CN215986859U

CN215986859U - DMD chip angle adjusting device and DMD light modulating device

Info

Publication number: CN215986859U
Application number: CN202121870066.8U
Authority: CN
Inventors: 程攀攀; 胡伟东; 李国峰; 朱旭杰
Original assignee: Jinhua Feiguang Technology Co ltd
Current assignee: Jinhua Feiguang Technology Co ltd
Priority date: 2021-08-11
Filing date: 2021-08-11
Publication date: 2022-03-08
Anticipated expiration: 2031-08-11

Abstract

The utility model discloses a DMD chip angle adjusting device, which relates to digital light processing and comprises a first supporting plate, second backup pad and a plurality of adjusting part, adjusting part is including adjusting pole and elastomeric element, each both ends of adjusting the pole set firmly first spacing portion and the spacing portion of second, elastomeric element sets up between first backup pad and second backup pad, the elastomeric element cover is located outside the pole of adjusting, elastomeric element's both ends respectively with first backup pad and second backup pad butt, first backup pad is located between first spacing portion and the elastomeric element and can restricts first backup pad and remove to the direction of keeping away from the second backup pad, the second backup pad is located between spacing portion of second and the elastomeric element and can restrict the second backup pad and remove to the direction of keeping away from first backup pad, the service length of adjusting the pole can be adjusted and keep unchangeable along the direction of self central line, first backup pad and DMD chip fixed connection. Simple structure, convenient adjustment, good stability, small friction loss and long service life.

Description

DMD chip angle adjusting device and DMD light modulating device

Technical Field

The utility model relates to the technical field of digital light processing, in particular to a DMD chip angle adjusting device and a DMD light modulation device.

Background

DLP (Digital Light processing) is a group of chip sets based on optical micro-electro-mechanical technology using a Digital micro-mirror device, which digitally processes image signals and projects Light. The DLP technology is widely applied to a plurality of fields such as projectors, 3D printing, maskless lithography, three-dimensional scanning, spectral analysis, etc., and a DMD (Digital Micromirror Device) chip is the basis of the DLP technology. DLP projection technology uses DMD chips as the main key elements to implement digital optical processing. In a DMD chip, the micromirror is the smallest unit of operation and is also critical to its performance. The operating principle of the DMD chip is to reflect desired light by the micromirrors and simultaneously absorb undesired light to realize the projection of an image.

When the DMD chip works, heat can be generated and absorbed by the light source, and thermal deformation is easy to generate; meanwhile, errors exist in processing and assembling, so that deviation occurs between the installation angle of the DMD chip and theoretical requirements, and the accuracy of light reflected by the DMD chip is seriously affected.

After the traditional DMD chip or DMD light modulation device is installed, angle adjustment cannot be carried out any more, the requirements on processing and assembling precision are high, and the influence on reflected light due to the fact that the DMD chip has angle deviation caused by thermal deformation of the DMD chip cannot be completely avoided; the heat dissipation device of the existing DMD chip is arranged inside a shell where the DMD chip is located, the heat dissipation area is small, and the heat dissipation effect is poor.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a DMD chip angle adjusting device and a DMD light modulating device, which are used for solving the problems in the prior art and have the advantages of simple structure, convenience in adjustment, good stability, small friction loss and long service life.

In order to achieve the purpose, the utility model provides the following scheme:

the utility model provides a DMD chip angle adjusting device, which comprises a first supporting plate, a second supporting plate and a plurality of adjusting parts, wherein each adjusting part comprises an adjusting rod and an elastic part, a first limiting part and a second limiting part are fixedly arranged at two ends of each adjusting rod, each elastic part is arranged between the first supporting plate and the second supporting plate, each elastic part is sleeved outside each adjusting rod, one end of each elastic part is used for abutting against the end surface, close to the second supporting plate, of the first supporting plate, the other end of each elastic part is used for abutting against the end surface, close to the first supporting plate, of the second supporting plate, the first supporting plate is positioned between the first limiting part and the elastic part, and the first limiting part can limit the first supporting plate to move towards the direction far away from the second supporting plate, the second support plate is located between the second limiting portion and the elastic component, the second limiting portion can limit the second support plate to move towards the direction far away from the first support plate, the using length of each adjusting rod can be adjusted along the direction of the central line of the adjusting rod and is kept unchanged, and the first support plate is used for being fixedly connected with the DMD chip.

Preferably, the adjusting rod comprises a first connecting piece, a first supporting column and an adjusting knob, the first supporting plate is provided with a plurality of first mounting holes, the second supporting plate is provided with a plurality of second mounting holes, one end of each first connecting piece is provided with a first limiting portion, the other end of each first connecting piece penetrates through each first mounting hole to be in threaded connection with one end of each first supporting column, each first limiting portion and each first supporting column can clamp the first supporting plate tightly, one end of each adjusting knob is provided with a second limiting portion, and the other end of each adjusting knob penetrates through each second mounting hole to be in threaded connection with the other end of each first supporting column.

Preferably, the number of the first mounting holes, the number of the second mounting holes and the number of the adjusting parts are three, and the elastic part is a spring.

The utility model also provides a DMD light modulation device which comprises a DMD chip and the DMD chip angle adjusting device, wherein the DMD chip is fixedly connected with the first supporting plate.

Preferably, the chip carrier also comprises a shell, a chip seat, a circuit board and a heat dissipation device, wherein one end of the shell is provided with an opening, the heat dissipation device is arranged at one end of the opening of the shell, the circuit board is arranged between the heat dissipation device and the shell, the heat dissipation device and the shell are fixedly connected through a second connecting piece, the heat dissipation device and the shell can clamp the chip holder and the circuit board, the DMD chip is fixedly connected with one end of the chip holder far away from the circuit board, the circuit board is provided with a first through hole, the chip holder is provided with a second through hole, the heat dissipation device can penetrate through the first through hole and the second through hole to be in contact with the DMD chip, the shell with first backup pad fixed connection, the DMD chip pass through the shell with first backup pad fixed connection, the DMD chip with the circuit board communication is connected.

Preferably, the heat dissipation device is close to a third support plate fixedly connected to an end face of the DMD chip, the third support plate is in contact with an end face of the circuit board far away from the DMD chip, an inner wall of the housing, which is opposite to the DMD chip, is a first inner wall, the first inner wall is provided with a plurality of second support columns, each of the second support columns can be in contact with an end face of the chip holder far away from the heat dissipation device, and a gap is reserved between the heat dissipation device and the housing in a direction perpendicular to a straight line of the first inner wall.

Preferably, the sum of the length of the second support column, the thickness of the chip holder, the thickness of the circuit board and the thickness of the third support plate is greater than the distance between the first inner wall and the end face of the end of the casing where the opening is provided.

Preferably, the DMD component further includes a protective cover, the protective cover is fixedly connected to an end surface of the housing far away from the heat dissipation device, a third through hole is formed in the first inner wall, a center line of the third through hole is collinear with a center line of the DMD chip, and a projection of an outer contour of the protective cover on the end surface of the housing far away from the heat dissipation device is located outside an outer contour of the third through hole.

Preferably, the device further comprises a base, and the base is fixedly connected with the second support plate.

Compared with the prior art, the utility model has the following technical effects:

according to the DMD chip angle adjusting device provided by the utility model, the distance between the first supporting plate and the second supporting plate is changed by adjusting the using length of one or more adjusting rods, so that the inclination angle of the first supporting plate relative to the second supporting plate is changed therewith, and the first supporting plate drives the DMD chip to change the inclination angle, so that the angle adjustment of the DMD chip is realized. Simple structure and convenient adjustment. The first supporting plate and the second supporting plate are supported through the elastic component, and the elastic component deforms along with the change of the inclination angle of the first supporting plate, so that good support can be provided in the adjusting process, and the stability is good; in the accommodation process, the change of the angle between the first supporting plate and the elastic component is realized through the deformation of the elastic component, namely, relative sliding does not need to be generated between the first supporting plate and the elastic component, the friction loss is small, the problem that the adjustment amount cannot be accurately controlled due to the abrasion of the spring is avoided, and the service life is prolonged.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a DMD chip angle adjusting device provided in embodiment 1;

fig. 2 is a schematic structural diagram of a DMD light modulation device provided in embodiment 2;

FIG. 3 is a schematic structural view of the casing in embodiment 2;

fig. 4 is an exploded view of the DMD light modulating device provided in embodiment 2;

FIG. 5 is a schematic view of a chip holder according to example 2;

FIG. 6 is a schematic view showing an error in the mounting angle of the DMD chip in embodiment 2;

in the figure: 100-DMD chip angle adjusting device, 200-DMD light modulating device, 1-first support plate, 2-second support plate, 3-adjusting part, 4-adjusting rod, 5-elastic part, 6-first limiting part, 7-second limiting part, 8-DMD chip, 9-first connecting piece, 10-first support column, 11-adjusting button, 12-second mounting hole, 13-spring, 14-first mounting hole, 15-shell, 16-chip seat, 17-circuit board, 18-heat radiating device, 19-opening, 20-second connecting piece, 21-first through hole, 22-second through hole, 23-third support plate, 24-first inner wall, 25-second support column, 26-protective cover, 27-third through hole, 28-base, 29-actual mounting surface, 30-theoretical mounting surface.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.

Example 1

As shown in fig. 1, the present embodiment provides a DMD chip angle adjusting device 100, which includes a first supporting plate 1, a second supporting plate 2, and a plurality of adjusting members 3, wherein the first supporting plate 1 and the second supporting plate 2 are preferably made of aluminum plates, each adjusting member 3 includes an adjusting rod 4 and an elastic member 5, two ends of each adjusting rod 4 are fixedly provided with a first limiting portion 6 and a second limiting portion 7, each elastic member 5 is disposed between the first supporting plate 1 and the second supporting plate 2, each elastic member 5 is sleeved outside each adjusting rod 4, one end of each elastic member 5 is used for abutting against an end surface of the first supporting plate 1 close to the second supporting plate 2, the other end of each elastic member 5 is used for abutting against an end surface of the second supporting plate 2 close to the first supporting plate 1, the first supporting plate 1 is located between the first limiting portion 6 and the elastic member 5, and the first limiting portion 6 can limit the first supporting plate 1 from moving in a direction away from the second supporting plate 2, the second supporting plate 2 is located between the second limiting portion 7 and the elastic component 5, the second limiting portion 7 can limit the second supporting plate 2 to move towards the direction far away from the first supporting plate 1, the using length of each adjusting rod 4 can be adjusted along the direction of the central line of the adjusting rod and is kept unchanged, and the first supporting plate 1 is used for being fixedly connected with the DMD chip 8. Through adjusting the use length of one or more regulation poles 4, make the distance between first backup pad 1 and the second backup pad 2 change, and then first backup pad 1 changes thereupon for the inclination between the second backup pad 2, and first backup pad 1 drives DMD chip 8 and changes inclination, realizes DMD chip 8's angle modulation. Simple structure and convenient adjustment. The first supporting plate 1 and the second supporting plate 2 are supported through the elastic component 5, the elastic component 5 deforms along with the change of the inclination angle of the first supporting plate 1, good support can be provided in the adjusting process, and the stability is good; in the accommodation process, the change of the angle between the first supporting plate 1 and the elastic component 5 is realized through the deformation of the elastic component 5, namely, relative sliding does not need to be generated between the first supporting plate 1 and the elastic component 5, the friction loss is small, the problem that the adjustment amount cannot be accurately controlled due to the abrasion of the spring 13 is avoided, and the service life is prolonged.

The adjusting rod 4 comprises a first connecting piece 9, a first supporting column 10 and an adjusting button 11, the first connecting piece 9 is preferably an M3 inner hexagonal screw, the first supporting column 10 is preferably an aluminum column, the adjusting button 11 is preferably a screw, the first supporting plate 1 is provided with a plurality of first mounting holes 14, the second supporting plate 2 is provided with a plurality of second mounting holes 12, one end of each first connecting piece 9 is provided with a first limiting part 6, the other end of each first connecting piece 9 penetrates through each first mounting hole 14 to be in threaded connection with one end of each first supporting column 10, each first limiting part 6 and each first supporting column 10 can clamp the first supporting plate 1 tightly, one end of each adjusting button 11 is provided with a second limiting part 7, and the other end of each adjusting button 11 penetrates through each second mounting hole 12 to be in threaded connection with the other end of each first supporting column 10. The adjustment of the use length of the adjusting rod 4 can be realized by screwing the adjusting button 11, the structure is simple, and the installation and the use are convenient; simultaneously, because there may be precision error in the screw thread of adjusting knob 11 and first support column 10, after adjusting the position of DMD chip 8, both may rock in the direction of the central line of first support column 10, lead to first backup pad 1 can't be fixed steadily, and then influence the angle modulation of DMD chip 8, and elastomeric element 5 can provide good support for first backup pad 1 and second backup pad 2, it can be fixed steadily to have guaranteed first backup pad 1, the required precision of the screw thread of adjusting knob 11 and first support column 10 has been reduced.

The first mounting holes 14, the second mounting holes 12 and the adjusting parts 3 are all three, so that the first support plate 1 can be adjusted at any angle, and the first support plate 1 can keep stress balance. The elastic member 5 is a spring 13.

Example 2

As shown in fig. 2 to 6, the present embodiment provides a DMD light modulation device 200, which includes a DMD chip 8 and a DMD chip angle adjustment device 100 in embodiment 1, wherein the DMD chip 8 is fixedly connected to the first support plate 1. Through adjusting the use length of one or more regulation poles 4, make the distance between first backup pad 1 and the second backup pad 2 change, and then first backup pad 1 changes thereupon for the inclination between the second backup pad 2, and first backup pad 1 drives DMD chip 8 and changes inclination, realizes DMD chip 8's angle modulation. Simple structure and convenient adjustment. The first supporting plate 1 and the second supporting plate 2 are supported through the elastic component 5, the elastic component 5 deforms along with the change of the inclination angle of the first supporting plate 1, good support can be provided in the adjusting process, and the stability is good; the friction loss is small in the adjusting process, the problem that the adjusting amount cannot be accurately controlled due to the fact that the spring 13 is abraded is avoided, and the service life is prolonged.

The DMD light modulating device 200 provided in this embodiment further includes a casing 15, a chip holder 16, a circuit board 17 and a heat dissipating device 18, wherein an opening 19 is formed at one end of the casing 15, the heat dissipating device 18 is disposed at one end of the opening 19 of the casing 15, and the heat dissipating device 18 is disposed outside the casing 15, which is beneficial to improving the heat dissipating effect; and the volume of the heat sink 18 is not limited by space, and a heat sink with larger volume can be selected, so that the heat dissipation effect can be enhanced. The circuit board 17 is arranged between the heat dissipation device 18 and the shell 15, the heat dissipation device 18 and the shell 15 are fixedly connected through the second connecting piece 20, the heat dissipation device 18 and the shell 15 can clamp the chip seat 16 and the circuit board 17 tightly, the DMD chip 8 is fixedly connected to one end, far away from the circuit board 17, of the chip seat 16, a first through hole 21 is formed in the circuit board 17, a second through hole 22 is formed in the chip seat 16, the heat dissipation device 18 can penetrate through the first through hole 21 and the second through hole 22 to be in contact with the DMD chip 8, namely, the heat dissipation device 18 is in contact with the heat dissipation surface of the DMD chip 8, the heat dissipation device is preferable, the center lines of the first through hole 21 and the second through hole 22 are collinear, a proper amount of heat conduction silicone grease is coated on the contact surfaces of the heat dissipation device 18 and the DMD chip 8, the heat conduction effect between the heat dissipation device and the DMD chip 8 is improved, and further. The housing 15 is fixedly connected to the first support plate 1, preferably by M6 socket head cap screws. DMD chip 8 passes through shell 15 and first backup pad 1 fixed connection, and DMD chip 8 fixed connection is on chip seat 16 promptly, and chip seat 16 fixed connection is on shell 15, and shell 15 fixed connection has realized DMD chip 8 and first backup pad 1's fixed connection on first backup pad 1. When the product works, if the light that DMD chip 8 reflects out has slight error, rotate adjusting knob 11, make first backup pad 1 for the inclination change of second backup pad 2, drive DMD chip 8 and carry out angle modulation. As shown in fig. 6, for example, the actual mounting surface 29 of the DMD chip 8 is tilted forward by 3 ° with respect to the theoretical mounting surface 30 (the direction in which the working surface of the DMD chip 8 faces forward and the direction in which the working surface of the DMD chip 8 faces away is backward), the adjusting knob 11 behind the DMD chip 8 may be screwed to compress the corresponding spring 13, and the first support plate 1 drives the housing 15 (the DMD chip 8) to tilt backward, thereby returning to the theoretical mounting surface 30. The DMD chip 8 is in communication connection with the circuit board 17.

The end face, close to the DMD chip 8, of the heat dissipation device 18 is fixedly connected with a third support plate 23, the third support plate 23 is in contact with the end face, far away from the DMD chip 8, of the circuit board 17, the inner wall, opposite to the DMD chip 8, of the housing 15 is a first inner wall 24, the first inner wall 24 is provided with a plurality of second support columns 25, and the number of the second support columns 25 is preferably three. Each second supporting column 25 can contact with the end face of the chip holder 16 far away from the heat sink 18, and preferably, the heights of the plurality of second supporting columns 25 are the same, so that the working face of the DMDDMD chip 8 is parallel to the shell 15; the chip holder 16 is provided with a plurality of slots, and each second supporting pillar 25 extends into each slot. A gap is reserved between the heat dissipation device 18 and the housing 15 in the direction perpendicular to the straight line of the first inner wall 24, so that heat on the heat dissipation device 18 is prevented from being transferred to the housing 15, and further the angle change of the DMD chip 8 caused by thermal deformation of the housing 15 is avoided. Preferably, the third support plate 23 is provided with a protrusion, and the heat sink 18 is in contact with the DMD chip 8 through the protrusion passing through the first through hole 21 and the second through hole 22. A plurality of through holes are formed in the heat dissipation device 18, the circuit board 17 and the shell 15, and four M3 hexagon socket head cap screws sequentially penetrate through the gasket, the heat dissipation device 18, the circuit board 17 and the through holes in the shell 15, so that the heat dissipation device 18, the circuit board 17, the chip holder 16 and the shell 15 are fixedly connected.

The sum of the length of the second supporting column 25, the thickness of the chip holder 16, the thickness of the circuit board 17 and the thickness of the third supporting plate 23 is greater than the distance between the first inner wall 24 and the end surface of the end of the casing 15, which is provided with the opening 19, so that a gap is reserved between the end surface of the heat dissipation device 18, which is close to the DMD chip 8, and the end surface of the end of the casing 15, which is provided with the opening 19, and the angle change of the DMD chip 8 caused by the thermal deformation of the casing 15 is avoided.

The DMD light modulating device 200 provided in this embodiment further includes a protective cover 26, the protective cover 26 is fixedly connected to the end surface of the housing 15 away from the heat dissipating device 18, the first inner wall 24 is provided with a third through hole 27, a center line of the third through hole 27 is collinear with a center line of the DMD chip 8, and a projection of an outer contour of the protective cover 26 on the end surface of the housing 15 away from the heat dissipating device 18 is located outside the outer contour of the third through hole 27. The protective cover 26 can protect the surface of the DMD chip 8 during transportation and storage, and prevent the DMD chip 8 from being scratched or worn.

The DMD light modulating device 200 provided in this embodiment further includes a base 28, and the base 28 is fixedly connected to the second supporting plate 2. Preferably, two third support columns are arranged between the base 28 and the second support plate 2, one end of each third support column is fixedly connected with the end face, far away from the first support plate 1, of the second support plate 2, and the other end of each third support column is fixedly connected with the base 28.

The principle and the implementation mode of the utility model are explained by applying a specific example, and the description of the embodiment is only used for helping to understand the method and the core idea of the utility model; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the utility model.

Claims

1. The utility model provides a DMD chip angle adjusting device which characterized in that: the adjusting device comprises a first supporting plate, a second supporting plate and a plurality of adjusting parts, wherein each adjusting part comprises an adjusting rod and an elastic part, a first limiting part and a second limiting part are fixedly arranged at two ends of each adjusting rod, each elastic part is arranged between the first supporting plate and the second supporting plate, each elastic part is sleeved outside each adjusting rod, one end of each elastic part is used for abutting against the end surface, close to the second supporting plate, of the first supporting plate, the other end of each elastic part is used for abutting against the end surface, close to the first supporting plate, of the second supporting plate, the first supporting plate is positioned between the first limiting part and the elastic part, the first limiting part can limit the first supporting plate to move towards the direction far away from the second supporting plate, and the second supporting plate is positioned between the second limiting part and the elastic part, the second limiting part can limit the second supporting plate to move towards the direction far away from the first supporting plate, the using length of each adjusting rod can be adjusted along the direction of the central line of the adjusting rod and is kept unchanged, and the first supporting plate is used for being fixedly connected with the DMD chip.

2. The DMD chip angle adjustment device of claim 1, wherein: the adjusting rod comprises a first connecting piece, first supporting columns and adjusting buttons, a plurality of first mounting holes are formed in the first supporting plate, a plurality of second mounting holes are formed in the second supporting plate, a first limiting portion is arranged at one end of each first connecting piece, the other end of each first connecting piece penetrates through each first mounting hole to be in threaded connection with one end of each first supporting column, each first limiting portion and each first supporting column can clamp the first supporting plate tightly, a second limiting portion is arranged at one end of each adjusting button, and the other end of each adjusting button penetrates through each second mounting hole to be in threaded connection with the other end of each first supporting column.

3. The DMD chip angle adjustment device of claim 2, wherein: the first mounting hole, the second mounting hole and the adjusting part are all three, and the elastic part is a spring.

4. A DMD light modulation device, characterized in that: comprising a DMD chip and the DMD chip angle adjusting device of any one of claims 1-3, wherein the DMD chip is fixedly connected with the first supporting plate.

5. The DMD light modulating device of claim 4, wherein: also comprises a shell, a chip seat, a circuit board and a heat dissipation device, wherein one end of the shell is provided with an opening, the heat dissipation device is arranged at one end of the opening of the shell, the circuit board is arranged between the heat dissipation device and the shell, the heat dissipation device and the shell are fixedly connected through a second connecting piece, the heat dissipation device and the shell can clamp the chip holder and the circuit board, the DMD chip is fixedly connected with one end of the chip holder far away from the circuit board, the circuit board is provided with a first through hole, the chip holder is provided with a second through hole, the heat dissipation device can penetrate through the first through hole and the second through hole to be in contact with the DMD chip, the shell with first backup pad fixed connection, the DMD chip pass through the shell with first backup pad fixed connection, the DMD chip with the circuit board communication is connected.

6. The DMD light modulating device of claim 5, wherein: the heat dissipation device is close to fixedly connected with a third supporting plate on the end face of the DMD chip, the third supporting plate is in end face contact with the circuit board far away from the DMD chip, the inner wall, opposite to the DMD chip, of the shell is a first inner wall, a plurality of second supporting columns are arranged on the first inner wall, each second supporting column can be in end face contact with the chip seat far away from the heat dissipation device, and a gap is reserved between the heat dissipation device and the shell in the direction perpendicular to the straight line of the first inner wall.

7. The DMD light modulating device of claim 6, wherein: the sum of the length of the second supporting column, the thickness of the chip seat, the thickness of the circuit board and the thickness of the third supporting plate is larger than the distance between the first inner wall and the end face of the shell, which is provided with the opening, at one end.

8. The DMD light modulating device of claim 6, wherein: the protective cover is fixedly connected with the end face, far away from the heat dissipation device, of the shell, a third through hole is formed in the first inner wall, the center line of the third through hole is collinear with the center line of the DMD chip, and the projection of the outer contour of the protective cover on the end face, far away from the heat dissipation device, of the shell is located on the outer side of the outer contour of the third through hole.

9. The DMD light modulating device of claim 4, wherein: still include the base, the base with second backup pad fixed connection.