CN216015097U - Double-sided metallized film capacitor - Google Patents
Double-sided metallized film capacitor Download PDFInfo
- Publication number
- CN216015097U CN216015097U CN202121077443.2U CN202121077443U CN216015097U CN 216015097 U CN216015097 U CN 216015097U CN 202121077443 U CN202121077443 U CN 202121077443U CN 216015097 U CN216015097 U CN 216015097U
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- CN
- China
- Prior art keywords
- film
- layer
- double
- metallized film
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000011104 metalized film Substances 0.000 title claims abstract description 41
- 239000003990 capacitor Substances 0.000 title claims abstract description 29
- 239000010408 film Substances 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 238000007738 vacuum evaporation Methods 0.000 claims description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000002985 plastic film Substances 0.000 abstract description 2
- 229920006255 plastic film Polymers 0.000 abstract description 2
- 238000001465 metallisation Methods 0.000 description 6
- 238000007599 discharging Methods 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The utility model relates to the technical field of manufacturing of metallized film capacitors, in particular to a double-sided metallized film capacitor, which comprises a film chip, a gold-sprayed layer, electrode leads and an encapsulating layer. The utility model has the beneficial effects that: because the double-sided metallized plastic film has strong current bearing capacity which is 2.0 times that of the single-sided metallized film, the temperature of the working environment of the capacitor is improved, and the electric strength is improved; the product is not easy to generate heat, short circuit and the like when used in a high-temperature environment, the working reliability of the product is improved, and the service life of the product is prolonged.
Description
Technical Field
The utility model relates to the technical field of manufacturing of metallized film capacitors, in particular to a metallized film capacitor which is made of a double-sided metallized film capacitor chip and has high electric strength and high temperature resistance.
Background
The metallized film capacitor has a very wide application range, and mainly has the functions of charging and discharging and storing electric energy; the current of charging and discharging directly passes through the metallized film capacitor, if the electrode lead of the metallized film capacitor is connected with the film chip with large resistance, the current locally generates heat at the junction of the electrode lead and the film chip, so that the temperature of the film chip body is instantly increased, and the dielectric strength between films is reduced; when the metallized film capacitor works at a high temperature state for a long time, the body is easy to deform and the voltage breakdown and explosion occur, so that the metallized film capacitor directly fails. The metallized film capacitor has many reasons for the functional failure, but most of them are caused by the high temperature thermal breakdown of the film chip body. After the metallized film capacitor fails, the functions of charging, discharging and storing electric energy correspondingly fail, so that a plurality of circuits fail to work normally due to failure.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a double-sided metalized film capacitor aiming at the prior technical situation. By optimizing the structure of the metallized film, the temperature resistance of the metallized film capacitor is improved, so that the service life is prolonged.
The double-sided metalized film capacitor comprises a film chip, a gold-sprayed layer, electrode leads and an encapsulating layer, wherein the upper surface and the lower surface of the film chip are coated with metalized films through vacuum evaporation, the two ends of the film chip are respectively provided with electrode copper leads, the electrode copper leads at the two ends are connected with the gold-sprayed layer of the film chip after being welded through soldering tin, and the encapsulating layer is wrapped on the periphery of the film chip.
Specifically, the thickness of the metallized film is 0.01-0.017 umm.
Specifically, the film chips are stacked together, the film chips of the first, third and sixth layers are not plated with metal layers, the two surfaces of the film chips of the second and fifth layers are both plated with metal layers at two sides and the middle is left empty and is not plated, and the upper surfaces of the film chips of the fourth and seventh layers are both plated with metal layers.
The utility model has the beneficial effects that: because the double-sided metallized plastic film has strong current bearing capacity (2.0 times of that of a single-sided metallized film), the temperature of the working environment of the capacitor is improved (85 ℃ for single-sided metallization and 110 ℃ for double-sided metallization), and the dielectric strength is improved (630 VDC for single-sided metallization and 2000VDC for double-sided metallization); the product is not easy to generate heat, short circuit and the like when used in a high-temperature environment, the working reliability of the product is improved, and the service life of the product is prolonged (more than 30000 hours); through the structure of analysis metallization film capacitor, a large amount of practical application tests verify simultaneously, this kind can bear the two-sided metallization film capacitor of heavy current for it can last work on high temperature environment, high voltage circuit, thereby has possessed longer life and has obtained better application market.
Drawings
FIG. 1 is a perspective view of the present invention.
Description of the labeling: the film chip comprises a film chip 1, a gold spraying layer 2, an electrode lead 3, a metalized film 4 and an encapsulating layer 5.
Detailed Description
The drawings are for illustrative purposes only and are not to be construed as limiting the patent; for the purpose of better illustrating the embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted. The positional relationships depicted in the drawings are for illustrative purposes only and are not to be construed as limiting the present patent.
As shown in fig. 1, a double-sided metallized film capacitor includes: the device comprises a thin film chip, a gold spraying layer, an electrode lead and an encapsulating layer; the upper surface and the lower surface of the film chip are coated with a metallized film through vacuum evaporation, electrode copper leads are respectively arranged at two ends of the film chip, the electrode copper leads at the two ends are connected with a gold spraying layer of the film chip after being welded through soldering tin, and an encapsulating layer wraps the periphery of the film chip.
According to the scheme, the thickness of the metalized film is 0.01-0.017umm, the film chips are stacked together, the film chips on the first layer, the third layer and the sixth layer are not plated with metal layers, the two surfaces of the film chips on the second layer and the fifth layer are both plated with metal layers on two sides, a space is left between the two surfaces of the film chips on the second layer and the fifth layer, and the upper surfaces of the film chips on the fourth layer and the seventh layer are both plated with metal layers. The metallized film is manufactured by a vacuum evaporation method, the whole evaporation process is in a high vacuum state, and metal coatings are combined together through chemical adsorption.
The utility model mainly aims to provide a double-sided metalized film capacitor which can bear heavy current, has good temperature resistance and can continuously work on a high-voltage line, and can effectively overcome the defects of small current resistance, poor temperature resistance, short service life and the like in the practical application of a common single-sided metalized film capacitor in the market.
The purpose realization principle of the utility model is as follows: a metallized film capacitor with high electric strength and high temperature resistance manufactured by a double-sided metallized film capacitor chip mainly comprises the metallized film chip, two-end electrode copper leads, a gold spraying layer and an encapsulating layer; the metallized film chip is made into a double-sided metallized film, and the carrying current of the metallized film chip is twice that of the common single-sided metallized film.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (3)
1. A double-sided metallized film capacitor comprising: film chip, spout gold layer, electrode lead and encapsulated layer, its characterized in that: the upper surface and the lower surface of the film chip are coated with a metallized film through vacuum evaporation, electrode copper leads are respectively arranged at two ends of the film chip, the electrode copper leads at the two ends are connected with a gold spraying layer of the film chip after being welded through soldering tin, and an encapsulating layer wraps the periphery of the film chip.
2. The double-sided metallized film capacitor of claim 1, wherein: the thickness of the metallized film is 0.01-0.017 umm.
3. A double-sided metallized film capacitor as claimed in claim 1 or 2, characterized in that: the thin film chips are stacked together, the thin film chips of the first layer, the third layer and the sixth layer are not plated with metal layers, the two surfaces of the thin film chips of the second layer and the fifth layer are both plated with metal layers at two sides and the middle part is left empty and not plated, and the upper surfaces of the thin film chips of the fourth layer and the seventh layer are both plated with metal layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121077443.2U CN216015097U (en) | 2021-05-19 | 2021-05-19 | Double-sided metallized film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121077443.2U CN216015097U (en) | 2021-05-19 | 2021-05-19 | Double-sided metallized film capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216015097U true CN216015097U (en) | 2022-03-11 |
Family
ID=80523822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121077443.2U Expired - Fee Related CN216015097U (en) | 2021-05-19 | 2021-05-19 | Double-sided metallized film capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216015097U (en) |
-
2021
- 2021-05-19 CN CN202121077443.2U patent/CN216015097U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220311 |