CN216054695U - Packaging structure, circuit board and electronic equipment - Google Patents
Packaging structure, circuit board and electronic equipment Download PDFInfo
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- CN216054695U CN216054695U CN202122557541.2U CN202122557541U CN216054695U CN 216054695 U CN216054695 U CN 216054695U CN 202122557541 U CN202122557541 U CN 202122557541U CN 216054695 U CN216054695 U CN 216054695U
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- circuit board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
Abstract
The embodiment of the application provides a packaging structure, a circuit board and electronic equipment, wherein the packaging structure comprises the circuit board and an acoustic device, the circuit board is provided with a sound hole, the circuit board comprises a first functional part and a second functional part which are positioned on two sides of the circuit board, the first functional part and the second functional part are arranged around the sound hole, the first functional part comprises a first metal part, the second functional part comprises a second metal part, the distance between the first metal part and the sound hole is greater than the distance between the second metal part and the sound hole, and/or the area of the first metal part is smaller than the area of the second metal part; the acoustic device is installed in the circuit board, and sets up and deviates from second function portion one side at first function portion, and the relative sound hole of acoustic device sets up. When ESD electric arc is struck from the side, deviating from the acoustic device, of the substrate, the ESD electric arc can be attracted by the second metal part with lower dielectric strength and is not easily attracted by the first metal part, so that the ESD electric arc is not easily struck to the acoustic device through the sound hole, the acoustic device is protected, and the ESD protection performance of the acoustic device is improved.
Description
Technical Field
The application relates to the technical field of electronics, in particular to a packaging structure, a circuit board and electronic equipment.
Background
With the development of technology, the demand for high-performance and small-volume semiconductor devices is increasing. Such small-sized semiconductor devices are widely used in electronic products. For example, during the production and use of microphones and other semiconductor devices, electrostatic discharge (ESD) can cause irreversible damage to the product. In the related art, the ESD protection performance for the microphone and other semiconductor devices is not good.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a packaging structure, a circuit board and electronic equipment, which can improve the ESD protection performance of an acoustic device on the circuit board.
In a first aspect, an embodiment of the present application provides a package structure, which includes:
the circuit board is provided with a sound hole, the circuit board comprises a substrate, a first functional part and a second functional part, the first functional part and the second functional part are positioned on two sides of the substrate, the first functional part and the second functional part are arranged around the sound hole, the first functional part comprises a first metal part, the second functional part comprises a second metal part, the distance between the first metal part and the sound hole and the thickness of the substrate are greater than the distance between the second metal part and the sound hole, and/or the area of the first metal part is smaller than the area of the second metal part; and
and the acoustic device is arranged on the circuit board and is arranged on one side of the first functional part, which deviates from the second functional part, and the acoustic device is arranged opposite to the sound hole.
Optionally, the first functional portion further includes a first insulating portion, and the first insulating portion covers the first metal portion;
the second functional portion further includes a second insulating portion covering a portion of the second metal portion.
Optionally, an orthogonal projection of the first metal part on the substrate is located within an orthogonal projection of the acoustic device on the substrate, and an orthogonal projection of the second metal part on the substrate is located within an orthogonal projection of the acoustic device on the substrate.
Alternatively, the first metal part is used for electrically connecting with the ground of the circuit board, and the second metal part is used for electrically connecting with the ground of the circuit board or a circuit for discharging static electricity.
Optionally, the distance between the first metal part and the sound hole is greater than the distance between the second metal part and the sound hole.
Optionally, the acoustic device includes a shielding case and an electroacoustic component, the electroacoustic component is mounted on the circuit board, and the shielding case is disposed on the electroacoustic component.
In a second aspect, an embodiment of the present application provides a package structure, which includes:
the circuit board is provided with a sound hole and comprises a substrate, a first functional part and a second functional part, wherein the first functional part and the second functional part are positioned on two sides of the substrate, the first functional part and the second functional part are arranged around the sound hole, and the dielectric strength of the first functional part is greater than that of the second functional part; and
an acoustic device mounted on the circuit board and arranged on one side of the first functional part departing from the second functional part, wherein the acoustic device is arranged opposite to the sound hole
In a third aspect, an embodiment of the present application further provides a circuit board, where the circuit board is provided with a sound hole for an acoustic device to transmit a sound signal, and the circuit board includes a substrate, and a first functional portion and a second functional portion located on two sides of the substrate, where the first functional portion and the second functional portion are both arranged around the sound hole, and the first functional portion and the sound hole are arranged opposite to the acoustic device;
the first functional part comprises a first metal part, the second functional part comprises a second metal part, the distance between the first metal part and the sound hole and the thickness of the substrate are greater than the distance between the second metal part and the sound hole, and/or the area of the first metal part is smaller than the area of the second metal part.
In a fourth aspect, an embodiment of the present application further provides a circuit board, the circuit board is provided with a sound hole for an acoustic device to transmit a sound signal, the circuit board includes a substrate and a first functional portion and a second functional portion located on two sides of the substrate, the first functional portion and the second functional portion all surround the sound hole, the dielectric strength of the first functional portion is greater than the dielectric strength of the second functional portion, the first functional portion and the sound hole are used for being arranged relative to the acoustic device.
In a fifth aspect, embodiments of the present application further provide an electronic device, which includes the package structure described above or the circuit board described above.
In the embodiment of the application, the acoustic device is arranged on the circuit board, the circuit board comprises a substrate, a first functional part and a second functional part, the first functional part and the second functional part are arranged on two sides of the substrate, the first functional part arranged on one side, facing the acoustic device, of the substrate comprises a first metal part, the second functional part arranged on one side, facing away from the acoustic device, of the substrate comprises a second metal part, the distance between the first metal part and the sound hole and the thickness of the substrate plus the thickness of the substrate are larger than the distance between the second metal part and the sound hole, and/or the area of the first metal part is smaller than the area of the second metal part, when an ESD electric arc hits the sound hole from one side, facing away from the acoustic device, of the substrate, relative to the ESD electric arc, the dielectric strength of the first functional part is larger than the dielectric strength of the second functional part, the ESD electric arc can be attracted by the second metal part with lower dielectric strength and is not easily attracted by the first metal part, so as not to easily hit the acoustic device through the sound hole, the acoustic device is protected, and the ESD protection performance of the acoustic device is improved. The problem of among the correlation technique, ESD electric arc hits the acoustics device through the sound hole, causes the injury to the acoustics device is solved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
For a more complete understanding of the present application and its advantages, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, wherein like reference numerals represent like parts in the following description.
Fig. 1 is a first structural schematic diagram of a package structure according to an embodiment of the present disclosure.
Fig. 2 is a schematic structural view of a side of the circuit board facing away from the acoustic element in the package structure shown in fig. 1.
Fig. 3 is a schematic structural diagram of a circuit board in the package structure shown in fig. 1.
Fig. 4 is a schematic diagram of a second structure of a circuit board according to an embodiment of the present application.
Fig. 5 is a schematic diagram of a third structure of a circuit board according to an embodiment of the present application.
Fig. 6 is a schematic diagram of a fourth structure of the circuit board according to the embodiment of the present application.
Fig. 7 is a fifth structural schematic diagram of a circuit board provided in the embodiment of the present application.
Fig. 8 is a top view of the wiring board of fig. 7 in a first direction.
Fig. 9 is a second structural diagram of a package structure according to an embodiment of the disclosure.
Fig. 10 is a schematic structural diagram of a third package structure according to an embodiment of the present application.
Fig. 11 is a schematic structural diagram of a circuit board in the package structure shown in fig. 10.
Fig. 12 is a schematic diagram of a fourth structure of a package structure according to an embodiment of the present application.
Fig. 13 is a fifth structural diagram of a package structure according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present application.
Referring to fig. 1, fig. 1 is a first structural schematic diagram of a package structure according to an embodiment of the present disclosure. The package structure 10 includes a wiring board 100 and an acoustic device 200. The circuit board 100 is provided with the sound hole 120, the circuit board 100 includes a substrate 150 and a first functional portion 140 and a second functional portion 160 located at two sides of the substrate 150, the first functional portion 140 is disposed at one side of the substrate 150 facing the acoustic device 200, the second functional portion 160 is disposed at one side of the substrate 150 facing away from the acoustic device 200, and the first functional portion 140 and the second functional portion 160 are disposed around the sound hole 120. The acoustic device 200 is mounted to the wiring board 100, and the acoustic device 200 is disposed opposite the sound hole 120.
Referring to fig. 2 and fig. 3, fig. 2 is a schematic structural diagram of a side of the circuit board of the package structure shown in fig. 1, which is away from the acoustic device, and fig. 3 is a schematic structural diagram of the circuit board of the package structure shown in fig. 1. The first functional part 140 may include a first metal part 142, and the second functional part 160 may include a second metal part 162, and a distance L1 between the first metal part 142 and the sound hole 120 plus a thickness H of the substrate 150 is greater than a distance L2 between the second metal part 162 and the sound hole 120. And is disposed on a side of the first functional portion 140 facing away from the second functional portion 160.
In the related art, a wiring board having acoustic devices such as a microphone and other semiconductor devices is often covered with a Ground (GND) wiring as entirely as possible in order to improve its shielding property and reduce interference. GND wiring is arranged on both sides of the circuit board, so that metal which is exposed and leaked is arranged on one side (GND ground) of the circuit board facing the microphone and other semiconductor device products and one side (GND ground) of the circuit board departing from the microphone, and the dielectric strength of both sides of the circuit board is basically consistent. When ESD electric arcs come, the electric arcs can randomly route the two sides of the circuit board due to the fact that dielectric strength of the two sides of the circuit board is consistent. The instantaneous explosion of the ESD arc on the side of the circuit board facing the microphone can cause significant damage to the fragile microphone and other semiconductor devices.
In this embodiment, the acoustic device 200 is disposed on the first functional portion 140 side of the circuit board 100, the second functional portion 160 is disposed on the side of the circuit board 100 away from the acoustic device 200, the distance between the first metal portion 142 and the sound hole 120 plus the thickness of the substrate 150 is greater than the distance between the second metal portion 162 and the sound hole 120, when an ESD arc strikes the sound hole 120 from the side of the substrate 150 away from the acoustic device 200, the ESD arc is attracted by the second metal portion 162 that is closer to the first metal portion, and it can also be understood that, with respect to the ESD arc, the dielectric strength of the first functional portion 140 is greater than the dielectric strength of the second functional portion 160, and the ESD arc is attracted by the second functional portion 160 with lower dielectric strength and is not easily attracted by the first functional portion 140, so that the ESD protection performance of the acoustic device 200 is not easily reached through the sound hole 120, the acoustic device 200 is protected, and the ESD protection performance of the acoustic device 200 is improved. The problem of among the correlation technique, ESD electric arc hits the acoustics device through the sound hole, causes the injury to the acoustics device is solved.
The distance between the first metal part 142 and the sound hole 120 may be equal to or slightly less than the distance between the second metal part 162 and the sound hole 120, as long as the distance between the first metal part 142 and the sound hole 120 plus the thickness of the substrate 150 is greater than the distance between the second metal part 162 and the sound hole 120. Of course, in some alternative embodiments, please refer to fig. 4, fig. 4 is a schematic diagram of a second structure of the circuit board according to the embodiment of the present application, and considering that the thickness of the substrate 150 is very small, or in order to make the second metal portion 162 better attract the ESD arc, so that the ESD arc does not strike the first metal portion 142 through the sound hole 120, the distance between the first metal portion 142 and the sound hole 120 may be greater than the distance between the second metal portion 162 and the sound hole 120.
The circuit board can also be in other structures. The main difference between this embodiment and the above-described embodiment is the first metal part and the second metal part. For example, please refer to fig. 5, where fig. 5 is a schematic diagram of a third structure of the circuit board according to an embodiment of the present application. The area of the first metal part 142 is smaller than that of the second metal part 162, and when an ESD arc hits the sound hole 120 from the side of the substrate 150 away from the acoustic device 200, the second metal part 162 having a larger area is more likely to attract the ESD arc than the ESD arc, and it can also be understood that the dielectric strength of the first functional part 140 is greater than that of the second functional part 160. The ESD arc is attracted by the second functional portion 160 having a lower dielectric strength and is not easily attracted by the first functional portion 140, so that the ESD arc is not easily applied to the acoustic device 200 through the acoustic hole 120, thereby protecting the acoustic device 200 and improving the ESD protection performance of the acoustic device 200. The problem of among the correlation technique, ESD electric arc hits the acoustics device through the sound hole, causes the injury to the acoustics device is solved.
Optionally, in some embodiments, the distance between the first metal part 142 and the sound hole 120 plus the thickness of the substrate 150 is greater than the distance between the second metal part 162 and the sound hole 120, and the area of the first metal part 142 is smaller than the area of the second metal part 162, so that the dielectric strength of the first functional part 140 is greater than the dielectric strength of the second functional part 160. When an ESD arc is applied from the side of the substrate 150 away from the acoustic device 200, the ESD arc is attracted by the second functional portion 160 with lower dielectric strength and is not easily attracted by the first functional portion 140, so that the ESD arc is not easily applied to the acoustic device 200 through the acoustic hole 120, the acoustic device 200 is protected, and the ESD protection performance of the acoustic device 200 is improved. The problem of among the correlation technique, ESD electric arc hits the acoustics device through the sound hole, causes the injury to the acoustics device is solved.
Referring to fig. 6, fig. 6 is a schematic diagram of a fourth structure of a circuit board according to an embodiment of the present application. The first functional part 140 may further include a first insulating part 144, the first insulating part 144 covering the first metal part 142; the second functional part 160 may further include a second insulating part 164, and the second insulating part 164 covers a portion of the second metal part 162.
In the wiring board 100, the first metal portion 142 and the second metal portion 162 are located on two opposite sides of the substrate 150. Specifically, the first metal part 142 is located on the side of the substrate 150 facing the acoustic device, the second metal part 162 is located on the side of the substrate 150 facing away from the acoustic device, and both the first metal part 142 and the second metal part 162 are located around the sound hole 120. The first insulating portion 144 covers the first metal portion 142, and the second insulating portion 164 covers a portion of the second metal portion 162. It can also be understood that the first metal part 142 is entirely covered by the first insulating part 144, and the second metal part 162 is partially uncovered by the second insulating part 164 and exposed, so that the dielectric strength of the first functional part 140 having the first metal part 142 is greater than the dielectric strength of the second functional part 160 having the second metal part 162. When ESD arcs hit the sound hole 120, the ESD arcs are attracted by the second metal portion 162 partially exposed on the second insulating portion 164, and are not easily attracted by the first metal portion 142 completely covered by the first insulating portion 144, so that the ESD arcs do not easily hit the acoustic device through the sound hole 120, the acoustic device is protected, and the ESD protection performance of the acoustic device is improved.
The first insulating portion 144 and the second insulating portion 164 may be circuit board ink, and the first insulating portion 144 and the second insulating portion 164 may protect and insulate the metal portions they cover. The first metal part 142 and the second metal part 162 may be metallic copper, or other conductive metal. It should be noted that, conductive layers may be disposed on both upper and lower sides of the substrate 150 of the circuit board 100, the conductive layers may be formed by copper, and the first metal portion 142 and the second metal portion 162 may be part of the corresponding conductive layers.
The first insulating portion 144 may cover the side of the first metal portion 142 facing the sound hole 120, and the second insulating portion 164 exposes the second metal portion 162 facing the sound hole 120. In other embodiments, a side of the first metal portion 142 facing away from the substrate 150 may be completely covered by the first insulating portion 144, a side of the second metal portion 162 facing away from the substrate 150 may be partially exposed to the second insulating portion 164, and a side of the first metal portion 142 facing the sound hole 120 and a side of the second metal portion 162 facing the sound hole 120 may be simultaneously covered by the corresponding insulating portions, or may be simultaneously exposed to the corresponding insulating portions. Optionally, in some other embodiments, the first insulating portion 144 may be disposed on a side of the first metal portion 142 facing the sound hole 120, and the second insulating portion 164 exposes the second metal portion 162 facing the sound hole 120, while a side of the first metal portion 142 facing away from the substrate 150 may be completely covered by the first insulating portion 144, and a side of the second metal portion 162 facing away from the substrate 150 may be partially exposed to the second insulating portion 164.
The first metal portion 142 and the second metal portion 162 may be insulated, and in another example, the first metal portion 142 and the second metal portion 162 may also be electrically connected, please refer to fig. 7 and fig. 8, fig. 7 is a fourth structural schematic diagram of the circuit board provided in the embodiment of the present application, and fig. 8 is a top view of the circuit board shown in fig. 7 along the first direction. The substrate 150 is provided with a via 151, the first metal portion 142 and the second metal portion 162 may communicate through a conductor penetrating the via 151 to achieve communication of the first metal portion 142 and the second metal portion 162, and the first metal portion 142 and/or the second metal portion 162 may be electrically connected to the ground of the wiring board, in this example, since the first metal portion 142 and the second metal portion 162 communicate, both the first metal portion 142 and the second metal portion 162 may serve as a ground metal of the acoustic device 200 or as a metal ground that reduces interference. In some embodiments, the second metal part 162 may also be completely covered by the second insulating part 164, and the dielectric strength of the first functional part 140 may be greater than that of the second functional part 160. The substrate 150 is further provided with a connecting via hole 146 for electrically connecting the acoustic electric device 200 with a circuit board, and the acoustic electric device 200 may be electrically connected with the circuit board through a wire penetrating the connecting via hole 146.
It can be understood that, with continued reference to fig. 3 or fig. 4, in the embodiment where the distance between the first metal portion 142 and the sound hole 120 plus the thickness of the substrate 150 is greater than the distance between the second metal portion 162 and the sound hole 120, the first metal portion 142 and the second metal portion 162 may be located between the substrate 150 and the corresponding circuit board ink, that is, the first metal portion 142 and the second metal portion 162 are covered with the circuit board ink respectively. For example, the first functional portion 140 further includes a first insulating portion 144 disposed on the first metal portion 142, and the second functional portion 160 further includes a second insulating portion 164 disposed on the second metal portion 162, wherein the first insulating portion 144 partially or completely covers the first metal portion 142, and the second insulating portion 164 partially or completely covers the first metal portion 142. Of course, in other embodiments, the first metal portion and the second metal portion may be bare metal.
Referring to fig. 5, in an embodiment where the area of the first metal portion 142 is smaller than the area of the second metal portion 162, the first metal portion 142 and the second metal portion 162 may be located between the substrate 150 and the corresponding circuit board ink, that is, the first metal portion 142 and the second metal portion 162 are covered with the circuit board ink respectively. For example, the first functional portion 140 further includes a first insulating portion 144 disposed on the first metal portion 142, and the second functional portion 160 further includes a second insulating portion 164 disposed on the second metal portion 162, wherein the first insulating portion 144 partially or completely covers the first metal portion 142, and the second insulating portion 164 partially or completely covers the first metal portion 142. Of course, in other embodiments, the first metal portion and the second metal portion may be bare metal.
Referring to fig. 9, fig. 9 is a second structural schematic diagram of a package structure according to an embodiment of the disclosure. The orthographic projection of the first metal part 142 on the substrate 150 is located within the orthographic projection of the acoustic device 200 on the substrate 150. The first metal part 142 is entirely located under the acoustic device 200, and the first metal part 142 may be electrically connected to the ground of the wiring board, so that the first metal part 142 may serve as a ground metal of the acoustic device 200 or a metal ground for reducing interference.
The orthogonal projection of the second metal part 162 on the substrate 150 is located within the orthogonal projection of the acoustic device 200 on the substrate 150. The second metal part 162 is also located below the acoustic device 200, and the second metal part 162 and the first metal part 142 are disposed opposite to each other. The second metal part 162 may be used for electrical connection with the circuit board, so that the second metal part 162 may serve as a metal ground for reducing interference. The second metal part 162 may also be electrically connected to a circuit for discharging static electricity, and the second metal part 162 may conduct the ESD arc to the circuit for discharging static electricity to be discharged. The circuit for discharging static electricity may be provided on the wiring board. When the circuit board is mounted on another structure, the second metal part can be electrically connected with a circuit for discharging static electricity of the other structure.
When the first metal part and the second metal part are both electrically connected with the ground, the first metal part and the second metal can be electrically connected with the ground through other circuits of the conductive layer where the first metal part and the second metal are located, and the first metal part and the second metal can also be directly electrically connected through circuits in the through holes of the circuit board. The present embodiment does not limit the wiring for electrically connecting the first metal portion and the second metal portion to ground.
The first and second functional parts 140 and 160 may be regions within the same range around the sound hole 120, i.e., regions located under the acoustic device 200. If the dielectric strengths of the first and second functional parts 140 and 160 are substantially the same, when ESD arcs strike the sound hole 120, the ESD arcs will strike the first or second functional part 140 or 160 randomly due to the consistent dielectric strengths of the first and second functional parts 140 and 160. Therefore, the present embodiment mainly changes the structure of the first functional portion in the related art, and increases the dielectric strength of the first functional portion in the related art, so that the dielectric strength of the first functional portion 140 in the present embodiment is greater than the dielectric strength of the second functional portion 160, and the problem that the ESD arc is emitted to the acoustic device through the acoustic hole to damage the acoustic device in the related art is solved.
Fig. 10 and fig. 11 are specifically shown, where fig. 10 is a schematic view of a third structure of the package structure provided in the embodiment of the present application, and fig. 11 is a schematic view of a circuit board in the package structure shown in fig. 10. The first functional portion 140 may not include the first metal portion, that is, the first functional portion 140 includes only the first insulating portion 144, and the first insulating portion 144 is directly adjacent to the substrate 150. The second functional part 160 may include a second metal part 162 and a second insulating part 164, and the second metal part 162 is disposed between the second insulating part 164 and the substrate 150.
Instead of providing the first metal portion on the side of the substrate 150 of the wiring board 100 facing the acoustic device, the first insulating portion 144 is directly provided on the substrate 150, and the second metal portion 162 and the second insulating portion 164 are sequentially provided on the other side of the substrate 150 facing away from the acoustic device. Since the first functional part 140 has no first metal part, only the first insulating part 144, and the second functional part 160 includes the second metal part 162 and the second insulating plate, the dielectric strength of the first functional part 140 without the first metal part is significantly greater than that of the second functional part 160 with the second metal part 162. When ESD arcs hit the sound hole 120, the ESD arcs are attracted by the second functional portion 160 having the second metal portion 162 and are not easily attracted by the first functional portion 140 having no first metal portion, so that the ESD arcs do not easily hit the acoustic device through the sound hole 120, the acoustic device is protected, and ESD protection performance of the acoustic device is improved.
The second metal part 162 may be partially exposed to the second insulating part 164, so as to better attract the ESD arc. The second metal part 162 may also serve other functions, such as grounding the second metal part 162, which may reduce interference near the sound hole 120. For another example, the second metal part 162 serves as a pad, and the second metal part 162 may be electrically connected to other functional devices. Of course, the second metal part 162 may be completely covered by the second insulating part 164.
It is understood that the second metal part 162 may be grounded or may be connected to a circuit for discharging static electricity, thereby discharging static electricity.
Other structures of the first functional portion and the second functional portion in this embodiment may also refer to the structures of the first functional portion and the second functional portion in any of the above embodiments, and are not described herein again.
Referring to fig. 9, the main difference between the package structure of the present embodiment and the package structure of the previous embodiment is the first functional portion, and the first functional portion 140 includes a first metal portion 142 and a first insulating portion 144, the first metal portion 142 is disposed between the first insulating portion 144 and the substrate 150, the second functional portion 160 may include a second metal portion 162 and a second insulating portion 164, the second metal portion 162 is disposed between the second insulating portion 164 and the substrate 150, the first insulating portion 144 covers a side of the first metal portion 142 facing the sound hole 120, and the second insulating portion 164 exposes a side of the second metal portion 162 facing the sound hole 120.
Since the first insulating portion 144 is disposed between the first metal portion 142 and the sound hole 120 and the second insulating portion 164 is not disposed between the second metal portion 162 and the sound hole 120, the dielectric strength of the first functional portion 140 is significantly greater than that of the second functional portion 160. When ESD arcs hit the sound hole 120, the ESD arcs are attracted by the exposed second metal portion 162 and are not easily attracted by the first metal portion 142 isolated by the first insulating portion 144, so that the ESD arcs do not easily hit the acoustic device 200 through the sound hole 120, the acoustic device 200 is protected, and the ESD protection performance of the acoustic device 200 is improved.
Other structures of the first functional portion and the second functional portion in this embodiment may also refer to the structures of the first functional portion and the second functional portion in any of the above embodiments, and are not described herein again.
In the present embodiment, referring to fig. 1 to 11, a package structure 10 may include a circuit board 100 and an acoustic device 200. The circuit board 100 is provided with the sound hole 120, the circuit board 100 includes a substrate 150 and a first functional portion 140 and a second functional portion 160 located at both sides of the substrate 150, the first functional portion 140 and the second functional portion 160 are both disposed around the sound hole 120, and the dielectric strength of the first functional portion 140 is greater than that of the second functional portion 160. The acoustic device 200 is mounted on the circuit board 100 and disposed on a side of the first functional portion 140 facing away from the second functional portion 160, and the acoustic device 200 is disposed opposite to the sound hole 120.
In the related art, a wiring board having acoustic devices such as a microphone and other semiconductor devices is often covered with a Ground (GND) wiring as entirely as possible in order to improve its shielding property and reduce interference. GND wiring is arranged on both sides of the circuit board, so that metal which is exposed and leaked is arranged on one side (GND ground) of the circuit board facing the microphone and other semiconductor device products and one side (GND ground) of the circuit board departing from the microphone, and the dielectric strength of both sides of the circuit board is basically consistent. When ESD electric arcs come, the electric arcs can randomly route the two sides of the circuit board due to the fact that dielectric strength of the two sides of the circuit board is consistent. The instantaneous explosion of the ESD arc on the side of the circuit board facing the microphone can cause significant damage to the fragile microphone and other semiconductor devices.
The acoustic device 200 in the present embodiment is disposed on the first functional portion 140 side of the wiring board 100, the second functional portion 160 is disposed on the side of the wiring board 100 away from the acoustic device 200, and the dielectric strength of the first functional portion 140 is greater than that of the second functional portion 160. When an ESD arc strikes, the ESD arc is attracted by the second functional portion 160 with lower dielectric strength and is not easily attracted by the first functional portion 140, so that the ESD arc does not easily strike the acoustic device 200 through the acoustic hole 120, the acoustic device 200 is protected, and the ESD protection performance of the acoustic device 200 is improved. The problem of among the correlation technique, ESD electric arc hits the acoustics device through the sound hole, causes the injury to the acoustics device is solved.
The structures of the first functional portion and the second functional portion in this embodiment may refer to the structures of the first functional portion and the second functional portion in any of the above embodiments, and are not described herein again.
Referring to fig. 12, fig. 12 is a schematic diagram illustrating a fourth structure of a package structure according to an embodiment of the disclosure. The acoustic device 200 includes an Electro-acoustic element, and the Electro-acoustic device may be a Micro-Electro-Mechanical System (MEMS) 210 or an Application Specific Integrated Circuit (ASIC) 220, but the acoustic device 200 may also be a microphone or a speaker with other structures. The asic 220 may be electrically connected to the connection pads 180 on the circuit board 100, the connection pads 180 may be disposed on one side of the circuit board 100 facing the acoustic device 200, the connection pads 180 may further include another side located on the circuit board 100 away from the acoustic device 200, and the connection pads 180 on two sides of the circuit board 100 may be electrically connected through the conductive members located in the vias of the circuit board 100, so as to facilitate electrical connection between the acoustic device 200 and other circuits.
The package structure in any of the above embodiments may further include a shielding cover, specifically referring to fig. 13, where fig. 13 is a fifth structural schematic diagram of the package structure provided in the embodiments of the present application. The acoustic device 200 may further include a shield 230, and the shield 230 may cover the electro-acoustic elements such as the electromechanical system 210 and the application specific integrated circuit 220. The shielding cover 230 is also arranged on the side of the wiring board 100 facing the electromechanical system 210 and the application specific integrated circuit 220, and the shielding cover 230 may completely cover the electromechanical system 210 and the application specific integrated circuit 220, thereby protecting the electromechanical system 210 and the application specific integrated circuit 220 from static electricity on the side of the acoustic device 200 facing away from the wiring board 100. The circuit board 100 is disposed on the other side of the acoustic device 200, which can also protect the acoustic device 200, and the static electricity near the sound hole 120 on the circuit board 100 is absorbed by the second functional portion 160, so as to protect the acoustic device 200 from the static electricity in all directions. Of course, the package structure 10 may also be protected from static electricity by other means, such as providing a static electricity guiding circuit, etc., from the side of the acoustic device 200 away from the circuit board 100. The shield 230 may also serve as a packaging housing for the electromechanical system 210 and the application specific integrated circuit 220.
The embodiment of the present application further provides a circuit board, please continue to refer to fig. 1, fig. 3, fig. 4 and fig. 5, where the circuit board 100 is provided with a sound hole 120 for the acoustic device to transmit a sound signal, the circuit board 100 includes a substrate 150, and a first functional portion 140 and a second functional portion 160 located at two sides of the substrate 150, both the first functional portion 140 and the second functional portion 160 are disposed around the sound hole 120, the first functional portion 140 may include a first metal portion 142, the second functional portion 160 may include a second metal portion 162, a distance between the first metal portion 142 and the sound hole 120 is greater than a distance between the second metal portion 162 and the sound hole 120, and/or an area of the first metal portion 142 is smaller than an area of the second metal portion 162. The first functional portion 140 is provided to be opposed to the acoustic device.
Referring to fig. 10 and 11, the circuit board 100 is provided with a sound hole 120 for the acoustic device to transmit a sound signal, the circuit board 100 includes a substrate 150, and a first functional portion 140 and a second functional portion 160 located at two sides of the substrate 150, the first functional portion 140 and the second functional portion 160 are both disposed around the sound hole 120, the first functional portion 140 includes a first insulating portion 144, and the first insulating portion 144 is adjacent to the substrate 150. The second functional part 160 includes a second metal part 162 and a second insulating part 164, and the second metal part 162 is disposed between the second insulating part 164 and the substrate 150. The first functional portion 140 is provided to be opposed to the acoustic device.
The present embodiment further provides a circuit board, please continue to refer to fig. 6, where the circuit board 100 is provided with a sound hole 120 for the acoustic device to transmit the sound signal, the circuit board 100 includes a substrate 150, and a first functional portion 140 and a second functional portion 160 located at two sides of the substrate 150, both the first functional portion 140 and the second functional portion 160 are disposed around the sound hole 120, the first functional portion 140 includes a first metal portion 142 and a first insulating portion 144, the first insulating portion 144 covers a side of the first metal portion 142 facing the sound hole 120, the second functional portion 160 may include a second metal portion 162 and a second insulating portion 164, and the second insulating portion 164 exposes a side of the second metal portion 162 facing the sound hole 120. The first functional portion 140 is provided to be opposed to the acoustic device.
The embodiment of the present application further provides a circuit board, please continue to refer to fig. 1 to 13, where the circuit board 100 is provided with a sound hole 120 for the acoustic device to transmit the sound signal, the circuit board 100 includes a substrate 150, and a first functional portion 140 and a second functional portion 160 located at two sides of the substrate 150, the first functional portion 140 and the second functional portion 160 are both disposed around the sound hole 120, the dielectric strength of the first functional portion 140 is greater than that of the second functional portion 160, and the first functional portion 140 is disposed opposite to the acoustic device.
In the related art, a wiring board having acoustic devices such as a microphone and other semiconductor devices is often covered with a Ground (GND) wiring as entirely as possible in order to improve its shielding property and reduce interference. GND wiring is arranged on both sides of the circuit board, so that metal which is exposed and leaked is arranged on one side (GND ground) of the circuit board facing the microphone and other semiconductor device products and one side (GND ground) of the circuit board departing from the microphone, and the dielectric strength of both sides of the circuit board is basically consistent. When ESD electric arcs come, the electric arcs can randomly route the two sides of the circuit board due to the fact that dielectric strength of the two sides of the circuit board is consistent. The instantaneous explosion of the ESD arc on the side of the circuit board facing the microphone can cause significant damage to the fragile microphone and other semiconductor devices.
In this embodiment, one side of the first functional portion 140 provided on the circuit board 100 is used for mounting an acoustic device, the second functional portion 160 provided on the circuit board 100 is provided on the other side of the circuit board 100, and the dielectric strength of the first functional portion 140 is greater than that of the second functional portion 160. When an ESD arc strikes, the ESD arc is attracted by the second functional portion 160 with lower dielectric strength and is not easily attracted by the first functional portion 140, so that the ESD arc is not easily struck to the acoustic device through the acoustic hole 120, the acoustic device is protected, and the ESD protection performance of the acoustic device is improved. The problem of among the correlation technique, ESD electric arc hits the acoustics device through the sound hole, causes the injury to the acoustics device is solved.
The circuit board in this embodiment may be the circuit board in any one of the above embodiments, and the specific structures of the first functional portion and the second functional portion in this embodiment may refer to the first functional portion and the second functional portion in any one of the above embodiments, which is not described herein again.
An embodiment of the present application further provides an electronic device, where the electronic device may include the package structure in any one of the above embodiments, or include the circuit board in any one of the above embodiments, and details are not repeated herein.
The electronic device may be a device having an audio playing function, such as any device having a function of converting a sound signal into an electrical signal or converting an electrical signal into a sound signal, such as a mobile phone, a sound box, a tablet computer, a television, a notebook computer, and a point-to-read machine, and the embodiment of the present application does not limit the type of the electronic device.
The package structure, the circuit board, and the electronic device provided in the embodiments of the present application are described in detail above, and a specific example is applied in the description to explain the principle and the implementation of the present application, and the description of the embodiments above is only used to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A package structure, comprising:
the circuit board is provided with a sound hole, the circuit board comprises a substrate, a first functional part and a second functional part, the first functional part and the second functional part are positioned on two sides of the substrate, the first functional part and the second functional part are arranged around the sound hole, the first functional part comprises a first metal part, the second functional part comprises a second metal part, the distance between the first metal part and the sound hole and the thickness of the substrate are greater than the distance between the second metal part and the sound hole, and/or the area of the first metal part is smaller than the area of the second metal part; and
and the acoustic device is arranged on the circuit board and is arranged on one side of the first functional part, which deviates from the second functional part, and the acoustic device is arranged opposite to the sound hole.
2. The package structure of claim 1, wherein the first functional portion further comprises a first insulating portion covering the first metal portion;
the second functional portion further includes a second insulating portion covering a portion of the second metal portion.
3. The package structure of claim 1, wherein an orthogonal projection of the first metal portion on the substrate is within an orthogonal projection of the acoustic device on the substrate, and wherein an orthogonal projection of the second metal portion on the substrate is within an orthogonal projection of the acoustic device on the substrate.
4. The package structure according to claim 1, wherein the first metal portion is electrically connected to a ground of the circuit board, and the second metal portion is electrically connected to a ground of the circuit board or a circuit for discharging static electricity.
5. The package structure of claim 1, wherein the first metal portion is farther from the acoustic aperture than the second metal portion.
6. The package structure according to any one of claims 1 to 5, wherein the acoustic device includes a shield case and an electroacoustic element, the electroacoustic element being mounted to the wiring board, the shield case being provided to the electroacoustic element.
7. A package structure, comprising:
the circuit board is provided with a sound hole and comprises a substrate, a first functional part and a second functional part, wherein the first functional part and the second functional part are positioned on two sides of the substrate, the first functional part and the second functional part are arranged around the sound hole, and the dielectric strength of the first functional part is greater than that of the second functional part; and
and the acoustic device is arranged on the circuit board and is arranged on one side of the first functional part, which deviates from the second functional part, and the acoustic device is arranged opposite to the sound hole.
8. A circuit board is characterized in that the circuit board is provided with a sound hole for an acoustic device to transmit sound signals, the circuit board comprises a substrate, a first functional part and a second functional part, the first functional part and the second functional part are positioned on two sides of the substrate, the first functional part and the second functional part are arranged around the sound hole, and the first functional part and the sound hole are used for being arranged opposite to the acoustic device;
the first functional part comprises a first metal part, the second functional part comprises a second metal part, the distance between the first metal part and the sound hole and the thickness of the substrate are greater than the distance between the second metal part and the sound hole, and/or the area of the first metal part is smaller than the area of the second metal part.
9. The circuit board is characterized in that the circuit board is provided with a sound hole for transmitting a sound signal by an acoustic device, the circuit board comprises a substrate, a first functional part and a second functional part, the first functional part and the second functional part are located on two sides of the substrate, the first functional part and the second functional part are arranged around the sound hole, the dielectric strength of the first functional part is greater than that of the second functional part, and the first functional part and the sound hole are used for being arranged relative to the acoustic device.
10. An electronic device comprising the package structure according to any one of claims 1 to 7 or the wiring board according to claim 8 or 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122557541.2U CN216054695U (en) | 2021-10-22 | 2021-10-22 | Packaging structure, circuit board and electronic equipment |
| PCT/CN2022/126332 WO2023066324A1 (en) | 2021-10-22 | 2022-10-20 | Microphone structure, packaging structure, and electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122557541.2U CN216054695U (en) | 2021-10-22 | 2021-10-22 | Packaging structure, circuit board and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN216054695U true CN216054695U (en) | 2022-03-15 |
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| CN202122557541.2U Active CN216054695U (en) | 2021-10-22 | 2021-10-22 | Packaging structure, circuit board and electronic equipment |
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| CN (1) | CN216054695U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023066324A1 (en) * | 2021-10-22 | 2023-04-27 | 苏州敏芯微电子技术股份有限公司 | Microphone structure, packaging structure, and electronic apparatus |
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2021
- 2021-10-22 CN CN202122557541.2U patent/CN216054695U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023066324A1 (en) * | 2021-10-22 | 2023-04-27 | 苏州敏芯微电子技术股份有限公司 | Microphone structure, packaging structure, and electronic apparatus |
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