CN215933539U - Leveling device and system - Google Patents
Leveling device and system Download PDFInfo
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- CN215933539U CN215933539U CN202122389626.4U CN202122389626U CN215933539U CN 215933539 U CN215933539 U CN 215933539U CN 202122389626 U CN202122389626 U CN 202122389626U CN 215933539 U CN215933539 U CN 215933539U
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Abstract
The utility model provides a leveling device and a system, wherein the leveling device comprises: a base; the two conductive blocks are arranged on the base at intervals; at least one conductive block is electrically insulated from the base; one of the conductive blocks can receive the input of an electric signal, and the other conductive block can output the electric signal outwards; one end of the elastic cantilever structure is fixed with one conductive block and is electrically connected with the conductive block in a conduction mode, and the other end of the elastic cantilever structure is arranged above the other conductive block and is provided with a contact structure; when the contact structure is pressed downwards, the contact structure can be contacted with the corresponding conductive block, so that an electric signal path is formed between the two conductive blocks; when the contact structure is not pressed downwards, the contact structure can be separated from the corresponding contact structure and the corresponding conductive block, so that an open circuit of an electric signal is formed between the two conductive blocks. The utility model can meet the requirement of high-precision leveling at low cost.
Description
Technical Field
The utility model relates to the technical field of semiconductor bonding, in particular to a leveling device and a leveling system.
Background
In the existing semiconductor bonding technology, before bonding, a bonding head needs to be leveled, so that a bonded device has higher levelness after the bonding head adsorbs the bonded device. In the leveling process, a triangular pyramid mode is usually adopted for leveling, the vertical type is detected through the light intensity between the tool and the workpiece table which is visually observed by human eyes, and the leveling precision of the mode is poor. In order to improve the leveling precision, the square-exchange mode is improved, and the leveling can be carried out by adopting a non-contact sensor for measurement, however, the non-contact sensor is usually required to be added inside a moving part, the equipment cost is increased, and meanwhile, the measurement precision of the non-contact sensor is still difficult to meet the requirement.
SUMMERY OF THE UTILITY MODEL
The leveling device and the leveling system provided by the utility model can meet the requirement of high-precision leveling at low cost.
In a first aspect, the present invention provides a leveling device comprising:
a base;
the two conductive blocks are arranged on the base at intervals; at least one conductive block is electrically insulated from the base; one of the conductive blocks can receive the input of an electric signal, and the other conductive block can output the electric signal outwards;
one end of the elastic cantilever structure is fixed with one conductive block and is electrically connected with the conductive block in a conduction mode, and the other end of the elastic cantilever structure is arranged above the other conductive block and is provided with a contact structure; when the contact structure is pressed downwards, the contact structure can be contacted with the corresponding conductive block, so that an electric signal path is formed between the two conductive blocks; when the contact structure is not pressed downwards, the contact structure can be separated from the corresponding contact structure and the corresponding conductive block, so that an open circuit of an electric signal is formed between the two conductive blocks.
Optionally, the contact structure comprises a conductive sphere, the sphere center of which is arranged in the central plane of the resilient cantilever structure.
Optionally, the elastic cantilever structure is a plate spring, and a through hole is formed in the plate spring;
the contact structure further comprises a conductive ring, the conductive ring is in interference fit with the conductive ball body, and at least part of the conductive ball body penetrates through the through hole from top to bottom so that the conductive ring is in conductive contact with and connected with the plate spring piece.
Optionally, an insulating pad is disposed between the at least one conductive block and the base, and the at least one conductive block and the base are connected by a connecting member made of an insulating material.
Optionally, one end of the elastic cantilever structure is fixedly connected with one of the conductive blocks through a pressing sheet, and the pressing sheet is fixedly connected with the corresponding conductive block; one end of the elastic cantilever structure is pressed between the conductive block and the pressing sheet.
Optionally, a plurality of magnets are arranged on the base and can be adsorbed on the corresponding workpiece table.
Optionally, the electronic device further comprises a casing, wherein the casing surrounds the base and the conductive block; the upper surface of the shell is not higher than the upper surface of the elastic cantilever structure; the upper surface of the shell is provided with an opening in clearance fit with the elastic cantilever structure.
Optionally, the two conductive blocks are respectively provided with a binding post, one of the binding posts is connected with a first signal line for inputting an electrical signal, and the other binding post is connected with a second signal line for outputting an electrical signal.
Optionally, a wire clamp is arranged on the base and used for fixing the first signal wire and the second signal wire.
In a second aspect, there is provided a leveling system comprising:
the plane motion module can perform two-dimensional motion in a first plane;
a vertical movement module movable in a vertical direction to the first plane;
a levelling device as claimed in any one of the preceding claims;
leveling the flat plate;
the plane motion module is used for driving the leveling module and the leveling flat plate to perform relative plane motion so as to enable the leveling module to correspond to different positions of the leveling flat plate, the vertical motion module is used for driving the leveling module and the leveling flat plate to perform relative vertical motion, and when the leveling flat plate applies pressure to the contact structure to enable a signal path to be formed between two conductive blocks, relative vertical motion displacement is determined.
The device for detecting the motion stop position is formed by the elastic cantilever structure, a flat plate is adsorbed on the bonding head, the contact structure corresponds to different areas of the plate, the bonding head moves in the vertical direction, the contact structure is separated from the corresponding conductive blocks before the plate contacts the contact structure, an open circuit of electric signals is formed between the two conductive blocks, when the plate contacts the contact, the contact structure contacts the corresponding conductive blocks, an electric signal passage is formed between the two conductive blocks, and when the signals change, the vertical motion of the bonding head is stopped and the motion displacement of the bonding head is recorded, so that the displacement of the bonding head can be accurately obtained. The structure provided by the utility model is simple, and standard workpieces can be adopted for preparation, so that the preparation efficiency is higher, and the processing cost is very low.
Drawings
FIG. 1 is a schematic view of a leveling device according to an embodiment of the present invention;
FIG. 2 is a schematic view of another angle of a leveling device according to an embodiment of the present invention;
FIG. 3 is a schematic view of a leveling device with magnets according to another embodiment of the present invention;
FIG. 4 is a schematic view of a leveling device with a housing according to another embodiment of the present invention;
fig. 5 is a schematic view of a leveling plate of a leveling system according to another embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
An embodiment of the present invention provides a leveling device, as shown in fig. 1-2, including:
the base 1, in some embodiments the base 1 is a structure for providing a supporting function, and the whole leveling device can be mounted on a workpiece table.
The two conductive blocks 3 are arranged on the base 1 at intervals; at least one conductive block 3 is electrically insulated from the base 1; one of the conductive blocks 3 can receive the input of an electric signal, and the other conductive block 3 can output the electric signal outwards; in some embodiments, at least one of the two conductive bumps 3 is electrically insulated from the base 1, thereby preventing the electrical signals on the two conductive bumps 3 from being shorted by the base 1. As an alternative embodiment, when one conductive block 3 is connected to the base 1 in an insulated manner, one conductive block 3 may be connected to the base 1 in an insulated manner, and the other conductive block may be prepared integrally with the base. In another alternative embodiment, both conductive bumps 3 may be connected to the base 1 in an insulated manner.
One end of the elastic cantilever structure is fixed with one conductive block 3 and is electrically connected with the conductive block in a conduction mode, and the other end of the elastic cantilever structure is arranged above the other conductive block 3 and is provided with a contact structure; when the contact structure is pressed downwards, the contact structure can be contacted with the corresponding conductive block 3, so that an electric signal path is formed between the two conductive blocks 3; when the contact structure is not pressed downwards, the contact structure and the corresponding conductive block 3 can be separated, so that an open circuit of an electric signal is formed between the two conductive blocks 3. In some embodiments, a cantilever structure refers to a structure with one end fixedly connected and the other end free. The elastic cantilever structure means that the structure has elasticity, the free end displaces when receiving pressure, and the free end restores to the original position when the pressure disappears. In some embodiments, the conductive block 3 corresponding to one end of the elastic cantilever structure to be fixed may be the conductive block 3 disposed on the base 1 in an insulating manner, or may be the conductive block 3 disposed on the base 1 in a conductive manner. The free end of the elastic cantilever structure is provided with a contact structure which is arranged above the corresponding conductive block 3, and when the contact structure is pressed, the contact moves downwards to contact the conductive block 3, so that a conductive path is formed between the two conductive blocks 3. When the pressure is removed, the contact structure is moved away from the conductive blocks 3, so that an open circuit is formed between the two conductive blocks 3.
In the embodiment provided by the utility model, the device for detecting the motion stop position is formed by the elastic cantilever structure, a flat plate is adsorbed on the bonding head, different areas of the plate correspond to the contact structures, the bonding head moves in the vertical direction, before the plate is contacted with the contact structures, the contact structures are separated from the corresponding conductive blocks 3, an open circuit of an electric signal is formed between the two conductive blocks 3, when the plate is contacted with the contact, the contact structures are contacted with the corresponding conductive blocks 3, a path of the electric signal is formed between the two conductive blocks 3, and when the signal changes, the vertical motion of the bonding head is stopped and the motion displacement of the bonding head is recorded, so that the displacement of the bonding head can be accurately obtained. The structure provided by the utility model is simple, and standard workpieces can be adopted for preparation, so that the preparation efficiency is higher, and the processing cost is very low.
As an alternative embodiment, as shown in fig. 1-2, the contact structure includes a conductive ball 10, and the center of the conductive ball 10 is disposed in the center plane of the elastic cantilever structure. In some embodiments, the resilient cantilever structure refers to a plane that is the same distance from the upper and lower surfaces of the resilient cantilever structure. In some embodiments, since the distance between any position of the conductive ball 10 and the center of the ball is consistent, when the conductive ball 10 contacts the conductive block 3, the stroke of the conductive ball is not extended due to the inclination angle, and the measurement accuracy of the moving distance of the bond head can be improved. In some embodiments, the aforementioned manner of using the conductive sphere as the elastic cantilever structure is not exclusive, and those skilled in the art should understand that the conductive pin may also be used as the contact structure, and preferably, both ends of the conductive pin are disposed as spherical surfaces, the spherical surfaces at both ends are concentric spherical surfaces, and the spherical centers of the two spherical surfaces are disposed at the intersection of the central plane of the elastic cantilever structure and the pin axis.
As an alternative embodiment, as shown in fig. 1-2, the elastic cantilever structure is a plate spring 7, and the plate spring 7 is provided with a through hole; the contact structure further comprises a conductive ring 5, the conductive ring 5 is in interference fit with the conductive ball 10, and at least part of the conductive ball 10 penetrates through the through hole from top to bottom, so that the conductive ring 5 is in conductive contact with and connected with the plate spring 7. In some embodiments, the conductive ring 5 and the conductive ball 10 are in interference fit, so that the conductive ring 5 and the conductive ball 10 are fixed to each other, the conductive ball 10 penetrates through the through hole of the plate spring 7, the conductive ring 5 is connected with the plate spring 7, and the plate spring 7 and the conductive ball 10 are not directly connected and processed, thereby avoiding the damage to the precision of the plate spring 7 in the processing process.
As an alternative embodiment, as shown in fig. 1-2, an insulating pad 8 is disposed between at least one conductive block 3 and the base 1, and the at least one conductive block 3 and the base 1 are connected by a connecting member 9 made of an insulating material. In some embodiments, in order to achieve insulation between the conductive block 3 and the base 1, an insulating pad 8 is disposed between the base 1 and the conductive block 3, and in order to avoid the connecting piece 9 forming a conductive path, the connecting piece 9 made of an insulating material is used for connection.
As an alternative embodiment, as shown in fig. 1-2, one end of the elastic cantilever structure is fixedly connected with one of the conductive blocks 3 through a pressing sheet 2, and the pressing sheet 2 is fixedly connected with the corresponding conductive block 3; one end of the elastic cantilever structure is pressed between the conductive block 3 and the pressing sheet 2. In some embodiments, the pressing sheet 2 is used for fixing the elastic cantilever structure, so that damage to the elastic cantilever structure is avoided, and meanwhile, the pressing sheet 2 is detachably connected with the corresponding conductive block through the screw 11, so that replacement or repair of the elastic cantilever structure is facilitated.
As an alternative embodiment, as shown in fig. 3, a plurality of magnets 14 are disposed on the base 1, and the magnets 14 can be attached to the corresponding workpiece stages. In some embodiments, the leveling device needs to be fixed on a workpiece table or an operation platform during use, and therefore, in the present embodiment, the plurality of magnets 14 are disposed on the base 1, so that the leveling device is adsorbed on a fixed target through the magnets 14 during use, and can be conveniently and quickly mounted and dismounted.
As an alternative embodiment, as shown in fig. 4, further comprising a housing 13, wherein the housing 13 encloses the base 1 and the conductive block 3; the upper surface of the housing 13 is not higher than the upper surface of the elastic cantilever structure; the upper surface of the housing 13 is provided with an opening in clearance fit with the resilient cantilever structure. In some embodiments, the base 1 and the conductive block 3 and the terminals 4 or 12 are protected by a housing 13, which is connected to the base 1 by screws 15. The upper surface of the shell 13 is not higher than the upper surface of the elastic cantilever structure, so that the leveling device is not limited, and the leveling device can apply pressure to the contact structure, so that the contact structure is contacted with the conductive block 3. The upper surface of the shell 13 is arranged in the opening of the elastic cantilever structure in clearance fit, so that the elastic cantilever structure can move freely without being constrained by the shell 13.
In an alternative embodiment, the two conductive bumps 3 are respectively provided with terminals 4 or 12, wherein one terminal 4 or 12 is connected to a first signal line for inputting an electrical signal, and the other terminal 4 or 12 is connected to a second signal line for outputting an electrical signal. In some embodiments, terminals 4 or 12 are provided on the two conductive blocks 3, respectively, for connecting a first signal line and a second signal line, respectively, one for inputting and one for outputting an electrical signal, thereby enabling monitoring of contact.
As an alternative embodiment, a clip 6 is disposed on the base 1, and the clip 6 is used for fixing the first signal line and the second signal line. In some embodiments, the wire clamp 6 is used for fixing the first signal wire and the second signal wire, so that the first signal wire and the second signal wire form a wire harness to extend out, and the edge outer shell 13 is arranged, and meanwhile, the fixing of the first signal wire and the second signal wire by the wire clamp 6 can also form protection for the terminal 4 or 12, and avoids dragging of the terminal 4 or 12 by the first signal wire and the second signal wire.
Embodiments of the present invention also provide a leveling system, including:
the plane motion module can perform two-dimensional motion in a first plane;
a vertical movement module movable in a vertical direction to the first plane;
a levelling device as claimed in any one of the preceding claims;
a leveling plate 17 as shown in fig. 5;
the plane motion module is used for driving the leveling module and the leveling flat plate 17 to perform relative plane motion so as to enable the leveling module to correspond to different positions of the leveling flat plate 17, the vertical motion module is used for driving the leveling module and the leveling flat plate 17 to perform relative vertical motion, and when the leveling flat plate 17 applies pressure to the contact structure to enable a signal path to be formed between the two conductive blocks 3, relative vertical motion displacement is determined.
In some embodiments, the leveling plate 17 may be disposed on the vertical motion module, the leveling device may be disposed on the planar motion module, and the leveling device may be driven by the planar motion module to correspond to different positions of the leveling plate 17, for example, any one of positions 1701-1704 in fig. 5; and then the leveling flat plate 17 is driven to move downwards by the vertical movement module, when the leveling flat plate 17 is contacted with the contact structure and a conductive path is formed between the two conductive blocks 3, the driving of the vertical movement module is stopped, and the distance of the driving leveling flat plate 17 of the vertical movement module moving in the vertical direction is recorded. In other embodiments, the leveling plate 17 may be driven to move in a three-dimensional space by using a vertical movement module and a plane movement module, and the leveling device is set at a fixed position and a fixed height, so as to level the leveling plate 17. In other embodiments, the leveling device may be driven by the vertical motion module and the planar motion module to move in a three-dimensional space, so as to set the leveling flat plate 17 at a fixed height and a fixed position, thereby leveling the leveling flat plate 17.
In the embodiment provided by the utility model, the device for detecting the motion stop position is formed by the elastic cantilever structure, a flat plate is adsorbed on the bonding head, different areas of the plate correspond to the contact structures, the bonding head moves in the vertical direction, before the plate is contacted with the contact structures, the contact structures are separated from the corresponding conductive blocks 3, an open circuit of an electric signal is formed between the two conductive blocks 3, when the plate is contacted with the contact, the contact structures are contacted with the corresponding conductive blocks 3, a path of the electric signal is formed between the two conductive blocks 3, and when the signal changes, the vertical motion of the bonding head is stopped and the motion displacement of the bonding head is recorded, so that the displacement of the bonding head can be accurately obtained. The structure provided by the utility model is simple, and standard workpieces can be adopted for preparation, so that the preparation efficiency is higher, and the processing cost is very low.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A leveling device, comprising:
a base;
the two conductive blocks are arranged on the base at intervals; at least one conductive block is electrically insulated from the base; one of the conductive blocks can receive the input of an electric signal, and the other conductive block can output the electric signal outwards;
one end of the elastic cantilever structure is fixed with one conductive block and is electrically connected with the conductive block in a conduction mode, and the other end of the elastic cantilever structure is arranged above the other conductive block and is provided with a contact structure; when the contact structure is pressed downwards, the contact structure can be contacted with the corresponding conductive block, so that an electric signal path is formed between the two conductive blocks; when the contact structure is not pressed downwards, the contact structure can be separated from the corresponding contact structure and the corresponding conductive block, so that an open circuit of an electric signal is formed between the two conductive blocks.
2. The leveling device of claim 1, wherein the contact structure comprises a conductive sphere having a center disposed in a center plane of the resilient cantilever structure.
3. The leveling device of claim 2, wherein the resilient cantilever structure is a leaf spring having a through hole disposed therein;
the contact structure further comprises a conductive ring, the conductive ring is in interference fit with the conductive ball body, and at least part of the conductive ball body penetrates through the through hole from top to bottom so that the conductive ring is in conductive contact with and connected with the plate spring piece.
4. The leveling device as recited in claim 1, wherein an insulating pad is disposed between at least one conductive block and the base, and the at least one conductive block is connected to the base by a connecting member made of an insulating material.
5. The leveling device as recited in claim 1, wherein one end of the elastic cantilever structure is fixedly connected with one of the conductive blocks through a pressing piece, and the pressing piece is fixedly connected with the corresponding conductive block; one end of the elastic cantilever structure is pressed between the conductive block and the pressing sheet.
6. The leveling device as recited in claim 1, wherein a plurality of magnets are disposed on the base, and the magnets are capable of being attracted to the corresponding work piece table.
7. The leveling device of claim 1, further comprising a housing surrounding the base and the conductive block; the upper surface of the shell is not higher than the upper surface of the elastic cantilever structure; the upper surface of the shell is provided with an opening in clearance fit with the elastic cantilever structure.
8. The leveling device as recited in claim 1, wherein the two conductive blocks are respectively provided with a binding post, one binding post is connected with a first signal line for inputting an electrical signal, and the other binding post is connected with a second signal line for outputting an electrical signal.
9. The leveling device as recited in claim 1 wherein a wire clamp is provided on the base for securing the first signal wire and the second signal wire.
10. A leveling system, comprising:
the plane motion module can perform two-dimensional motion in a first plane;
a vertical movement module movable in a vertical direction to the first plane;
a leveling device as recited in any one of claims 1-9;
leveling the flat plate;
the plane motion module is used for driving the leveling module and the leveling flat plate to perform relative plane motion so as to enable the leveling module to correspond to different positions of the leveling flat plate, the vertical motion module is used for driving the leveling module and the leveling flat plate to perform relative vertical motion, and when the leveling flat plate applies pressure to the contact structure to enable a signal path to be formed between two conductive blocks, relative vertical motion displacement is determined.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122389626.4U CN215933539U (en) | 2021-09-29 | 2021-09-29 | Leveling device and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122389626.4U CN215933539U (en) | 2021-09-29 | 2021-09-29 | Leveling device and system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215933539U true CN215933539U (en) | 2022-03-01 |
Family
ID=80407092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122389626.4U Active CN215933539U (en) | 2021-09-29 | 2021-09-29 | Leveling device and system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215933539U (en) |
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2021
- 2021-09-29 CN CN202122389626.4U patent/CN215933539U/en active Active
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