CN215898130U

CN215898130U - Three-dimensional molding interconnection device

Info

Publication number: CN215898130U
Application number: CN202121842496.9U
Authority: CN
Inventors: 冯鑫
Original assignee: Shenzhen Sunway Communication Co Ltd
Current assignee: Shenzhen Sunway Communication Co Ltd
Priority date: 2021-08-09
Filing date: 2021-08-09
Publication date: 2022-02-22
Anticipated expiration: 2031-08-09

Abstract

The utility model discloses a three-dimensional molding interconnection device which comprises a plastic support and a metallized circuit arranged on the plastic support, wherein the metallized circuit comprises a welding area arranged on the top surface of the plastic support, the top surface of the plastic support is also provided with a tin containing groove, the tin containing groove is arranged close to the welding area, and the metallized circuit further comprises a covering area covering the tin containing groove and a connecting area connecting the welding area and the covering area. The plastic support is provided with a tin containing groove, and the metallized circuit covers the tin containing groove, so that tin liquid overflowing outwards from a welding area during welding can flow into the tin containing groove along the connecting area, bad phenomena such as tin balls and short circuits caused by tin overflowing in the welding process are avoided, and the production yield of the three-dimensional molding interconnection device is favorably improved.

Description

Three-dimensional molding interconnection device

Technical Field

The present invention relates to a three-dimensional molded interconnect device.

Background

3D-MID (Three-dimensional molded interconnect device), Chinese is interpreted to mean a Three-dimensional molded interconnect device, including but not limited to LDS devices.

As shown in fig. 1, a three-dimensional molded interconnect device generally includes a plastic support 1 and a metallized circuit 2 disposed on a surface of the plastic support 1, generally, an electronic component 3 is soldered on the metallized circuit 2 by an SMT technique, and in the prior art, since an area of the metallized circuit 2 around the electronic component 3 is a plane, during the SMT soldering process, tin overflow is likely to occur, which leads to a short circuit or poor appearance (solder ball).

SUMMERY OF THE UTILITY MODEL

The technical problem to be solved by the utility model is as follows: a three-dimensional molded interconnect device with high yield is provided.

In order to solve the technical problems, the utility model adopts the technical scheme that: the utility model provides a three-dimensional moulding interconnection device, includes the plastic support and locates metallization circuit on the plastic support, metallization circuit is including the weld zone of locating the top surface of plastic support, and the top surface of plastic support still is equipped with holds the molten tin bath, it is close to hold the molten tin bath the weld zone sets up, metallization circuit still including covering hold the footprints of molten tin bath and connect the weld zone with the joining region of footprints.

Furthermore, the cross section of the tin containing groove is V-shaped.

Furthermore, hold the molten tin bath including relative first inclined plane and the second inclined plane that sets up, first inclined plane is close to the weld zone sets up, first inclined plane with the contained angle between the top surface of plastic support is more than or equal to 120, the contained angle between the second inclined plane with the top surface of plastic support is more than or equal to 120.

Furthermore, the first inclined plane is connected with the top surface of the plastic support through a first fillet, and the radius corresponding to the first fillet is greater than or equal to 0.15 mm.

Furthermore, the second inclined plane is connected with the top surface of the plastic support through a second round angle, and the radius corresponding to the second round angle is larger than or equal to 0.15 mm.

Further, the first inclined plane is connected with the second inclined plane through a third fillet, and the radius corresponding to the third fillet is greater than or equal to 0.15 mm.

Furthermore, two end surfaces of the tin containing groove are respectively provided with a third inclined surface.

Furthermore, the third inclined plane pass through the fourth fillet with the top surface of plastic support is connected, the radius that the fourth fillet corresponds is greater than or equal to 0.15 mm.

The electronic component is welded on the metallized circuit, the number of the metallized circuit is at least two, two groups of pins of the electronic component are respectively welded with welding areas of two different metallized circuits, and the electronic component is positioned between the two tin containing grooves.

The utility model has the beneficial effects that: the plastic support is provided with a tin containing groove, and the metallized circuit covers the tin containing groove, so that tin liquid overflowing from a welding area during welding can flow into the tin containing groove along the connecting area, bad phenomena such as tin ball and short circuit caused by tin overflowing in a welding process (such as SMT process) are avoided, and the production yield of the three-dimensional molding interconnection device is improved.

Drawings

FIG. 1 is a cross-sectional view of a prior art three-dimensional molded interconnect device;

FIG. 2 is a top view of a three-dimensional molded interconnect device according to a first embodiment of the present invention;

fig. 3 is a cross-sectional view of a three-dimensional molded interconnect device in accordance with a first embodiment of the present invention;

fig. 4 is an enlarged view of detail a in fig. 3.

Description of reference numerals:

1. a plastic bracket; 11. a tin containing groove; 111. a first inclined plane; 112. a second inclined plane; 113. a first rounded corner; 114. a second rounded corner; 115. a third fillet; 116. a fourth fillet;

2. a metallization line; 21. a welding zone; 22. a coverage area; 23. a connecting region; 24. a surrounding region;

3. an electronic component.

Detailed Description

In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.

Referring to fig. 2 to 4, a three-dimensional molding interconnection device includes a plastic support 1 and a metallized circuit 2 disposed on the plastic support 1, where the metallized circuit 2 includes a bonding area 21 disposed on a top surface of the plastic support 1, the top surface of the plastic support 1 is further provided with a tin-containing slot 11, the tin-containing slot 11 is disposed near the bonding area 21, and the metallized circuit 2 further includes a covering area 22 covering the tin-containing slot 11 and a connecting area 23 connecting the bonding area 21 and the covering area 22.

From the above description, the beneficial effects of the present invention are: the plastic support 1 is provided with a tin containing groove 11, and the metallized circuit 2 covers the tin containing groove 11, so that tin liquid overflowing from a welding area 21 during welding can flow into the tin containing groove 11 along a connecting area 23, bad phenomena such as tin ball and short circuit caused by tin overflowing in a welding process (such as SMT process) are avoided, and the production yield of the three-dimensional molding interconnection device is improved.

Further, the cross section of the tin containing groove 11 is V-shaped.

As can be seen from the above description, the tin-containing bath 11 having a V-shaped cross section can better collect the overflowing tin liquid.

Further, the tin containing groove 11 includes a first inclined surface 111 and a second inclined surface 112 which are oppositely disposed, the first inclined surface 111 is disposed near the welding region 21, an included angle between the first inclined surface 111 and the top surface of the plastic support 1 is greater than or equal to 120 °, and an included angle between the second inclined surface 112 and the top surface of the plastic support 1 is greater than or equal to 120 °.

As can be seen from the above description, the inclination angle of the first/second inclined planes is greater than or equal to 120 °, so that the overflowing molten tin can flow into the tin containing slot 11 more smoothly.

Further, the first inclined plane 111 is connected with the top surface of the plastic support 1 through a first round corner 113, and a radius corresponding to the first round corner 113 is greater than or equal to 0.15 mm.

Further, the second inclined plane 112 is connected to the top surface of the plastic bracket 1 through a second rounded corner 114, and a corresponding radius of the second rounded corner 114 is greater than or equal to 0.15 mm.

From the above description, the first/second inclined planes are transited to the top surface of the plastic bracket 1 through the fillet with the radius larger than or equal to 0.15mm, which is beneficial to the overflowing tin liquid to flow into the tin containing slot 11 more smoothly.

Further, the first inclined surface 111 is connected with the second inclined surface 112 through a third fillet 115, and the radius corresponding to the third fillet 115 is greater than or equal to 0.15 mm.

Further, two end surfaces of the tin containing groove 11 are respectively third inclined surfaces.

Further, the third inclined plane is connected with the top surface of the plastic support 1 through a fourth fillet 116, and the radius corresponding to the fourth fillet 116 is greater than or equal to 0.15 mm.

As can be seen from the above description, the fourth rounded corner 116 can guide the overflowing tin outside the end of the tin containing tank 11 to flow into the tin containing tank 11, which is beneficial to enhancing the tin liquid collecting effect of the tin containing tank 11.

Further, the electronic component module further comprises an electronic component 3 welded on the metallized circuit 2, the number of the metallized circuit 2 is at least two, two groups of pins of the electronic component 3 are respectively welded with welding areas 21 of two different metallized circuits 2, and the electronic component 3 is located between the two tin containing tanks 11.

Example one

Referring to fig. 2 to 4, a first embodiment of the present invention is: a three-dimensional molding interconnection device can be used in electronic equipment such as mobile phones, smart watches, computers and the like.

Referring to fig. 2 and fig. 3, the three-dimensional molding interconnection device includes a plastic support 1, a metallized circuit 2 disposed on the plastic support 1, and at least two electronic components 3 soldered on the metallized circuit 2; the metallized circuit 2 comprises a welding zone 21 arranged on the top surface of the plastic support 1, the top surface of the plastic support 1 is also provided with a tin containing groove 11, the tin containing groove 11 is arranged close to the welding zone 21, the metallized circuit 2 further comprises a covering zone 22 covering the tin containing groove 11 and a connecting zone 23 connecting the welding zone 21 and the covering zone 22, two groups of pins of the electronic component 3 are respectively welded with the welding zones 21 of two different metallized circuits 2, namely one group of pins of the electronic component 3 is welded and conducted with one metallized circuit 2, and the other group of pins of the electronic component 3 is welded and conducted with the other metallized circuit 2; the electronic component 3 is located between the two tin containing grooves 11 on the two different metallized circuits 2. The electronic component 3 includes, but is not limited to, a capacitor, and the like.

In this embodiment, as shown in fig. 4, the cross section of the tin containing groove 11 is V-shaped. Specifically, hold tin bath 11 including relative first inclined plane 111 and the second inclined plane 112 that sets up, first inclined plane 111 is close to welding region 21 sets up, first inclined plane 111 with the contained angle between the top surface of plastic support 1 is greater than or equal to 120, second inclined plane 112 with the contained angle between the top surface of plastic support 1 is greater than or equal to 120.

The first inclined plane 111 is connected with the top surface of the plastic support 1 through a first round angle 113, and the radius corresponding to the first round angle 113 is greater than or equal to 0.15 mm; the second inclined surface 112 is connected with the top surface of the plastic support 1 through a second round angle 114, and the corresponding radius of the second round angle 114 is greater than or equal to 0.15 mm; the first inclined surface 111 is connected with the second inclined surface 112 through a third fillet 115, and the radius corresponding to the third fillet 115 is greater than or equal to 0.15 mm. It will be understood that, due to the first rounded corner 113, the connection between the connection region 23 and the covering region 22 is also rounded accordingly, so as to make the tin liquid flow into the tin-containing groove 11 more smoothly.

Optionally, two end surfaces of the tin containing groove 11 are respectively a third inclined surface. Further, the third inclined plane is connected with the top surface of the plastic support 1 through a fourth fillet 116, and the radius corresponding to the fourth fillet 116 is greater than or equal to 0.15 mm. Optionally, the metallization line 2 further includes a surrounding area 24 surrounding the covering area 22, the surrounding area 24 is connected to the covering area 22, the surrounding area 24 is U-shaped as a whole, and it is easy to understand that the joint of the surrounding area 24 and the covering area 22 covers the second fillet 114 and the fourth fillet 116.

In summary, in the three-dimensional molding interconnection device provided by the utility model, the plastic support is provided with the tin containing groove, and the metallized circuit covers the tin containing groove, so that tin liquid overflowing from the welding area during welding can flow into the tin containing groove along the connecting area, thereby avoiding bad phenomena such as tin ball and short circuit caused by tin overflow in the welding process, and being beneficial to improving the production yield of the three-dimensional molding interconnection device; the connecting part of the connecting area and the covering area is provided with a fillet with the radius larger than or equal to 0.15mm, the inclination angle of the first inclined plane of the tin containing groove is larger than or equal to 120 degrees, the tin liquid which conveniently overflows smoothly flows into the tin containing groove, and the tin liquid collecting capacity of the tin containing groove is enhanced.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.

Claims

1. A three-dimensional molding interconnection device comprises a plastic support and a metallized circuit arranged on the plastic support, wherein the metallized circuit comprises a welding area arranged on the top surface of the plastic support, and the three-dimensional molding interconnection device is characterized in that: the top surface of the plastic support is also provided with a tin containing groove, the tin containing groove is arranged close to the welding area, and the metallized circuit further comprises a covering area covering the tin containing groove and a connecting area connecting the welding area and the covering area.

2. The three-dimensional molded interconnect device of claim 1, wherein: the cross section of the tin containing groove is V-shaped.

3. The three-dimensional molded interconnect device of claim 2, wherein: the tin containing groove comprises a first inclined surface and a second inclined surface which are oppositely arranged, the first inclined surface is close to the welding area, an included angle between the first inclined surface and the top surface of the plastic support is larger than or equal to 120 degrees, and an included angle between the second inclined surface and the top surface of the plastic support is larger than or equal to 120 degrees.

4. The three-dimensional molded interconnect device of claim 3, wherein: the first inclined plane is connected with the top surface of the plastic support through a first round angle, and the radius corresponding to the first round angle is larger than or equal to 0.15 mm.

5. The three-dimensional molded interconnect device of claim 3, wherein: the second inclined plane passes through the second fillet with the top surface of plastic support is connected, the corresponding radius of second fillet is greater than or equal to 0.15 mm.

6. The three-dimensional molded interconnect device of claim 3, wherein: the first inclined plane is connected with the second inclined plane through a third fillet, and the radius corresponding to the third fillet is larger than or equal to 0.15 mm.

7. The three-dimensional molded interconnect device of claim 1, wherein: and the two end surfaces of the tin containing groove are respectively provided with a third inclined surface.

8. The three-dimensional molded interconnect device of claim 7, wherein: the third bevel is connected with the top surface of the plastic support through a fourth fillet, and the radius corresponding to the fourth fillet is greater than or equal to 0.15 mm.

9. The three-dimensional molded interconnect device of claim 1, wherein: the electronic component is welded on the metallized circuit, the number of the metallized circuit is at least two, two groups of pins of the electronic component are respectively welded with welding areas of two different metallized circuits, and the electronic component is positioned between the two tin containing grooves.