CN211823256U - Semiconductor refrigeration protective cover - Google Patents
Semiconductor refrigeration protective cover Download PDFInfo
- Publication number
- CN211823256U CN211823256U CN202020274655.9U CN202020274655U CN211823256U CN 211823256 U CN211823256 U CN 211823256U CN 202020274655 U CN202020274655 U CN 202020274655U CN 211823256 U CN211823256 U CN 211823256U
- Authority
- CN
- China
- Prior art keywords
- refrigeration
- installation
- protection casing
- protection
- protective cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model discloses a semiconductor refrigeration protection casing relates to protection casing technical field, and is not good enough for solving current semiconductor refrigeration protection casing refrigeration effect, uses the inconvenient problem of not enough. Protection installation side, two are all installed to the both sides of refrigeration protection casing one side inside protection installation side all is provided with the installation fixed orifices, one side of installation fixed orifices is provided with the louvre, fixed connection limit is installed to the top of refrigeration protection casing front end, the thermantidote protection casing is installed to the front end on fixed connection limit, the below of refrigeration protection casing front end is provided with the thermovent, the internally mounted of refrigeration protection casing rear end has radiating gasket.
Description
Technical Field
The utility model relates to a protection casing technical field specifically is a semiconductor refrigeration protection casing.
Background
The refrigerating protective cover is a protective cover with refrigerating function, freezing, namely lowering temperature to solidify and freeze an object, also called 'refrigerating', is a method for artificially manufacturing low temperature by applying thermodynamic principle, both refrigerators and air conditioners adopt the refrigerating principle, generally a gas with high critical point is adopted from the chemical engineering angle, the gas is pressurized and liquefied, then the gas is vaporized and absorbs heat, the process is repeatedly carried out, heat is released at other places during liquefaction, heat is absorbed in a required range during vaporization, a semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, the semiconductor refers to a material with controllable electric conductivity ranging from the insulator to the conductor, the existence forms of substances are various, and the materials with poor electric conductivity, such as coal, artificial crystals and the like, are generally mixed, and then the mixture is subjected to vacuum evaporation, amber, ceramic, etc. are called insulators, metals having relatively good conductivity, such as gold, silver, copper, iron, tin, aluminum, etc., are called conductors, and materials interposed between conductors and insulators can be simply called semiconductors.
However, the existing semiconductor refrigeration protective cover has poor refrigeration effect and is inconvenient to use; therefore, the existing requirements are not met, and a semiconductor refrigeration protective cover is provided for the requirement.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor refrigeration protection casing to solve the current semiconductor refrigeration protection casing refrigeration effect that proposes in the above-mentioned background art good inadequately, use inconvenient problem inadequately.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a semiconductor refrigeration protection casing, includes the refrigeration protection casing, protection installation side, two are all installed to the both sides of refrigeration protection casing the inside one side of protection installation side all is provided with the installation fixed orifices, one side of installation fixed orifices is provided with the louvre, fixed connection limit is installed to the top of refrigeration protection casing front end, the thermantidote protection casing is installed to the front end on fixed connection limit, the below of refrigeration protection casing front end is provided with the thermovent, the internally mounted of refrigeration protection casing rear end has radiating gasket, first radiator is installed to the inside one side of refrigeration protection casing rear end, the second radiator is installed to the inside opposite side of refrigeration protection casing rear end.
Preferably, two supplementary installation stickers, two are all installed to the inside of protection installation side the refrigeration piece is all installed to one side of protection installation side, supplementary installation stickers and refrigeration piece all paste with the protection installation side and are connected.
Preferably, a heat dissipation fan is installed on one side of the first heat sink, and a silica gel sealing ring is installed outside the heat dissipation fan.
Preferably, a heat exchanger mounting plate is installed below the rear end of the refrigeration protective cover, the heat exchanger mounting plate is connected with the refrigeration protective cover through screws, a heat exchanger is installed inside the heat exchanger mounting plate, and the heat exchanger is fixedly connected with the heat exchanger mounting plate.
Preferably, the mounting and fixing holes 3 are provided with a plurality of mounting and fixing holes 3 which are distributed in sequence.
Preferably, the protection installation side edge and the refrigeration protective cover are of an integrated structure.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a set up radiator fan, thermantidote protection casing, heat exchanger, first radiator and second radiator, radiator fan can dispel the heat to the semiconductor during use, exchange heat and air, take away the heat, thermantidote protection casing has a guard action to radiator fan, and can filter the magazine in the air, the heat exchanger is the equipment that transmits the partial heat of hot-fluid to the cold fluid, can take away the heat, and easy and simple to handle, the effect of radiator is to absorb the heat of semiconductor, then dispel in the air, it is not good enough to have solved current semiconductor refrigeration protection casing refrigeration effect, it is not convenient enough to use the problem;
2. the utility model discloses a set up supplementary installation sticker, protection installation side, installation fixed orifices and louvre, during the use, can install through the inside installation fixed orifices of protection installation side, also can install through supplementary installation sticker, simple structure, convenient operation, the louvre has a radiating effect.
Drawings
Fig. 1 is a front view of a semiconductor refrigeration protective cover of the present invention;
fig. 2 is a top view of a semiconductor refrigeration protective cover according to the present invention;
fig. 3 is a schematic structural view of the protection installation side of the present invention.
In the figure: 1. a refrigeration shield; 2. protecting the installation side edge; 3. mounting a fixing hole; 4. heat dissipation holes; 5. a cooling fan protective cover; 6. fixing the connecting edge; 7. a heat dissipation port; 8. a heat sink pad; 9. a first heat sink; 10. a silica gel seal ring; 11. a heat radiation fan; 12. a heat exchanger; 13. a heat exchanger mounting plate; 14. auxiliary installation of the adhesive sheet; 15. a second heat sink; 16. a refrigeration sheet.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-3, the present invention provides an embodiment: the utility model provides a semiconductor refrigeration protection casing, including refrigeration protection casing 1, protection installation side 2 is all installed to the both sides of refrigeration protection casing 1, 2 inside one side of two protection installation sides all is provided with installation fixed orifices 3, one side of installation fixed orifices 3 is provided with louvre 4, there is a radiating effect, fixed connection limit 6 is installed to the top of 1 front end of refrigeration protection casing, thermantidote protection casing 5 is installed to the front end of fixed connection limit 6, the below of 1 front end of refrigeration protection casing is provided with thermovent 7, the internally mounted of 1 rear end of refrigeration protection casing has radiating gasket 8, first radiator 9 is installed to the inside one side of 1 rear end of refrigeration protection casing, second radiator 15 is installed to the inside opposite side of 1 rear end of refrigeration protection casing.
Further, supplementary installation sticker 14 is all installed to the inside of two protection installation sides 2, and refrigeration piece 16 is all installed to one side of two protection installation sides 2, and supplementary installation sticker 14 and refrigeration piece 16 all paste with protection installation side 2 and be connected, connect simply, convenient operation.
Further, a heat radiation fan 11 is installed on one side of the first heat radiator 9, and a silica gel sealing ring 10 is installed outside the heat radiation fan 11, so that the connection stability is further guaranteed.
Further, a heat exchanger mounting plate 13 is installed below the rear end of the refrigeration protective cover 1, the heat exchanger mounting plate 13 is connected with the refrigeration protective cover 1 through screws, a heat exchanger 12 is installed inside the heat exchanger mounting plate 13, the heat exchanger 12 is fixedly connected with the heat exchanger mounting plate 13, overall performance is more stable, and operation is convenient.
Further, installation fixed orifices 3 are provided with a plurality of, and a plurality of installation fixed orifices 3 distributes in proper order, simple structure, and the form is various.
Further, protection installation side 2 and refrigeration protection casing 1 structure as an organic whole, the wholeness can be more stable.
The working principle is as follows: when in use, the semiconductor can be installed through the installation fixing hole 3 in the protection installation side edge 2, the auxiliary installation adhesive sheet 14 has an adhesive effect, the connection stability is further ensured, the heat dissipation hole 4 has a heat dissipation effect, when in use, the heat dissipation fan 11 is started, the heat dissipation fan 11 starts to rotate, the heat dissipated by the semiconductor is blown away, the cooling fan protective cover 5 has a protective effect on the heat dissipation fan 11 and can filter impurities in air, the silica gel sealing ring 10 ensures the connection tightness, the fixed connection edge 6 ensures the connection tightness between the cooling fan protective cover 5 and the refrigeration protective cover 1, the heat exchanger 12 is installed on the refrigeration protective cover 1 through the heat exchanger installation plate 13, the heat exchanger 12 absorbs hot air in the semiconductor, then the hot air in the semiconductor is discharged through the flow of outside air, and the heat can be taken away, easy and simple to handle, the heat of conversion can distribute through thermovent 7, and cooling gasket 8 and refrigeration piece 16 have further ensured the radiating effect of refrigeration protection casing 1, and steam can be better disperse away, and first radiator 9 and second radiator 15 can absorb the heat of semiconductor, then disperse in the air, simple operation, and practicality is strong.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. A semiconductor refrigeration protection cover comprises a refrigeration protection cover (1), and is characterized in that: protection installation side (2), two are all installed to the both sides of refrigeration protection casing (1) the inside one side of protection installation side (2) all is provided with installation fixed orifices (3), one side of installation fixed orifices (3) is provided with louvre (4), fixed connection limit (6) are installed to the top of refrigeration protection casing (1) front end, thermantidote protection casing (5) are installed to the front end of fixed connection limit (6), the below of refrigeration protection casing (1) front end is provided with thermovent (7), the internally mounted of refrigeration protection casing (1) rear end has radiating gasket (8), first radiator (9) are installed to the inside one side of refrigeration protection casing (1) rear end, second radiator (15) are installed to the inside opposite side of refrigeration protection casing (1) rear end.
2. A semiconductor refrigeration protective cover according to claim 1, wherein: two supplementary installation sticker (14), two are all installed to the inside of protection installation side (2) refrigeration piece (16) are all installed to one side of protection installation side (2), supplementary installation sticker (14) and refrigeration piece (16) are all pasted with protection installation side (2) and are connected.
3. A semiconductor refrigeration protective cover according to claim 1, wherein: radiator fan (11) are installed to one side of first radiator (9), radiator fan's (11) externally mounted has silica gel sealing washer (10).
4. A semiconductor refrigeration protective cover according to claim 1, wherein: the heat exchanger is characterized in that a heat exchanger mounting plate (13) is installed below the rear end of the refrigeration protective cover (1), the heat exchanger mounting plate (13) is connected with the refrigeration protective cover (1) through screws, a heat exchanger (12) is installed inside the heat exchanger mounting plate (13), and the heat exchanger (12) is fixedly connected with the heat exchanger mounting plate (13).
5. A semiconductor refrigeration protective cover according to claim 1, wherein: the installation fixing holes (3) are provided with a plurality of installation fixing holes, and the installation fixing holes (3) are distributed in sequence.
6. A semiconductor refrigeration protective cover according to claim 1, wherein: the protection installation side edge (2) and the refrigeration protective cover (1) are of an integrated structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020274655.9U CN211823256U (en) | 2020-03-09 | 2020-03-09 | Semiconductor refrigeration protective cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020274655.9U CN211823256U (en) | 2020-03-09 | 2020-03-09 | Semiconductor refrigeration protective cover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211823256U true CN211823256U (en) | 2020-10-30 |
Family
ID=73008092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020274655.9U Expired - Fee Related CN211823256U (en) | 2020-03-09 | 2020-03-09 | Semiconductor refrigeration protective cover |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211823256U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115464334A (en) * | 2022-07-19 | 2022-12-13 | 佑达光电科技(苏州)有限公司 | Computer shell and punch forming method thereof |
-
2020
- 2020-03-09 CN CN202020274655.9U patent/CN211823256U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115464334A (en) * | 2022-07-19 | 2022-12-13 | 佑达光电科技(苏州)有限公司 | Computer shell and punch forming method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3474647B1 (en) | Cooling system of working medium contact type for high-power device, and working method thereof | |
| CN102791107B (en) | Sealing and water-cooling method and equipment for cooling electronic equipment | |
| CN101610660A (en) | Compressor cooling type fully sealed high-efficiency radiating electronic cabinet | |
| CN205595424U (en) | PTC heater and power battery heating and cooling device | |
| WO2017215169A1 (en) | Cooling system of working medium contact type for high-power electromagnetic wave generator and working method thereof | |
| WO2017215143A1 (en) | Electric controller based on thermally superconductive heat dissipating plate and air conditioner outdoor unit | |
| CN211823256U (en) | Semiconductor refrigeration protective cover | |
| CN106025869A (en) | On-site installed electric power secondary equipment convenient for heat dissipation | |
| CN103687450A (en) | Circuit board heat conduction optimization design structure for onboard aviation product | |
| CN207690951U (en) | A kind of lithium battery system realized active heat removal and reach IP67 | |
| CN114510135A (en) | Temperature-uniforming plate with good heat conduction and heat dissipation effects | |
| CN208480197U (en) | A kind of electrical control cabinet convenient for heat dissipation | |
| CN207677338U (en) | A kind of high current gas-filling cabinet radiator | |
| CN207354786U (en) | A kind of radiator | |
| CN201226629Y (en) | High-efficiency cooling device for electronic module | |
| CN216697700U (en) | Heat radiation structure of LED display screen | |
| CN202928392U (en) | Direct-type liquid radiator | |
| CN212463758U (en) | Communication cabinet | |
| CN108583213A (en) | A kind of novel vehicle clerestory window air-conditioning system | |
| CN115101853B (en) | Cooling device for new energy automobile | |
| CN208073829U (en) | A kind of efficient CPU radiator fans | |
| CN217469238U (en) | Intelligent on-line monitoring system for switch cabinet | |
| CN210771019U (en) | Anti-frost-heaving hardware sleeve | |
| CN212571858U (en) | Piece formula heat dissipation switch board | |
| CN219611294U (en) | Distribution network bus protection device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201030 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |