CN215955279U - 光学感测封装体 - Google Patents

光学感测封装体 Download PDF

Info

Publication number
CN215955279U
CN215955279U CN202122607520.7U CN202122607520U CN215955279U CN 215955279 U CN215955279 U CN 215955279U CN 202122607520 U CN202122607520 U CN 202122607520U CN 215955279 U CN215955279 U CN 215955279U
Authority
CN
China
Prior art keywords
light
chip
window
package
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202122607520.7U
Other languages
English (en)
Chinese (zh)
Inventor
周正三
范成至
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Egis Technology Inc
Original Assignee
Egis Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Egis Technology Inc filed Critical Egis Technology Inc
Application granted granted Critical
Publication of CN215955279U publication Critical patent/CN215955279U/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Light Receiving Elements (AREA)
CN202122607520.7U 2020-11-10 2021-10-28 光学感测封装体 Active CN215955279U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202063112061P 2020-11-10 2020-11-10
US63/112,061 2020-11-10

Publications (1)

Publication Number Publication Date
CN215955279U true CN215955279U (zh) 2022-03-04

Family

ID=79743188

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202122607520.7U Active CN215955279U (zh) 2020-11-10 2021-10-28 光学感测封装体
CN202111261442.8A Pending CN113990856A (zh) 2020-11-10 2021-10-28 光学感测封装体

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202111261442.8A Pending CN113990856A (zh) 2020-11-10 2021-10-28 光学感测封装体

Country Status (3)

Country Link
CN (2) CN215955279U (fr)
TW (2) TWM625090U (fr)
WO (1) WO2022100443A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI822302B (zh) * 2022-09-05 2023-11-11 財團法人工業技術研究院 光學雷達及其光訊號拾取方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110002266A (ko) * 2009-07-01 2011-01-07 삼성테크윈 주식회사 촬상 모듈
CN205752171U (zh) * 2016-05-17 2016-11-30 歌尔股份有限公司 一种光学传感器封装结构
FR3061630B1 (fr) * 2017-01-03 2021-07-09 St Microelectronics Grenoble 2 Procede de fabrication d'un capot pour boitier electronique et boitier electronique comprenant un capot
CN109698208B (zh) * 2017-10-20 2023-06-30 新加坡有限公司 图像传感器的封装方法、图像传感器封装结构和镜头模组
CN109872986B (zh) * 2017-12-04 2023-07-04 新加坡有限公司 光学传感器的封装结构及光学传感器的封装方法

Also Published As

Publication number Publication date
CN113990856A (zh) 2022-01-28
WO2022100443A1 (fr) 2022-05-19
TW202220224A (zh) 2022-05-16
TWM625090U (zh) 2022-04-01

Similar Documents

Publication Publication Date Title
US10749067B2 (en) Optical sensor package including a cavity formed in an image sensor die
US9684074B2 (en) Optical sensor arrangement and method of producing an optical sensor arrangement
US9443835B2 (en) Methods for performing embedded wafer-level packaging (eWLP) and eWLP devices, packages and assemblies made by the methods
US9570649B2 (en) Methods for fabricating a plurality of optoelectronic devices from a wafer that includes a plurality of light detector sensor areas
US9305967B1 (en) Wafer Level optoelectronic device packages and methods for making the same
US9543282B2 (en) Optical sensor package
CN111052406B (zh) 制造多个飞行时间传感器器件的方法
US9721837B2 (en) Wafer level optoelectronic device packages with crosstalk barriers and methods for making the same
CN215955279U (zh) 光学感测封装体
US9018645B2 (en) Optoelectronics assembly and method of making optoelectronics assembly
CN114429949A (zh) 小型化光传感器封装及其制作方法
CN114599998A (zh) 一种接收芯片及其制备方法、测距装置、可移动平台
CN215953857U (zh) Tof光学感测模块
CN214669574U (zh) 具有杂散光导离结构的tof光学感测模组
CN216285703U (zh) 堆叠式光学感测封装体
KR20230122573A (ko) 센서 및 이를 이용한 ToF 카메라
US20240128292A1 (en) Optoelectronic module
CN115685146A (zh) 直接飞行时间感测模组

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant