CN216054617U

CN216054617U - Silicon wafer unlocking mechanism

Info

Publication number: CN216054617U
Application number: CN202121791277.2U
Authority: CN
Inventors: 李宏; 方勇健; 景健; 张江水; 王俊; 张广犬; 黄游; 刘哲; 朱肖营
Original assignee: Hangzhou Zhongwei Photoelectricity Co Ltd
Current assignee: Hangzhou Zhongwei Photoelectricity Co Ltd
Priority date: 2021-08-02
Filing date: 2021-08-02
Publication date: 2022-03-15
Anticipated expiration: 2031-08-02

Abstract

The utility model relates to the technical field of photovoltaics, in particular to a silicon wafer unlocking mechanism, which comprises: a support; an unlocking member for engaging the locking assembly; the driving assembly is arranged on the bracket; wherein, drive assembly with the deblocking piece is connected, drive assembly is used for the drive the deblocking piece is close to locking assembly, so that the deblocking piece with locking assembly cooperates, and drives the deblocking piece unblock locking assembly. The silicon chip unlocking mechanism has the advantages that: the automation of locking and unlocking the silicon wafer can be realized, the labor cost is reduced, and the working efficiency is improved; the difficulty of locking and unlocking the silicon wafer is reduced, and the silicon wafer is timely locked or unlocked, so that the silicon wafer can be accurately matched with the process flow of the wafer and the inserting piece after the silicon wafer is transferred, the scheduling difficulty of the whole process flow is reduced, and the scheduling time is shortened, and the working efficiency is further improved.

Description

Silicon wafer unlocking mechanism

Technical Field

The utility model relates to the technical field of photovoltaics, in particular to a silicon wafer unlocking mechanism.

Background

In the production process of the silicon wafer, firstly, the silicon rod is cut into the silicon wafer by the wire cutting machine, the silicon wafer is adhered on the crystal support through the resin plate at the moment, in order to realize the automatic degumming of the silicon wafer after wire cutting, the crystal support and the silicon wafer on the crystal support need to be transported to a degumming machine for degumming so as to separate the silicon wafer from the crystal support, and then the separated silicon wafer is transported to a sheet inserting machine for slicing and sheet inserting.

In the production process, the silicon wafers need to be transferred and conveyed for many times through the silicon wafer turnover mechanism, and the silicon wafers are always clamped by the locking assembly in the material frame of the silicon wafer turnover mechanism, so that the silicon wafers are prevented from toppling over. However, in the slicing step, the silicon wafer must be released and the silicon wafer must be released from the holding by the locking unit.

Therefore, a silicon wafer unlocking mechanism capable of realizing automatic and quick unlocking of the silicon wafer turnover mechanism is needed to be arranged.

SUMMERY OF THE UTILITY MODEL

In view of the above, there is a need to provide a silicon wafer unlocking mechanism that saves labor cost, has a simple structure, and can realize automatic unlocking of a silicon wafer transferring mechanism.

The silicon wafer unlocking mechanism is used for unlocking and releasing the silicon wafer on the silicon wafer turnover mechanism; the silicon wafer turnover mechanism comprises a material frame and a locking assembly, wherein the material frame is used for bearing a silicon wafer, and the locking assembly is arranged on the material frame and used for clamping the silicon wafer; the silicon chip unlocking mechanism comprises: a support; and an unlocking member for engaging the locking assembly; the driving assembly is arranged on the bracket; wherein, drive assembly with the deblocking piece is connected, drive assembly is used for the drive the deblocking piece is close to locking assembly, so that the deblocking piece with locking assembly cooperates, and drives the deblocking piece unblock locking assembly.

In one embodiment, the drive assembly comprises a first drive assembly and a second drive assembly; the first driving assembly is arranged on the support or the second driving assembly, is connected with the unlocking piece and is used for driving the unlocking piece to move along a first direction so as to enable the unlocking piece to be close to the locking assembly or drive the unlocking piece to unlock the locking assembly; the second driving assembly is arranged on the bracket and used for driving the unlocking piece to move along a second direction so that the unlocking piece is close to the locking assembly and is matched with the locking assembly; wherein, during the unblock, second drive assembly drives along the second direction unblock piece removes, so that unblock piece with the locking Assembly butt, first drive assembly drives unblock piece removes along the motion of first direction, so that unblock piece unblock locking assembly.

In one embodiment, the first driving assembly comprises a sliding block, a second driving piece and a second connecting piece, wherein the second driving piece is used for driving the sliding block to move along the first direction; the unlocking piece is arranged on the sliding block; the second connecting piece is connected with the second driving component, the second driving piece is installed on the second connecting piece, and the second driving component is used for driving the second connecting piece and the second driving piece to move along the second direction.

In one embodiment, the second driving assembly is provided as a second air cylinder, and a piston rod of the second air cylinder is connected with the unlocking piece or the first driving assembly; the unlocking member is moved in a second direction by a piston rod of the second cylinder.

In one embodiment, the drive assembly comprises: the first driving assembly is arranged on the support and connected with the unlocking piece and used for driving the unlocking piece to move along a first direction so as to enable the unlocking piece to be close to the locking assembly or drive the unlocking piece to unlock the locking assembly; the guide assembly is arranged on the bracket; the unlocking piece is driven by the driving assembly to move along the first direction, the unlocking piece moves towards the locking assembly along the guide groove, and the other end of the unlocking piece is abutted to the locking assembly; wherein, during the unblock, first drive assembly drives along the first direction unblock piece removes, when removing unblock piece is followed the guide way orientation locking Assembly is close to and the butt, first drive assembly drives unblock piece removes along the first direction motion, so that unblock piece unblock locking assembly.

In one embodiment, the guide assembly comprises a guide plate and a roller; the guide plate is provided with the guide groove, and the guide groove comprises a first guide section and a second guide section; the first guide section extends along the first direction, one end of the second guide section is communicated with the first guide section, the other end of the second guide section extends along the second direction, and the second guide section is obliquely arranged along the direction departing from the first direction and the direction departing from the material frame; the gyro wheel with the unblock piece is kept away from the one end of material frame is connected, just the gyro wheel slide set up in the guide way.

In one embodiment, the first drive assembly comprises a first drive member and a first connector; the first driving piece is mounted on the support and connected with the first connecting piece and can drive the first connecting piece to move along the first direction; the first connecting piece is connected with the unlocking piece.

In one embodiment, the first drive member is provided as a first cylinder; the piston rod of the first cylinder is connected with the first connecting piece, and the extending direction of the piston rod of the first cylinder is consistent with the first direction.

In one embodiment, the first drive assembly further comprises a guide cylinder; the guide cylinder is arranged on the first connecting piece; an installation channel extending along the second direction is formed in the guide cylinder, and the unlocking piece penetrates through the installation channel and can slide along the installation channel.

In one embodiment, the unlocking piece comprises a connecting part and a bending part, the connecting part is connected with the driving assembly, and the bending part is connected with the connecting part; the driving assembly drives the unlocking piece to be close to the locking assembly, so that the bending part is matched and abutted with the locking assembly; when the material frame is unlocked, the driving assembly drives the bending part to move, so that the bending part and the locking assembly are unlocked, and the silicon wafer in the material frame is released; the driving assembly drives the bending part to move in the direction opposite to the unlocking direction, so that the locking assembly clamps the silicon wafer in the material frame.

Compared with the prior art, the silicon wafer unlocking mechanism provided by the utility model has the following beneficial effects:

the silicon wafer unlocking mechanism comprises an unlocking piece and a driving component, wherein the unlocking piece is automatically driven by the driving component to move close to the locking component and be matched with the locking component, and then the unlocking piece drives the locking component to unlock and release the locking silicon wafer; or the driving component drives the unlocking component to move along the direction opposite to the unlocking direction so that the locking component locks the silicon wafer; therefore, the automation of locking and unlocking the silicon wafer is realized, the labor cost is reduced, and the working efficiency is improved; the difficulty of locking and unlocking the silicon wafer is reduced, and the silicon wafer is timely locked or unlocked, so that the silicon wafer can be accurately matched with the process flow of the wafer and the inserting piece after the silicon wafer is transferred, the scheduling difficulty of the whole process flow is reduced, and the scheduling time is shortened, and the working efficiency is further improved.

And, the silicon chip release mechanism that this application provided only comprises unlocking piece and drive assembly, and the structure is extremely simple, and the structure volume is less, is particularly useful for the less application scene of the space volume of piecemeal inserted sheet department.

Drawings

Fig. 1 is a schematic view of a silicon wafer unlocking mechanism in a second embodiment of the present invention.

Fig. 2 is a schematic diagram of a silicon wafer unlocking mechanism in a third embodiment of the present invention.

Fig. 3 is a schematic diagram of a silicon wafer transfer mechanism in the prior art.

Fig. 4 is a schematic diagram of a driving assembly on a silicon wafer transfer mechanism in the prior art.

In the figure, 100, a silicon wafer unlocking mechanism; 10. a support; 20. unlocking the lock; 21. a connecting portion; 22. a bending part; 30. a drive assembly; 31. a first drive assembly; 311. a first driving member; 312. a first connecting member; 313. a guide cylinder; 314. installing a channel; 315. a slider; 316. a second driving member; 317. a second connecting member; 32. a second drive assembly; 33. a guide assembly; 331. a guide plate; 332. a guide groove; 3321. a first guide section; 3322. a second guide section; 333. a roller; 34. a piston rod; 200. a silicon wafer turnover mechanism; 40. a clamping assembly; 41. a clamping member; 42. a rotating shaft; 50. a driving module; 51. a drive block; 52. a slide rail; 53. a connecting rod assembly; 60. and (7) material frame.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

It will be understood that when an element is referred to as being "mounted on" another element, it can be directly mounted on the other element or intervening elements may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. When an element is referred to as being "secured to" another element, it can be directly secured to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "or/and" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 3 and 4, the silicon wafer transferring mechanism 200 includes a material frame 60 and a locking assembly, the material frame 60 is used for carrying and transferring silicon wafers, and the locking assembly is disposed on the material frame. When the silicon wafers are transported, the silicon wafers are easy to incline, and a plurality of silicon wafers are easy to mutually extrude when inclined, so that the silicon wafers are cracked or subfissure, and the quality and the yield of the silicon wafers are seriously influenced. Therefore, the silicon wafers in the material frame are clamped through the locking assembly, so that the silicon wafers are effectively prevented from falling and being extruded mutually.

However, in the dicing step, the wafer transfer mechanism 200 transports the wafer to the dicing station, and at this time, the wafer must be released to release the clamping of the silicon wafer by the lock assembly. Therefore, the silicon wafer unlocking mechanism 100 capable of automatically and quickly unlocking the silicon wafer turnover mechanism 200 is provided.

Referring to fig. 1 and fig. 2, the silicon wafer unlocking mechanism 100 provided by the present invention is used for unlocking and releasing a silicon wafer on a silicon wafer turnover mechanism 200; the silicon wafer unlocking mechanism 100 includes: a support 10; an unlocking member 20 for engaging the locking assembly; a driving assembly 30 mounted on the bracket 10; wherein, drive assembly 30 is connected with deblocking piece 20, and drive assembly 30 is used for driving deblocking piece 20 to be close to locking assembly to make deblocking piece 20 and locking assembly cooperation, and drive deblocking piece 20 unblock locking assembly.

The unlocking piece 20 is automatically driven by the driving component 30 to move close to the locking component and is matched with the locking component, and then the unlocking piece 20 drives the locking component to unlock and release the silicon wafer; or the driving component 30 drives the unlocking component 20 to move along the direction opposite to the unlocking direction, so that the locking component locks the silicon wafer; therefore, the automation of locking and unlocking the silicon wafer is realized, the labor cost is reduced, and the working efficiency is improved; the difficulty of locking and unlocking the silicon wafer is reduced, and the silicon wafer is timely locked or unlocked, so that the silicon wafer can be accurately matched with the process flow of the wafer and the inserting piece after the silicon wafer is transferred, the scheduling difficulty of the whole process flow is reduced, and the scheduling time is shortened, and the working efficiency is further improved.

In addition, the silicon wafer unlocking mechanism 100 provided by the application only comprises the unlocking piece 20 and the driving component 30, is extremely simple in structure and small in structure volume, and is particularly suitable for application scenes with small space volumes at the wafer separation and insertion pieces.

The present application takes a silicon wafer transfer mechanism 200 as an example, and specifically describes an unlocking process of the silicon wafer unlocking mechanism 100. It should be emphasized that the silicon wafer unlocking structure provided by the present application is not limited to be applied to the silicon wafer circulation mechanism 200 illustrated herein, and is also applicable to other types of silicon wafer circulation mechanisms 200.

In one embodiment of the prior art, referring to fig. 3 and 4, the wafer transfer mechanism 200 comprises a frame 60 and a locking assembly, which generally comprises at least one set of clamping assemblies 40 and a driving module 50; each group of clamping assemblies 40 comprises two oppositely arranged rotating shafts 42 and two oppositely arranged clamping pieces 41, and the two rotating shafts 42 are rotatably connected with the material frame; the two clamping pieces 41 are respectively and correspondingly arranged on the two rotating shafts 42; each clamping piece 41 can rotate along with the corresponding rotating shaft 42, so that the two clamping pieces 41 which are arranged oppositely move oppositely and clamp the silicon wafer in the material frame; the driving module 50 is used for driving the two clamping members 41 in each group of clamping assemblies 40 to move towards or away from each other so as to lock or release the silicon wafers in the material frame.

With reference to fig. 3 and 4, the driving module 50 specifically includes a driving block 51, a sliding rail 52 and two sets of connecting rod assemblies 53, wherein one end of each set of connecting rod assemblies 53 is hinged to the corresponding rotating shaft 42, and the other end is connected to the driving block 51; the driving block 51 is arranged in the slide rail 52 and can slide along the slide rail 52, and when the driving block 51 slides along the slide rail 52, the driving block drives the two groups of connecting rod assemblies 53 to move, so that the connecting rod assemblies 53 drive the corresponding rotating shafts 42 to rotate, and the corresponding clamping members 41 are driven to move towards or away from each other, thereby realizing locking clamping or unlocking release of the silicon wafers in the material frame. In the silicon wafer turnover mechanism 200, the slide rail 52 is arranged along the height direction of the material frame, and when the driving block 51 is set to be pressed downwards towards the bottom of the material frame along the height direction of the material frame, the driving block 51 drives the connecting rod assembly 53 to move, so that the connecting rod assembly 53 drives the two clamping pieces 41 to move back to realize the unlocking and releasing of the silicon wafer, and when the driving block 51 moves back to the bottom of the material frame along the height direction, the driving block 51 drives the two clamping pieces 41 to approach to each other to clamp the silicon wafer; of course, in other silicon wafer turnover mechanisms 200, the relationship between the moving direction of the driving block 51 and the locking state and the releasing state is not limited to the above, for example, when the driving block 51 moves back to the bottom of the material frame along the height direction, the driving block 51 drives the two clamping members 41 to move back and forth to unlock and release the silicon wafer.

The following embodiments specifically describe the structure of the silicon wafer unlocking mechanism 100 and the unlocking process corresponding to the above silicon wafer turnover mechanism 200.

Example 1

In the present embodiment, a silicon wafer unlocking mechanism 100 is provided, in which a driving assembly 30 is configured as a robot arm (not shown) having at least two degrees of freedom, and an unlocking member 20 is connected to one end of the robot arm. When the unblocking, mechanical arm drive unblocking piece 20 is close to locking Assembly to make unblocking piece 20 and the cooperation of drive block 51 butt, when the mechanical arm removed towards the material frame bottom along the direction of height of material frame, when driving unblocking piece 20 and pushing down drive block 51, two link assembly 53 movements of drive block 51 drive, and two link assembly 53 drive two corresponding clamping pieces 41 and move mutually away mutually, thereby realize the unblock of silicon chip. The motion direction of the mechanical arm unlocking is matched with the applied silicon wafer turnover mechanism 200.

Example 2

Referring to fig. 1 and 3 and fig. 4, in the silicon wafer unlocking mechanism 100 according to the present embodiment, the driving assembly 30 includes a first driving assembly 31 and a guiding assembly 33; the first driving assembly 31 is disposed on the bracket 10, and the first driving assembly 31 is connected to the unlocking piece 20 and is used for driving the unlocking piece 20 to move along a first direction, so that the unlocking piece 20 approaches the locking assembly or drives the unlocking piece 20 to unlock the locking assembly; the guide assembly 33 is arranged on the bracket 10; the guide assembly 33 is provided with a guide groove 332, the guide groove 332 extends towards the direction close to the unlocking piece 20, one end of the unlocking piece 20 is connected with the guide groove 332 in a sliding manner, and when the driving assembly 30 drives the unlocking piece 20 to move along the first direction, the unlocking piece 20 moves towards the locking assembly along the guide groove 332 so that the other end of the unlocking piece 20 abuts against the locking assembly; during the unblock, first drive assembly 31 drives unblock piece 20 along first direction and removes, and unblock piece 20 is close to and the butt towards locking Assembly along guide way 332 when removing, and first drive assembly 31 drives unblock piece 20 and continues to move along first direction motion to make unblock piece 20 unblock locking Assembly.

In the present embodiment, referring to fig. 1, the guide assembly 33 includes a guide plate 331 and a roller 333; the guide plate 331 is provided with a guide groove 332, and the guide groove 332 comprises a first guide section 3321 and a second guide section 3322; the first guide section 3321 extends along a first direction, one end of the second guide section 3322 is communicated with the first guide section 3321, and the other end of the second guide section 3322 extends along a second direction and is obliquely arranged along a direction deviating from the first direction and a direction deviating from the material frame; the roller 333 is connected to an end of the unlocking member 20 away from the material frame, and the roller 333 is slidably disposed in the guide groove 332. So set up, only remove along first direction through first drive assembly 31 drive unlocking piece 20, can drive unlocking piece 20 and accomplish the motion of first direction and second direction simultaneously, so only need set up a drive assembly, effectively simplify silicon chip release mechanism 100's structure, reduced silicon chip release mechanism 100's unblock energy consumption to reduction in production cost and application cost.

Wherein, the first direction and the second direction form an included angle.

Referring to fig. 3 and 4, in the embodiment, the first direction is preferably a direction toward the bottom of the material frame 60 along the height direction of the material frame 60, which is adapted to the silicon wafer turnover mechanism 200 of the above example; the second direction is a direction perpendicular to the first direction and toward the material frame 60, for example, the second direction is a horizontal direction perpendicular to the height direction of the material frame 60 and capable of approaching the material frame 60. In other embodiments, the specific orientation of the first direction and the second direction is not limited to the above, and the driving assembly 30 can drive the unlocking member 20 to approach the locking assembly for unlocking. In the embodiment, the guiding assembly 33 is located below the first driving assembly 31, and correspondingly, the first guiding section 3321 extends along the height direction of the material frame 60, and one end of the second guiding section 3322 away from the first guiding section 3321 extends along the direction toward the first driving assembly 31 and away from the material frame 60, so that the second guiding section 3322 is disposed obliquely. Of course, in other embodiments, the first and second directions are not limited to the orientations described above.

Referring to fig. 1, in the present embodiment, the first driving assembly 31 includes a first driving member 311 and a first connecting member 312; the first driving member 311 is installed on the bracket 10, and the first driving member 311 is connected to the first connecting member 312 and can drive the first connecting member 312 to move along a first direction; the first connecting member 312 is connected to the unlocking member 20 such that the first connecting member 312 moves to move the unlocking member 20 in the first direction. Of course, in other embodiments, the connection manner of the first driving member 311 and the unlocking member 20 is not limited to the above, and the specific structure of the first driving member 311 is not limited to the above

Referring to fig. 1, in the present embodiment, the first driving member 311 is configured as a first cylinder; the piston rod 34 of the first cylinder is connected to the first connecting member 312, and the extending direction of the piston rod 34 of the first cylinder is consistent with the first direction (i.e. the height direction of the material frame). In other embodiments, the specific structure of the first driving member 311 is not limited to the above-mentioned manner, for example, the first driving member 311 may be a linear module.

With continued reference to fig. 1, the first driving assembly 31 further includes a guiding cylinder 313; the guide cylinder 313 is mounted on the first link 312; the guide cylinder 313 has a mounting passage 314 formed therein and extending in the second direction, and the unlocking member 20 extends through the mounting passage 314 and is slidable along the mounting passage 314. By providing the guide cylinder 313 and the installation passage 314, the moving direction of the unlocking member 20 is guided, so that the unlocking member 20 moves in the second direction and engages with the driving block 51 in the locking assembly, thereby preventing the movement path of the unlocking member 20 from being deflected to cause unlocking failure.

In this embodiment, during unlocking, the piston rod 34 of the first cylinder is firstly extended to push the unlocking element 20 to move downwards along the first direction (i.e. downwards along the height direction of the material frame), and during the downward movement of the unlocking element 20, the roller 333 is subjected to a force applied by the second guide section 3322 along the second direction (i.e. towards the material frame and perpendicular to the first direction), so that the roller 333 and the unlocking element 20 connected with the roller 333 move towards the material frame along the installation channel 314 until the unlocking element 20 abuts against the top surface of the driving block 51; then, the piston rod 34 of the first cylinder continues to extend out to drive the roller 333 and the unlocking member 20 to move downwards along the first guide section 3321, so that the unlocking member 20 presses the driving block 51 downwards, the driving block 51 drives the connecting rod assembly 53 to move, the connecting rod assembly 53 drives the two clamping members 41 to move back and forth, unlocking of the locking assembly is achieved, and the clamping members 41 release silicon wafers. The moving direction of the unlocking piece 20 in the unlocking process is matched with the unlocking direction of the locking component in the silicon wafer turnover mechanism 200

Example 3

Referring to fig. 2-4, in the silicon wafer unlocking mechanism 100 provided in the present embodiment, the driving assembly 30 includes a first driving assembly 31 and a second driving assembly 32; the first driving assembly 31 is disposed on the bracket 10 or the second driving assembly 32, and the first driving assembly 31 is connected to the unlocking piece 20 and is used for driving the unlocking piece 20 to move along a first direction, so that the unlocking piece 20 approaches the locking assembly or drives the unlocking piece 20 to unlock the locking assembly; the second driving assembly 32 is arranged on the bracket 10 and used for driving the unlocking piece 20 to move along the second direction, so that the unlocking piece 20 is close to the locking assembly and is matched with the locking assembly; during unlocking, the second driving member 316 drives the unlocking member 20 to move along the second direction, so that the unlocking member 20 abuts against the locking assembly, and the first driving member 311 drives the unlocking member 20 to move along the first direction, so that the unlocking member 20 unlocks the locking assembly.

In this embodiment, the first direction is preferably a direction toward the bottom of the material frame along the height direction of the material frame; the second direction is a direction perpendicular to the first direction and toward the material frame, for example, the second direction is a horizontal direction perpendicular to the height direction of the material frame and capable of approaching the material frame. In other embodiments, the specific orientation of the first direction and the second direction is not limited to the above, and the driving assembly 30 can drive the unlocking member 20 to approach the locking assembly for unlocking.

Referring to fig. 2, in the present embodiment, the first driving assembly 31 includes a sliding block 315, a second driving member 316 and a second connecting member 317, wherein the second driving member 316 is used for driving the sliding block 315 to move along a first direction; the unlocking member 20 is mounted on the slider 315; the second connecting member 317 is connected to the second driving assembly 32, the second driving member 316 is mounted on the second connecting member 317, and the second driving assembly 32 is configured to drive the second connecting member 317 and the second driving member 316 to move along the second direction.

Wherein, in one embodiment, the second driving member 316 is a lead screw or slide rail 52.

Specifically, referring to fig. 2, the first driving assembly 31 is a linear module, and the linear module can be a linear module of a synchronous belt type, a ball screw type, or a linear motor type, which is commonly used in the prior art, and is not limited herein. And first drive assembly 31 establishes to linear module, and linear module is as a complete mechanism that independently carries out the operation, and the source obtains easily, assembles linear module and second drive assembly 32, and quick manufacturing produces the silicon chip release mechanism 100 that this application provided, and from this, the silicon chip release mechanism 100 that this application provided simple structure, the assembly degree of difficulty is lower to effectively reduce the cost of silicon chip release mechanism 100, be favorable to popularization and wide application. Of course, in other embodiments, the specific structure of the first driving assembly 31 is not limited to the above-mentioned manner, for example, the first driving assembly 31 may also adopt the structure shown in embodiment 2, and is not limited herein.

In one embodiment of the present application, second drive assembly 32 is configured as a second pneumatic cylinder, and piston rod 34 of the second pneumatic cylinder is connected to unlocking member 20 or first drive assembly 31; and the extending direction of the piston rod 34 of the second cylinder is consistent with the second direction (i.e. the height direction of the material frame), so as to drive the unlocking member 20 or the first driving assembly 31 to move close to the locking assembly along the second direction. Unlocking member 20 is moved in a second direction by plunger rod 34. In other embodiments, the specific structure of the second driving assembly 32 is not limited to the above, for example, the driving assembly 30 of the second driving assembly 32 may be a linear module.

Specifically, referring to fig. 2, in the present embodiment, in order to adapt to the linear module, the linear module is disposed on the second connecting member 317, the piston rod 34 of the second cylinder is connected to the second connecting member 317, one end of the unlocking member 20 is connected to the linear module, and the other end is used for unlocking the locking member. During the unblock, linear module drive unlocking piece 20 moves along the first direction near the drive block 51 among the locking Assembly, the piston rod 34 of second cylinder stretches out simultaneously, it removes towards the second direction to promote second connecting piece 317, thereby it removes to promote unlocking piece 20 on linear module and the linear module and be close to locking Assembly along the second direction, so that unlocking piece 20 supports with the drive block 51 top and leans on, linear module continues to move down after that, and then promote drive block 51 and drive link assembly 53 motion, thereby link assembly 53 drives two clamping pieces 41 and moves back to back, realize the unblock and release the silicon chip.

Of course, in other embodiments, the specific structure of the first driving assembly 31 may also be as described in embodiment 2, where the second cylinder is installed on the bracket 10, and the piston rod 34 of the second cylinder is connected to the unlocking member 20, and the unlocking member 20 is driven to cooperate with the driving block 51 and unlock the driving block through the joint motion of the first cylinder and the second cylinder.

Referring to fig. 2, the unlocking member 20 includes a connecting portion 21 and a bending portion 22, the connecting portion 21 is connected to the driving assembly 30, and the bending portion 22 is connected to the connecting portion 21; the driving component 30 drives the unlocking component 20 to approach the locking component, so that the bending part 22 is matched and abutted with the locking component; during unlocking, the driving assembly 30 drives the bending part 22 to move so as to unlock the locking assembly and release the silicon wafer in the material frame; the driving component 30 drives the bending part 22 to move in the direction opposite to the unlocking direction, so that the locking component clamps the silicon wafer in the material frame. The unlocking member 20 shown in fig. 2 is not limited to the present embodiment, and can be applied to embodiment 1, for example. In other embodiments, the specific structure of the unlocking member 20 is not limited to the above, such as the unlocking member 20 shown in fig. 1;

the process of unlocking or locking the locking assembly by the unlocking member 20 is specifically described in conjunction with the exemplary silicon wafer transfer mechanism 200.

When unlocking, firstly, the driving assembly 30 drives the unlocking piece 20 to move, so that the bending part 22 of the unlocking piece 20 is close to the driving block 51, the bending part 22 is positioned above the driving block 51, the projection of the bending part 22 and the driving block 51 in the height direction of the material frame is overlapped, and at the moment, the bending part 22 is abutted against the top of the driving block 51; then the driving component 30 drives the unlocking component 20 to move towards the bottom of the material frame along the height direction of the material frame, so that the bending part 22 presses the driving block 51 downwards to realize the unlocking of the locking component;

when clamping is performed, firstly, the driving assembly 30 drives the unlocking piece 20 to move, so that the bending part 22 of the unlocking piece 20 is close to the driving block 51, the bending part 22 is located below the driving block 51, then, the driving assembly 30 drives the unlocking piece 20 to be close to the driving block 51, so that the projections of the bending part 22 and the driving block 51 in the height direction of the material frame are overlapped, and at the moment, the bending part 22 is abutted to the bottom of the driving block 51; then the driving assembly 30 drives the unlocking piece 20 to move away from the bottom of the material frame along the height direction of the material frame, so that the bending part 22 hooks the driving block 51, the driving block 51 drives the connecting rod assembly 53 to move, and the connecting rod assembly 53 drives the two clamping pieces 41 to approach to each other to clamp the silicon wafer; with the arrangement, when the automatic locking function of the locking assembly fails, the locking action completed by the locking assembly is driven by the silicon wafer unlocking mechanism 100, so that the locking failure of the locking assembly is avoided, and the silicon wafer is prevented from being toppled and damaged. So set up, through adjusting the relative position of deblocking piece 20 and drive block 51 to make deblocking piece 20 and drive block 51 cooperation, change drive assembly 30 drive deblocking piece 20's direction of motion, realize locking Assembly's unblock and locking, under the condition that does not increase the structure, through setting up the portion of bending 22, increased silicon chip release mechanism 100's locking function, reduced silicon chip release mechanism's cost and enlarged silicon chip release mechanism 100's application scope.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.

The features of the above embodiments may be arbitrarily combined, and for the sake of brevity, all possible combinations of the features in the above embodiments are not described, but should be construed as being within the scope of the present specification as long as there is no contradiction between the combinations of the features.

It should be understood by those skilled in the art that the above embodiments are only for illustrating the present invention and are not to be used as a limitation of the present invention, and that suitable changes and modifications of the above embodiments are within the scope of the claimed invention as long as they are within the spirit and scope of the present invention.

Claims

1. A silicon wafer unlocking mechanism is used for unlocking and releasing a silicon wafer on a silicon wafer turnover mechanism; the silicon wafer turnover mechanism comprises a material frame and a locking assembly, wherein the material frame is used for bearing a silicon wafer, and the locking assembly is arranged on the material frame and used for clamping the silicon wafer;

the silicon wafer unlocking mechanism is characterized by comprising:

a support;

an unlocking member for engaging the locking assembly; and

the driving assembly is arranged on the bracket; wherein, drive assembly with the deblocking piece is connected, drive assembly is used for the drive the deblocking piece is close to locking assembly, so that the deblocking piece with locking assembly cooperates, and drives the deblocking piece unblock locking assembly.

2. The wafer unlocking mechanism of claim 1 wherein the drive assembly comprises a first drive assembly and a second drive assembly;

the first driving assembly is arranged on the support or the second driving assembly, is connected with the unlocking piece and is used for driving the unlocking piece to move along a first direction so as to enable the unlocking piece to be close to the locking assembly or drive the unlocking piece to unlock the locking assembly;

the second driving assembly is arranged on the bracket and used for driving the unlocking piece to move along a second direction so that the unlocking piece is close to the locking assembly and is matched with the locking assembly;

wherein, during the unblock, second drive assembly drives along the second direction unblock piece removes, so that unblock piece with the locking Assembly butt, first drive assembly drives unblock piece removes along the motion of first direction, so that unblock piece unblock locking assembly.

3. The wafer unlocking mechanism of claim 2 wherein the first drive assembly includes a slider and a second drive member and a second link member, the second drive member being configured to drive the slider in the first direction; the unlocking piece is arranged on the sliding block; the second connecting piece is connected with the second driving component, the second driving piece is installed on the second connecting piece, and the second driving component is used for driving the second connecting piece and the second driving piece to move along the second direction.

4. The silicon wafer unlocking mechanism of claim 2 wherein the second driving assembly is configured as a second cylinder, a piston rod of the second cylinder is connected to the unlocking member or the first driving assembly, and the unlocking member is moved in the second direction by the piston rod of the second cylinder.

5. The delatch mechanism of claim 1 wherein the drive assembly includes:

the first driving assembly is arranged on the support and connected with the unlocking piece and used for driving the unlocking piece to move along a first direction so as to enable the unlocking piece to be close to the locking assembly or drive the unlocking piece to unlock the locking assembly;

the guide assembly is arranged on the bracket; the unlocking piece is driven by the driving assembly to move along the first direction, the unlocking piece moves towards the locking assembly along the guide groove, and the other end of the unlocking piece is abutted to the locking assembly;

wherein, during the unblock, first drive assembly drives along the first direction unblock piece removes, when removing unblock piece is followed the guide way orientation locking Assembly is close to and the butt, first drive assembly drives unblock piece removes along the first direction motion, so that unblock piece unblock locking assembly.

6. The silicon wafer unlocking mechanism according to claim 5, wherein the guide assembly includes a guide plate and a roller;

the guide plate is provided with the guide groove, and the guide groove comprises a first guide section and a second guide section; the first guide section extends along the first direction, one end of the second guide section is communicated with the first guide section, the other end of the second guide section extends along the second direction, and the second guide section is obliquely arranged along the direction departing from the first direction and the direction departing from the material frame;

the gyro wheel with the unblock piece is kept away from the one end of material frame is connected, just the gyro wheel slide set up in the guide way.

7. The wafer unlocking mechanism of claim 2 or 5 wherein the first drive assembly includes a first drive member and a first coupling member; the first driving piece is mounted on the support and connected with the first connecting piece and can drive the first connecting piece to move along the first direction; the first connecting piece is connected with the unlocking piece.

8. The wafer release mechanism of claim 7, wherein the first driving member is configured as a first cylinder; the piston rod of the first cylinder is connected with the first connecting piece, and the extending direction of the piston rod of the first cylinder is consistent with the first direction.

9. The wafer release mechanism of claim 7, wherein the first drive assembly further comprises a guide cylinder; the guide cylinder is arranged on the first connecting piece; an installation channel extending along the second direction is formed in the guide cylinder, and the unlocking piece penetrates through the installation channel and can slide along the installation channel.

10. The silicon wafer unlocking mechanism according to claim 1, wherein the unlocking member includes a connecting portion and a bent portion, the connecting portion being connected to the driving assembly, the bent portion being connected to the connecting portion; the driving assembly drives the unlocking piece to be close to the locking assembly, so that the bending part is matched and abutted with the locking assembly;

when the material frame is unlocked, the driving assembly drives the bending part to move, so that the bending part and the locking assembly are unlocked, and the silicon wafer in the material frame is released; the driving assembly drives the bending part to move in the direction opposite to the unlocking direction, so that the locking assembly clamps the silicon wafer in the material frame.