CN216014190U - Compound heat dissipation mechanism of computer - Google Patents
Compound heat dissipation mechanism of computer Download PDFInfo
- Publication number
- CN216014190U CN216014190U CN202121992404.5U CN202121992404U CN216014190U CN 216014190 U CN216014190 U CN 216014190U CN 202121992404 U CN202121992404 U CN 202121992404U CN 216014190 U CN216014190 U CN 216014190U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- plate body
- plate
- water
- heat pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 70
- 150000001875 compounds Chemical class 0.000 title description 2
- 238000001816 cooling Methods 0.000 claims abstract description 39
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 33
- 238000010438 heat treatment Methods 0.000 claims abstract description 24
- 239000012530 fluid Substances 0.000 claims abstract description 18
- 239000002131 composite material Substances 0.000 claims abstract description 16
- 239000007788 liquid Substances 0.000 claims abstract description 15
- 238000007789 sealing Methods 0.000 claims description 7
- 238000005086 pumping Methods 0.000 claims description 6
- 230000009977 dual effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a computer composite heat dissipation mechanism which comprises a heat dissipation plate, a heat pipe assembly and a liquid cooling assembly, wherein the heat dissipation plate can be attached to a heating element, part of the heat pipe assembly is arranged at the bottom wall of the heat dissipation plate, the liquid cooling assembly comprises a water cooling seat and a water pump device matched with the water cooling seat, the water cooling seat and the water pump device are provided with closed-loop fluid channels, and the upper wall of the heat dissipation plate is attached to the bottom wall of the water cooling seat. Through setting up heat pipe subassembly and liquid cooling subassembly at the heating panel, also with heat conduction to the heating panel when heating element's heat conduction is to closed loop heat pipe, thermal quick cycle can be realized through closed loop heat pipe's capillary heat dissipation, can guarantee the stable heat dissipation of heating panel through the liquid cooling subassembly, through direct contact and indirect radiating dual heat dissipation promptly, also can guarantee fast heat dissipation when guaranteeing that heating element keeps the constant temperature, effectively improve the life of product.
Description
Technical Field
The utility model relates to the field of computer heat dissipation, in particular to a computer composite heat dissipation mechanism.
Background
The CPU and other parts of the computer generate heat in the high-speed operation process, and the heat dissipation is a heat transfer process, so that the heat generated by the CPU is carried to other media, and the temperature of the CPU is controlled within a stable range. According to the environment of our lives, the heat of the CPU is ultimately dissipated into the air. This process is computer heat dissipation.
However, the existing fan is generally used for radiating heat of a heating element (such as a CPU, a graphics card or a chip), which has a poor heat radiating effect, and especially for some components running at high frequency, only air cooling heat radiation is used and the required requirements are far from met, which seriously affects the work of a computer, and even damages related components due to high temperature, which affects the service life of the product.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a composite heat dissipation mechanism for a computer, and aims to improve the cooling effect of a heating element in a composite heat dissipation mode, so that the reduction of the operating frequency of a component due to the temperature is avoided, and the service life of a product is prolonged.
In order to achieve the above object, the present invention provides a computer composite heat dissipation mechanism, including:
the heat dissipation plate can be attached to the heating element;
the heat pipe assembly is partially arranged on the bottom wall of the heat dissipation plate;
the liquid cooling subassembly, the liquid cooling subassembly includes water-cooling seat and with water-cooling seat matched with pumping plant, water-cooling seat and pumping plant are equipped with closed loop's fluid passage, the upper wall of heating panel is laminated with the diapire of water-cooling seat mutually.
Preferably, the heat pipe assembly includes a closed loop heat pipe, a heat dissipation fin, and a fan disposed on the heat dissipation fin, wherein one end of the closed loop heat pipe is disposed on the bottom wall of the heat dissipation plate, and the other end of the closed loop heat pipe is disposed in the heat dissipation fin.
Preferably, the bottom wall of the heat dissipation plate is provided with a semicircular positioning groove, and the closed loop heat pipe is fixed in the positioning groove and is flush with the bottom wall of the heat dissipation plate.
Preferably, the cross section of the part of the closed loop heat pipe, which is matched with the positioning groove, is semicircular.
Preferably, the water cooling seat comprises a first plate body attached to the heat dissipation plate and a second plate body matched with the first plate body, the first plate body and the second plate body enclose a fluid channel, the fluid channel is provided with a water inlet and a water outlet, and the water inlet and the water outlet are respectively connected with two ends of the water pump device.
Preferably, the heat dissipation plate and the first plate body are respectively provided with a first mounting hole and a second mounting hole, and a first screw penetrates through the first mounting hole and the second mounting hole to fix the first plate body on the heat dissipation plate.
Preferably, the upper wall of the first plate body is provided with radiating fins arranged at intervals.
Preferably, a flow separation plate is arranged between the first plate body and the second plate body, and the fluid channel is divided into a water inlet channel and a water outlet channel.
Preferably, the first plate body and the second plate body are respectively provided with a first screw hole and a second screw hole which are matched with each other, and a second screw passes through the first screw hole and the second screw hole to fix the first plate body and the second plate body to each other and form a relatively closed fluid channel.
Preferably, the second plate body is provided with a clamping groove, the clamping groove is provided with a sealing ring, and the sealing ring can abut against the first plate body.
According to the technical scheme, the heat pipe assembly and the liquid cooling assembly are arranged on the heat dissipation plate, when the heat of the heating element is conducted to the closed loop heat pipe, the heat is also conducted to the heat dissipation plate, the heat can be quickly circulated through capillary heat dissipation of the closed loop heat pipe, stable heat dissipation of the heat dissipation plate can be guaranteed through the liquid cooling assembly, namely, through double heat dissipation of direct contact and indirect heat dissipation, the constant temperature of the heating element is guaranteed, the quick heat dissipation can be guaranteed, and the service life of a product is effectively prolonged.
Drawings
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a cross-sectional view of the present invention;
FIG. 3 is an exploded view of the first embodiment of the present invention;
fig. 4 is an exploded view of the second embodiment of the present invention.
In the drawing, 1 is a heat dissipating plate, 11 is a positioning groove, 2 is a heat pipe assembly, 21 is a closed loop heat pipe, 22 is a heat dissipating fin, 23 is a fan, 4 is a liquid cooling assembly, 41 is a water cooling base, 411 is a first plate, 412 is a second plate, 413 is a heat dissipating fin, 414 is a flow isolating plate, 42 is a water pump device, 51 is a first mounting hole, 52 is a second mounting hole, 61 is a first screw hole, 62 is a second screw hole, 71 is a sealing ring, and 72 is a clamping groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that if directional indications (such as … …, which is up, down, left, right, front, back, top, bottom, inner, outer, vertical, transverse, longitudinal, counterclockwise, clockwise, circumferential, radial, axial) are provided in the embodiments of the present invention, the directional indications are only used for explaining the relative position relationship, motion condition, etc. of the components at a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first" or "second", etc. in the embodiments of the present invention, the description of "first" or "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
As shown in fig. 1 to 4, a composite heat dissipation mechanism for a computer includes:
the heat dissipation plate 1, the said heat dissipation plate 1 can be laminated with the heating element;
the heat pipe assembly 2, part of the heat pipe assembly 2 is installed on the bottom wall position of the heat dissipation plate 1;
liquid cooling subassembly 4, liquid cooling subassembly 4 including water-cooling seat 41 and with water-cooling seat 41 matched with pumping plant 42, water-cooling seat 41 and pumping plant 42 are equipped with closed loop's fluid passage, the upper wall of heating panel 1 is laminated with the diapire of water-cooling seat 41 mutually.
Through setting up heat pipe assembly 2 and liquid cooling subassembly 4 at heating panel 1, also with heat conduction to heating panel 1 when heating element's heat conduction is to closed loop heat pipe 21, thermal quick cycle can be realized through closed loop heat pipe 21's capillary heat dissipation, can guarantee the stable heat dissipation of heating panel 1 through liquid cooling subassembly 4, through direct contact and indirect radiating dual heat dissipation promptly, also can guarantee fast heat dissipation when guaranteeing that heating element keeps the constant temperature, effectively improve the life of product.
In the embodiment of the present invention, the heat pipe assembly 2 includes a closed-loop heat pipe 21, a heat dissipating fin 22 and a fan 23 disposed on the heat dissipating fin 22, one end of the closed-loop heat pipe 21 is disposed on the bottom wall of the heat dissipating plate 1, and the other end is disposed in the heat dissipating fin 22, wherein the heat dissipating fin 22 is used for dissipating heat from the hot end of the closed-loop heat pipe 21, and the heat dissipation of the closed-loop heat pipe 21 is not described in detail in the prior art.
In the embodiment of the utility model, the bottom wall of the heat dissipation plate 1 is provided with the semicircular positioning groove 11, the closed loop heat pipe 21 is fixed in the positioning groove 11 and is flush with the bottom wall of the heat dissipation plate 1, and the arrangement of the closed loop heat pipe 21 can effectively improve the contact area between the heat pipe and the heating element, so that the rapid heat dissipation is ensured.
In the embodiment of the present invention, the cross section of the part of the closed loop heat pipe 21, which is matched with the positioning slot 11, is a semi-circular shape, but in a specific embodiment, the part of the closed loop heat pipe 21, which is matched with the positioning slot 11, may also be set according to actual conditions.
In the embodiment of the present invention, the water cooling seat 41 includes a first plate 411 attached to the heat dissipation plate 1 and a second plate 412 engaged with the first plate 411, the first plate 411 and the second plate 412 form a fluid channel, the fluid channel is provided with a water inlet and a water outlet, and the water inlet and the water outlet are respectively connected to two ends of the water pump device 42.
In the embodiment of the present invention, the heat dissipation plate 1 and the first plate 411 are respectively provided with a first mounting hole 51 and a second mounting hole 52, and a first screw passes through the first mounting hole 51 and the second mounting hole 52 to fix the first plate 411 to the heat dissipation plate 1, thereby facilitating the mounting of the heat dissipation plate 1 and the water cooling base 41.
In the embodiment of the present invention, the upper wall of the first plate 411 is provided with the heat dissipation fins 413 arranged at intervals, so that the heat dissipation area between the fluid and the first plate 411 is effectively increased, and the heat dissipation effect of the first plate 411 is improved.
In the embodiment of the present invention, a flow separation plate 414 is disposed between the first plate 411 and the second plate 412, and the fluid channel is divided into a water inlet channel and a water outlet channel, so that a unidirectional fluid flow is realized, and a turbulent flow is avoided.
In the embodiment of the present invention, the first plate 411 and the second plate 412 are respectively provided with a first screw hole 61 and a second screw hole 62, which are matched with each other, and a second screw passes through the first screw hole 61 and the second screw hole 62 to fix the first plate 411 and the second plate 412 to each other and form a relatively closed fluid passage.
In the embodiment of the present invention, the second plate body 412 is provided with a locking groove 72, the locking groove 72 is provided with a sealing ring 71, and the sealing ring 71 can abut against the first plate body 411, so that the water-cooling seat 41 is sealed.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the technical solutions of the present invention, which are made by using the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A computer composite heat dissipation mechanism, comprising:
the heat dissipation plate can be attached to the heating element;
the heat pipe assembly is partially arranged on the bottom wall of the heat dissipation plate;
the liquid cooling subassembly, the liquid cooling subassembly includes water-cooling seat and with water-cooling seat matched with pumping plant, water-cooling seat and pumping plant are equipped with closed loop's fluid passage, the upper wall of heating panel is laminated with the diapire of water-cooling seat mutually.
2. The composite heat dissipation mechanism of claim 1, wherein: the heat pipe assembly comprises a closed loop heat pipe, a radiating fin and a fan arranged on the radiating fin, wherein one end of the closed loop heat pipe is arranged on the bottom wall of the radiating plate, and the other end of the closed loop heat pipe is arranged in the radiating fin.
3. The computer composite heat dissipation mechanism of claim 2, wherein: the bottom wall of the heat dissipation plate is provided with a semicircular positioning groove, and the closed-loop heat pipe is fixed in the positioning groove and is flush with the bottom wall of the heat dissipation plate.
4. The composite heat dissipation mechanism of claim 3, wherein: the cross section of the part of the closed loop heat pipe matched with the positioning groove is in a semicircular shape.
5. The composite heat dissipation mechanism of claim 1, wherein: the water cooling seat comprises a first plate body attached to the radiating plate and a second plate body matched with the first plate body, the first plate body and the second plate body enclose a fluid channel, the fluid channel is provided with a water inlet and a water outlet, and the water inlet and the water outlet are respectively connected with two ends of the water pump device.
6. The composite heat dissipation mechanism of claim 5, wherein: the heating panel and the first plate body are respectively provided with a first mounting hole and a second mounting hole, and a first screw penetrates through the first mounting hole and the second mounting hole to fix the first plate body on the heating panel.
7. The composite heat dissipation mechanism of claim 5, wherein: the upper wall of the first plate body is provided with radiating fins arranged at intervals.
8. The composite heat dissipation mechanism of claim 5, wherein: a flow isolating plate is arranged between the first plate body and the second plate body, and the fluid channel is divided into a water inlet channel and a water outlet channel.
9. The composite heat dissipation mechanism of claim 5, wherein: the first plate body and the second plate body are respectively provided with a first screw hole and a second screw hole which are matched with each other, and a second screw passes through the first screw hole and the second screw hole to mutually fix the first plate body and the second plate body and form a relatively closed fluid channel.
10. The composite heat dissipation mechanism of claim 5, wherein: the second plate body is provided with a clamping groove, the clamping groove is provided with a sealing ring, and the sealing ring can abut against the first plate body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121992404.5U CN216014190U (en) | 2021-08-23 | 2021-08-23 | Compound heat dissipation mechanism of computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121992404.5U CN216014190U (en) | 2021-08-23 | 2021-08-23 | Compound heat dissipation mechanism of computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216014190U true CN216014190U (en) | 2022-03-11 |
Family
ID=80594537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121992404.5U Active CN216014190U (en) | 2021-08-23 | 2021-08-23 | Compound heat dissipation mechanism of computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216014190U (en) |
-
2021
- 2021-08-23 CN CN202121992404.5U patent/CN216014190U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10609841B2 (en) | Liquid cooling radiation system and liquid radiator thereof | |
| US20060021737A1 (en) | Liquid cooling device | |
| TWI272056B (en) | Integrated liquid cooling system | |
| US20080314559A1 (en) | Heat exchange structure and heat dissipating apparatus having the same | |
| US6945315B1 (en) | Heatsink with active liquid base | |
| KR20050080722A (en) | Liquid circulation type cooling system | |
| CN1964610A (en) | A liquid cooling heat radiator | |
| WO2018176535A1 (en) | Novel mechanical pump liquid-cooling heat-dissipation system | |
| CN106255396B (en) | A kind of pipe type microcirculation radiator and microcirculation heat-exchange system | |
| KR101325569B1 (en) | Air-cooled and water cooled by exchanging heat with protection against sink assembly | |
| CN211125625U (en) | Liquid cooling heat dissipation assembly, liquid cooling heat dissipation device and power electronic equipment | |
| CN216014190U (en) | Compound heat dissipation mechanism of computer | |
| CN201039637Y (en) | Composite heat exchange device | |
| US20200185306A1 (en) | Liquid cooling system | |
| US20050024824A1 (en) | Arrangement for cooling heat-generating computer components | |
| CN107910306B (en) | Water-cooled radiator and heat radiation system | |
| TWM628952U (en) | Liquid-cooling type heat dissipation module | |
| TWM245500U (en) | Water cooling apparatus | |
| CN210142305U (en) | Non-fan computer radiator | |
| CN212910605U (en) | Uniform temperature radiator structure | |
| CN218467920U (en) | Water-cooling heat dissipation pump structure and radiator with same | |
| CN206118284U (en) | Plate -fin microcirculation radiator and microcirculation heat transfer system | |
| CN111488045A (en) | Computer cooling assembly working in large range | |
| CN214545301U (en) | Water-cooled radiating fin structure | |
| CN216450016U (en) | Liquid radiator structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240313 Address after: 511510, 6th Floor, Building 1, Guangdong Zhongqing Industrial Co., Ltd., No. 9 East Huaqing Industrial Avenue, Guangzhou (Qingyuan) Industrial Transfer Industrial Park, Shijiao Town, Qingcheng District, Qingyuan City, Guangdong Province Patentee after: Jiete Technology (Guangdong) Co.,Ltd. Country or region after: China Address before: 510000 floor 3 and floor 4 of Building 2 and floor 4 of Building 1, No. 21, Lingdong Road, Huadu District, Guangzhou City, Guangdong Province Patentee before: GUANGZHOU ZETA MODEL AIRCRAFT TECHNOLOGY Co.,Ltd. Country or region before: China |