CN216054676U

CN216054676U - Jump ring subassembly and controller for controller

Info

Publication number: CN216054676U
Application number: CN202121895199.0U
Authority: CN
Inventors: 王在辉; 张占磊
Original assignee: TIANJIN SANTROLL ELECTRIC SCIENCE & TECHNOLOGY CO LTD
Current assignee: TIANJIN SANTROLL ELECTRIC SCIENCE & TECHNOLOGY CO LTD
Priority date: 2021-08-13
Filing date: 2021-08-13
Publication date: 2022-03-15
Anticipated expiration: 2031-08-13

Abstract

The utility model provides a clamp spring component for a controller, which is used for being connected with a heat radiating piece provided with an MOS (metal oxide semiconductor) tube and comprises a clamp spring and a pressing piece, wherein the clamp spring is detachably connected with the pressing piece, the clamp spring is arranged in the pressing piece, the pressing piece is connected with the heat radiating piece, the clamp spring is contacted with the MOS tube in the heat radiating piece, and the clamp spring is compressed and deformed so as to press the MOS tube and the heat radiating piece. The clamp spring has the beneficial effects that the clamp spring is provided with the pressing claws which correspond to the MOS tubes one by one, the pressing claws have elasticity and can generate deformation, the MOS tubes are pressed on the heat radiating members by utilizing the elastic deformation of the pressing claws, when the clamp spring is arranged in the pressing member, the clamp spring is in contact with the pressing member in a fitting manner, no gap exists, the integral deformation of the clamp spring under stress can be prevented, and the MOS tubes and the heat radiating members are ensured to be pressed tightly.

Description

Jump ring subassembly and controller for controller

Technical Field

The utility model belongs to the technical field of electronic control, and particularly relates to a clamp spring assembly for a controller and the controller.

Background

In the design production of controller, because the size restriction of controller, need carry out the level with the MOS pipe and place many times, and conventional jump ring is only applicable to MOS pipe and places vertically.

The prior art is that directly fix MOS pipe and heat-sink with the screw, and this position accuracy requirement to the MOS pipe is higher, and the MOS pipe that some powerful controllers used is more in quantity moreover, beats the screw process and can increase man-hour in a large number, greatly reduces production efficiency.

Disclosure of Invention

In view of the above problems, the present invention provides a circlip assembly for a controller and a controller, so as to solve the above or other former problems in the prior art.

In order to solve the technical problems, the utility model adopts the technical scheme that: the utility model provides a jump ring subassembly for controller for with be equipped with the heat-radiating piece of MOS pipe and be connected, include the jump ring and compress tightly the piece, the jump ring with compress tightly the piece and can dismantle and be connected, and the jump ring is located and is compressed tightly inside the piece, compress tightly the piece and be connected with the heat-radiating piece, compress tightly the MOS pipe on the heat-radiating piece and compress tightly.

Further, the clip spring is in contact with the MOS tube located in the heat sink, and the clip spring is compressed and deformed to press the MOS tube and the heat sink.

Further, the clamp spring comprises a clamp spring body, a pressing claw and a clamping claw, wherein,

the clamping spring body is provided with a plurality of pressing claws which are arranged on one side face of the clamping spring body in sequence along the length of the clamping spring body and are used for pressing the MOS tube by utilizing elastic deformation;

the jack catch is arranged on a group of oppositely arranged side faces of the clamp spring body and is used for being connected with the pressing piece in a clamping mode.

Furthermore, the pressing claw is intersected with the clamp spring body.

Furthermore, a plurality of pressure claws are arranged in at least one row, in each row, the number of the pressure claws is consistent with that of the MOS tubes, and the plurality of pressure claws correspond to the MOS tubes one to one.

Furthermore, the jack catch has two sets at least, sets gradually along the length direction of jump ring body.

Furthermore, the pressing piece is of a groove structure, grooves are formed in the inner side walls, opposite to the pressing piece, of the pressing piece, and the grooves are connected with the clamping jaws in a clamping mode.

Furthermore, the side of the clamp spring body which is not provided with the pressing claw is contacted and attached with the inner wall of the pressing piece.

Furthermore, through holes are formed in two ends of the clamp spring body, first through holes are formed in two ends of the pressing piece, and the first through holes correspond to the through holes of the clamp spring body;

the compressing part is provided with a connecting piece which sequentially penetrates through the first through hole and the through hole to be connected with the heat radiating part.

A controller comprises the clamp spring assembly for the controller.

By adopting the technical scheme, the clamp spring assembly is simple in structure and convenient to install and use, and is provided with the clamp spring and the pressing piece, the clamp spring is provided with the pressing claws, the pressing claws correspond to the MOS tubes one by one, the pressing claws are elastic and can deform, and the MOS tubes are pressed tightly on the heat dissipation piece by utilizing the elastic deformation of the pressing claws; the clamp spring is provided with a clamping claw which is embedded into a groove on the inner side of the pressing piece, so that the position fixation of the clamp spring and the pressing piece is realized; when the clamp spring is arranged in the pressing piece, the clamp spring is in contact with the pressing piece in a fitting manner, no gap exists, the clamp spring can be prevented from being integrally deformed when stressed, and the MOS tube and the heat radiating piece are guaranteed to be pressed tightly; the compressing part and the radiating part penetrate through the clamp spring through the screws to be connected with the compressing part and the radiating part, and the MOS tubes of any number are fixed through only two screws, so that the installation is convenient, and the production efficiency is improved.

Drawings

Fig. 1 is a schematic structural view of a circlip assembly and a heat sink according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a clamp spring according to an embodiment of the utility model;

FIG. 3 is a schematic structural diagram of another view of the clamp spring according to an embodiment of the utility model;

fig. 4 is a schematic cross-sectional view illustrating a connection between a clip spring assembly and a heat sink according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of another angle when the circlip assembly is connected with the heat sink according to an embodiment of the utility model.

In the figure:

10. circlip 20, pressing piece 30 and heat sink

40. MOS tube 50, connecting piece 100 and clamp spring body

101. Claw 102, pressing claw 103 and through hole

200. Groove

Detailed Description

The utility model is further described with reference to the following figures and specific embodiments.

Fig. 1 shows a schematic structural diagram of an embodiment of the present invention, and the embodiment relates to a clamp spring assembly for a controller and a controller, which are used for compressing an MOS tube disposed on a heat dissipation member, and compressing the MOS tube on the heat dissipation member so as to transfer heat to the heat dissipation member for heat dissipation.

A circlip 10 assembly for a controller is shown in figures 1-5, and is used for connecting with a heat sink 30 provided with an MOS tube 40, and tightly pressing the MOS tube 40 on the heat sink 30; the clamp spring assembly comprises a clamp spring 10 and a pressing piece 20, wherein the clamp spring 10 is detachably connected with the pressing piece 20, so that the clamp spring 10 and the pressing piece 20 can be conveniently installed and detached; and the circlip 10 is arranged inside the compressing member 20, the compressing member 20 is connected with the heat sink 30, the circlip 10 contacts the MOS tube 40 located inside the heat sink 30, and the circlip 10 is compressed and deformed to compress the MOS tube 40 and the heat sink 30. When the pressing part 20 is not connected with the heat sink 30, the clamp spring 10 is in a free state, and after the pressing part 20 is connected with the heat sink 30, the clamp spring 10 contacts with the top end of the MOS tube, and the clamp spring 10 is compressed to press the MOS tube.

In this embodiment, in order to simplify the structure of jump ring subassembly, it is preferable, jump ring 10 with compress tightly 20 block connection, jump ring 10 is fixed the joint in compressing tightly 20, realize jump ring 10 with compress tightly the position of 20 fixed, so that compress tightly when 20 is connected with heat dissipation member 30 jump ring 10 and MOS pipe 40 contact, jump ring 10 can not produce when receiving the reaction force and remove, compress tightly MOS pipe 40 on heat dissipation member 30 through the elastic deformation of jump ring 10, so that MOS pipe 40 and heat dissipation member 30 in close contact with dispel the heat, dispel the heat.

Specifically, as shown in fig. 2 and 3, the snap spring 10 includes a snap spring body 100, a pressing claw 102 and a claw 101, wherein the snap spring body 100 functions as a framework, so as to facilitate installation of the pressing claw 102 and the claw 101, and the snap spring body 100 is of a plate-shaped structure, has a certain length, and facilitates arrangement of the pressing claws 102; in this embodiment, it is preferable that the length of the circlip body 100 is adapted to the length of the heat sink 30, so that the pressing claw 102 provided on the circlip body 100 can press all the MOS transistors 40.

In this embodiment, it is preferable that the circlip body 100 has a rectangular shape.

The number of the pressing claws 102 is multiple, the pressing claws are arranged on one side surface of the clamp spring body 100 and are sequentially arranged along the length direction of the clamp spring body 100, the pressing claws 102 are made of elastic materials and have certain elasticity, and the MOS tube 40 is pressed by utilizing elastic deformation; along the length direction of the clamp spring body 100, the plurality of pressing claws 102 are arranged in at least one row, the number of rows of the pressing claws 102 is selected according to the width of the MOS transistor 40, and is not particularly required, and in the present embodiment, the number of rows of the pressing claws 102 is preferably one row.

In each row, the number of the pressing claws 102 is the same as the number of the MOS transistors 40, and the plurality of pressing claws 102 correspond to the plurality of MOS transistors 40 one by one, so that one pressing claw 102 presses one MOS transistor 40, and all the plurality of MOS transistors 40 are pressed against the heat sink 30.

Moreover, when the number of rows of the pressing claws 102 is multiple, in the multiple rows of the pressing claws 102, the pressing claws 102 located in the same row are in one group, each group corresponds to one MOS transistor, and each group of the pressing claws 102 simultaneously presses one MOS transistor.

The pressing claw 102 is fixedly connected with the clamp spring body 100, and the pressing claw 102 intersects with the clamp spring body 100, preferably, in this embodiment, the pressing claw 102 intersects with the clamp spring body 100 in an inclined manner, so that the pressing claw 102 is in inclined contact with the MOS transistor 40 when in contact with the MOS transistor 40, and generates elastic deformation under the compression action of the pressing piece 20 and the MOS transistor 40 to press the MOS transistor 40. One end of the pressing claw 102 is fixedly connected with the clamp spring body 100, and the other end is bent to form a radian, so that the end is in line contact with the MOS transistor 40, and the MOS transistor 40 is prevented from being damaged. Meanwhile, the pressing claw 102 is obliquely arranged, so that the pressing claw 102 can be restored to a free state when the pressing member 20 is separated from the heat sink 30, so that the snap spring 10 can be repeatedly used.

In this embodiment, preferably, the connection mode of the pressing claw 102 and the snap spring body 100 is preferably integrally formed, and the snap spring has a stable structure and a long service life.

When the pressing claw 102 contacts the MOS transistor 40, the pressing claw compresses the MOS transistor 40 and also receives a reaction force applied by the MOS transistor, so that the snap spring body 100 receives a certain pressure, and therefore, the material of the snap spring body 100 is preferably an elastic material and can deform to a certain degree, so that the snap spring body 100 is balanced in stress and cannot move along the pressing piece 20.

In this embodiment, preferably, the pressing claw 102 is formed by cutting the clip spring body 100 during preparation, and along the length direction of the clip spring body 100, the position of each pressing claw 102 is set according to the position of each MOS transistor 40 on the heat sink 30, and the cutting is performed, so that only one end of the pressing claw 102 is connected with the clip spring body 100, pressure is applied to the pressing claw 102 after the cutting, the pressing claw 102 is bent to the side in the direction toward one side of the clip spring body 100, so that the pressing claw 102 and the clip spring body 100 are obliquely and crosswise arranged, and the free end of the pressing claw 102 is bent, so that the free end of the pressing claw 102 faces the clip body 100, and the free end of the pressing claw 102 has a certain arc-shaped structure.

The projection length of the pressing claw 102 in the vertical direction is smaller than the distance between the clamp spring body 100 and the top end of the MOS tube 40 after the pressing piece 20 and the heat dissipation piece 30 are connected and fixed, so that the pressing claw 102 is compressed and deformed to generate elastic deformation, and the MOS tube 40 and the heat dissipation piece 30 are pressed tightly.

The above-mentioned jack catch 101 is arranged on a group of opposite side surfaces of the snap spring body 100 for being clamped with the pressing piece 20, the group of opposite side surfaces are two side surfaces perpendicular to the side surface provided with the pressing claw 102, in this embodiment, the jack catch 101 is arranged along the width direction of the snap spring body 100, and the two oppositely arranged side edges are both provided with the jack catch 101 for clamping and connecting the snap spring 10 with the pressing piece 20; the claw 101 is fixedly connected with the side edge of the clamp spring body 100, and the fixed connection mode is preferably integrated, so that the structure is stable; the claw 101 is formed by extending the joint of the claw 101 and the clamp spring body 100 in the direction of the pressing claw 102, and the cross section of the claw 101 is curved and has an arc-shaped protrusion so as to be engaged with the pressing member 20. Jack catch 101 has certain elasticity, can produce elastic deformation for the in-process that the jump ring 10 was installed in compressing tightly 20, inside jack catch 101 was compressed to get into and is compressed tightly 20, after jump ring 10 got into and compresses tightly 20, jack catch 101 reconversion under the effect of restoring force, in the recess 200 of embedding compression 20 inside wall, with the joint of jump ring 10 on compressing tightly 20.

In this embodiment, the claws 101 on both sides of the circlip body 100 are preferably arranged oppositely when arranged; the oppositely arranged claws 101 are taken as a group, at least two groups of claws 101 are sequentially arranged along the length direction of the clamp spring body 100, and the group number of the claws 101 is selected according to the length of the clamp spring body 100 without specific requirements.

As shown in fig. 4 and 5, the pressing member 20 has a groove structure, two inner side walls of the pressing member 20, which are opposite to each other, are provided with grooves 200, and the grooves 200 are engaged with the claws 101. Preferably, the cross-sectional shape of the compressing member 20 is n, having a top inner wall and two inner side walls, and the compressing member 20 has a certain length, and the length of the compressing member 20 is not less than the length of the heat dissipating member 30, so that the compressing member 20 can be connected with the heat dissipating member 30; grooves 200 are formed in the two inner side walls, the number of the grooves 200 is the same as that of the clamping jaws 101, the positions of the grooves 200 correspond to those of the clamping jaws 101, and one clamping jaw 101 is clamped with one groove 200. Alternatively, the groove 200 is a through groove, and is disposed along the length direction of the inner sidewall of the pressing member 20, and penetrates through the inner sidewall.

When jump ring 10 was installed and is being compressed tightly in 20, jump ring body 100 not be equipped with the side of pressing claw 102 and the inner wall contact laminating that compresses tightly 20, jack catch 101 joint is in recess 200, with jump ring 10 fixed mounting compress tightly 20 in, jump ring body 100 with compress tightly 20 inner wall laminating contact setting, wholly produce deformation when can prevent that jump ring 10 from receiving the reaction force that the MOS pipe was applyed, guarantee that MOS pipe 40 compresses tightly with heat dissipation piece 30.

Through holes 103 are formed in two ends of the clamp spring body 100, the through holes 103 are located at two ends of the clamp spring body 100 in the length direction, the through holes 103 can be circular, U-shaped or other shapes, and selection is performed according to actual requirements, and no specific requirement is made here. Through-hole 103's setting, when jump ring 10 atress, it is spacing to the removal along length direction of jump ring 10 to make pressure claw 102 produce elastic deformation and compress tightly MOS pipe 40 when jump ring 10 can not remove along length direction, so that jump ring 10 stabilizes to compress tightly MOS pipe 40.

The both ends of compressing tightly piece 20 are equipped with first through-hole, and first through-hole is corresponding with the through-hole 103 of jump ring body 100, and after jump ring 10 was installed in compressing tightly piece 20, the through-hole 103 of jump ring 10 was corresponding with the position of compressing tightly the first through-hole of piece 20, and both communicate. The shape of the first through hole can be circular, U-shaped or other shapes, and is selected according to actual requirements, and no specific requirement is made here.

The pressing member 20 is provided with a connector 50, the connector 50 is connected with the heat sink 30 through the first through hole and the through hole 103 in turn, and the pressing member 20 is connected with the heat sink 30 through the connector 50, and in this embodiment, the connector 50 is preferably a bolt or a screw. The first through hole may be a light hole, the first through hole may be a threaded hole, which is selected according to actual requirements, the heat sink 30 is provided with a threaded hole, and the compressing member 20 is connected with the heat sink 30 by a bolt or a screw. In the process that the compression element 20 is connected with the heat dissipation element 30, the pressing claw 102 of the clamp spring 10 contacts the MOS tube 40 and is compressed, and the pressing claw 102 presses the MOS tube 40 against the heat dissipation element 30, so that heat generated by the MOS tube 40 in the use process is transferred to the heat dissipation element 30 for heat dissipation.

The arrangement of the through hole 103 of the clamp spring 10 and the first through hole of the compressing element 20 is convenient to install, and the production efficiency is improved, so that the compressing element 20 and the radiating element 30 can be fixed only by two connecting elements 50 for any number of MOS tubes 40 on the radiating element 30.

A controller comprises the clamp spring 10 assembly.

When the clamp spring 10 assembly is used, the clamp spring 10 is pressed into the pressing part 20, the claws 101 at two sides of the clamp spring 10 are embedded into the corresponding grooves 200 on the inner side wall of the pressing part 20, and the position fixing of the clamp spring 10 and the pressing part 20 is realized; the connecting piece 50 sequentially penetrates through the first through hole 1 of the pressing piece 20 and the through hole 103 of the clamp spring 10 and extends into the mounting hole of the radiating piece 30, the pressing piece 20 is connected with the radiating piece 30, and because the distance from the clamp spring body 100 to the top end of the MOS tube 40 is smaller than the projection length of the pressing claw 102 in the vertical direction, after the pressing piece 20 is fixedly connected with the radiating piece 30, the pressing claw 102 on the clamp spring 10 deforms under stress, and the MOS tube 40 and the radiating piece 30 are pressed tightly.

The embodiments of the present invention have been described in detail, but the description is only for the preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.

Claims

1. The utility model provides a jump ring subassembly for controller for with be equipped with the heat-sink connection of MOS pipe, its characterized in that: including the jump ring with compress tightly the piece, the jump ring with compress tightly the piece and can dismantle the connection, just the jump ring is located compress tightly inside the piece, compress tightly the piece with the heat-radiating piece is connected, and is right MOS pipe on the heat-radiating piece compresses tightly.

2. The circlip assembly for a controller of claim 1, wherein: the clamp spring is in contact with the MOS tube positioned in the heat dissipation piece, and the clamp spring is compressed and deformed so that the MOS tube and the heat dissipation piece are tightly pressed.

3. The circlip assembly for a controller according to claim 1 or 2, wherein: the clamp spring comprises a clamp spring body, a pressing claw and a clamping claw, wherein,

the clamping spring body is provided with a plurality of pressing claws, the pressing claws are arranged on one side face of the clamping spring body, and the pressing claws are sequentially arranged along the length of the clamping spring body and are used for pressing the MOS tube by utilizing elastic deformation;

the clamping claw is arranged on a group of oppositely arranged side faces of the clamp spring body and is used for being connected with the pressing piece in a clamping mode.

4. The circlip assembly for a controller of claim 3, wherein: the pressing claw is intersected with the clamp spring body.

5. The circlip assembly for a controller according to claim 4, wherein: the plurality of pressing claws are arranged in at least one row, the number of the pressing claws is consistent with that of the MOS tubes in each row, and the plurality of pressing claws correspond to the plurality of MOS tubes one to one.

6. The circlip assembly for a controller of claim 5, wherein: the clamping jaws are at least two groups and are sequentially arranged along the length direction of the clamp spring body.

7. The circlip assembly for a controller according to any one of claims 4 to 6, wherein: the pressing piece is of a groove structure, grooves are formed in the inner side walls, opposite to the pressing piece, of the pressing piece, and the grooves are connected with the clamping jaws in a clamping mode.

8. The circlip assembly for a controller of claim 7, wherein: and one side surface of the clamp spring body, which is not provided with the pressing claw, is in contact fit with the inner wall of the pressing piece.

9. The circlip assembly for a controller according to any one of claims 1 to 2, 4 to 6 and 8, wherein: through holes are formed in two ends of the clamp spring body, first through holes are formed in two ends of the pressing piece, and the first through holes correspond to the through holes of the clamp spring body;

the compressing piece is provided with a connecting piece, and the connecting piece sequentially penetrates through the first through hole and the through hole to be connected with the radiating piece.

10. A controller, characterized by: a circlip assembly for a controller comprising any one of claims 1 to 9.