of the cover body 1, mounting blocks 4 are fixed on the left and right edges of the front and rear end faces of the cover body 1, threaded holes 6 are arranged on the left and right edges of the upper end face of the cover body 1, a protective film 7 is arranged in the cavity of the lower end face of the cover body 1, a semiconductor cooling fin 8 is arranged in the cover body 1, the protective film 7 is made of graphene materials, transparent insulating double faced adhesive tape is arranged on the front and rear edge of the lower end face of the protective film 7, transparent insulating single faced adhesive tape is arranged on the upper end face of the protective film 7, the protective film 7 is fixedly connected with the cavity of the lower end face of the cover body 1 through the transparent insulating single faced adhesive tape, personnel are fixedly connected with the cavity of the lower end face of the cover body 1 through the transparent insulating single faced adhesive tape, and then are fixedly connected with electronic elements in electronic products through the transparent insulating double faced adhesive tape on the front edge of the lower end face of the protective film 7, therefore, the protective film 7 conducts heat to the electronic element when the electronic element works, and protects the electronic element, and the trouble that the existing shielding case is poor in heat conduction and heat dissipation effects is solved.
Example two:
the difference between this embodiment and the first embodiment is: the upper end face of the cover body 1 is fixedly connected with a dust cover 9 through a threaded hole 6, personnel utilize an external screw to match the threaded hole 6 to fixedly connect the dust cover 9 with the cover body 1, then the electronic element conducts heat through a protective film 7 during working, hot air of the electronic element is discharged into the inner cavity of the heat insulation groove 2 through the round hole 3, the hot air is rapidly diffused in the heat insulation groove 2, and then the dust cover 9 is utilized to dissipate heat, so that the problems that the heat dissipation speed is slow due to the fact that the existing shielding cover simply utilizes the round hole to dissipate heat, the electronic element is damaged and cannot be used due to overhigh temperature are solved, the semiconductor cooling fin 8 is made of copper materials, when the electronic product works, the temperature of the electronic element is transmitted to the semiconductor cooling fin 8 through the protective film 7, and then the hot air of the electronic element is discharged into the inner cavity of the heat insulation groove 2 through the round hole 3 to dissipate heat, because the semiconductor radiating fin 8 is made of copper materials, the heat dissipation and cooling of the hot air of the electronic element can be rapidly carried out, the trouble that the electronic element is damaged due to the fact that the temperature is too high because the heat dissipation of the electronic element is slow is avoided, the mounting hole 5 is formed in the upper end face of the mounting block 4, personnel can fixedly connect the shield body 1 with the mainboard of the electronic element through the mounting hole 5 on the upper end face of the mounting block 4 and the external fixing bolt, the trouble that the existing shielding cover is fixedly mounted with the mainboard of the electronic product due to the fact that the temperature of the electronic product is too high after long-time use, the shielding cover and the mainboard of the electronic product are degummed, and the shielding cover cannot continuously shield the electromagnetic interference of the electronic product is avoided, the shielding cover body 1 forms the shielding cover with the heat dissipation function through the mounting block 4, the mounting hole 5, the dust cover 9, the protective film 7 and the semiconductor radiating fin 8, personnel cooperate the outside gim peg through the mounting hole 5 of the 4 up end of installation pieces to make the cover body 1 and electronic component's mainboard fixed connection, then utilize protecting film 7, semiconductor cooling fin 8 cooperation heat-proof slot 2 to dispel the heat to the electron mainboard, when personnel maintained the electronic product, maintain the electron mainboard through utilizing the bottle opener to tear down the gim peg to avoid the shield cover to utilize industry glue to dismantle inconvenient trouble when leading to the maintenance with the mainboard of electronic product installation fixed.
During operation, personnel utilize outside screw cooperation screw hole 6 to carry out fixed connection with dust cover 9 and the cover body 1, then make electronic component carry out the heat conduction through protecting film 7 at the during operation, arrange electronic component's steam into 2 inner chambers of hot wall tank through round hole 3, make steam spread fast in hot wall tank 2, then utilize dust cover 9 to dispel the heat, then personnel cooperate outside gim peg to make cover body 1 and electronic component's mainboard fixed connection through mounting hole 5 of installation piece 4 up end, thereby it utilizes industry glue and electronic product's mainboard to install fixedly to avoid current shield cover, lead to electronic product because long-time service temperature is too high, make shield cover come unstuck with electronic product's mainboard, and lead to the trouble that the shield cover can't continue to shield electromagnetic interference for electronic product.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
Claims (6)
1. The utility model provides a shield cover with heat dissipation function, includes the cover body (1), its characterized in that: the utility model discloses a cover body, including the cover body (1), the cover body is provided with heat-insulating groove (2) on the end face, the cover body (1) up end is provided with round hole (3), edge is fixed with installation piece (4) about the end face around the cover body (1), edge is provided with screw hole (6) about the cover body (1) up end, the end face inner chamber is provided with protecting film (7) under the cover body (1), the inside semiconductor fin (8) that is provided with of cover body (1).
2. The shielding case with a heat dissipation function according to claim 1, wherein: the protective film (7) is made of graphene materials, transparent insulating double faced adhesive tapes are arranged at the front edge and the rear edge of the lower end face of the protective film (7), transparent insulating single faced adhesive tapes are arranged on the upper end face of the protective film (7), and the protective film (7) is fixedly connected with the inner cavity of the lower end face of the cover body (1) through the transparent insulating single faced adhesive tapes.
3. The shielding case with a heat dissipation function according to claim 1, wherein: the upper end face of the cover body (1) is fixedly connected with a dust cover (9) through a threaded hole (6).
4. The shielding case with a heat dissipation function according to claim 1, wherein: the semiconductor cooling fin (8) is made of copper materials.
5. The shielding case with a heat dissipation function according to claim 1, wherein: the upper end face of the mounting block (4) is provided with a mounting hole (5).
6. The shielding case with a heat dissipation function according to claim 1, wherein: the shield cover body (1) is formed into a shield cover with a heat dissipation function through the mounting block (4), the mounting hole (5), the dust cover (9), the protective film (7) and the semiconductor cooling fins (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121894502.5U CN216058115U (en) | 2021-08-13 | 2021-08-13 | Shielding case with heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121894502.5U CN216058115U (en) | 2021-08-13 | 2021-08-13 | Shielding case with heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216058115U true CN216058115U (en) | 2022-03-15 |
Family
ID=80558444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121894502.5U Active CN216058115U (en) | 2021-08-13 | 2021-08-13 | Shielding case with heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216058115U (en) |
-
2021
- 2021-08-13 CN CN202121894502.5U patent/CN216058115U/en active Active
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