CN216054665U - Power device module and fill electric pile - Google Patents

Abstract

The application provides a power device module and fills electric pile. The power device module comprises a first radiator, a second radiator, a power device and colloid. Each of the first heat sink and the second heat sink includes a first heat dissipation unit and a second heat dissipation unit. An accommodating space is formed between the first heat dissipation units of the two radiators. And a glue filling channel is formed between the first radiator and the second radiating unit of the second radiator. The first heat dissipation unit includes a plurality of first heat dissipation fins. The second heat dissipation unit includes a plurality of second heat dissipation fins. The extending direction of the first radiating fins is different from that of the second radiating fins. The glue filling channel is communicated with the accommodating space in the extending direction of the second radiating fins. The colloid is contained in the containing space. The power device is embedded in the colloid. When the equipment encapsulating, the encapsulating head can stretch into the encapsulating passageway along second radiating fin's extending direction and carry out the encapsulating, has reduced the colloid and has blockked up the possibility of fin, and then has improved the radiating efficiency.

Description

Power device module and fill electric pile

Technical Field

The application relates to the technical field of semiconductor heat dissipation, in particular to a power device module and a charging pile.

Background

The charging pile is an electrical device for charging new energy vehicles (such as electric vehicles and hybrid electric vehicles). Dust, moisture in the environment can influence the reliability of filling electric pile. The charging pile uses power devices (such as MOS, IGBT, diode, rectifier bridge and the like) to realize electrical functions. Creepage distance requirements exist between pins of the power device and between the power device and peripheral devices.

Usually, a radiator is arranged beside the power device in the charging pile for radiating. When assembling, the two radiators are arranged at intervals. A glue filling channel is formed between the radiating fins of the two radiators. And arranging the power device between the two radiators and below the glue filling channel. And extending the glue filling head into the glue filling channel for glue filling. The colloid submerges the power device, so that dust is prevented from being accumulated between the conductive parts of the power device, and the influence of the dust on the creepage distance is reduced. However, the glue is easy to cause the heat dissipation fins beside the glue filling channel to be blocked, which affects the heat dissipation efficiency.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a power device module capable of improving heat dissipation efficiency and a charging pile.

In a first aspect, the present application provides a power device module, including a first heat sink, a second heat sink, a power device, and a colloid; each of the first radiator and the second radiator comprises a first radiating unit and a second radiating unit, an accommodating space is formed between the first radiating units of the first radiator and the second radiator, a glue filling channel is formed between the second radiating units of the first radiator and the second radiator, the first radiating unit comprises a plurality of first radiating fins, the second radiating unit comprises a plurality of second radiating fins, the extending direction of the first radiating fins is different from the extending direction of the second radiating fins, the glue filling channel is communicated with the accommodating space in the extending direction of the second radiating fins, the glue is accommodated in the accommodating space, and the power device is embedded in the glue.

The extending direction of the first radiating fins is different from the extending direction of the second radiating fins, namely the extending direction of the first radiating fins is different from the extending direction of the second radiating fins, the glue filling channel is communicated with the accommodating space in the extending direction of the second radiating fins, when the radiator is assembled with a power device, the glue filling head can stretch into the glue filling channel along the extending direction of the second radiating fins to fill the accommodating space with glue, the glue cannot enter gaps formed by the adjacent second radiating fins, therefore, the possibility that the glue blocks the second radiating fins is reduced, and the radiating efficiency and the radiating effect of the power device module are improved.

In addition, the glue filling channel is communicated with the accommodating space in the extending direction of the second radiating fins, so that the possibility that the glue filling head touches the tail ends of the second radiating fins when extending into the glue filling channel is reduced, and the possibility that the second radiating fins deform is further reduced.

According to the first aspect, in a first possible implementation manner of the first aspect of the present application, the first heat dissipation unit further includes a first support portion, the second heat dissipation unit further includes a second support portion, the first support portion includes a first surface and a second surface that are arranged oppositely, the second support portion includes a third surface and a fourth surface that are arranged oppositely, the third surface is fixedly connected with one end of the first support portion, the plurality of first heat dissipation fins are convexly disposed on the first surface and extend in a direction away from the second surface, the plurality of second heat dissipation fins are convexly disposed on the fourth surface and extend in a direction away from the third surface, and the second surfaces of the two heat sinks are arranged oppositely and enclose the accommodation space; and the glue filling channel is formed between the second radiating fin of the first radiator, which is closest to the second radiator, and the second radiating fin of the second radiator, which is closest to the first radiator. The first supporting part and the second supporting part form a T-shaped structure.

According to the first aspect or the first possible implementation manner of the first aspect of the present application, in a second possible implementation manner of the first aspect of the present application, the power device includes a base and a pin, the base is embedded in the glue, the pin is fixed on the base and extends in a direction away from the third surface, the pin is at least partially exposed from the glue, and the pin is used for facilitating an electrical connection between the power device and another device (for example, a circuit board) or a device.

According to the first aspect or the first to second possible implementation manners of the first aspect of the present application, in a third possible implementation manner of the first aspect of the present application, the first heat sink and the second heat sink are metal heat sinks, the power device module further includes a heat conduction insulating member embedded in the glue body, one surface of the heat conduction insulating member is fixed on the second surface, and the power device is fixed on one surface of the heat conduction insulating member departing from the second surface. The heat conduction insulating part is used for electrically insulating and isolating the radiator and the power device and conducting heat generated by the power device to the radiator for heat dissipation.

According to the first aspect or the first to third possible implementation manners of the first aspect of the present application, in the fourth possible implementation manner of the first aspect of the present application, the power device module further includes an auxiliary heat sink, the auxiliary heat sink includes a first heat conduction portion and a second heat conduction portion that are connected and disposed, the first heat conduction portion is located in the accommodating space and is disposed in a manner of being attached to the power device, the first heat conduction portion is embedded in the glue body, and the second heat conduction portion is exposed out of the glue body and extends into the glue filling channel.

One side face of the power device radiates heat through the first radiator or the second radiator, and the other side face of the power device radiates heat through the auxiliary radiator, namely the power device can realize double-sided heat radiation through the radiator and the auxiliary radiator, and the heat radiation efficiency and the heat radiation effect of the power device module can be improved.

According to the first aspect or the first to fourth possible implementation manners of the first aspect of the present application, in a fifth possible implementation manner of the first aspect of the present application, the number of the auxiliary heat sinks is at least one, the number of the power devices is at least two, and the first heat conduction portion of each of the auxiliary heat sinks is interposed between the two power devices in an arrangement direction of the first support portion of the first heat sink and the second support portion of the second heat sink. One auxiliary radiator can correspondingly carry out auxiliary heat dissipation on two power devices, so that the structure compactness of the power device module is improved while the heat dissipation of the power device module is improved.

According to the first aspect or the first to fifth possible implementation manners of the first aspect of the present application, in a sixth possible implementation manner of the first aspect of the present application, the third surface and the first surface enclose a first groove, the plurality of first heat dissipation fins are accommodated in the first groove, and an extending direction of the second heat dissipation fins is the same as an extending direction of the first supporting portion. Because the first radiating fins are accommodated in the first grooves, the first radiating fins are protected.

According to the first aspect or the first to sixth possible implementation manners of the first aspect of the present application, in a seventh possible implementation manner of the first aspect of the present application, at least one of the first heat sink and the second heat sink further includes a third heat dissipation fin, the third heat dissipation fin is protruded on the third surface and is located in the first groove, and an extending direction of the third heat dissipation fin is the same as an extending direction of the first heat dissipation fin. The third surface is also provided with the third radiating fins, so that the radiating efficiency and the radiating effect of the radiator are improved.

According to the first aspect or the first to seventh possible implementation manners of the first aspect of the present application, in an eighth possible implementation manner of the first aspect of the present application, the third surface and the second surface enclose a second groove, and a caliber of the receiving space is greater than a caliber of the glue filling channel, so as to increase a receiving space enclosed by the two radiators, that is, increase an installation space of the power device.

In a second aspect, the present application provides a charging pile, including a functional circuit and a charging gun, where the functional circuit includes the power device module according to the first aspect or the first to ninth possible implementations of the first aspect of the present application, and the functional circuit is configured to supply power to the charging gun.

Drawings

Fig. 1 is a schematic view of an application scenario when a charging pile provided in a first embodiment of the application charges a new energy vehicle;

fig. 2 is a side view of a power module according to a first embodiment of the present disclosure;

fig. 3 is a side view of a power device module according to a second embodiment of the present disclosure;

fig. 4 is a schematic perspective assembly view of a partial structure of a power device module according to a second embodiment of the present application;

fig. 5 is a side view of a power device module according to a third embodiment of the present application;

fig. 6 is a side view of a power device module according to a fourth embodiment of the present application.

Detailed Description

Usually, a radiator is arranged beside the power device in the charging pile for radiating. The radiator comprises a supporting part, a first radiating fin and a second radiating fin. The supporting part comprises a first surface and a second surface which are oppositely arranged. The first radiating fins are convexly arranged on the first surface. A plurality of second radiating fins are convexly arranged on the second surface. The first radiating fins and the second radiating fins extend along the transverse direction. The second surfaces of the two heat sinks are oppositely arranged. The power device is mounted on the second surface of one of the heat sinks. Gaps are formed between the adjacent second radiating fins on the same radiator. The second radiating fins of the two radiators are oppositely arranged to form a glue filling channel. And extending the glue filling head into the glue filling channel for glue filling. The colloid submerges the power device, so that dust is prevented from being accumulated between the conductive parts of the power device, and the influence of the dust on the creepage distance is reduced. However, in the glue filling process, the glue easily enters the gap to cause the second heat dissipation fins to be blocked, which affects the heat dissipation efficiency of the heat sink. On the other hand, the thickness of the radiating fin is relatively thin, and the radiating fin is easy to deform, for example, when the glue filling head extends into the glue filling channel, the radiating fin is easy to deform, and the radiating efficiency is further influenced.

Based on this, this application provides a power device module and fills electric pile. The power device module comprises a first radiator, a second radiator, a power device and a colloid; each of the first radiator and the second radiator comprises a first radiating unit and a second radiating unit, an accommodating space is formed between the first radiating units of the first radiator and the second radiator, a glue filling channel is formed between the second radiating units of the first radiator and the second radiator, the first radiating unit comprises a plurality of first radiating fins, the second radiating unit comprises a plurality of second radiating fins, the extending direction of the first radiating fins is different from the extending direction of the second radiating fins, the glue filling channel is communicated with the accommodating space in the extending direction of the second radiating fins, the glue is accommodated in the accommodating space, and the power device is embedded in the glue.

The power device module and the charging post are further described with reference to the following detailed description and the accompanying drawings.

Referring to fig. 1, a charging pile 2000 according to a first embodiment of the present application is a schematic view of an application scenario when a new energy vehicle 1000 is charged. When the new energy automobile 1000 charges, generally, the new energy automobile 1000 can be charged through the charging pile 2000. Similar to the relationship between a gas station and a conventional fuel automobile, the charging pile 2000 can "charge" the new energy automobile 1000, that is, can charge the new energy automobile 1000.

More specifically, the new energy vehicle 1000 is driven by electric energy, and fig. 1 exemplarily shows a system structure diagram of the new energy vehicle 1000. As shown in fig. 1, the new energy automobile 1000 includes a power distribution unit 100, a low-voltage load 200, a power battery 300, an electric drive system 400, and wheels 500.

The power battery 300 is a large-capacity and high-power storage battery. The low-voltage load 200 is a functional circuit or an on-vehicle device inside a vehicle (new energy vehicle 1000), and the rated voltage of the low-voltage load 200 is much lower than the rated voltage of the power battery 300. For example, the low-voltage load 200 may include, but is not limited to, a lead-acid battery inside the new energy vehicle 1000, a car radio, a car navigator, and the like, which are not listed in the embodiments of the present application.

When the new energy automobile 1000 runs, the power battery 300 can drive the electric drive system 400 to work, and the electric drive system 400 further drives the wheels 500 to rotate, so that the vehicle moves. In addition, the power battery 300 may also supply power to the low-voltage load 200 through the power distribution unit 100, or may also supply power to an external load (such as another new energy vehicle 1000) of the new energy vehicle 1000 through the power distribution unit 100.

As shown in fig. 1, the charging pile 2000 mainly includes a functional circuit 600 and a charging gun 700. The functional circuit 600 is coupled to a power grid (not shown) at one end and to the charging gun 700 at the other end by a cable. Generally, the functional circuit 600 may use the power grid as an ac power source, receive ac power provided by the power grid, and convert the received ac power into charging power adapted to the new energy vehicle 1000. An operator can insert the charging gun 700 into a charging socket of the new energy automobile 1000, so that the charging gun 700 is coupled with the power distribution unit 100 inside the new energy automobile 1000, and the functional circuit 600 of the charging pile 2000 can further provide charging electric energy for the power distribution unit 100 through the charging gun 700.

The functional circuit 600 includes a power device module 601 and functional electronics 603. The power device module 601 is used for realizing the electrical function of the charging pile 2000. Functional electronics 603 includes capacitive, inductive, etc. electronics. The power device module 601 is connected with the functional electronic devices 601 to form a circuit capable of providing electric energy for the charging gun 700.

Referring to fig. 2, the power device module 601 includes a first heat sink 11, a second heat sink 12, a power device 13, a heat conductive insulating member 14, and a molding compound 15. In the present embodiment, the first heat sink 11 and the second heat sink 12 are metal heat sinks. The number of power devices 13 is at least two. At least one power device 13 is fixedly attached to the first heat sink 11 through a heat conductive insulator 14, and at least one power device 13 is fixedly attached to the first heat sink 11 through the heat conductive insulator 14. The power device 13 is used for performing power conversion processing including frequency conversion, voltage conversion, current conversion, power management and the like. The power device 13 and the heat conducting insulating part 14 are both embedded in the colloid 15, and are used for preventing dust, impurities and the like from being accumulated around the power device 13 and reducing the influence of the dust on the creepage distance. The heat conducting insulator 14 is used for electrically insulating and isolating the first heat sink 11 and the power device 13, and conducting heat generated by the power device 13 to the first heat sink 11 for heat dissipation. The heat conducting insulator 14 is used for electrically insulating and isolating the second heat sink 12 from the power device 13, and conducting heat generated by the power device 13 to the second heat sink 12 for heat dissipation. It can be understood that, the power device 13 and the heat conducting and insulating member 14 are both embedded in the colloid 15, which means that at least a part of the power device 13 and at least a part of the heat conducting and insulating member 14 are wrapped and/or covered by the colloid 15.

It is understood that if the first heat sink 11 and the second heat sink 12 are made of insulating materials, the heat conducting insulating member 14 may be omitted, the first heat sink 11 may be directly attached to the power device 13, and the second heat sink 12 may be directly attached to the power device 13.

Each of the first heat sink 11 and the second heat sink 12 includes a first heat dissipating unit 101 and a second heat dissipating unit 103. The first heat dissipation unit 101 includes a first support portion 111 and a plurality of first heat dissipation fins 112. The second heat dissipation unit 103 includes a second support portion 113 and a plurality of second heat dissipation fins 117. The first supporting portion 111 includes a first surface 1113 and a second surface 1115 opposite to each other. The second support portion 113 includes a third surface 1131 and a fourth surface 1133 disposed oppositely. The third surface 1131 is fixedly connected to one end of the first supporting portion 111. A plurality of first heat dissipating fins 112 are disposed protruding from the first surface 1113 and extend in a direction away from the second surface 1115 (e.g., laterally in fig. 2). A first gap 1120 is formed between adjacent first heat dissipation fins 112. A plurality of second heat dissipating fins 117 protrude from the fourth surface 1133 and extend in a direction away from the third surface 1131 (e.g., a longitudinal direction or a vertical direction in fig. 2). The second gaps 1170 are formed between the adjacent second heat dissipation fins 117. The extending direction of the first heat radiating fins 112 is different from the extending direction of the second heat radiating fins 117. In other words, the first heat radiation fins 112 and the second heat radiation fins 117 are oriented differently.

In this embodiment, the third surface 1131 and the first surface 1113 define a first groove 1130, and the plurality of first heat dissipation fins 112 are accommodated in the first groove 1130. Since the first heat dissipation fins 112 are accommodated in the first grooves 1130, the first heat dissipation fins 112 are protected, so that the possibility of deformation of the first heat dissipation fins 112 is reduced. The extending direction of the first heat dissipating fins 112 is perpendicular to the extending direction of the first support 111, and the extending direction of the second heat dissipating fins 117 is the same as the extending direction of the first support 111. The ends of all the first heat dissipating fins 112 away from the first surface 1113 are flush with each other and are located on a plane parallel to the extending direction of the first supporting portion 111. The ends of all the second heat dissipating fins 117 remote from the fourth surface 1133 are flush and lie in the same plane perpendicular to the first support section 111.

It is understood that in other embodiments, the ends of the plurality of first cooling fins 112 distal to the first surface 1113 are not flush.

It is understood that in other embodiments, the ends of the plurality of second fins 117 distal from the fourth surface 1133 are not flush.

The second surfaces 1115 of the first heat sink 11 and the second heat sink 12 are disposed opposite to each other and enclose an accommodating space 105 for accommodating the power device 13, the heat-conducting insulator 14, and the encapsulant 15. A glue filling channel 107 is also formed between the first heat sink 11 and the second heat sink 12 for filling glue. In the present embodiment, the glue filling channel 107 is formed between the second heat dissipation fin 117 of the first heat sink 11 closest to the second heat sink 12 and the second heat dissipation fin 117 of the second heat sink 12 closest to the first heat sink 11. The potting passage 107 communicates with the housing space 105 in the extending direction of the second heat radiation fins 117. In other words, the potting channel 107 is formed between the two second heat dissipation fins 117 of the first heat sink 11 and the second heat sink 12 that are closest to each other.

Because the orientations of the first heat dissipation fins 112 and the second heat dissipation fins 117 are different, the glue filling channel 107 is communicated with the accommodating space 105 in the extending direction of the second heat dissipation fins 117, on one hand, the possibility that the glue enters the second gap 1170 to cause the blockage of the second heat dissipation fins 117 when the glue filling head extends into the glue filling channel 107 for glue filling is reduced, and therefore the heat dissipation efficiency of the power device module 601 is improved; on the other hand, the possibility that the second heat dissipation fins 117 are deformed by force during taking and the like of the power device module 601 is reduced, for example, the possibility that the potting head touches the second heat dissipation fins 117 is reduced.

In this embodiment, the third surface 1131 and the second surface 1115 form a second groove 1140 to increase the space of the accommodating space 105. The aperture of the accommodating space 105 is larger than that of the glue filling channel 107. It is understood that in other embodiments, the third surface 1131 and the first surface 1113 may not enclose the first groove 1130.

In the present embodiment, the number of the power devices 13 is at least two (only two power devices are exemplarily shown in fig. 2). The power device 13 is housed in the power device 13 and includes a base 131 and pins 133. The substrate 131 and the second surface 1115 are attached to each other through the thermal conductive insulating member 14, so that heat is transferred to the first heat sink 11 or the second heat sink 12 through the thermal conductive insulating member 14 for heat dissipation. The base 131 is embedded in the colloid 15. The pins 133 are at least partially exposed from the gel 15 to facilitate electrical connection with other functional electronics 603 or devices.

More specifically, the substrate 131 includes a first end surface 1311, a second end surface 1313, a first side surface 1315, and a second side surface 1317. The first end face 1311 is disposed opposite the second end face 1313. The first side 1315 is disposed opposite the second side 1317. The first end surface 1311 is provided on the base 131 on the side closer to the second support 113. The first side surface 1315 is connected between the first end surface 1311 and the second end surface 1313.

One side of the thermal conductive and insulating member 14 is fixed to the second surface 1115, and the other side of the thermal conductive and insulating member 14 facing away from the second surface 1115 is fixed to the first side 1315. That is, the thermal conductive insulator 14 is sandwiched between the first side surface 1315 and the second surface 1115, so that the substrate 131 is fixedly attached to the second surface 1115. The second side surface 1317 is connected between the first end surface 1311 and the second end surface 1313. The pins 133 are fixed to the second end surface 1313 of the base 131 and extend in a direction away from the third surface 1131. The pins 133 are used to electrically connect with other functional electronics 603. The substrate 131 includes an exposed metal portion. The metal portion of the base 131 is embedded in the colloid 15.

It is understood that the thermal conductive insulator 14 may not be fixed to the first heat sink 11, the thermal conductive insulator 14 may not be fixed to the power device 13, the thermal conductive insulator 14 may electrically insulate the first heat sink 11 from the power device 13, and the thermal conductive insulator 14 may electrically insulate the second heat sink 12 from the power device 13. It should be understood that the application is not limited to the application of the power device module 601 only to the charging pile 2000, and in other embodiments, the power device module 601 may also be applied to other devices or apparatuses, for example, household appliances.

It is to be understood that the present application is not limited to the structure of the first heat sink 11 and the second heat sink 12, and in other embodiments, each of the first heat sink 11 and the second heat sink 12 includes the first heat dissipation unit 101 and the second heat dissipation unit 103. An accommodation space 105 is formed between the first heat sink 11 and the first heat dissipation unit 101 of the second heat sink 12. A glue filling channel 107 is formed between the first heat sink 11 and the second heat dissipation unit 103 of the second heat sink 12. The first heat dissipation unit 101 includes a plurality of first heat dissipation fins 112. The second heat dissipation unit 103 includes a plurality of second heat dissipation fins 117. The extending direction of the first heat radiating fins 112 is different from the extending direction of the second heat radiating fins 117. The potting passage 107 communicates with the accommodating space 105 in the extending direction of the second heat dissipating fin 117, the molding compound 15 is accommodated in the accommodating space 105, and the power device 13 is embedded in the molding compound 15.

Referring to fig. 3 and fig. 4, a power device module provided in the second embodiment of the present disclosure has a structure substantially similar to that of the power device module provided in the first embodiment, except that the power device module 601 provided in the second embodiment of the present disclosure further includes an auxiliary heat sink 17 for performing auxiliary heat dissipation on the power device 13.

The auxiliary heat sink 17 includes a first heat conduction portion 171 and a second heat conduction portion 173 connected to each other. The first heat conduction portion 171 is connected to the second side 1317 of the base 131 and embedded in the gel 15. The second heat conduction portion 173 exposes the gel 15 and extends into the gel filling channel 107. The first heat conduction portion 171 conducts heat of the power device 13 to the second heat conduction portion 173, and the second heat conduction portion 173 transfers the heat to the outside of the colloid 15 for heat dissipation, so as to improve the heat dissipation efficiency and the heat dissipation effect of the power device module 601.

The first side 1315 of the power device 13 conducts heat to the first heat sink 11 or the second heat sink 12 through the heat conducting insulating member 14 for heat dissipation, and the second side 1317 of the power device 13 transfers heat to the outside of the colloid 15 through the auxiliary heat sink 17 for heat dissipation, that is, the power device 13 can achieve double-sided heat dissipation through the first heat sink 11 or the second heat sink 12 and the auxiliary heat sink 17, which is beneficial to improving the heat dissipation efficiency and the heat dissipation effect of the power device module 601.

In the present embodiment, the number of the power devices 13 is at least two, and the number of the auxiliary heat sinks 17 is at least one. The first heat conduction portion 171 of each auxiliary heat sink 17 is sandwiched between the base bodies 131 of the two power devices 13 in the arrangement direction of the first support portion 111 of the first heat sink 11 and the first support portion 111 of the second heat sink 12. In the present embodiment, the first heat conduction portion 171 is fixed to the second side 1317 of the base 131 of one power device 13. The first heat conduction portion 171 is embedded in the colloid 15. The second heat conduction portion 173 exposes the gel 15 and extends into the gel filling channel 107.

In addition, each auxiliary heat sink 17 is sandwiched between two power devices 13, that is, one auxiliary heat sink 17 can perform auxiliary heat dissipation for two power devices 13, so that the structural compactness of the power device module 601 is improved while the heat dissipation of the power device module 601 is improved.

In the present embodiment, the first heat conduction portion 171 and the second heat conduction portion 173 are bent and connected. The first heat conduction portion 171 is attached to the second side surface 1317, and the end surface of the second heat conduction portion 173 close to the first heat conduction portion 171 is located on the first end surface 1311 side of the base 131.

It is understood that one auxiliary heat sink 17 may be connected to only one power device 13, and one auxiliary heat sink 17 may also be connected to two or more power devices 13.

It is understood that the auxiliary heat sink 17 may directly contact or indirectly contact the second side 1317 of the power device 13 through a thermally conductive material.

It is to be understood that the present application does not limit the number of the auxiliary heat sinks 17, and the present application does not limit the number of the power devices 13. The number of the power devices 13 may be one, the number of the auxiliary heat sinks 17 may be one, and the auxiliary heat sinks 17 may be capable of assisting the power devices 13 in dissipating heat.

Referring to fig. 5, a power device module provided in a third embodiment of the present application has a structure substantially similar to that of the power device module provided in the first embodiment, the power device 13 is disposed between the first heat sink 11 and the second heat sink 12, and the power device 13 is embedded in the colloid 15. The difference is that in the power device module 601 provided in the third embodiment of the present application, an included angle between a direction of the first end of the first supporting portion 111 toward the second end of the first supporting portion 111 and an extending direction of the first heat dissipation fin 112 is smaller than 90 degrees, in other words, the first heat dissipation fin 112 is obliquely disposed relative to the first supporting portion 111, so that flexibility of arrangement of the heat dissipation fins is improved. The first end of the first supporting portion 111 is an end of the first supporting portion 111 close to the second supporting portion 113.

The third surface 1131 and the first surface 1113 define a first recess 1130. Each of the first heat sink 11 and the second heat sink 12 further includes a third heat dissipating fin 118, and the third heat dissipating fin 118 is protruded from the third surface 1131 and is located in the first groove 1130. The extending direction of the third heat dissipation fins 118 is the same as the extending direction of the first heat dissipation fins 112. The first heat dissipating fins 112 and the third heat dissipating fins 118 have different lengths. The ends of all the first heat dissipating fins 112 remote from the first surface 1113 are flush with the ends of the third heat dissipating fins 118 remote from the third surface 1131. All the ends of the first heat dissipating fins 112 away from the first surface 1113 and the ends of the third heat dissipating fins 118 away from the third surface 1131 are located on a plane parallel to the extending direction of the first supporting portion 111.

Since the third surface 1131 is also provided with the third heat dissipation fins 118, the heat dissipation efficiency and the heat dissipation effect of the first heat sink 11 and the second heat sink 12 are improved.

It is understood that the ends of the first heat dissipating fins 112 distal from the first surface 1113 may not be flush with the ends of the third heat dissipating fins 118 distal from the third surface 1131.

It is understood that at least one of the first heat sink 11 and the second heat sink 12 further includes a third heat dissipating fin 118.

Referring to fig. 6, a power device module according to a fourth embodiment of the present disclosure has a structure substantially similar to that of the power device module according to the third embodiment, the power device 13 is buried in the colloid 15, and the third heat dissipation fin 118 is protruded on the third surface 1131 and is located in the first groove 1130. The difference is that in the power device module 601 provided in the fourth embodiment of the present invention, at least one of the plurality of second heat dissipation fins 117 is different from the lengths of the remaining second heat dissipation fins 117, the number of the third heat dissipation fins 118 is at least two, and at least one of the at least two third heat dissipation fins 118 is different from the lengths of the remaining third heat dissipation fins 118. In other words, the plurality of second heat dissipating fins 117 are unequal-length fins, and at least two third heat dissipating fins 118 are unequal-length fins, so as to improve the structural flexibility of the first heat sink 11 and the second heat sink 12. The number of the third heat dissipation fins 118 that can be disposed on the third surface 1131 is increased, and the heat dissipation efficiency and the heat dissipation effect of the first heat sink 11 and the second heat sink 12 are further improved.

In the present embodiment, the second supporting portion 113 has a bent structure, and at least a portion of the second supporting portion 113 is inclined with respect to a direction perpendicular to the first supporting portion 111.

It should be understood that expressions such as "include" and "may include" that may be used in the present application indicate the presence of the disclosed functions, operations, or constituent elements, and do not limit one or more additional functions, operations, and constituent elements. In the present application, terms such as "including" and/or "having" may be interpreted as indicating specific characteristics, numbers, operations, constituent elements, components, or combinations thereof, but may not be interpreted as excluding the existence or addition possibility of one or more other characteristics, numbers, operations, constituent elements, components, or combinations thereof.

Further, in this application, the expression "and/or" includes any and all combinations of the associated listed words. For example, the expression "a and/or B" may include a, may include B, or may include both a and B.

In the present application, expressions including ordinal numbers such as "first" and "second" and the like may modify the respective elements. However, such elements are not limited by the above expression. For example, the above description does not limit the order and/or importance of the elements. The above expressions are only used to distinguish one element from another. For example, the first user equipment and the second user equipment indicate different user equipments, although both the first user equipment and the second user equipment are user equipments. Similarly, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present application.

When a component is referred to as being "connected" or "accessed" to other components, it should be understood that: not only does the component connect or tap directly to other components, but there may be another component between the component and the other components. On the other hand, when components are referred to as being "directly connected" or "directly accessing" other components, it is understood that no components exist therebetween.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (11)

1. A power device module is characterized by comprising a first radiator, a second radiator, a power device and a colloid; the first radiator and each of the second radiators comprise a first radiating unit and a second radiating unit, an accommodating space is formed between the first radiating units of the first radiator and the second radiator, a glue filling channel is formed between the first radiator and the second radiating units of the second radiator, the first radiating unit comprises a plurality of first radiating fins, the second radiating unit comprises a plurality of second radiating fins, the extending direction of the first radiating fins is different from that of the second radiating fins, the glue filling channel is communicated with the accommodating space in the extending direction of the second radiating fins, the colloid is accommodated in the accommodating space, and the power device is embedded in the colloid.

2. The power device module of claim 1, wherein the first heat dissipation unit further comprises a first support portion, the second heat dissipation unit further comprises a second support portion, the first support portion comprises a first surface and a second surface which are oppositely arranged, the second support portion comprises a third surface and a fourth surface which are oppositely arranged, the third surface is fixedly connected with one end of the first support portion, the plurality of first heat dissipation fins are convexly arranged on the first surface and extend in a direction away from the second surface, the plurality of second heat dissipation fins are convexly arranged on the fourth surface and extend in a direction away from the third surface, and the second surfaces of the two heat sinks are oppositely arranged and enclose the receiving space; and the glue filling channel is formed between the second radiating fin of the first radiator, which is closest to the second radiator, and the second radiating fin of the second radiator, which is closest to the first radiator.

3. The power device module of claim 2, wherein the power device comprises a base and pins, the base is embedded in the encapsulant, the pins are fixed to the base and extend in a direction away from the third surface, and at least a portion of the pins are exposed from the encapsulant.

4. The power device module of claim 2, wherein the first heat sink and the second heat sink are metal heat sinks, the power device module further comprises a heat conducting insulating member embedded in the glue, one surface of the heat conducting insulating member is fixed on the second surface, and the power device is fixed on the surface of the heat conducting insulating member, which faces away from the second surface.

5. The power device module according to any one of claims 1 to 4, further comprising an auxiliary heat sink, wherein the auxiliary heat sink includes a first heat conduction portion and a second heat conduction portion, the first heat conduction portion and the second heat conduction portion are connected, the first heat conduction portion is located in the accommodating space and is attached to the power device, the first heat conduction portion is embedded in the glue body, and the second heat conduction portion is exposed out of the glue body and extends into the glue filling channel.

6. The power device module according to claim 5, wherein the number of the auxiliary heat spreaders is at least one, the number of the power devices is at least two, and the first heat conduction portion of each of the auxiliary heat spreaders is interposed between the two power devices in an arrangement direction of the first supporting portion of the first heat spreader and the first supporting portion of the second heat spreader.

7. The power device module as claimed in any one of claims 2 to 4, wherein the third surface and the first surface define a first groove, the plurality of first heat dissipation fins are received in the first groove, and the extension direction of the second heat dissipation fins is the same as the extension direction of the first support portion.

8. The power device module of claim 7, wherein at least one of the first heat sink and the second heat sink further comprises a third heat sink fin, the third heat sink fin protrudes from the third surface and is located in the first groove, and an extending direction of the third heat sink fin is the same as an extending direction of the first heat sink fin.

9. The power device module according to any one of claims 2 to 4, wherein the third surface and the second surface define a second groove, and an aperture of the accommodating space is larger than an aperture of the glue filling channel.

10. The power device module as claimed in claim 2, wherein an included angle between a direction of the first end of the first support portion toward the second end of the first support portion and an extending direction of the first heat dissipation fin is not greater than 90 degrees, and the first end is an end of the first support portion close to the second support portion.

11. A charging pile, characterized by comprising a functional circuit and a charging gun, wherein the functional circuit comprises the power device module according to any one of claims 1-10, and the functional circuit is used for supplying power to the charging gun.

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