CN216771921U - Novel high-efficient test fixture of bonding electrical property - Google Patents
Novel high-efficient test fixture of bonding electrical property Download PDFInfo
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- CN216771921U CN216771921U CN202123298677.2U CN202123298677U CN216771921U CN 216771921 U CN216771921 U CN 216771921U CN 202123298677 U CN202123298677 U CN 202123298677U CN 216771921 U CN216771921 U CN 216771921U
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- bonding electrical
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Abstract
The utility model discloses a novel efficient testing jig for bonding electrical performance, which comprises a jig main body, wherein the jig main body is formed by combining an upper plate and a lower plate through a connecting plate, a first fixing hole is formed in the upper plate, a vertical sliding rod connected with the lower plate is arranged in the fixing hole, a second fixing hole is formed in the upper end of the upper plate, a lifting rod is sleeved in the second fixing hole, the upper end of the lifting rod is connected with a knob, a lifting plate is sleeved outside the sliding rod, one end of the lifting plate is connected with a downward-protruding ejector pin, and a clamp is arranged on the upper surface of the lower plate. Compared with the existing device, the device is simple in structure and more convenient to assemble, does not need to be cut into small pieces for testing after wafer bonding, is low in cost, and is higher in assembly efficiency.
Description
Technical Field
The utility model relates to a technical field of vacuum bonding especially relates to a novel high-efficient test fixture of bonding electrical property.
Background
Wafer bonding refers to contacting two wafers tightly enough to bond them together firmly, and current wafer bonding techniques all require a special wafer bonding system to achieve. The wafer bonding system has the advantages that the requirements on wafer bonding are high due to the material requirements of the wafers, the two wafers are required to be perfectly attached without bubbles, if the wafers are required to be bonded without bubbles, bonding needs to be completed in a vacuum environment, but the two wafers are required to be perfectly corresponding in the wafer bonding process, the existing wafer bonding system generally adopts a mechanical arm to achieve position correspondence of the two wafers in the vacuum environment, the structure is complex, and the cost is high.
The prior art needs to test the electrical performance after bonding two wafers, has high cost, long time and low efficiency, and has hidden cracking risk on the wafer.
SUMMERY OF THE UTILITY MODEL
Aiming at the problems in the prior art, a novel efficient testing jig for bonding electrical performance is provided, and comprises a jig main body, wherein the jig main body is formed by combining an upper plate and a lower plate through a connecting plate;
a first fixing hole is formed in the upper plate, a vertical sliding rod connected with the lower plate is arranged in the fixing hole, a second fixing hole is formed in the upper end of the upper plate, a lifting rod is sleeved in the second fixing hole, and the upper end of the lifting rod is connected with a knob;
the lifting plate is sleeved outside the sliding rod, one end of the lifting plate is connected with a downward-protruding ejector pin, and a clamp is arranged on the upper surface of the lower plate.
As a further description of the above technical solution: the lower plate and the lifting plate are also internally provided with a plurality of groups of first fixing holes and second fixing holes.
As a further description of the above technical solution: and screw teeth are arranged in the second fixing holes formed in the lifting plate and matched with the lifting rod.
As a further description of the above technical solution: the lifting rod is a screw rod.
As a further description of the above technical solution: the thimble and the lifting plate are in threaded connection.
As a further description of the above technical solution: the thimble with anchor clamps are provided with a set ofly or multiunit, and a set of the thimble with a set of the position of anchor clamps is corresponding.
As a further description of the above technical solution: pressing sheets are arranged on two sides of the clamp and connected with the lower plate through screws.
As a further description of the above technical solution: the slide bar and the first fixed orifices of multiunit that the lifter plate was inside seted up all carry out polishing treatment.
As a further description of the above technical solution: scales are arranged outside the knob.
As a further description of the above technical solution: the thimble is made of polypropylene.
The technical scheme has the following advantages or beneficial effects: the lifting plate drives the thimble below to move downwards to extrude the two bonded wafers in the clamp below, so that the two bonded wafers are pressed together, then the test device is connected with the thimble through an external vector analyzer so as to test the electrical property of the bonding of the two wafers, compared with the prior device, the device has simple structure, more convenient assembly, low cost, higher assembly efficiency, and improved test reliability and work efficiency, does not need to cut the wafer into small pieces for testing after bonding, can arrange a plurality of groups of threaded holes for connecting the lifting plate and the thimble, meanwhile, the clamp is also provided with a plurality of groups, the number of the clamps is consistent with that of the thimbles, the clamp is fixed on the upper surface of the lower plate through an external pressing sheet, a plurality of groups of wafers can be clamped through the additional clamp, then, a plurality of groups of bonded wafers can be tested through the ejector pin at the upper end, and the detection efficiency is greatly improved.
Drawings
Embodiments of the present invention will now be described more fully hereinafter with reference to the accompanying drawings. The drawings are only for purposes of illustration and description, and are not intended to limit the scope of the present disclosure.
Fig. 1 is a perspective view of a novel efficient testing fixture for bonding electrical performance according to the present invention;
fig. 2 is a perspective view of a jig main body in the novel efficient testing jig for bonding electrical performance according to the present invention;
fig. 3 is a perspective view of a lifting plate in the novel efficient testing fixture for bonding electrical performance according to the present invention.
The above reference numerals denote: 1. a jig main body; 101. an upper plate; 102. a lower plate; 103. connecting the plate members; 2. a first fixing hole; 3. a vertical slide bar; 4. a second fixing hole; 5. a lifting rod; 6. a knob; 7. a lifting plate; 8. a thimble; 9. a clamp; 10. and (6) tabletting.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is to be understood that the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without any creative effort belong to the protection scope of the present application.
It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.
The present invention will be further described with reference to the following drawings and specific examples, which should not be construed as limiting the utility model.
Referring to fig. 1-3, the present use is newly provided example 1: a novel efficient testing jig for bonding electrical performance comprises a jig main body 1, wherein the jig main body 1 is formed by combining an upper plate 101 and a lower plate 102 through a connecting plate 103;
a first fixing hole 2 is formed in the upper plate 101, a vertical sliding rod 3 connected with the lower plate is arranged in the fixing hole 2, a second fixing hole 4 is formed in the upper end of the upper plate 101, a lifting rod 5 is sleeved in the second fixing hole 4, and the upper end of the lifting rod 5 is connected with a knob 6;
a lifting plate 7 is sleeved outside the sliding rod 3, one end of the lifting plate 7 is connected with a thimble 8 protruding downwards, and a clamp 9 is arranged on the upper surface of the lower plate 102.
According to the technical scheme, the lifting plate 7 is driven to move downwards for a certain distance when the knob 6 is rotated, scales are arranged outside the knob 6, the pressure applied downwards can be observed more visually in rotation, the ejector pin 8 below the lifting plate 7 is driven to move downwards to extrude two bonded wafers in the clamp 9 below, the two wafers are pressed together, and then the two bonded wafers are connected with the ejector pin 8 through an external vector analyzer, so that the electrical property of testing the bonding of the two wafers is achieved, the device is compared with the existing device, the structure is simple, the assembly is more convenient, the cost is low, the assembly efficiency is higher, and the testing reliability and the working efficiency are improved.
Furthermore, the lower plate 102 and the lifting plate 7 are also provided with a plurality of sets of first fixing holes 2 and second fixing holes 4.
Furthermore, a screw thread is arranged in a second fixing hole 4 formed in the lifting plate 7 and matched with the lifting rod 5.
Further, the lifting lever 5 is a screw rod, and the lifting plate 7 can be moved up or down by the rotation of the screw rod.
Furthermore, the ejector pin 8 is in threaded connection with the lifting plate 7, and when the ejector pin 8 needs to be replaced, the ejector pin only needs to be rotated and separated from a threaded hole of the lifting plate 7, so that the effect of convenient replacement is achieved.
Further, the thimble 8 and the clamp 9 are provided with one or more groups, and the position of one group of thimble 8 corresponds to the position of one group of clamp 9.
Further, pressing pieces 10 are provided on both sides of the jig 9, and the pressing pieces 10 are connected to the lower plate 102 by screws.
According to the technical scheme, the threaded holes formed by the lifting plate 7 and the ejector pins 8 can be provided with multiple groups, meanwhile, the clamps 9 are also provided with multiple groups, the number of the clamps is consistent with that of the ejector pins 8, the clamps 9 are fixed on the upper surface of the lower plate 101 through the external pressing sheets 10, multiple groups of wafers can be clamped through the additional clamps 9, then the ejector pins 8 at the upper ends can be used for testing multiple groups of bonded wafers, and the detection efficiency is greatly improved.
Furthermore, the slide bar 3 and the first fixing holes 2 formed in the lifting plate 7 are polished.
Furthermore, scales are arranged outside the knob 6, and the force of the thimble 8 on the wafer test can be observed more intuitively through the scales.
Further, the material of the thimble 8 is polypropylene.
The working principle is as follows: when the device is used, two bonded wafers are placed at the upper end of a clamp 9, the clamp 9 is positioned on the upper surface of a lower plate 102, a lifting plate 7 capable of moving up and down is arranged right above the clamp 9, a vertical downward thimble 8 is arranged on one side of the lifting plate 7, the knob 6 is manually rotated to drive the lower lifting rod 5 to rotate, the lifting rod 5 is a lead screw, matched screw teeth are arranged in an opening hole for connecting the lifting plate 7 and the lifting rod 5, so that the lifting plate 7 is driven to move downwards for a certain distance when the knob 6 is rotated, scales are arranged outside the knob 6, the pressure applied downwards can be more visually observed during rotation, the thimble 8 driven by the lifting plate 7 downwards moves downwards to press the two bonded wafers in the lower clamp 9, the two bonded wafers are pressed together and then are connected with the thimble 8 through an external detection mechanism, compared with the existing device, the device has the advantages of simple structure, more convenience in assembly, low cost and higher assembly efficiency, and improves the reliability and the working efficiency of the test.
The above description is only an example of the preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and it should be understood that all modifications and obvious variations of the present invention, which are equivalent to those of the present invention and illustrated in the drawings, should be included in the scope of the present invention.
Claims (10)
1. The utility model provides a novel bonding electrical property high efficiency test fixture which characterized in that: the jig comprises a jig main body (1), wherein the jig main body (1) is formed by combining an upper plate (101) and a lower plate (102) through a connecting plate (103);
a first fixing hole (2) is formed in the upper plate (101), a vertical sliding rod (3) connected with the lower plate is arranged in the first fixing hole (2), a second fixing hole (4) is formed in the upper end of the upper plate (101), a lifting rod (5) is sleeved in the second fixing hole (4), and the upper end of the lifting rod (5) is connected with a knob (6);
the lifting plate (7) is sleeved outside the sliding rod (3), one end of the lifting plate (7) is connected with a downward-protruding ejector pin (8), and a clamp (9) is arranged on the upper surface of the lower plate (102).
2. The novel bonding electrical performance efficient test fixture of claim 1, wherein: the lower plate (102) and the lifting plate (7) are also internally provided with a plurality of groups of first fixing holes (2) and second fixing holes (4).
3. The novel bonding electrical performance efficient test fixture of claim 1, wherein: and screw teeth are arranged in the second fixing holes (4) formed in the lifting plate (7) and matched with the lifting rod (5).
4. The novel bonding electrical performance efficient test fixture of claim 1, wherein: the lifting rod (5) is a screw rod.
5. The novel bonding electrical performance efficient test fixture of claim 1, wherein: the thimble (8) is in threaded connection with the lifting plate (7).
6. The novel bonding electrical property high-efficiency test fixture of claim 1, characterized in that: the thimble (8) with anchor clamps (9) are provided with one set of or multiunit, and a set of thimble (8) and a set of anchor clamps (9) the position is corresponding.
7. The novel bonding electrical performance efficient test fixture of claim 1, wherein: pressing sheets (10) are arranged on two sides of the clamp (9), and the pressing sheets (10) are connected with the lower plate (102) through screws.
8. The novel bonding electrical property high-efficiency test fixture of claim 1, characterized in that: the sliding rod (3) and the plurality of groups of first fixing holes (2) formed in the lifting plate (7) are polished.
9. The novel bonding electrical property high-efficiency test fixture of claim 1, characterized in that: scales are arranged outside the knob (6).
10. The novel bonding electrical performance efficient test fixture of claim 1, wherein: the thimble (8) is made of polypropylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123298677.2U CN216771921U (en) | 2021-12-24 | 2021-12-24 | Novel high-efficient test fixture of bonding electrical property |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123298677.2U CN216771921U (en) | 2021-12-24 | 2021-12-24 | Novel high-efficient test fixture of bonding electrical property |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216771921U true CN216771921U (en) | 2022-06-17 |
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ID=81968452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123298677.2U Active CN216771921U (en) | 2021-12-24 | 2021-12-24 | Novel high-efficient test fixture of bonding electrical property |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216771921U (en) |
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2021
- 2021-12-24 CN CN202123298677.2U patent/CN216771921U/en active Active
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