CN215941786U - PCB board crest soldering flux atomizer - Google Patents
PCB board crest soldering flux atomizer Download PDFInfo
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- CN215941786U CN215941786U CN202122349594.5U CN202122349594U CN215941786U CN 215941786 U CN215941786 U CN 215941786U CN 202122349594 U CN202122349594 U CN 202122349594U CN 215941786 U CN215941786 U CN 215941786U
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Abstract
The utility model discloses a PCB wave-soldering flux spraying device which comprises a main body, wherein a liquid storage tank is fixedly connected to the inner wall of the bottom of the main body, a liquid outlet pipe is arranged inside the main body, two ends of the liquid outlet pipe respectively penetrate through the outer portion of the top end of the main body and the inside of the liquid storage tank, a supporting plate is fixedly connected to one side of the top of the main body, a rack is slidably connected to one side of the supporting plate, a driving shaft and a driven shaft are respectively and rotatably connected to one side of the supporting plate, a second gear and a first gear are respectively and fixedly connected to the outer portions of the driving shaft and the driven shaft, the second gear is meshed with the first gear and the rack, and a fixing ring is fixedly connected to one end of the driven shaft. According to the utility model, by arranging the liquid storage tank, the liquid outlet pipe, the liquid suction pipe, the fixing ring, the driving shaft, the fixing block, the liquid suction disc, the fixing block, the heating bin, the heating pipe, the fixing frame and the damping base, when the device is used, the device is uniform in spraying, high in operation efficiency, good in effect, simple to operate, stable and practical.
Description
Technical Field
The utility model relates to the technical field of wave soldering machines, in particular to a spraying device for soldering flux for wave soldering of a PCB (printed circuit board).
Background
The wave soldering machine is a soldering machine which sprays molten soft soldering flux (lead-tin alloy) into a soldering flux wave with design requirements through an electric pump or an electromagnetic pump, and can also be formed by injecting nitrogen into a soldering pool, so that a printed board with components in advance passes through the soldering flux wave, and the soldering of mechanical and electrical connection between soldering terminals or pins of the components and a pad of the printed board is realized. The soldering flux is an indispensable product for wave soldering, is mainly used for removing rust films on the surface of a soldered base metal, reducing the surface tension of a wave soldering liquid tin material, preventing the secondary oxidation of the soldered metal of a circuit board in the heating process of wave soldering, and also has the function of heat transfer and the like.
Through retrieval, chinese patent publication No. CN212384787U discloses a PCB wave soldering flux spraying apparatus, which comprises a nozzle, a spraying range adjusting device detachably disposed on the nozzle, the spraying range adjusting device comprising a connecting seat connected with the nozzle, two adjusting plates disposed on the connecting seat relatively, a spraying range between the two adjusting plates, angle adjusting devices respectively connected to the two adjusting plates, and the angle adjusting devices changing the angle of the adjusting plates in the vertical direction, thereby realizing a device changing the size of the spraying range between the two adjusting plates.
A PCB board crest soldering flux atomizer in above-mentioned patent exists following not enough: when the device is used, the range of the nozzle is changed by the two adjusting plates, and the operation mode is more limited, so that the operation effect is poor.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art, and provides a spraying device for a wave soldering flux of a PCB.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a wave soldering flux spraying device for a PCB (printed circuit board) comprises a main body, wherein a liquid storage tank is fixedly connected to the inner wall of the bottom of the main body, a liquid outlet pipe is arranged in the main body, two ends of the liquid outlet pipe respectively penetrate through the outer portion of the top end of the main body and the inner portion of the liquid storage tank, a supporting plate is fixedly connected to one side of the top of the main body, a rack is slidably connected to one side of the supporting plate, a driving shaft and a driven shaft are respectively and rotatably connected to one side of the supporting plate, a second gear and a first gear are respectively and fixedly connected to the outer portions of the driving shaft and the driven shaft, the second gear is meshed with the first gear and the rack, a fixing ring is fixedly connected to one end of the driven shaft, a rubber pipe is fixedly connected to one end of the liquid outlet pipe, a rotating pipe is fixedly connected to the top of the rubber pipe, a nozzle is arranged at the top of the rotating pipe, the fixing ring is sleeved on the outer portion of the rotating pipe, a driving mechanism is arranged at the top of the main body, the liquid storage tank is internally provided with a liquid pumping mechanism.
Further, actuating mechanism includes the motor, the motor with the top fixed connection of main part, the one end of driving shaft runs through to one side of backup pad, the one end of the output shaft of motor and the one end fixed connection of driving shaft, first gear is the half-gear form, the second gear is the symmetry form.
Further, pump liquid mechanism includes the water pump, the bottom inner wall fixed connection of water pump and liquid reserve tank, the one end of drain pipe and the delivery outlet looks adaptation of water pump, the input port of water pump is equipped with the pipette, the one end of pipette is equipped with the pipette dish.
Further, the outside cover of drain pipe is equipped with the heated warehouses, the top fixedly connected with fixed block of heated warehouses, the fixed block with the top inner wall fixed connection of main part, fixedly connected with mount between the top inner wall of heated warehouses and the bottom inner wall, one side fixedly connected with heating pipe of mount, the inside of heated warehouses is equipped with the heater, the heating pipe with heater electric connection, the outside of drain pipe is located to the heating pipe cover.
Furthermore, the bottom of the main body is fixedly connected with four support legs.
Furthermore, the bottoms of the four supporting legs are fixedly connected with damping bases.
The utility model has the beneficial effects that:
1. by arranging the liquid storage tank, the liquid outlet pipe, the liquid suction pipe, the rubber pipe, the supporting plate, the rack, the gear, the rotating pipe, the fixing ring, the driving shaft, the fixing block and the liquid suction disc, when the device is used, a water pump sucks soldering flux through the liquid suction disc on the liquid suction pipe, then the soldering flux is guided into the liquid outlet pipe and is sprayed out through the nozzle at one end, meanwhile, the motor drives the second gear through the driving shaft, the second gear drives the rack and the first gear on the driven shaft through the driving of the rack respectively, so that the first gear rotates in a reciprocating manner, the first gear drives the fixing ring through the driven shaft, the fixing ring drives the nozzle at the top of the rotating pipe and rotates in a reciprocating manner through the rubber pipe together, so that the soldering flux is uniformly sprayed, the device is uniform in spraying, high in operation efficiency and good in effect;
2. by arranging the fixing block, the heating bin, the heating pipe and the fixing frame, when the device is used, the scaling powder flows in the liquid outlet pipe, and the heating pipe in the heating bin preheats the scaling powder, so that the operation effect of the device is greatly ensured;
3. through setting up vibration damping mount, when using this device, vibration damping mount has guaranteed device steady operation greatly, has increased the practicality of device.
Through setting up liquid reserve tank, drain pipe, pipette, rubber tube, backup pad, rack, gear, rotating tube, retainer plate, driving shaft, fixed block, imbibition dish, fixed block, heated warehouses, heating pipe, mount, vibration damping mount, when using this device, this device sprays evenly, and the operating efficiency is high, and is effectual, easy operation, stable practical.
Drawings
Fig. 1 is a schematic front cross-sectional structural diagram of a device for spraying a solder flux for wave soldering of a PCB board according to embodiment 1;
FIG. 2 is a schematic top view of the solder flux spraying apparatus for solder wave soldering of PCB board according to embodiment 1;
fig. 3 is a schematic structural diagram of a vibration damping mount of the device for spraying the solder flux for the wave soldering of the PCB in embodiment 2.
In the figure: the device comprises a main body 1, a liquid storage tank 2, a liquid outlet pipe 3, a liquid suction pipe 4, a rubber pipe 5, a supporting plate 6, a rack 7, a first gear 8, a rotating pipe 9, a fixing ring 10, a driving shaft 11, a second gear 12, a fixing block 13, a heating bin 14, a heating pipe 15, a fixing frame 16, a liquid suction disc 17, a supporting leg 18, a driven shaft 19 and a damping base 20.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.
In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.
In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
Example 1
Referring to fig. 1-2, a device for spraying a soldering flux for peak soldering of a PCB comprises a main body 1, a liquid storage tank 2 is fixedly connected to the inner wall of the bottom of the main body 1, a liquid outlet pipe 3 is arranged inside the main body 1, two ends of the liquid outlet pipe 3 respectively penetrate through the outside of the top end of the main body 1 and the inside of the liquid storage tank 2, a support plate 6 is fixedly connected to one side of the top of the main body 1, a rack 7 is slidably connected to one side of the support plate 6, a driving shaft 11 and a driven shaft 19 are respectively rotatably connected to one side of the support plate 6, a second gear 12 and a first gear 8 are respectively fixedly connected to the outside of the driving shaft 11 and the driven shaft 19, the second gear 12 is engaged with the first gear 8 and the rack 7, a fixed ring 10 is fixedly connected to one end of the driven shaft 19, a rubber tube 5 is fixedly connected to one end of the liquid outlet pipe 3, a rotating tube 9 is fixedly connected to the top of the rubber tube 5, and a nozzle is arranged at the top of the rotating tube 9, the outside of rotating tube 9 is located to the retainer plate 10 cover, and the top of main part 1 is equipped with actuating mechanism, and the inside of liquid reserve tank 2 is equipped with pump liquid mechanism.
Wherein, actuating mechanism includes the motor, the top fixed connection of motor and main part 1, and one side to backup pad 6 is run through to the one end of driving shaft 11, the one end of the output shaft of motor and the one end fixed connection of driving shaft 11, and first gear 8 is the half-gear form, and second gear 12 is the symmetry form.
Wherein, the liquid pumping mechanism comprises a water pump, the water pump is fixedly connected with the inner wall of the bottom of the liquid storage tank 2, one end of the liquid outlet pipe 3 is matched with the output port of the water pump, the input port of the water pump is provided with a liquid suction pipe 4, one end of the liquid suction pipe 4 is provided with a liquid suction disc 17, an XDC-6500 type water pump sucks soldering flux through the liquid suction disc 17 on the liquid suction pipe 4, then the soldering flux is guided into the liquid outlet pipe 3 and is sprayed out through a nozzle at one end, simultaneously, a Y2-631-4 type motor drives a second gear 12 through a driving shaft 11, the second gear 12 respectively drives a rack 7 and a first gear 8 on a driven shaft 19 to make the first gear 8 do reciprocating rotation, the first gear 8 drives a fixed ring 10 through a driven shaft 19, the fixed ring 10 drives a nozzle at the top of a rotating pipe 9 to do reciprocating rotation together through a rubber pipe 5, so that the soldering flux is uniformly sprayed, the device has uniform spraying effect, the operation efficiency is high, and the effect is good;
the heating device comprises a liquid outlet pipe 3, a heating bin 14, a fixing block 13, a fixing frame 16, a heating pipe 15, a heater, a heating pipe 15, a heating pipe and a heating pipe, wherein the heating bin 14 is sleeved outside the liquid outlet pipe 3, the heating pipe 14 is used for preheating soldering flux when the soldering flux flows inside the liquid outlet pipe 3, and the operation effect of the device is greatly guaranteed;
wherein, four support legs 18 are fixedly connected to the bottom of the main body 1.
The working principle is as follows: when the device is used, a water pump sucks soldering flux through a liquid sucking disc 17 on a liquid sucking pipe 4, then the soldering flux is guided into a liquid outlet pipe 3 and is sprayed out through a nozzle at one end, meanwhile, a motor drives a second gear 12 through a driving shaft 11, the second gear 12 respectively drives a rack 7 and a first gear 8 on a driven shaft 19 to enable the first gear 8 to rotate in a reciprocating mode, the first gear 8 drives a fixed ring 10 through the driven shaft 19, and the fixed ring 10 drives a nozzle at the top of a rotating pipe 9 to rotate in a reciprocating mode through a rubber pipe 5, so that the soldering flux is uniformly sprayed;
when the soldering flux flows in the liquid outlet pipe 3, the heating pipe 14 in the heating bin 14 preheats the soldering flux, and the operation effect of the device is greatly ensured.
Example 2
Referring to fig. 3, in order to increase the practicability of the device, compared with embodiment 1, in the embodiment of the spraying device for the wave soldering flux of the PCB, shock absorbing bases 20 are fixedly connected to the bottoms of four support legs 18, and the shock absorbing bases 20 greatly ensure the stable operation of the device, thereby increasing the practicability of the device.
The working principle is as follows: when the device is used, a water pump sucks soldering flux through a liquid sucking disc 17 on a liquid sucking pipe 4, then the soldering flux is guided into a liquid outlet pipe 3 and is sprayed out through a nozzle at one end, meanwhile, a motor drives a second gear 12 through a driving shaft 11, the second gear 12 respectively drives a rack 7 and a first gear 8 on a driven shaft 19 to enable the first gear 8 to rotate in a reciprocating mode, the first gear 8 drives a fixed ring 10 through the driven shaft 19, and the fixed ring 10 drives a nozzle at the top of a rotating pipe 9 to rotate in a reciprocating mode through a rubber pipe 5, so that the soldering flux is uniformly sprayed;
when the soldering flux flows in the liquid outlet pipe 3, the heating pipe 14 in the heating bin 14 preheats the soldering flux, and the operation effect of the device is greatly ensured.
When the device is used, the damping base 20 greatly ensures the stable work of the device, and the practicability of the device is increased.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.
Claims (6)
1. The utility model provides a PCB board crest soldering flux atomizer, includes main part (1), its characterized in that, the bottom inner wall of main part (1) is equipped with liquid reserve tank (2), and the inside of main part (1) is equipped with drain pipe (3), the both ends of drain pipe (3) run through respectively to the top outside of main part (1) with the inside of liquid reserve tank (2), and top one side of main part (1) is equipped with backup pad (6), one side of backup pad (6) is equipped with rack (7), and one side of backup pad (6) is equipped with driving shaft (11) and driven shaft (19) respectively, driving shaft (11) with the outside of driven shaft (19) is equipped with second gear (12) and first gear (8) respectively, second gear (12) with first gear (8) with rack (7) mesh mutually, the one end of driven shaft (19) is equipped with retainer plate (10), the one end of drain pipe (3) is equipped with rubber tube (5), top fixed connection rotating tube (9) of rubber tube (5), the top of rotating tube (9) is equipped with the nozzle, the outside of rotating tube (9) is located to retainer plate (10) cover, and the top of main part (1) is equipped with actuating mechanism, and the inside of liquid reserve tank (2) is equipped with pump liquid mechanism.
2. The PCB peak soldering flux spraying device of claim 1, wherein the driving mechanism comprises a motor, the motor is fixedly connected with the top of the main body (1), one end of the driving shaft (11) penetrates through one side of the supporting plate (6), one end of an output shaft of the motor is fixedly connected with one end of the driving shaft (11), the first gear (8) is in a half-gear shape, and the second gear (12) is in a symmetrical shape.
3. The device for spraying the solder flux on the PCB according to claim 2, wherein the liquid pumping mechanism comprises a water pump, the water pump is fixedly connected with the inner wall of the bottom of the liquid storage tank (2), one end of the liquid outlet pipe (3) is matched with an output port of the water pump, a liquid suction pipe (4) is arranged at an input port of the water pump, and a liquid suction disc (17) is arranged at one end of the liquid suction pipe (4).
4. The PCB board wave peak welding scaling powder atomizer of claim 3, characterized in that, the outside cover of drain pipe (3) is equipped with heated warehouses (14), the top of heated warehouses (14) is equipped with fixed block (13), fixed block (13) with the top inner wall fixed connection of main part (1), be equipped with mount (16) between the top inner wall of heated warehouses (14) and the bottom inner wall, one side of mount (16) is equipped with heating pipe (15), and the inside of heated warehouses (14) is equipped with the heater, heating pipe (15) with heater electric connection, the outside of drain pipe (3) is located to heating pipe (15) cover.
5. A device for spraying solder flux for peak soldering of PCB according to claim 4, wherein the bottom of the main body (1) is provided with four legs (18).
6. The PCB peak soldering flux spraying device according to claim 5, wherein the bottom of four of the supporting legs (18) is provided with a shock absorbing base (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122349594.5U CN215941786U (en) | 2021-09-27 | 2021-09-27 | PCB board crest soldering flux atomizer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122349594.5U CN215941786U (en) | 2021-09-27 | 2021-09-27 | PCB board crest soldering flux atomizer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215941786U true CN215941786U (en) | 2022-03-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122349594.5U Active CN215941786U (en) | 2021-09-27 | 2021-09-27 | PCB board crest soldering flux atomizer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215941786U (en) |
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2021
- 2021-09-27 CN CN202122349594.5U patent/CN215941786U/en active Active
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