CN215887286U - Electroplating hanger device - Google Patents
Electroplating hanger device Download PDFInfo
- Publication number
- CN215887286U CN215887286U CN202122405559.0U CN202122405559U CN215887286U CN 215887286 U CN215887286 U CN 215887286U CN 202122405559 U CN202122405559 U CN 202122405559U CN 215887286 U CN215887286 U CN 215887286U
- Authority
- CN
- China
- Prior art keywords
- cathode
- rod
- copper rod
- hanger
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses an electroplating hanger device which comprises a copper rod, a cathode ring, a conductive assembly, a lead, a cathode rod and a driving device, wherein the copper rod is vertically arranged on the central axis, the cathode ring is arranged at the lower end of the copper rod, the conductive assembly is arranged on the copper rod, the lead is connected with the conductive assembly, the cathode rod is connected with the lead and is positioned right above the copper rod, the driving device drives the copper rod to rotate, the lead is connected with the cathode rod, and a hanger to be electroplated is arranged on the cathode ring. By adopting the structure, the rotatable cathode ring is adopted, the cathode ring is annular, the hangers are uniformly distributed on the annular cathode ring, and the annular cathode ring rotates during electroplating, so that all workpieces have equal opportunity to receive nickel ions under the action of an electric field, and the coating thicknesses of the workpieces in different areas are ensured to be consistent.
Description
Technical Field
The utility model relates to an electroplating hanger device, in particular to an electroplating hanger device with compact structure and good electroplating uniformity.
Background
The original electroplating process is to place the product to be plated on a hanger which is placed on a cathode rod of an electroplating bath, wherein anode titanium baskets are arranged on two sides of the electroplating bath, and a nickel cake is arranged in the electroplating bath. Under the action of the electric field, the nickel ions move to the product to be plated, and a layer of nickel is formed on the surface of the product to be plated. As shown in FIG. 1, the thickness of the nickel layer plated on the surface of the product to be plated is different due to the non-uniform electric field of the plating solution, which exceeds the requirement of the technical specification, and the thickness of the plating layer of the product to be plated at different positions of the hanger is different due to the non-uniform concentration of nickel ions in each region under the action of the electric field in the middle of the hanger.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an electroplating hanger device which has the characteristics of compact structure and good electroplating uniformity.
In order to solve the technical problems, the technical scheme of the utility model is as follows: the utility model provides an electroplating hanger device which innovation point lies in: the electroplating hanger device comprises a copper rod, a cathode ring, a conductive assembly, a conducting wire, a cathode rod and a driving device, wherein the copper rod is vertically arranged on the central axis, the cathode ring is arranged at the lower end of the copper rod, the conducting assembly is arranged on the copper rod, the conducting wire is connected with the conductive assembly, the cathode rod is connected with the conducting wire and is positioned right above the copper rod, the driving device drives the copper rod to perform rotary motion, the conducting wire is connected with the cathode rod, and the electroplating hanger device is arranged on the cathode ring.
Preferably, the cathode rod is connected to the copper rod through a support rod.
Preferably, the driving device is arranged below the cathode rod and is connected with the copper rod through a transmission device.
Preferably, the driving device is a speed regulating motor, and the transmission device is a belt pulley transmission.
Preferably, the conductive component is a mercury conductive ring, and the mercury conductive ring is mounted on the copper rod above the cathode ring.
Preferably, the cathode ring is of a circular ring structure, a plurality of metal ties extending from the center of the top surface of the circular ring structure to the edges of the side edges of the circular ring structure are arranged on the circular ring structure, and a hanger to be electroplated is vertically hung on the metal ties.
Preferably, a plurality of the metal lacing ring copper rods are uniformly distributed.
Preferably, the cathode ring is provided with a guide groove for the metal tie to be embedded in, and the guide groove extends from the center of the top surface of the circular ring structure to the side edge of the circular ring structure.
Preferably, the electroplating hanger device is arranged in a plating tank, and the hanger to be electroplated, which is hung on the cathode ring, is positioned in the plating tank.
The utility model has the advantages that: by adopting the structure, the rotatable cathode ring is adopted, the cathode ring is annular, the hangers are uniformly distributed on the annular cathode ring, and the annular cathode ring rotates during electroplating, so that all workpieces have equal opportunity to receive nickel ions under the action of an electric field, and the coating thicknesses of the workpieces in different areas are ensured to be consistent.
Drawings
The utility model is described in further detail below with reference to the figures and the detailed description.
Fig. 1 is a schematic structural view of a conventional plating hanger device.
Fig. 2 is a schematic structural diagram of an electroplating hanger device according to the present invention.
FIG. 3 is a schematic structural diagram of a cathode ring in an electroplating rack device according to the present invention.
FIG. 4 is a diagram illustrating a state of use of the plating hanger apparatus according to the present invention.
In the figure: 1-copper rod, 2-cathode ring, 3-conductive component, 4-lead, 5-cathode rod, 6-driving device, 7-hanging tool to be electroplated, 8-supporting rod, 9-driving device, 10-metal tie, 11-guide groove, 12-plating tank and 13-anode rod.
Detailed Description
The electroplating hanger device comprises a copper rod 1, a cathode ring 2, a conductive assembly 3, a lead 4, a cathode rod 5 and a driving device 6, wherein the copper rod 1 is vertically arranged on a central axis, the cathode ring 2 is arranged at the lower end of the copper rod, the conductive assembly 3 is arranged on the copper rod, the lead 4 is connected with the conductive assembly, the cathode rod 5 is connected with the lead and is positioned right above the copper rod, the driving device 6 is used for driving the copper rod to rotate, the lead is connected with the cathode rod, and a hanger 7 to be electroplated is arranged on the cathode ring. By adopting the structure, the rotatable cathode ring is adopted, the cathode ring is annular, the hangers are uniformly distributed on the annular cathode ring, and the annular cathode ring rotates during electroplating, so that all workpieces have equal opportunity to receive nickel ions under the action of an electric field, and the coating thicknesses of the workpieces in different areas are ensured to be consistent.
In order to facilitate the fixation of the cathode rod and ensure the electroplating effect of the hanger to be electroplated, the cathode rod is connected to the copper rod through the support rod 8. The driving device is arranged below the cathode rod and is connected with the copper rod through a transmission device, the driving device is a speed regulating motor, and the transmission device 8 is driven by a belt pulley.
The conductive assembly is a mercury conductive ring, and the mercury conductive ring is arranged on the copper rod above the cathode ring. The cathode ring is of a circular ring structure, a plurality of metal laces extending from the center of the top surface of the circular ring structure to the side edges of the circular ring structure are arranged on the circular ring structure, and a hanger to be electroplated is vertically hung on the metal laces 10.
In order to ensure the electroplating effect, a plurality of metal lacing rings are uniformly distributed on the copper rods. In order to prevent the metal ties from moving in a dislocation way in the rotating process of the cathode ring, the cathode ring is provided with a guide groove 11 for the metal ties to be embedded, and the guide groove extends from the center of the top surface of the circular ring structure to the edge of the side edge of the circular ring structure. The electroplating hanger device is arranged in the plating tank 12, the hanger to be electroplated, which is hung on the cathode ring, is positioned in the plating tank, and the anode rod 13 is positioned at the periphery of the hanger to be electroplated in the plating tank when in use.
It should be finally noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the technical solutions, and those skilled in the art should understand that the present invention is not limited to nickel electroplating but also can be applied to other metal electroplating without departing from the spirit and scope of the technical solutions, and all that should be covered by the claims of the present invention.
Claims (9)
1. An electroplating hanger device is characterized in that: the electroplating hanger device comprises a copper rod, a cathode ring, a conductive assembly, a conducting wire, a cathode rod and a driving device, wherein the copper rod is vertically arranged on the central axis, the cathode ring is arranged at the lower end of the copper rod, the conducting assembly is arranged on the copper rod, the conducting wire is connected with the conductive assembly, the cathode rod is connected with the conducting wire and is positioned right above the copper rod, the driving device drives the copper rod to perform rotary motion, the conducting wire is connected with the cathode rod, and the electroplating hanger device is arranged on the cathode ring.
2. The plating hanger device according to claim 1, characterized in that: the cathode rod is connected to the copper rod through a support rod.
3. The plating hanger device according to claim 1, characterized in that: the driving device is arranged below the cathode rod and is connected with the copper rod through a transmission device.
4. An electroplating hanger apparatus according to claim 3, wherein: the driving device is a speed regulating motor, and the transmission device is driven by a belt pulley.
5. The plating hanger device according to claim 1, characterized in that: the conducting component is a mercury conducting ring, and the mercury conducting ring is arranged on the copper rod above the cathode ring.
6. The plating hanger device according to claim 1, characterized in that: the cathode ring is of a circular ring structure, a plurality of metal belts extending from the center of the top surface of the circular ring structure to the side edges of the circular ring structure are arranged on the circular ring structure, and a hanger to be electroplated is vertically hung on the metal belts.
7. An electroplating hanger apparatus according to claim 6, wherein: and a plurality of metal lacing rings are uniformly distributed on the copper rods.
8. An electroplating hanger apparatus according to claim 6, wherein: the cathode ring is provided with a guide groove for embedding the metal lacing, and the guide groove extends from the center of the top surface of the circular ring structure to the edge of the side edge of the circular ring structure.
9. The plating hanger device according to claim 1, characterized in that: the electroplating hanger device is arranged in a plating tank, and a hanger to be electroplated, which is hung on the cathode ring, is positioned in the plating tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122405559.0U CN215887286U (en) | 2021-09-30 | 2021-09-30 | Electroplating hanger device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122405559.0U CN215887286U (en) | 2021-09-30 | 2021-09-30 | Electroplating hanger device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215887286U true CN215887286U (en) | 2022-02-22 |
Family
ID=80473034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122405559.0U Active CN215887286U (en) | 2021-09-30 | 2021-09-30 | Electroplating hanger device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215887286U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117568906A (en) * | 2024-01-17 | 2024-02-20 | 江苏贺鸿电子有限公司 | High-efficient ceramic substrate plating equipment |
-
2021
- 2021-09-30 CN CN202122405559.0U patent/CN215887286U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117568906A (en) * | 2024-01-17 | 2024-02-20 | 江苏贺鸿电子有限公司 | High-efficient ceramic substrate plating equipment |
| CN117568906B (en) * | 2024-01-17 | 2024-04-02 | 江苏贺鸿电子有限公司 | High-efficient ceramic substrate plating equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107604426B (en) | Electroplanting device and electro-plating method | |
| CN206783808U (en) | The hanging gold-plated equipment of plating | |
| CN215887286U (en) | Electroplating hanger device | |
| CN102505137A (en) | Rotary electroplating device | |
| KR20210007802A (en) | Clamp horizontal cycle continuous movable plating apparatus | |
| US3878062A (en) | Electroplating apparatus and method | |
| CN211057260U (en) | Wafer electroplating machine | |
| CN104630858B (en) | A kind of uniform chromium plating electroplanting device of rotation type axial and circumferential | |
| CN1308494C (en) | Method for electroplating a cylindrical inside surface of a work-piece-extending substantially over a semi-circle | |
| CN108265325B (en) | Plating bath | |
| CN215103635U (en) | Eccentric connecting piece processing platform | |
| US3915832A (en) | Electroplating apparatus for forming a nonuniform coating on workpieces | |
| CN213113551U (en) | Compact type high-speed diamond wire thickening equipment | |
| CN218596555U (en) | Noble metal automobile component electroplating line | |
| CN112176384A (en) | Plastic vibrator electroplating equipment | |
| CN107876756A (en) | A kind of device and method of electrodeposition process synchronous production variety classes Coated powder | |
| US3275542A (en) | Apparatus for electroplating leads of small electronic components | |
| KR20130047078A (en) | Surface treatment method for nut bore and surface treatment apparatus for nut bore | |
| CN218756112U (en) | Steel belt conveying device | |
| CN217733330U (en) | Electroplating roller and electroplating equipment | |
| CN220520677U (en) | Circuit board electrolytic copper plating fixture | |
| CN205741262U (en) | A kind of electroplanting device | |
| CN214361806U (en) | Electroplating device for treating tower internals with complex structures | |
| CN213113581U (en) | Electroplated diamond is with portable stores pylon | |
| CN211339730U (en) | Electroplating turnover device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |