CN215955315U - Even light type patch type light-emitting diode - Google Patents
Even light type patch type light-emitting diode Download PDFInfo
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- CN215955315U CN215955315U CN202122103998.6U CN202122103998U CN215955315U CN 215955315 U CN215955315 U CN 215955315U CN 202122103998 U CN202122103998 U CN 202122103998U CN 215955315 U CN215955315 U CN 215955315U
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Abstract
The utility model discloses a uniform light type surface mount light-emitting diode, which relates to the technical field of light-emitting diodes and has the technical key points that: the LED light source comprises a mounting base, wherein a light reflecting cavity is formed in the mounting base, a light reflecting layer is attached to the inner wall of the light reflecting cavity, an LED chip is arranged in the light reflecting layer, a light evening mechanism is arranged above the LED chip, pins are connected to two sides of the LED chip and downwards penetrate through the mounting base, and a heat dissipation mechanism is arranged below the mounting base; the utility model is provided with the heat dissipation mechanism, thereby reducing the working temperature of the light-emitting diode, improving the stability of the light-emitting diode during working and prolonging the service life.
Description
Technical Field
The utility model relates to the technical field of light-emitting diodes, in particular to a uniform light type patch light-emitting diode.
Background
The LED is made of gallium, arsenic, phosphorus, nitrogen, indium compounds, and can radiate visible light when electrons and holes are combined, and the LED can be used as an indicator light in circuits and instruments, or can form a character or number display.
A uniform light type patch light emitting diode with the prior application number of CN202021259791.7, which comprises a casing, wherein a bowl-shaped cavity is arranged on the casing, a reflective layer is covered on the bowl-shaped cavity, a first conductive pin and a second conductive pin are arranged in the casing, an LED chip is arranged at the bottom of the bowl-shaped cavity, a bottom electrode of the LED chip is welded on the first conductive pin, and a top electrode of the LED chip is connected with the second conductive pin through a conductive lead; the bowl-shaped cavity is internally provided with a first transparent layer for coating the LED chip, the top surface of the first transparent layer is of an upward convex curved surface structure, the bowl-shaped cavity is also internally provided with a second transparent layer coated on the first transparent layer, a fluorescent layer is arranged between the first transparent layer and the second transparent layer, and the refractive index of the first transparent layer is smaller than that of the second transparent layer. However, the technology lacks a heat dissipation mechanism, the temperature of the light emitting diode during working cannot be effectively controlled, the stability of the light emitting diode during working is reduced, and the service life of the light emitting diode is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a uniform light type surface mounted light-emitting diode which is provided with a heat dissipation mechanism, so that the working temperature of the light-emitting diode is reduced, the stability of the light-emitting diode during working is improved, and the service life is prolonged.
In order to achieve the purpose, the utility model provides the following technical scheme:
the utility model provides a SMD emitting diode of even light type, includes the mounting base, it has reflection of light chamber to open on the mounting base, the laminating of reflection of light intracavity wall has the reflector layer, be equipped with the LED chip in the reflector layer, LED chip top is equipped with even light mechanism, LED chip both sides are connected with the pin, the pin runs through the mounting base downwards, the mounting base below is equipped with heat dissipation mechanism.
By adopting the scheme, after the LED chip is electrified through the pins, the LED chip starts to emit light and heat, and the generated heat can be discharged from the reflecting cavity through the heat dissipation mechanism, so that the working temperature of the LED is reduced, the working stability of the LED is improved, and the service life of the LED is prolonged; the light emitted by the LED chip is refracted and gathered through the reflecting layer on the inner wall of the reflecting cavity, and then is emitted after being homogenized through the light homogenizing mechanism, so that the effect of homogenizing light distribution is achieved; the LED chip is directly connected with the circuit board or other external power supplies through pins, the structure is simple, and the technology is mature.
Preferably, the heat dissipation mechanism comprises a plurality of heat dissipation sheets, and the heat dissipation sheets penetrate through the mounting base and extend into the light reflection cavity.
Preferably, each heat dissipation sheet is U-shaped, one end of each heat dissipation sheet is located in the light reflection cavity, and the other end of each heat dissipation sheet is located on the outer periphery side of the mounting base.
Preferably, the light homogenizing mechanism comprises a first light homogenizing layer, the top of the first light homogenizing layer is of an upward convex curved surface structure, the first light homogenizing layer is located in the light reflecting cavity and covers the LED chip, a second light homogenizing layer which covers the outer surface of the first light homogenizing layer is arranged in the light reflecting cavity, and the refractive index of the second light homogenizing layer is larger than that of the first light homogenizing layer.
Preferably, a fluorescent layer is arranged between the first light homogenizing layer and the second light homogenizing layer.
Preferably, smooth curved surface grooves are uniformly formed in the top of the second light uniformizing layer.
The utility model has the following beneficial effects:
when the LED chip is electrified through the pins, the LED chip starts to emit light and heat, and the generated heat can be discharged from the reflecting cavity through the heat dissipation mechanism, so that the working temperature of the LED is reduced, the working stability of the LED is improved, and the service life of the LED is prolonged; the light emitted by the LED chip is refracted and gathered through the reflecting layer on the inner wall of the reflecting cavity, and then is emitted after being homogenized through the light homogenizing mechanism, so that the effect of homogenizing light distribution is achieved; the LED chip is directly connected with the circuit board or other external power supplies through the pins, the structure is simple, and the technology is mature;
one end of the heat dissipation sheet extends into the light reflection cavity to discharge heat accumulated in the light reflection cavity from the other end of the heat dissipation sheet, and one end of the heat dissipation sheet extends to the outer peripheral side of the mounting base, so that a certain heat dissipation effect is further improved.
Drawings
FIG. 1 is a cross-sectional view of an embodiment of the present invention;
FIG. 2 is a top view of an embodiment of the present invention.
In the figure: 1. mounting a base; 2. a light reflecting cavity; 3. a light-reflecting layer; 4. an LED chip; 5. a pin; 6. a heat dissipating sheet; 71. a first light uniformizing layer; 72. a second light homogenizing layer; 8. a fluorescent layer; 9. a curved surface groove.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
A light-homogenizing surface-mounted light-emitting diode (LED) comprises a mounting base 1, wherein a light reflecting cavity 2 is formed in the mounting base 1, a light reflecting layer 3 is attached to the inner wall of the light reflecting cavity 2, an LED chip 4 is arranged in the light reflecting layer 3, a light homogenizing mechanism is arranged above the LED chip 4, pins 5 are connected to two sides of the LED chip 4, the pins 5 downwards penetrate through the mounting base 1, and a heat radiating mechanism is arranged below the mounting base 1;
as shown in fig. 1, when the LED chip 4 is powered on through the pin 5, the LED chip 4 starts to emit light and heat, and the heat generated by the heat dissipation mechanism can be discharged from the reflective cavity 2, so as to reduce the operating temperature of the light emitting diode, improve the stability of the light emitting diode during operation, and prolong the service life of the light emitting diode; the light emitted by the LED chip 4 is refracted and gathered by the reflecting layer 3 on the inner wall of the reflecting cavity 2, and then is emitted after being homogenized by the light homogenizing mechanism, so that the effect of uniform light distribution is achieved; the LED chip 4 is directly connected with a circuit board or other external power supplies through the pins 5, the structure is simple, and the technology is mature.
As shown in fig. 1-2, the heat dissipation mechanism includes a plurality of heat dissipation sheets 6, the heat dissipation sheets 6 penetrate through the mounting base 1 and extend into the reflective cavity 2, each heat dissipation sheet 6 is U-shaped, one end of each heat dissipation sheet 6 is located in the reflective cavity 2, and the other end of each heat dissipation sheet 6 is located on the outer periphery side of the mounting base 1; one end of the heat dissipation sheet 6 extends into the light reflection cavity 2, so that heat accumulated in the light reflection cavity 2 can be discharged from the other end of the heat dissipation sheet 6, and one end of the heat dissipation sheet 6 extends to the peripheral side of the outer part of the mounting base 1, so that a certain heat dissipation effect is further improved.
As shown in fig. 1-2, the light uniformizing mechanism includes a first light uniformizing layer 71, the top of the first light uniformizing layer 71 is a curved surface structure protruding upwards, the first light uniformizing layer 71 is located in the light reflecting cavity 2 and covers the LED chip 4, a second light uniformizing layer 72 covering the outer surface of the first light uniformizing layer 71 is arranged in the light reflecting cavity 2, the refractive index of the second light uniformizing layer 72 is greater than that of the first light uniformizing layer 71, a fluorescent layer 8 is arranged between the first light uniformizing layer 71 and the second light uniformizing layer 72, and a smooth curved surface groove 9 is uniformly opened at the top of the second light uniformizing layer 72;
as shown in fig. 1-2, due to the convex top surface structure of the first light uniformizing layer 71, the second light uniformizing layer 72 forms a concave lens structure, light from the LED chip 4 is subjected to light uniformizing and diverging, the refractive index of the first light uniformizing layer 71 is smaller than that of the second light uniformizing layer 72, and the light sequentially passes through the first light uniformizing layer 71 and the second light uniformizing layer 72 to form a diverging refraction effect, so as to form a light emitting effect with uniform brightness;
as shown in fig. 1-2, light emitted by the LED chip 4 passes through the first light-equalizing layer 71 and reaches the fluorescent layer 8, and after the fluorescent layer 8 brightens and colors the light, the light enters the second light-equalizing layer 72 and is diffused all around, so that the edge brightness of light spots formed by the light can be supplemented, and the light-emitting effect of the light-emitting diode can be improved; the top of the second light homogenizing layer 72 is provided with a plurality of curved surface grooves 9, the curved surface grooves 9 are uniformly distributed on the second light homogenizing layer 72, and a large number of micro lens units with negative focal power are formed at the top of the second light homogenizing layer 72 through the curved surface grooves 9, so that the light homogenizing effect of the second light homogenizing layer 72 is effectively improved.
The above is only a specific embodiment of the present invention, but the technical features of the present invention are not limited thereto. Any simple changes, equivalent substitutions or modifications made on the basis of the present invention to solve the substantially same technical problems and achieve the substantially same technical effects are within the scope of the present invention.
Claims (6)
1. The utility model provides a SMD emitting diode of even light type, includes mounting base (1), it has reflection of light chamber (2) to open on mounting base (1), reflection of light chamber (2) inner wall laminating has reflector layer (3), be equipped with LED chip (4) in reflector layer (3), LED chip (4) top is equipped with even light mechanism, its characterized in that: the LED chip is characterized in that pins (5) are connected to two sides of the LED chip (4), the pins (5) penetrate through the mounting base (1) downwards, and a heat dissipation mechanism is arranged below the mounting base (1).
2. The uniform light patch type light-emitting diode of claim 1, wherein: the heat dissipation mechanism comprises a plurality of heat dissipation sheets (6), and the heat dissipation sheets (6) penetrate through the mounting base (1) and extend into the reflection cavity (2).
3. The uniform light patch type light-emitting diode of claim 2, wherein: each heat dissipation sheet (6) is U-shaped, one end of each heat dissipation sheet (6) is located in the light reflection cavity (2), and the other end of each heat dissipation sheet (6) is located on the outer peripheral side of the mounting base (1).
4. The uniform light patch type light-emitting diode of claim 1, wherein: the light homogenizing mechanism comprises a first light homogenizing layer (71), the top of the first light homogenizing layer (71) is of an upward convex curved surface structure, the first light homogenizing layer (71) is located in the light reflecting cavity (2) and covers the LED chip (4), a second light homogenizing layer (72) which covers the outer surface of the first light homogenizing layer (71) is arranged in the light reflecting cavity (2), and the refractive index of the second light homogenizing layer (72) is larger than that of the first light homogenizing layer (71).
5. The uniform light patch type light-emitting diode of claim 4, wherein: and a fluorescent layer (8) is arranged between the first light homogenizing layer (71) and the second light homogenizing layer (72).
6. The dodging patch-type light-emitting diode according to claim 5, wherein: smooth curved surface grooves (9) are uniformly formed in the top of the second light homogenizing layer (72).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122103998.6U CN215955315U (en) | 2021-09-01 | 2021-09-01 | Even light type patch type light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122103998.6U CN215955315U (en) | 2021-09-01 | 2021-09-01 | Even light type patch type light-emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215955315U true CN215955315U (en) | 2022-03-04 |
Family
ID=80431359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122103998.6U Active CN215955315U (en) | 2021-09-01 | 2021-09-01 | Even light type patch type light-emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215955315U (en) |
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2021
- 2021-09-01 CN CN202122103998.6U patent/CN215955315U/en active Active
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