CN215872360U - PCB paster packaging structure - Google Patents

PCB paster packaging structure Download PDF

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Publication number
CN215872360U
CN215872360U CN202122108250.5U CN202122108250U CN215872360U CN 215872360 U CN215872360 U CN 215872360U CN 202122108250 U CN202122108250 U CN 202122108250U CN 215872360 U CN215872360 U CN 215872360U
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CN
China
Prior art keywords
pcb board
pcb
threaded rod
fixed
erection column
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202122108250.5U
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Chinese (zh)
Inventor
王跃武
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Suzhou Xinbairun Electronic Technology Co ltd
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Suzhou Xinbairun Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Xinbairun Electronic Technology Co ltd filed Critical Suzhou Xinbairun Electronic Technology Co ltd
Priority to CN202122108250.5U priority Critical patent/CN215872360U/en
Application granted granted Critical
Publication of CN215872360U publication Critical patent/CN215872360U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a PCB (printed circuit board) patch packaging structure, which belongs to the field of PCB patch packaging and comprises a PCB, wherein uniformly distributed mounting holes are formed in the top of the PCB, fixed threaded rods are inserted into the mounting holes, the bottom of each fixed threaded rod is in threaded connection with a mounting column, the bottom of the PCB is in contact with a heat dissipation plate, and four corners of the heat dissipation plate are sleeved on the mounting columns. The utility model discloses a, then through the height of adjusting the erection column, decide the interval space at PCB board and mounted position top, when the PCB board is single face top installation electronic component, its bottom space can hold the heating panel and dispel the heat to the PCB board, improves the life of PCB board, when the PCB board belongs to two-sided installation electronic component, according to electronic component's size, can adapt to through the height of adjusting the erection column, improves PCB board packaging structure's application scope, has the practicality.

Description

PCB paster packaging structure
Technical Field
The utility model relates to the field of PCB (printed circuit board) patch packaging, in particular to a PCB patch packaging structure.
Background
Packaging, is the process of assembling an integrated circuit into a chip end product, which is simply to put an integrated circuit Die (Die) produced by a foundry on a substrate for bearing, lead out pins, and then fix and Package the Die into a whole.
Generally, the conventional packaging structure cannot be adjusted after being installed, cannot adapt to conversion between a single-sided PCB and a double-sided PCB, is small in application range, improves packaging cost, has poor heat dissipation effect and influences the service life of the PCB, and therefore the PCB patch packaging structure is provided to solve the problems.
SUMMERY OF THE UTILITY MODEL
1. Technical problem to be solved
Aiming at the problems in the prior art, the utility model aims to provide a PCB patch packaging structure which has the advantages of adjustable height and heat dissipation, and solves the problems that the conventional packaging structure cannot be adjusted after being installed, cannot adapt to the conversion between a single-sided PCB and a double-sided PCB, has a small application range, improves the packaging cost, has poor heat dissipation effect and influences the service life of the PCB.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
The utility model provides a PCB board paster packaging structure, includes the PCB board, evenly distributed's mounting hole is seted up at the top of PCB board, alternate on the mounting hole and have fixed threaded rod, fixed threaded rod's bottom threaded connection has the erection column, and the bottom contact of PCB board has the heating panel, the four corners of heating panel cup joints on the erection column.
As a further scheme of the utility model: the erection column includes the outer tube, the inside rotation of outer tube is connected with the support column, fixed screw has been seted up to the inside of support column, fixed threaded rod's bottom extend to the inside of fixed screw and with the inner wall threaded connection of fixed screw.
As a further scheme of the utility model: the bottom integrated into one piece of outer tube has the otic placode, the top fixedly connected with rubber pad of outer tube.
As a further scheme of the utility model: and a limiting threaded rod in threaded connection with the outer sleeve is inserted into the outer sleeve, and one end of the limiting threaded rod, which is positioned on the inner side of the outer sleeve, is in contact with the support column.
As a further scheme of the utility model: the heating panel includes the copper plate, the bottom integrated into one piece of copper plate has evenly distributed's fin, the bottom fixed mounting of copper plate has the heat dissipation fan, the fin distributes around the heat dissipation fan.
As a further scheme of the utility model: the lantern ring is formed integrally at each of four corners of the red copper plate, the limiting ring is formed integrally on the mounting column and located at the bottom of the lantern ring and is in contact with the lantern ring.
3. Advantageous effects
Compared with the prior art, the utility model has the advantages that:
(1) this scheme, shelve the PCB board on the erection column, then through the height of adjusting the erection column, decide the interval space at PCB board and mounted position top, when the PCB board is single face top installation electronic component, its bottom space can hold the heating panel and dispel the heat to the PCB board, improve the life of PCB board, when the PCB board belongs to two-sided installation electronic component, according to electronic component's size, can adapt to through the height of adjusting the erection column, improve PCB board packaging structure's application scope, and has the practicality.
(2) This scheme is through installing the outer tube in preset position, then interval between rotatory support column location PCB board bottom and the mounted position comes suitable installation electronic component's mounting dimension, then through the threaded connection of fixed threaded rod and fixed screw, fixes the PCB board at the erection column and accomplishes the installation, and simple to operate possesses adjustable function in order to satisfy user's user demand.
(3) This scheme, through otic placode person of facilitating the use fix the outer tube at the mounted position, simple to operate is swift, and the rubber pad protects the erection column.
(4) This scheme, utilization limiting threaded rod comes the fixed stay post, avoids fixed threaded rod when fixed screw is inside rotatory, and the support column is followed rotatoryly, ensures the inconvenience of height, improves packaging structure's stability.
(5) This scheme utilizes the temperature that produces on the fin dispersion PCB board during operation of copper plate and its bottom, improves the radiating effect of structure, accelerates the air flow speed around the fin through the heat dissipation fan, further improves radiating efficiency and effect.
(6) This scheme, the lantern ring is convenient installs the copper plate on the erection column to utilize spacing ring restriction copper plate's position, the location of easy to assemble.
Drawings
FIG. 1 is a front cross-sectional structural schematic view of the present invention;
FIG. 2 is a schematic structural view of the mounting post of the present invention;
FIG. 3 is an enlarged view of portion A of FIG. 1 according to the present invention;
fig. 4 is a schematic bottom view of the heat dissipating plate of the present invention.
The reference numbers in the figures illustrate:
1. a PCB board; 2. mounting holes; 3. fixing a threaded rod; 4. mounting a column; 41. an outer sleeve; 411. an ear plate; 412. a restraining threaded rod; 42. a support pillar; 43. fixing screw holes; 5. a heat dissipation plate; 51. a red copper plate; 511. a collar; 52. a heat sink; 53. a heat dissipation fan; 6. a limit ring.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.
Example 1
Referring to fig. 1 to 4, in the embodiment of the utility model, a PCB chip packaging structure includes a PCB 1, mounting holes 2 are uniformly distributed on the top of the PCB 1, fixing threaded rods 3 are inserted into the mounting holes 2, mounting posts 4 are connected to the bottoms of the fixing threaded rods 3 through threads, a heat dissipation plate 5 is contacted with the bottom of the PCB 1, four corners of the heat dissipation plate 5 are sleeved on the mounting posts 4, the PCB 1 is placed on the mounting posts 4, then a spacing gap between the PCB 1 and the top of a mounting position is determined by adjusting the height of the mounting posts 4, when an electronic element is mounted on the single-sided top of the PCB 1, the bottom gap can accommodate the heat dissipation plate 5 to dissipate heat of the PCB 1, so as to improve the service life of the PCB 1, when the PCB 1 belongs to a double-sided mounted electronic element, the height of the mounting posts 4 can be adjusted to adapt to the size of the electronic element, the application range of the PCB board 1 packaging structure is improved, and the practicability is achieved.
Erection column 4 includes outer tube 41, the internal rotation of outer tube 41 is connected with support column 42, fixed screw 43 has been seted up to support column 42's inside, fixed threaded rod 3's bottom extend to fixed screw 43's inside and with the inner wall threaded connection of fixed screw 43, through installing outer tube 41 in preset position, then interval between rotatory support column 42 location PCB board 1 bottom and the mounted position, come suitable installation electronic component's mounting dimension, then threaded connection through fixed threaded rod 3 and fixed screw 43, fix PCB board 1 and accomplish the installation at erection column 4, simple to operate is simple, possess adjustable function in order to satisfy user's user demand.
The bottom of outer tube 41 is integrated into one piece has otic placode 411, and the top fixedly connected with rubber pad of outer tube 41, fixes outer tube 41 in the mounted position through otic placode 411 convenience of customers, and simple to operate is swift, and the rubber pad protects erection column 4.
The outer sleeve 41 is inserted with the limiting threaded rod 412 in threaded connection, one end of the limiting threaded rod 412, which is located on the inner side of the outer sleeve 41, is in contact with the supporting column 42, the supporting column 42 is fixed by the limiting threaded rod 412, the supporting column 42 is prevented from rotating along with the fixed threaded rod 3 when the fixed threaded rod is rotated in the fixed screw hole 43, the inconvenience of height is guaranteed, and the stability of the packaging structure is improved.
Example 2
Referring to fig. 3 and fig. 4, a further improvement is made on the basis of embodiment 1: the heat radiation plate 5 includes a copper plate 51, the heat radiation fins 52 are uniformly distributed on the bottom of the copper plate 51, the heat radiation fans 53 are fixedly installed on the bottom of the copper plate 51, the heat radiation fins 52 are distributed around the heat radiation fans 53, the temperature generated on the PCB 1 during the operation is dispersed by using the copper plate 51 and the heat radiation fins 52 at the bottom of the copper plate 51, the heat radiation effect of the structure is improved, the air flow speed around the heat radiation fins 52 is accelerated by the heat radiation fans 53, and the heat radiation efficiency and the heat radiation effect are further improved.
Lantern ring 511 is all integrated into one piece in the four corners of copper plate 51, and integrated into one piece has spacing ring 6 on the erection column 4, and spacing ring 6 is located the bottom of lantern ring 511 and contacts with lantern ring 511, and lantern ring 511 conveniently installs copper plate 51 on erection column 4 to utilize spacing ring 6 to restrict copper plate 51's position, the location of facilitating the installation.
The working principle is as follows: the PCB 1 is placed on the mounting post 4, through the ear plate 411, a user can conveniently fix the outer sleeve 41 at the mounting position, the mounting is convenient and rapid, then the support post 42 is rotated to position the distance between the bottom of the PCB 1 and the mounting position, the support post 42 is fixed by using the limit threaded rod 412, the support post 42 is prevented from rotating along with the fixed threaded rod 3 when the fixed threaded rod 3 rotates in the fixed threaded hole 43, then the PCB 1 is fixed on the mounting post 4 through the threaded connection of the fixed threaded rod 3 and the fixed threaded hole 43 to complete the mounting, so as to determine the spacing gap between the PCB 1 and the top of the mounting position, when the PCB 1 is provided with an electronic element at the top of a single surface, the bottom gap can accommodate the heat dissipation plate 5 to dissipate heat of the PCB 1, the service life of the PCB 1 is prolonged, when the PCB 1 belongs to the electronic element mounted at the double surfaces, the height of the mounting post 4 can be adjusted according to the size of the electronic element, the application range of the packaging structure of the PCB board 1 is improved, the packaging structure has practicability, the temperature generated on the PCB board 1 during working is dispersed by utilizing the red copper plate 51 and the radiating fins 52 at the bottom of the red copper plate, the radiating effect of the structure is improved, the air flowing speed around the radiating fins 52 is accelerated by the radiating fan 53, and the radiating efficiency and the radiating effect are further improved.
The foregoing is only a preferred embodiment of the present invention; the scope of the utility model is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.

Claims (6)

1. The utility model provides a PCB board paster packaging structure, includes PCB board (1), its characterized in that: evenly distributed's mounting hole (2) are seted up at the top of PCB board (1), alternate on mounting hole (2) and have fixed threaded rod (3), the bottom threaded connection of fixed threaded rod (3) has erection column (4), and the bottom contact of PCB board (1) has heating panel (5), the four corners of heating panel (5) cup joints on erection column (4).
2. A PCB board die attach package structure according to claim 1, wherein: erection column (4) include outer tube (41), the internal rotation of outer tube (41) is connected with support column (42), fixed screw (43) have been seted up to the inside of support column (42), the bottom of fixed threaded rod (3) extend to the inside of fixed screw (43) and with the inner wall threaded connection of fixed screw (43).
3. A PCB board die attach package structure according to claim 2, wherein: the bottom integrated into one piece of outer tube (41) has otic placode (411), the top fixedly connected with rubber pad of outer tube (41).
4. A PCB board die attach package structure according to claim 2, wherein: a limit threaded rod (412) in threaded connection with the outer sleeve (41) is inserted into the outer sleeve (41), and one end, located on the inner side of the outer sleeve (41), of the limit threaded rod (412) is in contact with the support column (42).
5. A PCB board die attach package structure according to claim 1, wherein: heating panel (5) include copper plate (51), the bottom integrated into one piece of copper plate (51) has evenly distributed's fin (52), the bottom fixed mounting of copper plate (51) has heat dissipation fan (53), fin (52) distribute around heat dissipation fan (53).
6. A PCB board paster packaging structure according to claim 5, characterized in that: the four corners of copper plate (51) all integrated into one piece have lantern ring (511), integrated into one piece spacing ring (6) on erection column (4), spacing ring (6) are located the bottom of lantern ring (511) and contact with lantern ring (511).
CN202122108250.5U 2021-09-02 2021-09-02 PCB paster packaging structure Expired - Fee Related CN215872360U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122108250.5U CN215872360U (en) 2021-09-02 2021-09-02 PCB paster packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122108250.5U CN215872360U (en) 2021-09-02 2021-09-02 PCB paster packaging structure

Publications (1)

Publication Number Publication Date
CN215872360U true CN215872360U (en) 2022-02-18

Family

ID=80245130

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122108250.5U Expired - Fee Related CN215872360U (en) 2021-09-02 2021-09-02 PCB paster packaging structure

Country Status (1)

Country Link
CN (1) CN215872360U (en)

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Granted publication date: 20220218