CN215988107U

CN215988107U - High-speed high-stability heat dissipation device for SATA3.0 solid state disk

Info

Publication number: CN215988107U
Application number: CN202121834224.4U
Authority: CN
Inventors: 余溥
Original assignee: Shenzhen Yichu Electronic Co ltd
Current assignee: Shenzhen Yichu Electronic Co ltd
Priority date: 2021-08-06
Filing date: 2021-08-06
Publication date: 2022-03-08
Anticipated expiration: 2031-08-06

Abstract

The utility model provides a high-speed and high-stability heat dissipation device of a SATA3.0 solid state disk, which is arranged on the inner side wall of a shell of the solid state disk and comprises heat dissipation fins arranged on the bottom surface in the shell and heat dissipation strips arranged on the inner side edge of the shell, wherein the heat dissipation fins are connected with the heat dissipation strips through heat dissipation tubes, one surface of each heat dissipation fin is tightly attached to the inner wall of the shell, and the other surface of each heat dissipation fin is tightly attached to a chip in the solid state disk. The utility model has the beneficial effects that: the heat dissipation effect is good.

Description

High-speed high-stability heat dissipation device for SATA3.0 solid state disk

Technical Field

The utility model belongs to the field of solid state disks, and particularly relates to a high-speed and high-stability heat dissipation device for a SATA3.0 solid state disk.

Background

The solid state disk has the characteristics of light weight and quick transmission, and is favored by users. The development direction of the existing solid state disk is towards the development of high capacity and high transmission rate, and when the solid state disk is repeatedly read and written, the temperature is higher, so that the stability of data transmission of the solid state disk is influenced, and the existing SATA3.0 solid state disk adopts a shell packaging mode, so that the heat dissipation is more difficult due to the structures.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects pointed out by the prior art, the utility model provides the heat dissipation device of the SATA3.0 solid state hard disk with high speed and high stability, which has the characteristic of good heat dissipation effect. The method is realized through the following scheme.

The utility model provides a high-speed high stability's SATA3.0 solid state hard disk's heat abstractor, heat abstractor sets up the shell inside wall at solid state hard disk, and heat abstractor is including being located the fin and the inboard side's of shell heat dissipation strip that set up at the shell bottom surface, fin and heat dissipation strip pass through the cooling tube and connect, the one side of fin is hugged closely at the shell inner wall, and the chip in another side and the solid state hard disk is hugged closely.

Furthermore, the number of the heat dissipation strips is 1 or 2, and the heat dissipation strips are located on one side or two sides of the inner side edge of the shell.

Furthermore, the cavity in the heat dissipation strip comprises a plurality of capillary structures, and heat dissipation liquid is filled in the cavity.

Further, the radiating pipe may be replaced with a metal sheet for radiating heat.

Furthermore, the radiating fins, the radiating strips and the radiating pipes are made of the same material.

The utility model has the beneficial effects that: the heat dissipation effect is good.

Drawings

Fig. 1 is a schematic structural diagram of a solid state disk in an embodiment of the present invention.

Fig. 2 is a schematic diagram of an internal structure of a solid state disk in the embodiment of the present invention.

Fig. 3 is a schematic structural diagram of a heat dissipation device in an embodiment of the utility model.

FIG. 4 is a schematic diagram of an internal structure of a heat dissipation strip according to an embodiment of the present invention.

Detailed Description

The present invention is further illustrated by the following examples, which are only a part of the examples of the present invention, and these examples are only for explaining the present invention and do not limit the scope of the present invention.

As shown in fig. 1, a high-speed and high-stability SATA3.0 solid state disk includes a housing 1 and a solid state disk body (not shown). The solid state disk body is fixed in the shell through screws, and the solid state disk body is an SATA3.0 solid state disk and is a high-speed transmission solid state disk.

As shown in fig. 2-4, a heat dissipation device 10 is disposed in the housing 1, specifically, the heat dissipation device 10 is disposed on an inner side wall of the housing of the solid state disk, the heat dissipation device 10 includes a heat dissipation plate 11 disposed on a bottom surface of the housing and a heat dissipation strip 12 disposed on an inner side edge of the housing, the heat dissipation plate and the heat dissipation strip are connected by a heat dissipation pipe 13, one surface of the heat dissipation plate 11 is tightly attached to the inner wall of the housing, and the other surface is tightly attached to a chip in the solid state disk.

In the embodiment of the present invention, the heat sink 11 is a copper plate with a thickness of about 1mm, and covers a plurality of chips on the PCB of the solid state disk body, where the chips include an SATA interface chip, a flash memory controller, and a flash memory chip for storage. The chip is covered by a heat sink and is in contact connection with the surface of the chip.

In the embodiment of the utility model, the shell 1 is formed by connecting an upper shell and a lower shell through screws, the radiating fins 11 can be selectively arranged in the lower shell, one surface of each radiating fin is tightly attached to the inner wall of the corresponding shell, and the other surface of each radiating fin is in contact with the surface of a chip.

According to different designs of solid state disk products, the radiating fins 11 can be selectively arranged in the upper shell, one surface of each radiating fin is tightly attached to the inner wall of the shell, and the other surface of each radiating fin is in contact with the surface of the chip.

In the embodiment of the present invention, the number of the heat dissipation bars 12 is 1 or 2, and is located at one side or both sides of the inner side edge of the housing. The cavity in the heat dissipation strip includes a plurality of capillary structures 121, the capillary structures 121 are wicks, and the cavity is filled with heat dissipation liquid 122. The cavity is a vacuum cavity, when one end of the heat dissipation strip absorbs heat, the heat dissipation liquid close to one section of the heat source absorbs heat and evaporates, the steam is carried to rapidly conduct the heat to the other section, and internal circulation is achieved through the internal capillary structure.

In the embodiment of the present invention, the heat absorbing end of the radiating strip is located at the junction of the radiating strip 12 and the radiating pipe. The heat of the solid state disk is concentrated on the chip and the interface, so that the heat generated at the chip and the interface is conducted to other areas of the solid state disk, and the heat dissipation can be realized.

The radiating pipe 13 may be replaced with a metal plate for radiating heat, and the radiating pipe connects the radiating fins and the radiating strips. The radiating fins, the radiating strips and the radiating tubes are made of the same material, so that heat dissipation is facilitated.

In the embodiment of the utility model, the radiating pipe can be communicated with the radiating strip to enhance the radiating effect. If the heat dissipation tube is replaced by a heat dissipation plate, the heat dissipation tube is not communicated with the heat dissipation strip.

In the embodiment of the utility model, when the heat dissipation pipe is communicated with the heat dissipation strip, the interior of the heat dissipation pipe is also provided with a plurality of capillary structures 121, and the vacuum cavity is filled with heat dissipation liquid 122 for enhancing heat dissipation.

Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the utility model as defined by the appended claims.

Claims

1. A high-speed high-stability heat abstractor of SATA3.0 solid state hard drives which characterized in that: the heat dissipation device is arranged on the inner side wall of the shell of the solid hard disk, and comprises a heat dissipation sheet arranged on the inner bottom surface of the shell and a heat dissipation strip arranged on the inner side edge of the shell, wherein the heat dissipation sheet and the heat dissipation strip are connected through a heat dissipation pipe, one side of the heat dissipation sheet is tightly attached to the inner wall of the shell, and the other side of the heat dissipation sheet is tightly attached to a chip in the solid hard disk.

2. The heat dissipating device of claim 1, wherein the number of the heat dissipating strips is 1 or 2, and the heat dissipating strips are located on one side or both sides of the inner side edge of the housing.

3. The heat dissipating device of claim 2, wherein the cavity in the heat dissipating strip comprises a plurality of capillary structures, and the cavity is filled with a heat dissipating fluid.

4. The heat dissipating device of claim 1, wherein the heat dissipating pipe is replaced with a metal sheet for dissipating heat.

5. The heat dissipating device of claim 4, wherein the heat dissipating fins, the heat dissipating strips and the heat dissipating tube are made of the same material.