CN216014128U - High-performance industrial control mainboard for chipset - Google Patents
High-performance industrial control mainboard for chipset Download PDFInfo
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- CN216014128U CN216014128U CN202121211274.7U CN202121211274U CN216014128U CN 216014128 U CN216014128 U CN 216014128U CN 202121211274 U CN202121211274 U CN 202121211274U CN 216014128 U CN216014128 U CN 216014128U
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- screw rod
- mounting plate
- chipset
- industrial control
- mainboard
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Abstract
The utility model belongs to the technical field of main boards, and particularly relates to a high-performance industrial control main board for a chipset, which comprises a mounting board, wherein a screw rod is connected in the mounting board through threads, a guide sleeve is sleeved outside the screw rod in a sliding manner, a spring is arranged outside the screw rod, the main board is fixedly sleeved outside the guide sleeve, a baffle is welded on the screw rod, a rubber pad is sleeved outside the screw rod, a heat conducting plate is bonded on one side of the main board close to the mounting board, a corrugated sleeve is bonded on the mounting board, the other end of the corrugated sleeve is bonded with the main board, an air outlet is formed in the corrugated sleeve, and a fan is fixedly mounted on the mounting board. According to the utility model, the spring is arranged on the outer side of the screw rod, the rubber pad is sleeved on the outer side of the screw rod, and when the mounting plate works and vibrates, the vibration of the device is damped by the elastic action of the spring and the rubber pad, so that the looseness of electronic elements on the mainboard due to overlarge vibration of the mainboard caused by the vibration of the device is avoided.
Description
Technical Field
The utility model relates to the technical field of mainboards, in particular to a high-performance industrial control mainboard for a chipset.
Background
The industrial control mainboard is a mainboard applied to industrial occasions, is adopted by industrial computers, can adapt to wide-temperature environment according to requirements, can adapt to severe environment, can work under high load for a long time, and the like. The industrial control mainboard generally adopts a low-power-consumption chip set so as to save energy consumption and improve environment adaptability. The high-performance industrial control mainboard is applied to the use of the chip set.
Among the prior art, the chipset uses the back with high performance industrial control mainboard in the installation, and the vibrations that the mounting panel work produced can drive the mainboard vibrations, leads to the electronic component pine on the mainboard to take off, and simultaneously, the device uses for a long time, and the mainboard produces high temperature and damages easily. Accordingly, there is a need for improvements in the art.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a high-performance industrial control mainboard for a chipset, which solves the problem that electronic elements of the mainboard are loosened due to vibration of a mounting plate and also solves the problem that the mainboard is high in temperature and easy to damage.
In order to achieve the purpose, the utility model provides the following technical scheme: the high-performance industrial control mainboard for the chipset comprises a mounting plate, there is the screw rod through threaded connection in the mounting panel, the guide pin bushing has been cup jointed in the outside slip of screw rod, the outside of screw rod is provided with the spring, the fixed mainboard that has cup jointed in the outside of guide pin bushing, the welding has the baffle on the screw rod, the rubber pad has been cup jointed in the outside of screw rod, one side that the mainboard is close to the mounting panel bonds and has the heat-conducting plate, it has the ripple cover to bond on the mounting panel, the other end and the mainboard bonding of ripple cover, the venthole has been seted up on the ripple cover, fixed mounting has the fan on the mounting panel, the welding has the backup pad on the mounting panel, the welding has the spoiler in the backup pad.
Preferably, the number of the screws is four, and the four screws are uniformly distributed on the mounting plate.
Preferably, one end of the spring is in contact with the mounting plate, and the other end of the spring is in contact with the guide sleeve.
Preferably, one end of the rubber pad is bonded with the baffle, and the other end of the rubber pad is contacted with the guide sleeve.
Preferably, the number of the air outlet holes is two, and the two air outlet holes are symmetrically distributed on the corrugated sleeve.
Preferably, the number of the support plates is two, and the two support plates are symmetrically distributed on the mounting plate.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, the spring is arranged on the outer side of the screw rod, the rubber pad is sleeved on the outer side of the screw rod, and when the mounting plate works and vibrates, the vibration of the device is damped by the elastic action of the spring and the rubber pad, so that the looseness of electronic elements on the mainboard due to overlarge vibration of the mainboard caused by the vibration of the device is avoided.
2. According to the utility model, the fan is arranged on the mounting plate, the heat conducting plate is bonded on the main plate, the heat conducting plate conducts heat to the heat of the main plate, and the fan radiates the heat of the heat conducting plate, so that the radiating efficiency of the main plate is improved, and further the damage caused by overhigh temperature of the main plate is avoided.
Drawings
FIG. 1 is an overall perspective view of the present invention;
FIG. 2 is a front cross-sectional view of the utility model of FIG. 1;
fig. 3 is an enlarged view of the utility model at a in fig. 2.
In the figure: 1. mounting a plate; 2. a screw; 3. a guide sleeve; 4. a spring; 5. a main board; 6. a baffle plate; 7. a rubber pad; 8. a heat conducting plate; 9. a corrugated sleeve; 10. an air outlet; 11. a fan; 12. a support plate; 13. a spoiler.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, the high-performance industrial control mainboard for chipsets comprises a mounting plate 1, a screw 2 is connected in the mounting plate 1 through threads, a guide sleeve 3 is slidably sleeved outside the screw 2, a spring 4 is arranged outside the screw 2, a mainboard 5 is fixedly sleeved outside the guide sleeve 3, a baffle 6 is welded on the screw 2, a rubber pad 7 is sleeved outside the screw 2, a heat conducting plate 8 is bonded on one side, close to the mounting plate 1, of the mainboard 5, a corrugated sleeve 9 is bonded on the mounting plate 1, the other end of the corrugated sleeve 9 is bonded with the mainboard 5, an air outlet 10 is formed in the corrugated sleeve 9, a fan 11 is fixedly mounted on the mounting plate 1, a support plate 12 is welded on the mounting plate 1, and a spoiler 13 is welded on the support plate 12.
Referring to fig. 1, there are four screws 2, and the four screws 2 are uniformly distributed on the mounting plate 1. Through setting up four screws 2 for mainboard 5 is more stable.
Referring to fig. 2, one end of the spring 4 contacts the mounting plate 1, and the other end of the spring 4 contacts the guide sleeve 3. The guide sleeve 3 is supported by the spring 4.
Referring to fig. 3, one end of the rubber pad 7 is adhered to the baffle 6, and the other end of the rubber pad 7 is in contact with the guide sleeve 3. Through setting up rubber pad 7, cushion between baffle 6 and mainboard 5.
Referring to fig. 2, there are two air outlets 10, and the two air outlets 10 are symmetrically distributed on the corrugated sleeve 9. The air in the corrugated sleeve 9 is conveniently discharged by arranging the air outlet holes 10.
Referring to fig. 2, there are two support plates 12, and the two support plates 12 are symmetrically distributed on the mounting plate 1. By providing two support plates 12, two spoilers 13 can be mounted.
The specific implementation process of the utility model is as follows: the device is when using, mounting panel 1 can produce vibrations at the external joint device during operation, the device vibrations make mainboard 5 slide on screw rod 2 under the effect of guide pin bushing 3, make spring 4 and rubber pad 7 produce deformation, the elastic action of spring 4 and rubber pad 7 carries out the shock attenuation to the vibrations of device, avoid the device vibrations to lead to mainboard 5 vibrations to shake greatly lead to on the mainboard 5 electronic component not hard up, start fan 11, fan 11 starts to blow to mainboard 5, spoiler 13 disturbs the air current, through bonding heat-conducting plate 8 on mainboard 5, heat-conducting plate 8 carries out the heat conduction to the heat of mainboard 5, fan 11 dispels the heat to 8 heat-conducting plates, the radiating efficiency to mainboard 5 has been improved, and then avoid mainboard 5 high temperature to lead to the damage.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. High performance industrial control mainboard is used to chipset, including mounting panel (1), its characterized in that: a screw rod (2) is connected in the mounting plate (1) through threads, a guide sleeve (3) is sleeved outside the screw rod (2) in a sliding manner, a spring (4) is arranged on the outer side of the screw rod (2), a main board (5) is fixedly sleeved on the outer side of the guide sleeve (3), a baffle (6) is welded on the screw rod (2), a rubber pad (7) is sleeved on the outer side of the screw rod (2), a heat conducting plate (8) is bonded on one side of the main board (5) close to the mounting plate (1), a corrugated sleeve (9) is bonded on the mounting plate (1), the other end of the corrugated sleeve (9) is bonded with the main plate (5), the corrugated sleeve (9) is provided with an air outlet (10), the mounting plate (1) is fixedly provided with a fan (11), the mounting plate (1) is welded with a support plate (12), and the support plate (12) is welded with a spoiler (13).
2. The high-performance industrial control mainboard for the chipset of claim 1, wherein: the number of the screw rods (2) is four, and the four screw rods (2) are uniformly distributed on the mounting plate (1).
3. The high-performance industrial control mainboard for the chipset of claim 1, wherein: one end of the spring (4) is in contact with the mounting plate (1), and the other end of the spring (4) is in contact with the guide sleeve (3).
4. The high-performance industrial control mainboard for the chipset of claim 1, wherein: one end of the rubber pad (7) is bonded with the baffle (6), and the other end of the rubber pad (7) is contacted with the guide sleeve (3).
5. The high-performance industrial control mainboard for the chipset of claim 1, wherein: the number of the air outlet holes (10) is two, and the two air outlet holes (10) are symmetrically distributed on the corrugated sleeve (9).
6. The high-performance industrial control mainboard for the chipset of claim 1, wherein: the number of the supporting plates (12) is two, and the two supporting plates (12) are symmetrically distributed on the mounting plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121211274.7U CN216014128U (en) | 2021-06-01 | 2021-06-01 | High-performance industrial control mainboard for chipset |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121211274.7U CN216014128U (en) | 2021-06-01 | 2021-06-01 | High-performance industrial control mainboard for chipset |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216014128U true CN216014128U (en) | 2022-03-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121211274.7U Active CN216014128U (en) | 2021-06-01 | 2021-06-01 | High-performance industrial control mainboard for chipset |
Country Status (1)
| Country | Link |
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| CN (1) | CN216014128U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115258238A (en) * | 2022-08-18 | 2022-11-01 | 华天科技（西安）有限公司 | Jig for adsorbing chip |
-
2021
- 2021-06-01 CN CN202121211274.7U patent/CN216014128U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115258238A (en) * | 2022-08-18 | 2022-11-01 | 华天科技（西安）有限公司 | Jig for adsorbing chip |
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