CN215954232U

CN215954232U - Signal acquisition and processing machine case

Info

Publication number: CN215954232U
Application number: CN202122080973.9U
Authority: CN
Inventors: 袁华; 陈强
Original assignee: Yiwei Technology Chengdu Co ltd
Current assignee: Yiwei Technology Chengdu Co ltd
Priority date: 2021-08-31
Filing date: 2021-08-31
Publication date: 2022-03-04
Anticipated expiration: 2031-08-31

Abstract

The utility model relates to the technical field of instrument control equipment, and aims to provide a signal acquisition and processing case which comprises a modularized case framework; the modular chassis framework adopts a standard upper frame structure design and comprises a CPU unit, a power supply module, a plurality of signal acquisition and processing units and a chassis shell; the CPU unit, the power supply module and the plurality of signal acquisition and processing units are respectively connected with the case shell in a plug-in manner; the CPU unit, the power supply module and the plurality of signal acquisition and processing units are respectively electrically connected with a back plate bus in the case shell; the CPU unit adopts an embedded processor and is also electrically connected with a CPU monitoring module; the design achieves the purposes of ensuring the attractiveness and practicability of equipment layout, increasing the intelligent degree of equipment and ensuring the working stability of components inside the case.

Description

Signal acquisition and processing machine case

Technical Field

The utility model relates to the technical field of instrument control equipment, in particular to a signal acquisition and processing case.

Background

The current signal acquisition and processing equipment mostly adopts standard buses such as CPCI/PXI/PXIe/VXI and the like, wherein the VXI is mainly a 6U high chassis and is eliminated by the market at present. The main stream of equipment mostly adopts PXI/PXIe/CPCI standard, and the main characteristics of the chassis are as follows:

a high-speed serial or parallel bus is adopted, each board card needs an interface chip, and the cost of the back plate and the functional board card is higher;

the standard 3U structure is adopted, the size of the board card is 160mm x 100mm, the PCB space is limited, and in some high-density and multi-channel application scenes, multilayer boards need to be overlapped, so that the density is high, the heat dissipation is not easy, and the long-term stable and reliable work is not facilitated;

the case adopts a standard front panel incoming line mode and a front panel outgoing line mode, and cable access is complicated, unattractive and difficult to investigate in a multi-channel application scene;

the overall power consumption of the chassis is high, the PXI/PXIe specification requires that the AC/DC power supply of the system exceeds 500W, and the heat dissipation of the system is a great challenge.

The equipment back plate is complex, the power supply adopts a built-in design, the power supply is most prone to problems, if the device is in a problem, the case needs to be disassembled for major maintenance, the maintenance time is long, and the quick maintenance is not facilitated.

The current self-diagnosis function in the case is few, and cannot judge timely, power distribution, temperature distribution, load distribution and the like, the future instrument technology develops towards the direction of intellectualization, and the current case is absent in self-diagnosis and intelligent design.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the defects of the prior art and provides a main transformer cooler self-starting system when a PLC control system of the main transformer cooler fails, which can automatically start the cooler when the PLC fails or loses power.

The method is realized by the following technical scheme:

the utility model aims to overcome the defects of the prior art and provides a signal acquisition and processing cabinet.

The method is realized by the following technical scheme:

a signal acquisition and processing chassis comprises a modular chassis architecture;

the modularized chassis framework adopts a standard upper frame structure design and comprises a CPU unit, a power supply module, a plurality of signal acquisition and processing units and a chassis shell;

the CPU unit, the power supply module and the signal acquisition and processing units are respectively connected with the case shell in a plug-in manner;

the CPU unit, the power supply module and the plurality of signal acquisition and processing units are respectively electrically connected with a back plate bus in the case shell;

the CPU unit adopts an embedded processor and is also electrically connected with a CPU monitoring module;

the power supply module is also electrically connected with the power supply monitoring module, and the chassis shell is also provided with a heat dissipation device which is used for cooling the interior of the chassis shell;

and the case shell is provided with a wire inlet at one side adjacent to the heat dissipation device and at the opposite side of one side adjacent to the heat dissipation device.

Further, the model of the power supply module is TUNS500F 28.

Further, the model of the CPU unit is Xilinx MPSOC 3 EG.

Further, the CPU monitoring module is configured to monitor a temperature and a load of the CPU unit.

Further, the power monitoring module is used for monitoring the power and the temperature of the power module.

Furthermore, the heat dissipation device is a plurality of heat dissipation fans which are arranged on one side of the chassis shell in an array manner.

Further, the power supply module adopts 220V AC and 24V DC power supply input.

The utility model has the beneficial effects that:

(1) the utility model adopts the user-defined serial bus to realize the point-to-point communication between the CPU unit and the acquisition processing unit, and reduces the interface cost and the power consumption of each functional unit.

(2) The casing of the case adopts the design of double-sided incoming and outgoing lines, so that signals can enter from the rear panel and exit from the rear panel, and the purposes of advancing, then exiting and then exiting can be realized, different incoming and outgoing lines can be realized for different application scenes, and the attractiveness of equipment layout is ensured.

(3) The modular power supply adopts a design idea of a modular power supply, the power supply module is provided with an active heat dissipation function, and can be quickly inserted into and pulled out of a case, so that the subsequent quick upgrade and maintenance are facilitated, and the maintainability and the expandability of the system are improved.

Drawings

FIG. 1 is an electrical connection diagram of the present invention;

fig. 2 is a diagram of the board card size of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to fig. 1-2 of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other implementations made by those of ordinary skill in the art based on the embodiments of the present invention are obtained without inventive efforts.

In the description of the present invention, it is to be understood that the terms "counterclockwise", "clockwise", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are used for convenience of description only, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be considered as limiting.

As shown in fig. 1 and 2, a signal acquisition and processing chassis includes a modular chassis architecture;

Further, the model of the power supply module is TUNS500F 28.

Further, the model of the CPU unit is Xilinx MPSOC 3 EG.

Further, the power supply module adopts 220V AC and 24V DC power supply input.

Example (b):

the board card adopts the self-defined size and width, the CPCI length (160 mm) is compatible, meanwhile, the height of the board card is increased from 100mm to 120mm, the PCB area is increased by 20%, more analog devices can be placed conveniently, better performance is realized, and the heat dissipation efficiency of the board card is improved;

the chassis shell adopts a double-sided inlet and outlet wire design, so that signals can enter from the rear panel and exit from the rear panel, and the front and rear outlet can be realized, and the rear and front outlet can be realized, so that different inlet and outlet wires can be realized for different application scenes, and the attractiveness of equipment layout is ensured;

the chassis adopts a low-power-consumption design framework, the CPU adopts an embedded processor, the power is properly controlled on the basis of meeting the application requirement, the power of the whole machine can be controlled within 200W (the board card is fully inserted), the heat dissipation of the chassis is greatly reduced, and the working stability of an analog device is ensured;

the power and temperature of a power supply unit, the temperature and load of a CPU unit and the temperature and data transmission rate of each acquisition processing unit are monitored in real time by adopting a self-diagnosis intelligent monitoring technology, the man-machine is alarmed through an intelligent embedded algorithm, the intelligent rotating speed of a fan is controlled, and the like, so that the intelligent degree of the device is greatly improved;

a power supply module: the plug-in card type design is adopted, various power modules are supported, flexible configuration can be realized, including but not limited to 200W, 300W, 500W and 700W, a self-contained temperature detection circuit, a power detection circuit, an overload protection circuit and the like, and high-reliability work is realized;

a CPU unit: the system adopts a card-inserting type design, and is provided with a dual gigabit Ethernet, a high-speed CAN interface, an HDMI video output port and a USB interface. A dual-core embedded controller is adopted, the main frequency is not lower than 667Mhz, the running memory is 4GB, and the nonvolatile storage medium is 32 GB;

the signal acquisition processing unit: the card-inserting type design is adopted, the multi-channel sensor signal access is supported, and the functions of signal conditioning, acquisition, calculation processing, bus transmission, local cache and the like are realized.

Claims

1. A signal acquisition and processing case is characterized by comprising a modularized case framework;

2. The signal acquisition and processing cabinet of claim 1, wherein the power module is of the TUNS500F28 type.

3. A signal acquisition and processing cabinet according to claim 1, wherein the CPU unit has a model of Xilinx MPSOC 3 EG.

4. The signal acquisition and processing chassis of claim 1, wherein the CPU monitoring module is configured to monitor a temperature and a load of the CPU unit.

5. The signal acquisition and processing chassis of claim 1, wherein the power monitoring module is configured to monitor power and temperature of the power module.

6. The signal acquisition and processing cabinet according to claim 1, wherein the heat dissipation device is a heat dissipation fan, and the heat dissipation fan comprises a plurality of heat dissipation fans arranged in an array on one side of the cabinet housing.

7. The signal acquisition and processing chassis of claim 1, wherein the power module employs 220V AC and 24V DC power inputs.