CN216051407U - Ink-jet type defective product marking mechanism - Google Patents
Ink-jet type defective product marking mechanism Download PDFInfo
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- CN216051407U CN216051407U CN202121098062.2U CN202121098062U CN216051407U CN 216051407 U CN216051407 U CN 216051407U CN 202121098062 U CN202121098062 U CN 202121098062U CN 216051407 U CN216051407 U CN 216051407U
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Abstract
The utility model relates to the technical field of detection equipment, and discloses an ink-jet defective product marking mechanism which comprises a base platform, wherein a material strip supporting plate is arranged on the base platform, an X-axis movement module is arranged on the base platform, a Y-axis movement module is also arranged on the X-axis movement module, a visual detection system and an ink dot marking module are arranged on the Y-axis movement module, the visual detection system is used for detecting the defects of chips on IC material strips to obtain the position information of the defects, the Y-axis movement module and the X-axis movement module receive the position information and drive the ink dot marking module to move to the defect position, and the ink dot marking module is used for spraying ink dots to the defect position. The visual inspection system obtains position information of the defects, the X-axis movement module and the Y-axis movement module move the ink dot marking module to the defect positions, the ink dot marking module sprays ink dots to the defect positions, the specific defect positions are marked by the ink dots, operators can identify defective IC material strips in subsequent processes, and the defective IC material strips are prevented from entering the subsequent processes.
Description
Technical Field
The utility model relates to the technical field of detection equipment, in particular to an ink-jet defective product marking mechanism.
Background
The conventional IC material strip has the length of between 180 and 300mm and the width of between 35 and 90mm, each material strip contains nearly thousand IC chips, and each IC chip is fixed on the material strip in a pressure welding mode. After the chip pins are bonded, the chip often has the following outsourcing defects, namely, the first defect is a chip mounting defect which comprises wrong pin welding, pin falling, deviation, damage, contamination, ink spots and the like; secondly, the defects of the bonding wire comprise the falling of the welding ball, the deviation of the welding ball, the abnormal sphericity, the bending of the bonding wire, the open circuit of the bonding wire, the tail of a plurality of wires and the like; and thirdly, the appearance defects of the substrate, including finger deformation, insufficient silver colloid overflow and the like.
The IC chip with the defects after the chip pin is subjected to pressure welding belongs to a defective product, continuous processing is stopped, the defect product is prevented from being mixed with a qualified product, and the processing cost is saved. The mode of manual observation is adopted mostly in the defective products detection in the mill, but the chip contact in staff and the IC material strip during manual detection can lead to the chip secondary damage to appear, and the effect that manual detection was in addition unstable appears lou examining, situations such as wrong detection easily to detect speed is slow.
The CCD visual detection system is a frequently-used defective product detection mode in modern industry, a machine is used for replacing human eyes to measure and judge, an industrial camera is used for collecting a sample picture, a shot target is converted into an image signal and transmitted to a special image processing system, and the image system is used for judging whether a defective product exists in the sample or not by comparing the image and reminding an operator to screen the defective product.
However, the number of chips in the IC material strip is large, the chips are densely distributed, and after the visual inspection system detects the defective IC material strip, an operator cannot judge which position of the material strip has a defect in the subsequent process, which affects the subsequent process operation.
SUMMERY OF THE UTILITY MODEL
The purpose of the utility model is: the utility model provides an inkjet formula substandard product marking mechanism to solve the problem that operating personnel can't judge concrete defect position when the check out test set among the prior art utilizes visual inspection system to detect IC material strip.
In order to achieve the purpose, the utility model provides an ink-jet defective product marking mechanism which comprises a base platform, wherein a material strip supporting plate used for supporting an IC material strip to be detected is arranged on the base platform, an X-axis movement module capable of moving parallel to the material strip supporting plate is arranged on the base platform, a Y-axis movement module capable of moving perpendicular to the material strip supporting plate is further arranged on the X-axis movement module, a visual detection system and an ink dot marking module are arranged on the Y-axis movement module, the visual detection system is used for detecting the defect of a chip on the IC material strip to obtain the position information of the defect, the Y-axis movement module and the X-axis movement module receive the position information and drive the ink dot marking module to move to the defect position, and the ink dot marking module is used for spraying ink dots to the defect position.
Preferably, the vision inspection system comprises an inspection camera, a focusing lens and a light source module, the focusing lens is fixedly connected with the inspection camera, and the light source module is arranged on one side of the focusing lens, which is close to the material strip supporting plate.
Preferably, the light source module comprises an annular light source and a coaxial light source, and the coaxial light source is arranged between the focus lens and the annular light source.
Preferably, the vision inspection system further comprises a Z-axis movement module connected with the Y-axis movement module, the Z-axis movement module is movable in a vertical plane, and the vision inspection system is arranged on the Z-axis movement module.
Preferably, the Z-axis movement module comprises a Z-direction motor and a Z-direction lead screw in transmission connection with the Z-direction motor, a Z-direction lifting seat is assembled on the Z-direction lead screw in a threaded manner, and the detection camera and the focusing lens are both fixedly arranged on the Z-direction lifting seat.
Preferably, the dot marking module includes a carriage and an inkjet head disposed on the carriage, and the carriage is fixedly connected to the Y-axis moving module.
Preferably, the Y-axis movement module comprises a Y-direction motor and a Y-direction screw rod in transmission connection with the Y-direction motor, a Y-direction moving seat is assembled on the Y-direction screw rod through threads, and the visual detection system and the ink dot marking module are both fixedly arranged on the Y-direction moving seat.
Preferably, the X-axis motion module comprises an X-direction motor and an X-direction slide seat assembled on an X-direction lead screw in transmission connection with the X-direction motor, and the Y-axis motion module is fixedly arranged on the X-direction slide seat.
Compared with the prior art, the ink-jet defective product marking mechanism provided by the embodiment of the utility model has the beneficial effects that: the visual detection system and the ink dot marking module are arranged on the Y-axis movement module, the visual detection system detects the defects of the chips on the IC material strips and obtains position information of the defects, then the position information is transmitted to the X-axis movement module and the Y-axis movement module, the X-axis movement module and the Y-axis movement module move to the defect positions along the X direction and the Y direction respectively in the horizontal plane, the ink dot marking module sprays ink dots to the defect positions, the specific defect positions are marked by the ink dots, operators in subsequent processes can directly judge the positions of the chips with the defects, the IC material strips of defective products are identified, the defective products are prevented from entering the subsequent processes, and cost is saved.
Drawings
FIG. 1 is a schematic view of the structure of an ink jet type defective marking mechanism of the present invention;
FIG. 2 is a schematic diagram of a visual inspection system of the inkjet fault marking mechanism of FIG. 1;
fig. 3 is a schematic structural view of a dot marking module of the inkjet defective marking mechanism of fig. 1.
In the figure, 1, a base platform; 11. a support frame; 12. a support leg; 2. a material strip supporting plate; 3. an X-axis motion module; 31. an X-direction motor; 32. an X-direction screw rod; 33. an X-direction sliding seat; 4. a Y-axis motion module; 41. a Y-direction motor; 42. a Y-direction screw rod; 43. a Y-direction moving seat; 5. a vision inspection system; 51. a Z-axis motion module; 52. a Z-direction motor; 53. a Z-direction screw rod; 54. a Z-direction lifting seat; 55. detecting a camera; 56. a focus lens; 57. an annular light source; 58. a coaxial light source; 6. a dot marking module; 61. a support; 62. an ink jet head.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the utility model but are not intended to limit the scope of the utility model.
A preferred embodiment of an inkjet defective marking mechanism according to the present invention is shown in fig. 1 to 3, and the inkjet defective marking mechanism includes a base platform 1, a material strip supporting plate 2, an X-axis movement module 3, a Y-axis movement module 4, a visual detection system 5, and an ink dot marking module 6, wherein the base platform 1 is a rectangular table, and the material strip supporting plate 2, the X-axis movement module 3, the Y-axis movement module 4, the visual detection system 5, and the ink dot marking module 6 are all disposed on the base platform 1.
Two support frames 11 which are parallel to each other are arranged on the base platform 1, the two support frames 11 are arranged at intervals, a plurality of support legs 12 are arranged at intervals at the bottom of the support frames 11, and the support legs 12 are fixedly connected with the base platform 1 through bolts. The material strip supporting plate 2 is supported and arranged at the tops of the two supporting frames 11, the interval between the two supporting frames 11 is smaller than the width of the material strip supporting plate 2, the material strip supporting plate 2 is used for sucking the IC material strips, plane supporting is provided for the IC material strips, and the detection flatness is guaranteed.
The X-axis motion module 3 can move in the horizontal plane along the direction parallel to the material strip supporting plate 2, the Y-axis motion module 4 can move in the horizontal plane along the direction perpendicular to the material strip supporting plate 2, and the Y-axis motion module 4 is arranged on the X-axis motion module 3 in a sliding mode. The vision detection system 5 and the ink dot marking module 6 are fixedly arranged on the Y-axis movement module 4, and after the X-axis movement module 3 and the Y-axis movement module 4 move in a combined manner, the IC material strips can be fully covered in the XY direction during detection.
The X-axis motion module 3 comprises an X-direction motor 31, an X-direction screw rod 32 and an X-direction sliding seat 33, the X-direction screw rod 32 is in transmission connection with the X-direction motor 31, the X-direction sliding seat 33 is assembled on the X-direction screw rod 32 in a threaded mode, and the Y-axis motion module 4 is fixedly arranged on the X-direction sliding seat 33. The extending direction of the X-direction screw rod 32 is parallel to the direction of the material strip supporting plate 2, the X-direction screw rod 32 is rotatably assembled on the base platform 1, the X-direction motor 31 drives the X-direction screw rod 32 to rotate when rotating, and the X-direction sliding seat 33 moves on the X-direction screw rod 32 under the action of a thread structure, so that the Y-axis movement module 4 is driven to move along the X-direction screw rod 32, and the sliding direction of the X-direction sliding seat 33 can be changed by changing the rotating direction of the X-direction motor 31.
The Y-axis motion module 4 comprises a Y-direction motor 41, a Y-direction lead screw 42 and a Y-direction moving seat 43, the Y-direction lead screw 42 is rotatably assembled on the X-direction sliding seat 33, the Y-direction lead screw 42 is in transmission connection with the Y-direction motor 41, the Y-direction moving seat 43 is in threaded assembly on the Y-direction motor 41, and the visual detection system 5 and the ink dot marking module 6 are fixedly arranged on the Y-direction moving seat 43. The extending direction of the Y-direction screw rod 42 is perpendicular to the direction of the material strip supporting plate 2, the Y-direction motor 41 can drive the Y-direction screw rod 42 to rotate when rotating, and the Y-direction moving seat 43 moves on the Y-direction screw rod 42 under the action of the thread structure, so that the visual detection system 5 and the ink dot marking module 6 are driven to move along the Y-direction screw rod 42, and the moving direction of the Y-direction moving seat 43 can be changed by changing the rotating direction of the Y-direction motor 41.
The Z-axis motion module 51 comprises a Z-direction motor 52, a Z-direction screw 53 and a Z-direction lifting seat 54, wherein the Z-direction motor 52 is fixedly arranged on the Y-direction moving seat 43, the Z-direction screw 53 is rotatably assembled on the Y-direction moving seat 43, the Z-direction screw 53 extends in the vertical direction, and the Z-direction lifting seat 54 is assembled on the Z-direction screw 53 in a threaded manner. The Z-direction motor 52 is in transmission connection with the Z-direction screw rod 53, the Z-direction motor 52 drives the Z-direction screw rod 53 to rotate, and the Z-direction lifting seat 54 is lifted and lowered under the action of the thread structure, so that the detection camera 55 and the focusing lens 56 are driven to move up and down, the distance between the IC material strip to be detected and the focusing lens 56 is changed, namely the object distance is changed, and the detected image is clear.
The light source module includes an annular light source 57 and a coaxial light source 58, and the coaxial light source 58 is disposed on the upper side of the annular light source 57 and between the annular light source 57 and the focus lens 56. The annular light source 57 is used for providing light source illumination environments in different directions around the inspection camera 55, and the coaxial light source 58 is used for providing light source illumination environments in the same direction in the vertical direction for the inspection camera 55.
The ink dot marking module 6 comprises a bracket 61 and an ink jet head 62, wherein the ink jet head 62 is fixedly arranged on the bracket 61, the bracket 61 is fixedly arranged on the Y-direction moving seat 43, the bracket 61 is a connecting structure for connecting the Y-axis moving module 4 and the ink jet head 62, and the ink jet head 62 is used for jetting ink to the defect position of the IC material strip to realize the ink dot marking function. The specific structure of the ink jet head 62 is conventional and will not be described in detail herein.
The working process of the utility model is as follows: s1, when detecting the IC material strip, an operator firstly establishes an image library through software, connects the visual detection system 5 with the image library and is used for providing a comparison object for the visual detection system 5; s2, conveying the IC material strips to the material strip supporting plate 2 by the feeding mechanism of the preorder station, and adsorbing and fixing the IC material strips by the material strip supporting plate 2 to provide plane support for the IC material strips; s3, the Z-axis movement module 51 moves through the Z-direction motor 52 and the Z-direction screw 53 to enable the detection camera 55 and the focusing lens 56 to move up and down, the distances between the focusing lens 56 and the detection camera 55 and the IC material strips are automatically adjusted, and the coaxial light source 58 and the annular light source 57 are turned on to provide a lighting environment for the detection camera 55; s4, the X-axis motion module 3 and the Y-axis motion module 4 move together, so that the vision detection system 5 and the ink dot marking module 6 move to the detection positions of the chips of the IC material strips, and the chips are photographed and detected; and S5, completing the detection of the IC strip by the vision detection system 5, if a defective chip is found, acquiring the position information of the defect by the vision detection system 5, receiving the position information by the Y-axis motion module 4 and the X-axis motion module 3, moving the ink dot marking module 6 to the defect position, and carrying out ink jet marking on the defect position by the ink jet head 62.
To sum up, the embodiment of the utility model provides an inkjet defective product marking mechanism, wherein a visual detection system and an ink dot marking module are arranged on a Y-axis movement module, the visual detection system detects the defects of chips on IC material strips and obtains position information of the defects, then the position information is transmitted to the X-axis movement module and the Y-axis movement module, the X-axis movement module and the Y-axis movement module move along the X direction and the Y direction in the horizontal plane respectively to move the ink dot marking module to the defect positions, the ink dot marking module sprays ink dots to the defect positions, the specific defect positions are marked by the ink dots, operators in subsequent processes can directly judge the positions of the chips with the defects, the IC material strips with defective products are identified, the defective products are prevented from entering the subsequent processes, and the cost is saved.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.
Claims (8)
1. An ink-jet defective product marking mechanism is characterized by comprising a base platform, wherein a material strip supporting plate used for supporting an IC material strip to be detected is arranged on the base platform, an X-axis movement module capable of moving parallel to the material strip supporting plate is arranged on the base platform, a Y-axis movement module capable of moving perpendicular to the material strip supporting plate is further arranged on the X-axis movement module, a visual detection system and an ink dot marking module are arranged on the Y-axis movement module, the visual detection system is used for detecting the defect of a chip on the IC material strip to obtain the position information of the defect, the Y-axis movement module and the X-axis movement module receive the position information and drive the ink dot marking module to move to the defect position, and the ink dot marking module is used for spraying ink dots to the defect position.
2. The inkjet defective marking mechanism according to claim 1, wherein the vision inspection system comprises an inspection camera, a focusing lens and a light source module, the focusing lens is fixedly connected with the inspection camera, and the light source module is arranged on one side of the focusing lens close to the material strip supporting plate.
3. The inkjet defect marking mechanism of claim 2, wherein the light source module comprises a ring light source and a coaxial light source, the coaxial light source being disposed between the focus lens and the ring light source.
4. The inkjet defect marking mechanism of claim 2, wherein the vision inspection system further comprises a Z-axis motion module connected to the Y-axis motion module, the Z-axis motion module being movable in a vertical plane, the vision inspection system being disposed on the Z-axis motion module.
5. The inkjet defective product marking mechanism according to claim 4, wherein the Z-axis moving module comprises a Z-direction motor and a Z-direction lead screw in transmission connection with the Z-direction motor, the Z-direction lead screw is provided with a Z-direction lifting seat in a threaded manner, and the detection camera and the focusing lens are fixedly arranged on the Z-direction lifting seat.
6. The inkjet defect marking mechanism as claimed in any one of claims 1 to 5, wherein the dot marking module comprises a carriage and an inkjet head disposed on the carriage, the carriage being fixedly connected to the Y-axis moving module.
7. The inkjet defective marking mechanism according to any one of claims 1 to 5, wherein the Y-axis motion module comprises a Y-direction motor and a Y-direction screw rod in transmission connection with the Y-direction motor, the Y-direction screw rod is provided with a Y-direction moving seat in a threaded manner, and the visual detection system and the ink dot marking module are both fixedly arranged on the Y-direction moving seat.
8. An ink jet defective marking mechanism according to any one of claims 1 to 5 wherein the X-axis movement module comprises an X-direction motor and an X-direction lead screw in transmission connection with the X-direction motor, and an X-direction slide is assembled on the X-direction slide by a screw thread, and the Y-axis movement module is fixedly arranged on the X-direction slide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121098062.2U CN216051407U (en) | 2021-05-21 | 2021-05-21 | Ink-jet type defective product marking mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121098062.2U CN216051407U (en) | 2021-05-21 | 2021-05-21 | Ink-jet type defective product marking mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216051407U true CN216051407U (en) | 2022-03-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121098062.2U Active CN216051407U (en) | 2021-05-21 | 2021-05-21 | Ink-jet type defective product marking mechanism |
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| Country | Link |
|---|---|
| CN (1) | CN216051407U (en) |
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2021
- 2021-05-21 CN CN202121098062.2U patent/CN216051407U/en active Active
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