CN216014775U - Integrated circuit, LED display screen and electronic equipment - Google Patents

Integrated circuit, LED display screen and electronic equipment Download PDF

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Publication number
CN216014775U
CN216014775U CN202121079906.9U CN202121079906U CN216014775U CN 216014775 U CN216014775 U CN 216014775U CN 202121079906 U CN202121079906 U CN 202121079906U CN 216014775 U CN216014775 U CN 216014775U
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line pattern
circuit
independent
led
integrated circuit
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习宜平
田雨洪
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Jiangxi Xinfei New Material Co ltd
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Jiangxi Zhanyao Microelectronics Co ltd
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Abstract

The application discloses integrated circuit, LED display screen and electronic equipment belongs to circuit technical field. The integrated circuit comprises a circuit substrate, and a positive circuit pattern, a grounding circuit pattern and a plurality of independent pads which are arranged on the same surface of the circuit substrate; the positive electrode circuit pattern, the grounding circuit pattern and the independent pads are arranged at intervals, the independent pads are arranged in a first direction, and any one of the independent pads is electrically connected with the positive electrode circuit pattern through a target resistor; the resistance value of the target resistance to which each of the plurality of independent pads is connected decreases in order along the first direction. According to the voltage divider, the voltage input into the positive line pattern can be divided through the target resistors respectively connected with the independent bonding pads, and the voltage of the electronic device connected to the independent bonding pads is kept the same, so that the difference existing in the working voltage of the electronic device welded to the independent bonding pads is reduced, and the display effect is improved.

Description

Integrated circuit, LED display screen and electronic equipment
Technical Field
The application relates to the technical field of circuits, in particular to an integrated circuit, an LED display screen and electronic equipment.
Background
With the rapid development of scientific technology, Light Emitting Diodes (LEDs) are used as fourth-generation Light sources, have the advantages of energy saving, environmental protection, small size, long service life, and the like, and are widely applied to various electronic and electrical products such as indicator lamps, display panels, liquid crystal displays, and general lighting lamps and decorative lighting lamps. In the LED integrated circuit, a plurality of LEDs are respectively connected in parallel and driven by constant current, so that the normal work of each LED is realized.
In the technical scheme, due to the parallel connection relationship of the LEDs, the current required by the corresponding parallel circuit can be reduced when the current in the circuit passes through one LED, so that the voltage difference among different LEDs is caused, and the display effect of the LEDs is reduced.
Disclosure of Invention
The embodiment of the application provides an integrated circuit, an LED display screen and electronic equipment, which can reduce the difference existing between the voltages of all LEDs and improve the display effect of the LEDs.
In one aspect, embodiments of the present application provide an integrated circuit including a circuit substrate, and a positive line pattern, a ground line pattern, and a plurality of independent pads disposed on a same side of the circuit substrate;
the anode line pattern, the grounding line pattern and the independent pads are arranged at intervals, the independent pads are arranged in a first direction, and any one of the independent pads is electrically connected with the anode line pattern through a target resistor;
the resistance value of the target resistance to which each of the plurality of independent pads is connected decreases in order along the first direction.
In an embodiment of the present application, an integrated circuit provided by the present application includes a circuit substrate, and a positive line pattern, a ground line pattern, and a plurality of independent pads disposed on a same surface of the circuit substrate; the positive electrode circuit pattern, the grounding circuit pattern and the independent pads are arranged at intervals, the independent pads are arranged in a first direction, and any one of the independent pads is electrically connected with the positive electrode circuit pattern through a target resistor; the resistance values of the target resistors connected with the independent bonding pads are sequentially reduced along the first direction, the voltage input into the positive line pattern is divided through the target resistors connected with the independent bonding pads, the voltage of the electronic device connected to the independent bonding pads is guaranteed to be the same, therefore, the difference in voltage when the electronic device welded to the independent bonding pads works is reduced, and the display effect is improved.
As an optional implementation manner, in an aspect of the embodiments of the present application, a plurality of signal line patterns are disposed between the positive electrode line pattern and the ground line pattern, the signal line patterns are separated from the positive electrode line pattern and the ground line pattern, and the signal line patterns are arranged at intervals along the first direction;
the signal line pattern is used for inputting a driving signal to a target circuit unit connected between each of the independent pads and the ground line pattern.
In the embodiment of the present application, the integrated circuit further includes a signal line pattern for inputting a driving signal to the target circuit unit between each independent pad and the ground line pattern, and the signal line pattern is separated from the positive electrode line pattern and the ground line pattern and is arranged in an isolated manner along the first direction, so that the target circuit unit can be independently controlled to be driven by the signal line pattern, and interference between circuits is reduced.
As an alternative implementation manner, in an aspect of the embodiments of the present application, the positive electrode line pattern and the ground line pattern are both long and have a length direction parallel to the first direction, and a first slit extending in the first direction is formed between the positive electrode line pattern and the ground line pattern;
the signal line pattern comprises a horizontal portion extending along the first direction, and a first bending portion and a second bending portion which are respectively arranged at two ends of the horizontal portion, the first bending portion extends towards the direction close to the grounding line pattern, the second bending portion extends towards the direction close to the anode line pattern, the horizontal portion is arranged at the first gap, a first notch used for accommodating the first bending portion is formed in the grounding line pattern, and a second notch used for accommodating the second bending portion is formed in the anode line pattern.
In this application embodiment, through carving out the signal line pattern that has first kink and second kink for the wholeness of signal line pattern and anodal line pattern, ground connection line pattern is better, and then practices thrift the metal on the circuit substrate.
As an optional implementation manner, in an aspect of the embodiment of the present application, the positive electrode circuit pattern is further formed with a plurality of third notches for accommodating the independent pads, and the plurality of independent pads are disposed in the plurality of third notches in a one-to-one correspondence manner.
In this application embodiment, through setting up each independent pad one-to-one in the third breach for each independent pad is better with anodal circuit pattern's wholeness, can practice thrift the metal on the circuit substrate.
As an optional implementation manner, in an aspect of the embodiments of the present application, the target circuit unit is an LED circuit unit, and the number of the target circuit units is at least two;
the first LED circuit unit comprises a voltage input port and a voltage output port, the voltage input port is electrically connected with the first independent bonding pad, the voltage output port is electrically connected with the grounding circuit pattern, the first LED circuit unit is any one of the LED circuit units, and the independent bonding pads connected with the voltage input ports of the at least two LED circuits are different.
In the embodiment of the application, the target circuit unit is an LED circuit unit, and different LED circuit units are connected to different independent pads, so that the voltage division effect of the target resistor connected to each independent pad in the integrated circuit is realized.
As an alternative implementation, in one aspect of the embodiments of the present application, the LED circuit unit includes an integrated circuit chip, an LED bulb, and a variable resistor;
the integrated circuit chip is connected with a first branch in parallel, and the first branch is formed by connecting the LED bulb and the variable resistor in series.
In the embodiment of the application, the LED circuit unit includes an integrated circuit chip, an LED bulb and a variable resistor, and the integrated circuit chip controls the display mode of the LED bulb, so that the practicability of the integrated circuit can be improved.
As an alternative implementation manner, in an aspect of the embodiments of the present application, each of the first notches and each of the second notches are respectively arranged along the first direction;
the first bent portion of the first signal circuit pattern is electrically connected with the second bent portion of the adjacent signal circuit pattern through the integrated circuit chip, and the first signal circuit pattern is any one of the signal circuit patterns.
In the embodiment of the present application, the first bending portion of the first signal line pattern is electrically connected to the second bending portion of the adjacent signal line pattern through the integrated circuit chip, so as to connect the signal line patterns, thereby improving the control force of the LED circuit unit soldered in the integrated circuit and facilitating the transmission of the driving signal.
As an optional implementation manner, in an aspect of the embodiment of the present application, the integrated circuit further includes a resistance adjustment device, where the resistance adjustment device is electrically connected to the target resistance electrically connected to each of the independent pads;
the resistance adjusting device is used for adjusting the resistance value of each target resistance.
In the embodiment of the application, the resistance value of each target resistor is adjusted by each resistor adjusting device, so that the integrated circuit can adjust the resistance value of each target resistor in the whole circuit, and the adaptability of the integrated circuit is improved.
In another aspect, the present application provides an LED display screen, which includes at least one integrated circuit as described in the above aspect.
In another aspect, the present application provides an electronic device including at least one LED display screen as described in the above aspect.
The technical scheme provided by the embodiment of the application can at least comprise the following beneficial effects:
in an embodiment of the present application, an integrated circuit provided by the present application includes a circuit substrate, and a positive line pattern, a ground line pattern, and a plurality of independent pads disposed on a same surface of the circuit substrate; the positive electrode circuit pattern, the grounding circuit pattern and the independent pads are arranged at intervals, the independent pads are arranged in a first direction, and any one of the independent pads is electrically connected with the positive electrode circuit pattern through a target resistor; the resistance values of the target resistors connected with the independent bonding pads are sequentially reduced along the first direction, the voltage input into the positive line pattern is divided through the target resistors connected with the independent bonding pads, the voltage of the electronic device connected to the independent bonding pads is guaranteed to be the same, therefore, the difference in voltage when the electronic device welded to the independent bonding pads works is reduced, and the display effect is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of a circuit structure of an LED parallel design according to an exemplary embodiment of the present application;
FIG. 2 is a schematic diagram of a hardware configuration of an exemplary embodiment of the present application relating to the parallel design of LEDs of FIG. 1;
FIG. 3 is a schematic diagram of an integrated circuit according to an exemplary embodiment of the present application;
FIG. 4 is a schematic diagram of an integrated circuit according to an exemplary embodiment of the present application;
FIG. 5 is a schematic diagram of another integrated circuit to which an exemplary embodiment of the present application relates;
fig. 6 is a schematic diagram of a structure of an LED circuit unit according to an exemplary embodiment of the present application;
FIG. 7 is a schematic diagram of an integrated circuit according to an exemplary embodiment of the present application;
FIG. 8 is a schematic diagram of an integrated circuit according to an exemplary embodiment of the present application;
fig. 9 is a schematic diagram of an integrated circuit according to an exemplary embodiment of the present application.
Description of reference numerals:
101-an LED circuit; 102-current input; 103-current output terminal; 201-positive electrode line pattern; 202-ground line pattern; 203-signal line pattern; 204-pad; 300-an integrated circuit; 301-a wiring substrate; 302-positive electrode line pattern; 303-ground line pattern; 304-independent pads; 305 — target resistance; 400-an integrated circuit; 401-a wiring substrate; 402-positive electrode line pattern; 403-ground line pattern; 404-independent pads; 405-target resistance; 406-signal line pattern; 407-a first slit; 406 a-horizontal portion; 406 b-a first bend; 406 c-a second bend; 403 a-first gap; 402 a-a second gap; 500-an integrated circuit; 501-a circuit substrate; 502-positive electrode line pattern; 503-ground line pattern; 504-independent pads; 505 — target resistance; 506-signal line pattern; 601-an integrated circuit chip; 602-LED light bulb; 603-variable resistance; 700-an integrated circuit; 701-voltage input; 702 — target resistance; 703-an LED circuit unit; 704-a voltage output; 800-an integrated circuit; 801-voltage input; 802 — target resistance; 803-LED circuit unit; 804-a voltage output terminal; 805-a resistance adjustment device; 901-positive line pattern; 902 a-free pad one; 902 b-independent pad two; 902c — positive pad three; 903 a-target resistance one; 903 b-target resistance two; 904 a-ground pad area one; 904 b-ground pad area two; 904 c-ground pad area three; 905 a-signal line pattern one; 905 b-signal line pattern two; 906-ground line pattern; 905a1 — first port of signal line pattern one; 905a2 — second port of signal line pattern one; 905b1 — first port of signal line pattern two; 905b2 — second port of signal line pattern two; 905c 1-first port of signal line pattern three.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.
Reference herein to "a plurality" means two or more. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.
It should be noted that the terms "first", "second", "third" and "fourth", etc. in the description and claims of the present application are used for distinguishing different objects, and are not used for describing a specific order. The terms "comprises," "comprising," and "having," and any variations thereof, of the embodiments of the present application, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The scheme provided by the application can be used in the process of adapting to different use scenes by switching the optical filters when the terminal used by people in daily life comprises the electromagnetic dual-optical-filter switcher, and for convenience of understanding, some terms and application architectures related to the embodiment of the application are briefly introduced below.
A Light Emitting Diode (LED) is a semiconductor device. The LED display board is used as an indicator light and a display LED board.
In daily life, an LED is called a fourth-generation illumination light source or a green light source, has the characteristics of energy conservation, environmental protection, long service life, small volume and the like, and is widely applied to the fields of various indications, display, decoration, backlight sources, general illumination, urban night scenes and the like. According to different use functions, the system can be divided into five categories of information display, signal lamps, vehicle lamps, liquid crystal display backlight sources and general illumination.
At present, in the design process of an LED circuit, a combination design is usually performed in a plurality of ways such as series connection and parallel connection, so that a user needs to be in a design form. Referring to fig. 1, a schematic circuit diagram of an LED parallel design according to an exemplary embodiment of the present application is shown. As shown in fig. 1, the LED circuits 101 are designed in parallel, and the current input terminal 102 and the current output terminal 103 can provide current to the parallel LED circuits.
In the circuit, a line resistor exists between each parallel circuit, and the magnitude of the line resistor is taken as R for example, and under the condition that N LED circuits are connected in parallel, the current is reduced by one I after passing through one LED circuit. In order to ensure that the rightmost LED circuit in fig. 1 operates normally, the current input terminal 102 needs to input N × I. The voltage at the first terminal a and the voltage at the second terminal B in fig. 1 are as follows:
V1=5-N*I*R-(N-1)*I*R-…-3*R*I-2*I*R-I*R=5-I*R*(N+1)*N/2;
V2=N*I*R-(N-1)*I*R-…-3*R*I-2*I*R-I*R=I*R*(N+1)*N/2;
then, V1-V2 is the voltage across the rightmost LED circuit in fig. 1, and if the value of 5-I × R (N +1) × N is not less than the lowest operating voltage of the LED circuit, the LED circuit can normally display, and if the value of 5-I × R (N +1) × N is less than the lowest operating voltage of the LED circuit, the LED circuit cannot normally display. As can be seen from 5-I × R (N +1) × N, the number N of parallel LED circuits and the constant current I, the line resistance R are factors affecting the voltage across the parallel LED circuits.
Referring to fig. 2, a schematic diagram of a hardware structure of an exemplary embodiment of the present application related to the parallel LED design of fig. 1 is shown. As shown in fig. 2, the integrated circuit includes a positive line pattern 201, a ground line pattern 202, a signal line pattern 203, and pads 204, the LED circuit is soldered between the positive line pattern and the ground line pattern through the pads 204, and a constant current is input into the positive line pattern to form a loop with the ground line pattern, thereby promoting normal light emission and operation of the LED circuit.
In the normal operation of the LED circuit shown in fig. 1 and 2, the positive circuit pattern connected to the LED circuit is integrated with the pad of the LED circuit, and the ground circuit pattern is also integrated with the pad of the LED circuit. Therefore, when the positive line pattern inputs constant current to each LED circuit with a fixed voltage, the voltage in each LED circuit is dropped by the previous LED circuit in the line, which causes the difference of the voltages of different LED lamp beads and affects the display effect of the LED.
To reduce the difference between the voltages in the LED circuits connected in parallel and improve the display effect, please refer to fig. 3, which shows a schematic structural diagram of an integrated circuit according to an exemplary embodiment of the present application. As shown in fig. 3, the integrated circuit 300 includes a wiring substrate 301, and a positive wiring pattern 302, a ground wiring pattern 303, and a plurality of independent pads 304 disposed on the same surface of the wiring substrate;
the positive electrode circuit pattern 302, the ground circuit pattern 303, and the plurality of independent pads 304 may be formed by engraving a metal layer on the circuit substrate 301, the positive electrode circuit pattern 302 may be used as an input terminal of a voltage positive electrode potential in the subsequent use, and the ground circuit pattern 303 may be used as an output terminal of the voltage negative electrode potential.
As shown in fig. 3, the positive electrode line pattern 302, the ground line pattern 303, and the plurality of independent pads 304 are disposed at intervals, the plurality of independent pads 304 are arranged along the first direction, and any one of the independent pads is electrically connected to the positive electrode line pattern 302 through the target resistor 305. The first direction may be a direction parallel to any one of the boundaries of the circuit substrate 301. For example, the first direction in fig. 3 described above is a direction along the length of the wiring substrate 301 (the direction indicated by an arrow in fig. 3).
The resistance value of the target resistor 305 connected to each of the plurality of independent pads 304 decreases in the first direction. The individual pads 304 may be used for soldering electric components such as a target circuit unit, for example, LED circuit components. Alternatively, the difference between the resistance values of the target resistors 305 respectively connected to the individual pads 304 may be a resistance value corresponding to the line resistance between two adjacent individual pads 304. When higher voltage is provided through the positive circuit pattern 302 in the integrated circuit, the target resistor 305 connected to each individual pad 304 can perform a voltage division effect, so as to ensure the normal operation of the welded target circuit unit, and further avoid the problem of voltage reduction caused by voltage attenuation between the parallel LED circuits.
In summary, in the embodiments of the present application, the integrated circuit provided in the present application includes a circuit substrate, and a positive circuit pattern, a ground circuit pattern and a plurality of independent pads disposed on the same surface of the circuit substrate; the positive electrode circuit pattern, the grounding circuit pattern and the independent pads are arranged at intervals, the independent pads are arranged in a first direction, and any one of the independent pads is electrically connected with the positive electrode circuit pattern through a target resistor; the resistance values of the target resistors connected with the independent bonding pads are sequentially reduced along the first direction, the voltage input into the positive line pattern is divided through the target resistors connected with the independent bonding pads, the voltage of the electronic device connected to the independent bonding pads is guaranteed to be the same, therefore, the difference in voltage when the electronic device welded to the independent bonding pads works is reduced, and the display effect is improved.
In a possible implementation manner, the integrated circuit is applied to the welding of the LED circuit unit, the plurality of independent pads can be respectively welded with the voltage input end in one LED circuit unit, and the voltage output end of the LED circuit unit is then welded with the pad on the grounding circuit pattern, so that when a voltage is provided in the positive circuit pattern, each structure forms a loop, and the LED circuit unit works normally.
Referring to fig. 4, a schematic diagram of an integrated circuit according to an exemplary embodiment of the present application is shown. The integrated circuit 400 includes a circuit substrate 401, and a positive electrode circuit pattern 402, a ground circuit pattern 403, and a plurality of independent pads 404 disposed on the same surface of the circuit substrate; the positive electrode circuit pattern 402, the grounding circuit pattern 403 and the independent pads 404 are arranged at intervals, the independent pads 404 are arranged along a first direction, and any one of the independent pads 404 is electrically connected with the positive electrode circuit pattern 402 through a target resistor 405; the resistance values of the target resistances 405 connected to the respective plurality of independent pads 404 decrease in order along the first direction.
Optionally, the circuit substrate 401 may be a Polyethylene Terephthalate (PET) base material, the positive electrode circuit pattern 402, the ground circuit pattern 403, and the plurality of independent pads 404 may be engraved from a metal layer on the PET base material, the positive electrode circuit pattern 402 may be used as an input terminal of a voltage positive electrode potential in the subsequent use, and the ground circuit pattern 403 may be used as an output terminal of a voltage negative electrode potential. The first direction may be a direction parallel to any one of the boundaries of the wiring substrate 401. For example, the first direction in fig. 4 described above is a direction along the length of the wiring substrate 401 (the direction indicated by an arrow in fig. 4).
As shown in fig. 4, a plurality of signal line patterns 406 are disposed between the positive line pattern 402 and the ground line pattern 403, the signal line patterns 406 are separated from the positive line pattern 402 and the ground line pattern 403, and the signal line patterns 406 are arranged at intervals along the first direction; the signal line pattern 406 is used to input a drive signal to the target circuit unit connected between each individual pad 404 and the ground line pattern 403. The driving signal is used to control the target circuit unit to operate.
That is, the signal line pattern 406 may be electrically connected to a signal input terminal and a signal output terminal of the target circuit unit, and input a driving signal into the target circuit unit, thereby controlling the target circuit unit to operate. For example, when the target circuit unit is an LED circuit unit, the integrated circuit chip in the LED circuit unit may be electrically connected to the signal line pattern 406, and after the integrated circuit chip receives the driving signal transmitted by the signal line pattern 406, the LED lamp bead in the LED circuit unit is controlled to operate.
Optionally, the positive electrode line pattern 402 and the ground line pattern 403 are both long strips, and the length direction is parallel to the first direction, and a first slit 407 extending along the first direction is formed between the positive electrode line pattern 402 and the ground line pattern 403; the signal line pattern 406 includes a horizontal portion 406a extending along a first direction, and a first bending portion 406b and a second bending portion 406c respectively disposed at two ends of the horizontal portion, the first bending portion 406b extends toward a direction close to the ground line pattern 403, the second bending portion 406c extends toward a direction close to the positive line pattern 402, the horizontal portion 406a is disposed at the first gap 407, the ground line pattern 403 has a first notch 403a for accommodating the first bending portion 406b, and the positive line pattern 402 has a second notch 402a for accommodating the second bending portion.
Optionally, as shown in fig. 4, each of the first gaps 403a and each of the second gaps 402a are also arranged along the first direction, the first bending portion of the first signal circuit pattern is electrically connected to the second bending portion of the adjacent signal circuit pattern through the integrated circuit chip, and the first signal circuit pattern is any one of the signal circuit patterns.
In fig. 4, the positive line pattern 402 and the ground line pattern 403 are both strip-shaped, two opposite patterns are formed after the positive line pattern 402 and the ground line pattern 403 are engraved on the circuit substrate, and the length directions of the positive line pattern 402 and the ground line pattern 403 are parallel to the first direction. The first bent portion 406b of the signal line pattern 406 may be regarded as a pad of the signal line pattern, the second bent portion 406c of the signal line pattern 406 may be regarded as another pad of the signal line pattern, optionally, the signal line pattern 406 may be welded to a signal input end in the LED circuit unit through the first bent portion 406b thereof, and the adjacent signal line pattern may be welded to a signal output end in the LED circuit unit through the second bent portion 406c thereof, so as to form a transmission loop of a driving signal, so that the LED circuit unit may receive the driving signal.
The signal line pattern may have other shapes, and the first bent portion and the second bent portion may or may not be provided during the manufacturing process. Referring to fig. 5, a schematic diagram of another integrated circuit according to an exemplary embodiment of the present application is shown. As shown in fig. 5, the integrated circuit 500 includes a wiring substrate 501, and a positive wiring pattern 502, a ground wiring pattern 503, a plurality of independent pads 504, a plurality of target resistances 505, and a signal wiring pattern 506 provided on the same surface of the wiring substrate. The circuit substrate 501, the positive circuit pattern 502, the ground circuit pattern 503, and the plurality of independent pads 504 can refer to the above-mentioned manner, and are not described herein again. The signal line pattern 506 has a long bar shape, both ends of which are not bent, and the positive electrode line pattern 502 and the ground line pattern 503 are not formed with the first notch and the second notch as shown in fig. 4, but both ends of the signal line pattern 506 may be formed as pad regions to be soldered to a target circuit unit to provide a driving signal, which is not limited in the embodiment of the present application.
Referring to fig. 4, optionally, the positive electrode circuit pattern 402 further forms a plurality of third notches 402b for accommodating the independent pads, and the independent pads are disposed in the third notches in a one-to-one correspondence. The third notch 402b is formed in the process of engraving the circuit substrate 401 to form the independent pad and the positive electrode circuit pattern 402. Alternatively, the second notch and the third notch may be integrally formed, that is, the second notch and the third notch may be one notch.
In the embodiment of the present application, the target circuit unit is an LED circuit unit, and the number of the target circuit units is at least two. For the first LED circuit unit, the first LED circuit unit includes a voltage input port and a voltage output port, the voltage input port is electrically connected to the first independent pad, the voltage output port is electrically connected to the ground line pattern 403, and the independent pads to which the respective voltage input ports of the respective LED circuits are connected are different. The first LED circuit unit is any one of at least two LED circuit units. That is, the LED circuit unit is welded to the first independent pad through its own voltage input port, and the LED circuit unit is electrically connected to the ground line pattern 403 through its own voltage output port to form a circuit loop, so that the LED circuit can be turned on.
Optionally, one end of the ground line pattern 403 corresponding to the first notch has a ground pad region 403b, and the ground pad region 403b is used for being soldered to a voltage output port of the LED circuit unit to which an independent pad in the third notch in a corresponding position is soldered. The LED lamp beads are welded with the first independent bonding pads through the voltage input ports of the LED lamp beads, and are welded with the grounding bonding pad areas 403b, corresponding to the third gaps where the first independent bonding pads are located, of the grounding circuit patterns 403 through the voltage output ports of the LED lamp beads, so that a circuit loop is formed, and the LED circuit can be conducted.
In a possible implementation mode, the LED lamp beads of the LED circuit units can adopt three-color LED lamp beads, in a normal display process, the LED lamp beads need to be controlled by an integrated circuit chip to display, and after the integrated circuit chip receives a driving signal transmitted by a signal circuit pattern, how the three-color LED lamp beads display is controlled by the driving signal. Optionally, the LED circuit unit may include an integrated circuit chip, an LED bulb, and a variable resistor; the integrated circuit chip is connected with a first branch in parallel, and the first branch is formed by connecting the LED bulb and the variable resistor in series.
Referring to fig. 6, a schematic diagram of a structure of an LED circuit unit according to an exemplary embodiment of the present application is shown. As shown in fig. 6, the integrated circuit chip 601, the LED light bulb 602 and the variable resistor 603 are included. The first branch is formed by connecting the LED bulb and the variable resistor in series, and the integrated circuit chip 601 is connected to the first branch in parallel. The LED circuit unit shown in fig. 6 may be integrated into an electronic device including several pins, and an integrated circuit including an LED circuit is formed by soldering each pin to the positive wiring pattern, the ground wiring pattern, and the independent pad.
Referring to fig. 7, a theoretical circuit diagram of an integrated circuit according to an exemplary embodiment of the present application is shown. As shown in fig. 7, the integrated circuit 700 includes a voltage input terminal 701, a target resistor 702, an LED circuit unit 703, and a voltage output terminal 704. Fig. 7 is a circuit diagram of an equivalent circuit after the integrated circuit shown in fig. 4 is soldered to the LED circuit units, where when a voltage of 7V is input to the voltage input terminal 701, the target resistor 702 can perform a voltage dividing effect in the circuit, where if the LED circuit unit 703 needs to use a voltage of 5V, the resistance value of the target resistor 702 installed by a developer at this point can be a resistance value for dividing 2V, if the voltage is attenuated by 0.1V in the positive electrode circuit pattern after passing through the adjacent LED circuit units, the resistance value of the target resistor connected to the LED circuit unit at the second point can be a resistance value for dividing 1.9V, and so on, the resistance values of the target resistors are sequentially reduced until the last LED circuit unit can also work normally.
In a possible implementation manner, the target resistance to which each of the individual pads is connected is a variable resistance, and the integrated circuit further includes a resistance adjusting device electrically connected to the target resistance to which each of the individual pads is electrically connected.
Referring to fig. 8, a theoretical circuit diagram of an integrated circuit according to an exemplary embodiment of the present application is shown. As shown in fig. 8, a voltage input terminal 801, a target resistor 802, an LED circuit unit 803, a voltage output terminal 804, and a resistance adjusting device 805 are included in an integrated circuit 800. The resistance adjusting device is electrically connected with the target resistors electrically connected with the independent bonding pads in parallel, and under the condition that the integrated circuit is provided with the controller, the resistance adjusting device can adjust the resistance values of the target resistors connected in parallel according to the voltage intensity by receiving the voltage intensity sent by the controller. Alternatively, the controller may be used to control the magnitude of the voltage provided by the positive line pattern in the integrated circuit.
For example, in fig. 8, when the integrated circuit inputs a voltage of 7V through the voltage input terminal 801, the target resistance of the first LED circuit unit is R1Target resistance connected to the second LED circuit unitSize R2When the voltage input by the integrated circuit via the voltage input terminal 801 is adjusted from 7V to 8V, each resistance adjustment device 805 can know that the voltage input by the voltage input terminal 801 is 8V, and each resistance adjustment device 805 adjusts the target resistance connected to itself, for example, the target resistance connected to the first LED circuit unit is adjusted from R1Is adjusted to RxThe target resistance connected with the second LED circuit unit is R2Is adjusted to RyAnd the like, so as to ensure that each LED circuit unit works at a normal working voltage in the process of bearing the voltage division effect by each target resistor.
Taking the number of the independent pads as two as an example, please refer to fig. 9, which shows a schematic structural diagram of an integrated circuit according to an exemplary embodiment of the present application. As shown in fig. 9, the integrated circuit includes a positive line pattern 901, a first independent pad 902a, a second independent pad 902b, a third positive pad 902c, a first target resistor 903a, a second target resistor 903b, a first ground pad region 904a, a second ground pad region 904b, a third ground pad region 904c, a first signal line pattern 905a, a second signal line pattern 905b, and a ground line pattern 906.
The voltage input end of the first LED circuit unit may be welded to the first independent pad 902a, the voltage output end of the first LED circuit unit may be welded to the first ground pad area 904a, the signal input end of the first LED circuit unit may be welded to the signal input line, the signal output end of the first LED circuit unit may be welded to the first port 905a1 of the first signal line pattern 905a, the signal input end of the second LED circuit unit may be welded to the second port 905a2 of the first signal line pattern 905a, the signal output end of the second LED circuit unit may be welded to the first port 905b1 of the second signal line pattern 905b, the signal input end of the third LED circuit unit may be welded to the second port 905b2 of the second signal line pattern 905b, and the signal output end of the third LED circuit unit may be welded to the first port 905c1 of the third signal line pattern 905 c.
Optionally, the working voltages of the first LED circuit unit, the second LED circuit unit and the third LED circuit unit are all 5V, if the input is performed according to the scheme in the above related art in the positive line pattern 901, the working voltages of the second LED circuit unit and the third LED circuit unit are always affected by the line resistance, the working voltages of the first LED circuit unit, the second LED circuit unit and the third LED circuit unit have a difference, and if the voltage is increased, the first LED circuit unit is burned. Therefore, according to the integrated circuit design LED circuit unit one, LED circuit unit two and LED circuit unit three shown in fig. 9, the input voltage can be increased to 6V or higher, here, taking 7V as an example, the voltage of 2V needs to be divided by the target resistor one 903a connected to the independent pad one 902a, the developer designs the target resistor one 903a to be capable of dividing 2V, and when the attenuation of the line resistor to the voltage is 1V, the voltage of 1V can be divided by the target resistor two 903b, and the voltage of 1V does not need to be divided by the LED circuit unit three, so that it is not necessary to additionally design the independent pad and the target resistor, and the pad and the positive line pattern are still not separated, thereby reducing the voltage difference of each LED circuit unit, improving the voltage attenuation problem, and improving the display effect.
In summary, in the embodiments of the present application, the integrated circuit provided in the present application includes a circuit substrate, and a positive circuit pattern, a ground circuit pattern and a plurality of independent pads disposed on the same surface of the circuit substrate; the positive electrode circuit pattern, the grounding circuit pattern and the independent pads are arranged at intervals, the independent pads are arranged in a first direction, and any one of the independent pads is electrically connected with the positive electrode circuit pattern through a target resistor; the resistance values of the target resistors connected with the independent bonding pads are sequentially reduced along the first direction, the voltage input into the positive line pattern is divided through the target resistors connected with the independent bonding pads, the voltage of the electronic device connected to the independent bonding pads is guaranteed to be the same, therefore, the difference in voltage when the electronic device welded to the independent bonding pads works is reduced, and the display effect is improved.
In addition, in the embodiment of the present application, the integrated circuit further includes a signal line pattern for inputting a driving signal to the target circuit unit between each independent pad and the ground line pattern, and the signal line pattern is separated from the positive electrode line pattern and the ground line pattern and is arranged in an isolated manner along the first direction, so that the target circuit unit can be independently controlled to be driven by the signal line pattern, and interference between circuits is reduced.
In a possible implementation manner, the embodiment of the present application further provides an LED display screen, where the LED display screen includes the integrated circuit as described in fig. 3 or fig. 4.
The embodiment of the application also discloses electronic equipment, which comprises at least one LED display screen.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. Those skilled in the art should also appreciate that the embodiments described in this specification are all alternative embodiments and that the acts and modules involved are not necessarily required for this application.
In various embodiments of the present application, it should be understood that the size of the serial number of each process described above does not mean that the execution sequence is necessarily sequential, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.
The integrated circuit, the LED display screen and the electronic device disclosed in the embodiments of the present application are introduced by way of example, and the principles and embodiments of the present application are explained in this document by applying an example, and the description of the embodiments is only used to help understand the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (10)

1. An integrated circuit, comprising a circuit substrate, and a positive line pattern, a ground line pattern, and a plurality of independent pads disposed on the same side of the circuit substrate;
the anode line pattern, the grounding line pattern and the independent pads are arranged at intervals, the independent pads are arranged in a first direction, and any one of the independent pads is electrically connected with the anode line pattern through a target resistor;
the resistance value of the target resistance to which each of the plurality of independent pads is connected decreases in order along the first direction.
2. The integrated circuit according to claim 1, wherein a plurality of signal line patterns are provided between the positive electrode line pattern and the ground line pattern, the signal line patterns are separated from the positive electrode line pattern and the ground line pattern, and the plurality of signal line patterns are arranged at intervals along the first direction;
the signal line pattern is used for inputting a driving signal to a target circuit unit connected between each of the independent pads and the ground line pattern.
3. The integrated circuit according to claim 2, wherein the positive electrode line pattern and the ground line pattern are both elongated and have a longitudinal direction parallel to the first direction, and a first slit extending in the first direction is formed between the positive electrode line pattern and the ground line pattern;
the signal line pattern comprises a horizontal portion extending along the first direction, and a first bending portion and a second bending portion which are respectively arranged at two ends of the horizontal portion, the first bending portion extends towards the direction close to the grounding line pattern, the second bending portion extends towards the direction close to the anode line pattern, the horizontal portion is arranged at the first gap, a first notch used for accommodating the first bending portion is formed in the grounding line pattern, and a second notch used for accommodating the second bending portion is formed in the anode line pattern.
4. The integrated circuit of claim 3, wherein the positive line pattern further forms a plurality of third notches for receiving the independent pads, and the independent pads are disposed in the third notches in a one-to-one correspondence.
5. The integrated circuit of claim 2, wherein the target circuit cells are LED circuit cells, and the number of the target circuit cells is at least two;
the first LED circuit unit comprises a voltage input port and a voltage output port, the voltage input port is electrically connected with the first independent bonding pad, the voltage output port is electrically connected with the grounding circuit pattern, the first LED circuit unit is any one of the LED circuit units, and the independent bonding pads connected with the voltage input ports of the at least two LED circuits are different.
6. The integrated circuit of claim 5, wherein the LED circuit unit comprises an integrated circuit chip, an LED bulb, and a variable resistor;
the integrated circuit chip is connected with a first branch in parallel, and the first branch is formed by connecting the LED bulb and the variable resistor in series.
7. The integrated circuit of claim 6, wherein each of the first gaps and each of the second gaps are respectively aligned along the first direction;
the first bent portion of the first signal circuit pattern is electrically connected with the second bent portion of the adjacent signal circuit pattern through the integrated circuit chip, and the first signal circuit pattern is any one of the signal circuit patterns.
8. The integrated circuit of claim 1, further comprising a resistance adjustment device electrically coupled to the target resistance electrically coupled to each of the individual pads;
the resistance adjusting device is used for adjusting the resistance value of each target resistance.
9. LED display screen, characterized in that it comprises at least one integrated circuit according to any of claims 1 to 8.
10. An electronic device, characterized in that it comprises at least one LED display screen according to claim 9.
CN202121079906.9U 2021-05-19 2021-05-19 Integrated circuit, LED display screen and electronic equipment Active CN216014775U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121079906.9U CN216014775U (en) 2021-05-19 2021-05-19 Integrated circuit, LED display screen and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121079906.9U CN216014775U (en) 2021-05-19 2021-05-19 Integrated circuit, LED display screen and electronic equipment

Publications (1)

Publication Number Publication Date
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