CN216030189U - Anti-overflow structure and burnishing machine of burnishing machine - Google Patents

Abstract

The embodiment of the application discloses anti-overflow structure and burnishing machine of burnishing machine. The anti-overflow structure comprises a cover body, the cover body is provided with an anti-overflow groove and at least one water guide groove, the water guide groove is arranged on one side of the anti-overflow groove, and the depth of the water guide groove is gradually increased along the direction close to the anti-overflow groove; the cover body top surface comprises a first inclined surface and a second inclined surface, the first inclined surface is the bottom surface of the water guide groove, the water guide groove is formed in the second inclined surface and is close to the direction of the overflow preventing groove, the height of the first inclined surface and the height of the second inclined surface gradually become lower, and the gradient of the first inclined surface is larger than that of the second inclined surface. The problem that liquid dripping on the wafer is easy to overflow from the cover body to cause alarm halt of the polishing machine can be effectively solved, the frequency of alarm halt of the polishing machine is reduced, and normal operation of the polishing machine is guaranteed.

Description

Anti-overflow structure and burnishing machine of burnishing machine

Technical Field

The application relates to the field of wafer processing, in particular to an anti-overflow structure of a polishing machine and the polishing machine.

Background

In the related art, in order to remove a metal layer located on a non-recessed region of a wafer, a common method is Chemical Mechanical Polishing (CMP), in which a downward pressure is applied to a wafer carrier head to press the wafer against a polishing pad and rotate the wafer relative to the polishing pad.

The chemical polishing machine comprises a cleaning mechanism, a wafer conveying mechanism, a drying mechanism and the like, wherein wafers are cleaned and then conveyed to the drying mechanism through the wafer conveying mechanism to be dried, liquid on the wafers drips in the conveying process of the wafers by the wafer conveying mechanism, and the drips wet parts below the cover body to cause the alarm stop of the chemical polishing machine.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides an anti-overflow structure and burnishing machine of burnishing machine, can effectively solve the problem that the liquid of drippage easily spills over from the lid and causes the burnishing machine to report to the police and shut down on the wafer, reduces the frequency that the burnishing machine was reported to the police and is shut down, guarantees the normal operating of burnishing machine. The technical scheme is as follows:

in a first aspect, an embodiment of the application provides an anti-overflow structure of polishing machine, anti-overflow structure includes the lid, sets up anti-overflow tank and at least one guiding gutter on the lid, the guiding gutter is located anti-overflow tank one side is followed and is close to anti-overflow tank direction, the degree of depth grow gradually of guiding gutter.

In the anti-overflow structure of the polishing machine, the depth of the water chute is gradually increased, the water chute is obliquely arranged on the bottom surface of the water chute, liquid drops into the water chute and flows downwards into the anti-overflow chute under the action of gravity, and in the process, the water chute plays a role in guiding the flow to provide acceleration for the liquid flowing downwards so as to promote the liquid to enter the anti-overflow chute, so that the liquid drops flow into the anti-overflow chute, the possibility of convergence before the liquid enters the anti-overflow chute is reduced, and the situation that a plurality of liquid drops directly overflow from the cover body after being gathered is prevented; the water chute guides liquid to the anti-overflow groove, the anti-overflow groove has a limiting effect on the liquid, the liquid flows in the anti-overflow groove after being gathered in the anti-overflow groove, the possibility that the liquid directly overflows the cover body can be reduced, the problem that the polishing machine is alarmed to be stopped due to the fact that the liquid easily overflows from the cover body is effectively solved, the frequency of alarming and stopping of the polishing machine is reduced, and the normal operation of the polishing machine is guaranteed.

In some embodiments, the top surface of the cover body includes a first inclined surface and a second inclined surface, the first inclined surface is a bottom surface of the water chute, the water chute is arranged in the second inclined surface, along a direction close to the overflow preventing groove, the height of the first inclined surface and the height of the second inclined surface both gradually decrease, and the gradient of the first inclined surface is greater than the gradient of the second inclined surface.

Based on the above embodiment, the slope of the bottom surface of the water guide groove is increased to be larger than that of the second inclined surface, so that the tendency of water drops to flow downwards is increased, and the water drops drip to the anti-overflow groove.

In some embodiments, the overflow preventing groove includes a strip-shaped groove located on the top surface of the cover body, and all the water guiding grooves are located on one side of the strip-shaped groove to guide the liquid to the strip-shaped groove.

Based on the embodiment, because the appearance of the cover body is not obviously different, the reverse installation is very easy to happen during the installation, and therefore all the water guide grooves are arranged on one side of the strip-shaped groove to distinguish the left side and the right side of the cover body, and the condition that the polishing machine is stopped due to operation errors after the reverse installation is avoided.

In some of these embodiments, the slope of the first ramp is between 10 ° and 15 °.

Based on the above embodiment, when the slope of the first inclined plane is less than 10 degrees, the liquid cannot resist the adhesive force of the cover body, the liquid can not directly flow downwards to the anti-overflow groove when dropping to the first inclined plane, and the liquid can easily converge before entering the anti-overflow groove, when the slope of the first inclined plane is greater than 15 degrees, the liquid can slide downwards at a higher acceleration rate and easily rush out of the anti-overflow groove, so that equipment below the cover body is wetted, and the polishing machine is alarmed to stop, therefore, the slope of the first inclined plane is most appropriate at 10 degrees to 15 degrees, so that the liquid can be promoted to flow downwards to the anti-overflow groove, and the liquid can be prevented from excessively rushing out of the anti-overflow groove due to the overlarge acceleration rate.

In some of these embodiments, the vertical depth of the end of the water chute remote from the spill proof trough is greater than 10 mm.

Based on the embodiment, the splashing can occur when the liquid drops, and the depth of the water guide groove is set to be larger than 10mm, so that the liquid can be prevented from splashing outside the water guide groove.

In some of these embodiments, the smoothness of the first beveled surface is greater than the smoothness of the second beveled surface.

Based on the embodiment, the smoothness of the first inclined surface of the water guide groove is improved, so that liquid can quickly flow downwards to the anti-overflow groove after dropping to the water guide groove, and the possibility of the liquid gathering before flowing to the anti-overflow groove is reduced.

In some embodiments, the spill-proof structure further comprises a baffle plate, and the baffle plate is arranged on the cover body and is positioned on one side of the spill-proof groove far away from the water chute.

Based on the above embodiment, the baffle is added to add a heavy anti-overflow measure, and the baffle has a blocking effect on the liquid flowing downwards, so that the liquid is prevented from directly rushing out of the cover body when flowing downwards.

In some of these embodiments, the height of the top end of the baffle is greater than the height of the top surface of the cover.

Based on the embodiment, the height of the baffle is higher than that of the cover body, so that the baffle can block liquid flowing downwards from the cover body, and the liquid is prevented from directly rushing out of the cover body when flowing downwards.

In some embodiments, the length of the baffle is greater than or equal to the length of the water chute along the direction parallel to the extension direction of the strip-shaped chute.

Based on the above embodiment, the length of the baffle plate is at least equal to the length of the water chute to further block the liquid from rushing out of the cover body.

In a second aspect, the embodiment of the present application provides a polishing machine, polishing machine includes wiper mechanism, wafer conveying mechanism and stoving mechanism, wafer conveying mechanism be used for with the wafer is followed wiper mechanism carries extremely stoving mechanism department is dried, polishing machine still includes above-mentioned embodiment the anti-overflow structure, the lid is located wiper mechanism with between the conveying mechanism.

Based on burnishing machine in this application embodiment, before the wafer was carried to drying mechanism from wiper mechanism, the liquid that drips was caught by the lid, via the guiding gutter water conservancy diversion, and give the acceleration of a downward flow of liquid through the guiding gutter, impel liquid to get into the anti-overflow groove, make the flow of liquid one drip to the anti-overflow inslot, reduce the possibility that takes place to assemble before liquid gets into the anti-overflow groove, and then prevent that the condition that many drops of liquid gathering are direct to spill over from the lid from taking place, effectively solve liquid and easily spill over from the lid and cause the problem that the burnishing machine was reported to the police and is shut down, reduce the frequency that the burnishing machine was reported to the police and is shut down, guarantee the normal operating of burnishing machine.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic structural view of an anti-overflow structure provided in an embodiment of the present application;

FIG. 2 is a schematic structural view of a spill prevention structure according to another embodiment of the present application;

FIG. 3 is a schematic structural view of a spill prevention structure according to another embodiment of the present application;

FIG. 4 is a schematic structural view of a spill prevention structure according to another embodiment of the present application;

FIG. 5 is a schematic structural view of a spill prevention structure according to yet another embodiment of the present application;

FIG. 6 is a schematic structural view of a spill prevention structure according to yet another embodiment of the present application;

FIG. 7 is a schematic structural view of a spill prevention structure according to yet another embodiment of the present application;

FIG. 8 is a schematic structural view of a spill prevention structure provided in another embodiment of the present application;

FIG. 9 is a schematic structural view of a spill prevention structure provided in another embodiment of the present application;

FIG. 10 is a top view of FIG. 1;

FIG. 11 is a cross-sectional view of FIG. 1;

fig. 12 is a schematic structural diagram of a polishing machine according to an embodiment of the present application.

Reference numerals: 1. polishing the machine; 10. an anti-overflow structure; 100. a cover body; 110. an anti-overflow groove; 111. a strip-shaped groove; 120. a water chute; 130. a first inclined plane; 140. a second inclined plane; 150. a baffle plate; 20. a cleaning mechanism; 30. a drying mechanism; 40. a cleaning tank; 50. and a baffle plate.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the application, as detailed in the appended claims.

The polishing machine in the prior art comprises a cleaning mechanism, a wafer conveying mechanism, a drying mechanism and the like, wherein wafers are conveyed to the drying mechanism through the wafer conveying mechanism to be dried after being cleaned, liquid on the wafers drops onto the cover body in the conveying process of the wafers by the wafer conveying mechanism, the water drops are gathered and overflow the cover body, parts below the cover body are easily wetted, and the polishing machine is stopped by alarming.

In order to solve the above problem, referring to fig. 1 and fig. 2, in a first aspect, an embodiment of the present application provides an anti-overflow structure 10 of a polishing machine 1, where a cover body 100 has an anti-overflow groove 110 and at least one water chute 120, which can effectively solve the problem that liquid dripping on a wafer easily overflows from the cover body 100 to cause alarm shutdown of the polishing machine, reduce the frequency of alarm shutdown of the polishing machine 1, and ensure normal operation of the polishing machine 1, where only one anti-overflow structure 10 is not limited, the anti-overflow structure 10 may be provided with one or more regions, where the liquid drips onto the cover body 100 is a dripping region, and when the dripping region is provided with a plurality of regions and is arranged at intervals, when one anti-overflow structure 10 cannot completely solve the overflow problem, the number of the anti-overflow structures 10 may be increased or decreased according to actual use conditions.

Referring to fig. 2 and 12, in one embodiment, the cover body 100 has liquid dripping in two regions A, B, and two spill-preventing structures 10 are provided, the two spill-preventing structures 10 being used for dredging A, B liquid in the two regions, respectively, and the spill-preventing grooves 110 of the two spill-preventing structures 10 can be communicated with each other, see fig. 3 and 4. In another modification, referring to fig. 12, since the polishing machine 1 is provided with two cleaning boxes 40 at a side close to the area B, and a barrier 50 is provided between the two cleaning boxes 40, the barrier 50 interferes with a side wall of the cover 100 close to the barrier 50 to prevent the liquid from overflowing from the side of the cover 100 close to the barrier 50, so that only the possibility that the liquid in the area a overflows from the cover 100 needs to be considered, and at this time, only one overflow preventing structure 10 needs to be provided. The following is a detailed description of the provision of the spill prevention structure 10.

Referring to fig. 1 and 5, the anti-overflow structure 10 includes a cover body 100, an anti-overflow groove 110 disposed on the cover body 100, and at least one water chute 120, the water chute 120 is communicated with the anti-overflow groove 110, a top surface of the cover body 100 may be a flat surface (as shown in fig. 1) or may be an inclined surface (as shown in fig. 5), the water chute 120 is disposed on one side of the anti-overflow groove 110, and a depth of the water chute 120 gradually increases along a direction approaching the anti-overflow groove 110. The anti-overflow structure 10 is provided according to the liquid dropping area, and extends one end of the water chute 120 to the liquid dropping area and covers the liquid dropping area so that the liquid directly drops to the water chute 120, and the other end extends toward the anti-overflow chute 110 to guide the dropped liquid to the anti-overflow chute 110.

In the anti-overflow structure 10 of the polishing machine 1 according to the embodiment of the present application, along the direction close to the anti-overflow groove 110, the depth of the water guiding groove 120 gradually increases, that is, the water guiding groove 120 is obliquely disposed on the bottom surface, and after the liquid drops into the water guiding groove 120, the liquid flows downward into the anti-overflow groove 110 under the action of its own gravity, in this process, the water guiding groove 120 plays a role in guiding the liquid, and the liquid has an acceleration of flowing downward, so that the liquid flows into the anti-overflow groove 110, the possibility of convergence occurring before the liquid enters the anti-overflow groove 110 is reduced, and further, the occurrence of a situation that a plurality of drops of liquid dropping from the wafer directly overflow from the cover body 100 after being converged on the cover body 10 is prevented; the water chute 120 guides the liquid to the anti-overflow trough 110, the anti-overflow trough 110 has a limiting effect on the liquid, and the liquid flows in the anti-overflow trough 110 after being collected in the anti-overflow trough 110, so that the possibility that the liquid directly overflows the cover body 100 can be reduced, the problem that the polishing machine is alarmed to be stopped because the liquid easily overflows from the cover body 100 is effectively solved, the frequency of alarming and stopping of the polishing machine 1 is reduced, and the normal operation of the polishing machine 1 is ensured.

Referring to fig. 1 and 6, in particular, at least one water chute 120 is provided, that is, one, two or more water chutes 120 may be provided. Referring to fig. 6 and 7, in some embodiments, the number of the water chutes 120 is multiple, and ends of the water chutes 120 away from the overflow preventing slot 110 may be communicated with each other (as shown in fig. 7) or disposed at intervals (as shown in fig. 6), and the shape of the water chute 120 is not limited, and the water chute 120 may be designed to be a long strip, a curved shape, or other shapes of chutes in the prior art.

Referring to fig. 6, 8 and 9, when the number of the water chutes 120 exceeds one, the water chutes 120 may be arranged in parallel with each other (as shown in fig. 6), or the water chutes 120 may be arranged in a diverging manner (as shown in fig. 8 or 9), and the closer to the anti-overflow chute 110, the greater the distance between the adjacent water chutes 120 is, so as to guide the liquid dropping from the wafer to all positions of the anti-overflow chute 110.

The shape of the overflow preventing groove 110 is not limited, and the overflow preventing groove 110 may be a single groove, or may be a groove having corners, such as an L-shape, a U-shape, or a mouth-shape, and the overflow preventing groove 110 may be designed to be straight or curved in part.

Referring to fig. 5, further, the top surface of the cover body 100 includes a first inclined surface 130 and a second inclined surface 140, the first inclined surface 130 is a bottom surface of the water chute 120, the water chute 120 is opened in the second inclined surface 140, the height of the first inclined surface 130 and the height of the second inclined surface 140 are gradually reduced along a direction close to the overflow preventing slot 110, and the slope of the first inclined surface 130 is greater than the slope of the second inclined surface 140. By increasing the slope of the bottom surface of the water guide groove 120, i.e., the first slope surface 130, to be greater than the slope of the second slope surface 140, the tendency of water droplets to flow downward is increased, and the water droplets are converged to the overflow preventing groove 110.

Referring to fig. 1 and 11, the overflow preventing groove 110 further includes a strip groove 111 located on the top surface of the cover body 100, and all the water guiding grooves 120 are located on one side of the strip groove 111 to guide the liquid to the strip groove 111. When the overflow preventing grooves 110 are formed at the four edges of the cover body 100 to form a square shape, the water guiding grooves 120 are distributed in a bilateral symmetry manner, the left and right sides of the cover body 100 are not obviously distinguished, and left and right reverse installation is easy to occur during installation, so that all the water guiding grooves 120 are arranged at one side of the strip-shaped groove 111, for example, the left side shown in fig. 6, to distinguish the left and right sides of the cover body 100, and the condition that the operation of the polishing machine 1 is mistakenly stopped after reverse installation is avoided.

Further, the slope of the bottom surface of the water chute 120, i.e., the first slope 130, is 10 ° to 15 °. When the gradient of the bottom surface of the water chute 120 is less than 10 degrees, the liquid cannot resist the adhesive force of the first inclined surface 130 to the liquid, the liquid cannot directly flow downwards to the overflow prevention groove 110 after dropping to the first inclined surface 130, and the liquid is easy to converge before entering the overflow prevention groove 110, when the gradient of the bottom surface of the water chute 120 is greater than 15 degrees, the liquid has a large downward sliding acceleration and is easy to rush out of the overflow prevention groove 110, and the device below the cover body 100 is wetted, so that the polishing machine 1 is alarmed to stop, therefore, the gradient of the bottom surface of the water chute 120 is more appropriate between 10 degrees and 15 degrees, which not only can promote the liquid to flow downwards to the overflow prevention groove 110, but also can prevent the liquid from excessively rushing out of the overflow prevention groove 110 due to the excessive acceleration.

Specifically, the width of the water chute 120 is adapted to the size of the polishing machine, and in one embodiment, the width D1 of the water chute 120 is greater than or equal to 4cm in a direction perpendicular to the extending direction of the water chute 120. The width of the liquid dropping area of the wafer is about 4cm, and the width of the water chute 120 is greater than or equal to 4cm, so that all the dropped liquid can be guaranteed to be received and guided to the anti-overflow chute 110.

Further, the vertical depth D2 of the end of the water chute 120 away from the overflow prevention groove 110 is more than 10 mm. The splashing of the liquid can occur when the liquid drops, and the depth of the water chute 120 is set to be more than 10mm, so that the liquid can be prevented from splashing to the outside of the water chute 120.

Further, the smoothness of the first inclined surface 130 is greater than that of the second inclined surface 140, so that the liquid can rapidly flow down to the overflow preventing groove 110 after dropping on the first inclined surface 130 of the water guiding groove 120, and the possibility of the liquid accumulating before flowing to the overflow preventing groove 110 is reduced.

Further, the anti-overflow structure 10 further includes a baffle 150, the baffle 150 is disposed on the cover body 100 and located on a side of the anti-overflow groove 110 away from the water chute 120, so that an anti-overflow measure is added through the baffle 150, the baffle 150 has a blocking effect on the liquid flowing downwards to the strip-shaped groove 111, and the liquid is prevented from directly rushing out of the strip-shaped groove 111 when flowing downwards to the strip-shaped groove 111.

Further, the height of the top end of the baffle 150 is greater than the height of the top surface of the cover body 100, and the height of the baffle 150 is greater than the height of the cover body 100, so that the baffle can block liquid flowing downwards from the cover body 100, and the liquid is prevented from directly rushing out of the cover body 100 when flowing downwards.

Further, the length of the baffle 150 is greater than or equal to the length of the water chute 120 in the extending direction of the parallel strip-shaped groove 111. The length of the baffle 150 is at least equal to the length of the chute 120 to further block the liquid from rushing out of the cover 100.

Referring to fig. 12, in a second aspect, the embodiment of the present application provides a polishing machine 1, where the polishing machine 1 includes a cleaning mechanism 20, a wafer conveying mechanism and a drying mechanism 30, the wafer conveying mechanism is used for conveying the wafer from the cleaning mechanism 20 to the drying mechanism 30 for drying, the polishing machine 1 further includes the anti-overflow structure 10 of the above embodiment, and the cover body 100 is located between the cleaning mechanism 20 and the wafer conveying mechanism.

Based on the polishing machine 1 in the embodiment of the present application, before the wafer is conveyed from the cleaning mechanism 20 to the drying mechanism 30, the dropped liquid is caught by the cover body 100, guided by the water chute 120, and is given a downward flowing acceleration through the water chute 120, so as to promote the liquid to enter the anti-overflow tank 110, so that the liquid drops flow into the anti-overflow tank 110, thereby reducing the possibility of aggregation before the liquid enters the anti-overflow tank 110, further preventing the situation that multiple drops aggregate and directly overflow from the cover body 100, effectively solving the problem of alarm shutdown caused by the easy overflow of the liquid from the cover body 100, reducing the frequency of alarm shutdown of the polishing machine 1, and ensuring the normal operation of the polishing machine 1.

In the description of the present application, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art. Further, in the description of the present application, "a plurality" means two or more unless otherwise specified. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present application and is not to be construed as limiting the scope of the present application, so that the present application is not limited thereto, and all equivalent variations and modifications can be made to the present application.

Claims (10)

1. The anti-overflow structure of the polishing machine is characterized by comprising a cover body, an anti-overflow groove and at least one water guide groove, wherein the anti-overflow groove and the at least one water guide groove are arranged on the cover body, the water guide groove is arranged on one side of the anti-overflow groove, and the depth of the water guide groove is gradually increased along the direction close to the anti-overflow groove.

2. The anti-overflow structure of a polishing machine according to claim 1, wherein the top surface of the cover body comprises a first inclined surface and a second inclined surface, the first inclined surface is a bottom surface of the water chute, the water chute is arranged in the second inclined surface, the height of the first inclined surface and the height of the second inclined surface both gradually decrease along a direction close to the anti-overflow chute, and the gradient of the first inclined surface is greater than the gradient of the second inclined surface.

3. The overflow preventing structure of a polishing machine according to claim 2, wherein the overflow preventing groove comprises a strip-shaped groove located on the top surface of the cover body, and all the water guiding grooves are located on one side of the strip-shaped groove to guide the liquid to the strip-shaped groove.

4. The overflow preventing structure of a polishing machine according to claim 2, wherein the slope of the first slope is 10 ° to 15 °.

5. The overflow preventing structure of a polishing machine according to claim 1, wherein a vertical depth of an end of the water chute away from the overflow preventing groove is greater than 10 mm.

6. The overflow preventing structure of a polishing machine according to claim 2, wherein the smoothness of the first slope is greater than the smoothness of the second slope.

7. The anti-overflow structure of a polishing machine according to claim 3, further comprising a baffle plate disposed on the cover body at a side of the anti-overflow groove away from the water chute.

8. The overfill prevention structure of claim 7, wherein said baffle has a top height greater than a height of said top surface of said cover.

9. The overflow preventing structure of a polishing machine according to claim 8, wherein the length of the baffle plate is greater than or equal to the length of the water chute in a direction parallel to the extending direction of the strip-shaped chute.

10. A polishing machine comprising a cleaning mechanism, a wafer conveying mechanism and a drying mechanism, wherein the wafer conveying mechanism is used for conveying the wafers from the cleaning mechanism to the drying mechanism for drying, and the polishing machine further comprises an anti-overflow structure according to any one of claims 1 to 9, and the cover body is positioned between the cleaning mechanism and the wafer conveying mechanism.

Images