CN216052035U

CN216052035U - Cam structure rapid pressing mechanism for semiconductor small-batch testing

Info

Publication number: CN216052035U
Application number: CN202122016188.7U
Authority: CN
Inventors: 何均
Original assignee: Shenzhen Xinjingwei Technology Co ltd
Current assignee: Shenzhen Xinjingwei Technology Co ltd
Priority date: 2021-08-25
Filing date: 2021-08-25
Publication date: 2022-03-15
Anticipated expiration: 2031-08-25

Abstract

The utility model belongs to the technical field of semiconductor testing, in particular to a cam structure rapid pressing mechanism for small-batch testing of semiconductors, which comprises a base, wherein a mounting plate is fixedly connected to the base, a plurality of chip testing jigs are fixedly mounted on the mounting plate, a rotatable driving shaft is mounted below the mounting plate, one end of the driving shaft is connected with a handle, the driving shaft is connected with a cam, the cam is connected with a pressing device through an upward driving rod, and the pressing device is arranged above the plurality of chip testing jigs in a vertically movable manner; the device can be used for rapidly opening and closing the opening and closing clamping jaws of the plurality of chip test fixtures at one time, so that the chips can be conveniently taken and placed.

Description

Cam structure rapid pressing mechanism for semiconductor small-batch testing

Technical Field

The utility model belongs to the technical field of semiconductor testing, and particularly relates to a cam structure rapid pressing mechanism for small-batch testing of semiconductors.

Background

Before a chip is mounted on a circuit board, comprehensive detection is needed, detection test or repeated drawing test of small batches is needed for a semiconductor when the semiconductor chip is produced at present, the semiconductor needs to be placed on a testing device when the semiconductor is tested and drawn, but the efficiency of the existing device is low when the semiconductor is tested, and the device is not suitable for batch test, so that the cam structure rapid pressing mechanism for the small-batch test of the semiconductor is provided at present to solve the problems.

SUMMERY OF THE UTILITY MODEL

To solve the problems set forth in the background art described above. The utility model provides a cam structure rapid pressing mechanism for small-batch testing of semiconductors, which solves the problems that the existing device is low in efficiency when in detection and is not suitable for batch testing.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a quick pressing mechanism of cam structure for test of semiconductor small batch, includes the base, fixedly connected with mounting panel on the base, fixed mounting has a plurality of chip test fixture on the mounting panel, and a drive shaft that can rotate is installed to the below of mounting panel, and a handle is connected to the one end of drive shaft, connects a cam in the drive shaft, a compression fittings is connected through an ascending transfer line to the cam, compression fittings can set up in a plurality of chip test fixture's top with reciprocating.

More specifically, the mounting panel is including being first mounting panel and the second mounting panel of two-layer setting from top to bottom, compression fittings includes the first pressfitting board that corresponds the setting with first mounting panel and corresponds the second pressfitting board that sets up with the second mounting panel.

More specifically, be provided with N chip test fixture on the first mounting panel, be provided with M chip test fixture on the second mounting panel.

More specifically, N is equal to M.

More specifically, but chip test fixture includes a test base and the elastic floating plate of connection in the test base top of up-and-down motion, and the chip that is provided with the holding on the test base and awaits measuring the chip holds the position, and the chip holds and is provided with the probe under the position, on the test base, and the both sides that the position was held to the chip are provided with a pair of rotatable clamping jaw that opens and shuts, the drive of elastic floating plate is connected the clamping jaw that opens and shuts can open a pair of clamping jaw that opens and shuts when the elastic floating plate pushes down, can make a pair of clamping jaw that opens and shuts close and support downwards when the elastic floating plate rises and press the chip in the chip holds the position.

More specifically, a PCB is arranged below the chip testing base and connected with a testing host through a flat cable.

More specifically, first pressfitting board be provided with N chip test fixture assorted N windows on the first mounting panel, the second pressfitting board be provided with M chip test fixture assorted M windows on the second mounting panel.

More specifically, first pressfitting board and second pressfitting board pass through a linking bridge fixed connection.

More specifically, both ends of the driving shaft are connected with the base through bearings.

More specifically, the pressing device is fixedly provided with a plurality of guide pillars, the base is provided with a sliding sleeve matched with the guide pillars, and the pressing device is connected to the base in a sliding mode through the guide pillars and the sliding sleeve which are matched with each other.

Compared with the prior art, the utility model has the beneficial effects that: the device can rapidly open and close the opening and closing clamping jaws of the plurality of chip test fixtures at one time, so that the chip taking and placing operation is convenient, the first mounting plate and the second mounting plate are designed into an upper layer and a lower layer, and more chip test fixtures can be accommodated in a limited space; during initial state, two pressfitting boards are in the low level and support the pressure to the elasticity kickboard of chip test fixture, the clamping jaw that opens and shuts is open mode, the outside vacuum suction nozzle of being convenient for will await measuring the chip and put into the tool test position, turning handle when beginning the test, two pressfitting boards synchronous upward movement break away from the elasticity kickboard, the elasticity kickboard rises to the high level, the clamping jaw that opens and shuts compresses tightly the chip, make chip pin and probe contact, convenient test, the back that the test finishes, the reverse rotation handle once more, the pressfitting board downstream supports the elasticity kickboard of pressing the fixture, the clamping jaw that opens and shuts is opened once more, the vacuum suction nozzle of being convenient for comes to take away the chip that the test finishes away.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings:

FIG. 1 is a first perspective view of the present invention;

FIG. 2 is a second perspective view of the present invention;

FIG. 3 is a schematic view of a removing and pressing apparatus according to the present invention;

FIG. 4 is a schematic structural diagram of a pressing device according to the present invention;

FIG. 5 is a schematic view of the connection structure between the chip testing fixture and the testing host;

FIG. 6 is a three-dimensional structure of the chip testing fixture;

FIG. 7 is a schematic view of the open state of the opening and closing jaws;

fig. 8 is a schematic view of the closed state of the opening and closing jaws.

In the figure: 1, a base; 2, testing the host; 3, arranging wires; 4, testing the jig by the chip; 5, pressing a plate; 6 connecting the bracket; 7, a window; 8, a handle; 9 driving the shaft; 10 a transmission rod; 11 a cam; 12, a guide post; 13 an elastic floating plate; 14 chip capacity bits; 15 opening and closing the clamping jaws; 16 probes; 17, mounting a plate; 31PCB board.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-8, the present invention provides the following technical solutions: an embodiment of a cam structure rapid pressing mechanism for semiconductor small batch test comprises a base 1, wherein the surface of the base 1 is fixedly connected with a mounting plate 17 which is arranged in an upper layer and a lower layer, namely a first mounting plate and a second mounting plate, a rotatable driving shaft 9 is arranged below the mounting plate 17, one end of the driving shaft 9 is connected with a handle 8, the surface of the driving shaft 9 is connected with a cam 11, the cam 11 is connected with a transmission rod 10, the top end of the transmission rod 10 is connected with a pressing device, the pressing device comprises a connecting bracket 6, the connecting bracket 6 is fixedly connected with two pressing plates 5, namely a first pressing plate and a second pressing plate, the mounting plate 17 is provided with N + M chip test jigs 4, one end of the base 1 is provided with a test host 2, the test host 2 is connected with a plurality of PCB plates 31 through a plurality of flat cables 3, the plurality of PCB plates 31 are correspondingly connected to the bottoms of the N + M chip test jigs 4 one by one, in this embodiment, the value of N and M is 4, chip test fixture 4 includes a test base 40 and connects the elasticity kickboard 13 of the activity from top to bottom in test base 40 top, test base 40's inside is provided with the chip and holds position 14, the chip holds 14 below of position and is provided with probe 16, probe 16 is connected with PCB board 31 electricity, the chip holds the both sides of position 14 and is provided with a pair of rotatable clamping jaw 15 that opens and shuts, elasticity kickboard 13 is connected with clamping jaw 15 that opens and shuts, when pressing elasticity kickboard 13, clamping jaw 15 that opens and shuts is opened, when no external force presses elasticity kickboard 13, elasticity kickboard 13 raises, clamping jaw 15 that opens and shuts is closed.

When testing semiconductor chip, test host 2 is connected with chip 400 that awaits measuring in the chip test fixture 4 through winding displacement 3, PCB board 31 electricity, and chip test fixture 4 has 8, installs respectively on being the first mounting panel and the second mounting panel of two-layer setting from top to bottom, and this kind of project organization has guaranteed to hold more chips in the finite space.

The working principle is illustrated, initially, the two pressing plates 5 are in a low position to press the elastic floating plate 13, the elastic floating plate 13 is in a low position, the pair of opening and closing clamping jaws 15 are in an open state as shown in fig. 7, then the chip 400 to be tested is sucked by an external vacuum suction nozzle and placed in the chip containing position 14, then the handle 8 is manually rotated, so that the driving shaft 9 is rotated and the driving rod 10 is moved upwards, the two pressing plates 5 synchronously move upwards to be separated from the elastic floating plate 13, the elastic floating plate 13 is lifted to a high position under the supporting action of the spring, the opening and closing clamping jaws 15 are closed to press the chip 400 to be tested, as shown in the state of fig. 8, the pin of the chip 400 to be tested is contacted with the probe 16 to be tested, the test is carried out, after the test, the handle 8 is reversely rotated again, the pressing device moves downwards, the two pressing plates 5 synchronously press the elastic floating plate 13 downwards, and the opening and closing clamping jaws 15 are opened again, the vacuum nozzle then comes to take the tested chip away.

In this embodiment, mounting panel 17 and pressfitting board 5 all set up to two-layer from top to bottom, and first mounting panel corresponds and sets up first pressfitting board, and the second mounting panel corresponds and sets up the second pressfitting board, and first pressfitting board passes through linking bridge 6 fixed connection with the second pressfitting board, and linking bridge 6 is connected with transfer line 10 top, and linking bridge 6 is the z style of calligraphy, conveniently drives two pressfitting boards 5 synchronous up-and-down motion in the test.

Be provided with on the first pressfitting board with 4 chip test fixture assorted 4 windows 7 on the first mounting panel (link up from top to bottom), be provided with on the second pressfitting board with 4 chip test fixture assorted 4 windows 7 on the second mounting panel, the chip 400 that conveniently awaits measuring puts into and takes out through window 7.

Two ends of the driving shaft 9 are connected with the base 1 through bearings, so that the driving shaft 9 can rotate relative to the base 1 conveniently, four guide pillars 12 are arranged at two ends of the pressing device, and the pressing device can be connected in a sliding sleeve matched with the base 1 in a vertically sliding mode through the guide pillars 12 and plays a role in guiding the vertical movement of the pressing device.

In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the utility model. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a quick pressing mechanism of cam structure for test of semiconductor small batch, its characterized in that, includes the base, fixedly connected with mounting panel on the base, fixed mounting has a plurality of chip test fixture on the mounting panel, and a drive shaft that can rotate is installed to the below of mounting panel, and a handle is connected to the one end of drive shaft, connects a cam in the drive shaft, a compression fittings is connected through an ascending transfer line to the cam, compression fittings can set up in a plurality of chip test fixture's top with reciprocating.

2. The cam structure rapid pressing mechanism for semiconductor small batch test according to claim 1, characterized in that: the mounting panel is including being first mounting panel and the second mounting panel of two-layer setting from top to bottom, compression fittings includes the first pressfitting board that corresponds the setting with first mounting panel and corresponds the second pressfitting board that sets up with the second mounting panel.

3. The cam structure rapid pressing mechanism for semiconductor small batch test according to claim 2, characterized in that: the first mounting plate is provided with N chip test fixtures, and the second mounting plate is provided with M chip test fixtures.

4. The cam structure rapid pressing mechanism for semiconductor small batch test according to claim 3, characterized in that: n is equal to M.

5. The cam structure rapid pressing mechanism for semiconductor small batch test according to claim 1, characterized in that: chip test fixture includes a test base and the elasticity kickboard of connection in the test base top that can up-and-down motion, and the chip that is provided with the holding on the test base and awaits measuring the chip holds the position, is provided with the probe under the chip holds the position, and the chip holds the both sides of position and is provided with a pair of rotatable clamping jaw that opens and shuts, elasticity kickboard drive is connected the clamping jaw that opens and shuts can open a pair of clamping jaw that opens and shuts when elasticity kickboard pushes down, can make a pair of clamping jaw that opens and shuts close and support the chip that presses the chip to hold the position downwards when elasticity kickboard rises.

6. The cam structure rapid pressing mechanism for semiconductor small batch test according to claim 1, characterized in that: the PCB is arranged below the chip testing base and connected with a testing host through a flat cable.

7. The cam structure rapid pressing mechanism for semiconductor small batch test according to claim 3, characterized in that: first pressfitting board be provided with N chip test fixture assorted N windows on the first mounting panel, second pressfitting board be provided with M chip test fixture assorted M windows on the second mounting panel.

8. The cam structure rapid pressing mechanism for semiconductor small batch test according to claim 2, characterized in that: first pressfitting board and second pressfitting board pass through a linking bridge fixed connection.

9. The cam structure rapid pressing mechanism for semiconductor small batch test according to claim 1, characterized in that: and two ends of the driving shaft are connected with the base through bearings.

10. The cam structure rapid pressing mechanism for semiconductor small batch test according to claim 1, characterized in that: the pressing device is fixedly provided with a plurality of guide pillars, the base is provided with a plurality of sliding sleeves matched with the guide pillars, and the pressing device is arranged on the base through the guide pillars and the sliding sleeves which are matched with each other.