CN215868878U - boost inductor - Google Patents

boost inductor Download PDF

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CN215868878U
CN215868878U CN202122131713.XU CN202122131713U CN215868878U CN 215868878 U CN215868878 U CN 215868878U CN 202122131713 U CN202122131713 U CN 202122131713U CN 215868878 U CN215868878 U CN 215868878U
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heat dissipation
inductor
magnetic ring
heat
accommodating groove
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海来布曲
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Dongguan Hongji Electronic Co ltd
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Dongguan Hongji Electronic Co ltd
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Abstract

本实用新型公开一种升压电感器,包括:壳体,其设有容纳槽;电感器主体,包括磁环和线圈,该线圈沿所述磁环的高度方向缠绕,并沿所述磁环的圆周方向延伸;所述磁环容纳于所述容纳槽,并凸伸所述容纳槽的开口;所述磁环与所述容纳槽的内壁设有散热部,该散热部接触所述电感器主体和所述壳体,并将所述电感器主体所产生的热量以所述壳体的延伸方向和所述容纳槽的开口方向散发。

Figure 202122131713

The utility model discloses a boosting inductor, comprising: a casing, which is provided with an accommodating slot; an inductor main body, comprising a magnetic ring and a coil, the coil is wound along the height direction of the magnetic ring, and is arranged along the magnetic ring. The magnetic ring is accommodated in the accommodating groove and protrudes from the opening of the accommodating groove; the magnetic ring and the inner wall of the accommodating groove are provided with a heat dissipation part, and the heat dissipation part contacts the inductor the main body and the casing, and dissipate the heat generated by the inductor main body in the extending direction of the casing and the opening direction of the accommodating groove.

Figure 202122131713

Description

Boost inductor
Technical Field
The utility model relates to the technical field of inductors, in particular to a boost inductor.
Background
The boost inductor belongs to a type of inductor, is mainly applied to equipment with higher power, and in the prior art, the boost inductor produces heat greatly in the working process, and uses in the confined space, is difficult to outwards give off heat, influences boost inductor's life.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problems, the utility model adopts the following technical scheme:
according to one aspect of the utility model, there is provided a boost inductor comprising:
a housing provided with an accommodating groove;
the inductor comprises an inductor main body and a coil, wherein the coil is wound along the height direction of the magnetic ring and extends along the circumferential direction of the magnetic ring; the magnetic ring is accommodated in the accommodating groove and convexly extends out of the opening of the accommodating groove; the inner walls of the magnetic ring and the accommodating groove are provided with heat dissipation parts, the heat dissipation parts are in contact with the inductor main body and the shell, and heat generated by the inductor main body is dissipated in the extending direction of the shell and the opening direction of the accommodating groove.
Optionally, the housing includes:
the heat dissipation device comprises a circular support, a heat dissipation plate and a heat dissipation plate, wherein the circular support is outwards convexly provided with a plurality of heat dissipation bosses which are arranged at intervals along the circumferential direction of the circular support;
and the chassis is connected with the bottom of the circular bracket and receives the inductor main body so as to absorb heat of the circular bracket and the inductor main body.
Optionally, two adjacent heat dissipation bosses are provided with heat dissipation cavities, and the heat dissipation cavities extend outwards; two adjacent heat dissipation bosss are arranged in an inclined mode oppositely, and an included angle is formed.
Optionally, the heat dissipation boss is provided with a plurality of heat dissipation grooves along the height direction, and the plurality of heat dissipation grooves are communicated with the heat dissipation cavity.
Optionally, the bottom of the chassis is provided with a heat dissipation adhesive, and the heat dissipation adhesive is opposite to the inductor main body.
Optionally, the heat dissipation portion fills the accommodating groove, communicates the magnetic ring, the coil and the housing, and fixes the magnetic ring and the coil; the heat dissipation part is made of resin glue.
Optionally, the coil is flat and sleeved outside the magnetic ring, and the coil abuts against the magnetic ring and the housing.
According to the technical scheme, the embodiment of the utility model at least has the following advantages and positive effects:
in the boost inductor of the embodiment of the utility model, the shell is provided with an accommodating groove; the inductor comprises an inductor main body and a coil, wherein the coil is wound along the height direction of the magnetic ring and extends along the circumferential direction of the magnetic ring; the magnetic ring is accommodated in the accommodating groove and convexly extends out of the opening of the accommodating groove; the inner walls of the magnetic ring and the accommodating groove are provided with heat dissipation parts, the heat dissipation parts are in contact with the inductor main body and the shell and dissipate heat generated by the inductor main body in the extending direction of the shell and the opening direction of the accommodating groove, so that the heat generated by the inductor main body is dissipated along multiple directions, the inductor main body keeps airflow circulation in the bearing of the shell, the heat generated by the inductor main body is dissipated and conducted, and the heat dissipation effect and the service life of the boost inductor are improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a boost inductor according to the present invention;
fig. 2 is a schematic diagram of the internal structure of the boost inductor according to the present invention;
the objects, features and advantages of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The boost inductor belongs to a type of inductor, is mainly applied to equipment with higher power, and in the prior art, the boost inductor produces heat greatly in the working process, and uses in the confined space, is difficult to outwards give off heat, influences boost inductor's life.
Referring to fig. 1 and 2, the present invention provides a boost inductor, which includes a case 1 and an inductor main body 2, wherein the case 1 carries the inductor main body 2.
The shell 1 comprises a circular bracket 11 and a chassis 12, the shell 1 is provided with a receiving groove 111, the receiving groove 111 is arranged in the circular bracket 11, the circular bracket 11 is provided with a plurality of radiating bosses 112 in an outward protruding manner, and the plurality of radiating bosses 112 are arranged at intervals along the circumferential direction of the circular bracket 11; the two adjacent heat dissipation bosses 112 are provided with heat dissipation cavities 113, and the heat dissipation cavities 113 extend outwards; two adjacent heat dissipation bosses 112 are oppositely and obliquely arranged and form an included angle so as to dissipate heat outwards. Optionally, the heat dissipation boss 112 is provided with a plurality of heat dissipation grooves along the height direction, and the plurality of heat dissipation grooves are communicated with the heat dissipation cavity 113, so that the heat dissipation range of the circular bracket 11 is increased, and the heat dissipation is fully performed by utilizing the gap.
The chassis 12 is connected to the bottom of the circular bracket 11 and receives the inductor main body 2 to absorb heat of the circular bracket 11 and the inductor main body 2, so as to radiate heat outwards through the chassis 12. Wherein, the bottom of the chassis 12 is provided with a heat dissipation glue, and the heat dissipation glue is opposite to the inductor main body 2.
Referring to fig. 1 and 2, the inductor main body 2 includes a magnetic ring 21 and a coil 22, the coil 22 being wound along a height direction of the magnetic ring 21 and extending along a circumferential direction of the magnetic ring 21; the magnetic ring 21 is accommodated in the accommodating groove 111 and protrudes out of the opening of the accommodating groove 111; the magnetic ring 21 and the inner wall of the accommodating groove 111 are provided with a heat dissipating part, the heat dissipating part contacts the inductor body 2 and the housing 1, and dissipates heat generated by the inductor body 2 in the extending direction of the housing 1 and the opening direction of the accommodating groove 111, so that the heat generated by the inductor body 2 is dissipated along multiple directions, and the inductor body 2 keeps the circulation of air flow in the bearing of the housing 1, thereby increasing the dissipation and conduction of heat generated by the inductor body 2, and improving the heat dissipating effect and the service life of the boost inductor.
The heat dissipation part fills the accommodating groove 111, communicates the magnetic ring 21, the coil 22 and the housing 1, and fixes the magnetic ring 21 and the coil 22; the heat dissipation part is made of resin glue.
The coil 22 is flat and sleeved outside the magnetic ring 21, the coil 22 is abutted against the magnetic ring 21 and the shell 1, the heat dissipation area of the magnetic ring 21 is increased, and the magnetic ring 21 is prevented from directly contacting with the chassis 12.
According to the technical scheme, the embodiment of the utility model at least has the following advantages and positive effects:
in the boost inductor of the embodiment of the present invention, the housing 1 is provided with the accommodating groove 111; an inductor main body 2 including a magnetic ring 21 and a coil 22, the coil 22 being wound in a height direction of the magnetic ring 21 and extending in a circumferential direction of the magnetic ring 21; the magnetic ring 21 is accommodated in the accommodating groove 111 and protrudes out of the opening of the accommodating groove 111; the magnetic ring 21 and the inner wall of the accommodating groove 111 are provided with a heat dissipating part, the heat dissipating part contacts the inductor body 2 and the housing 1, and dissipates heat generated by the inductor body 2 in the extending direction of the housing 1 and the opening direction of the accommodating groove 111, so that the heat generated by the inductor body 2 is dissipated along multiple directions, and the inductor body 2 keeps the circulation of air flow in the bearing of the housing 1, thereby increasing the dissipation and conduction of heat generated by the inductor body 2, and improving the heat dissipating effect and the service life of the boost inductor. In addition, the case 1 fixes the inductor body 2 by potting the heat dissipation portion, and sufficiently dissipates the heat of the inductor body 2, so that the boost inductor has low failure rate and high reliability.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the technical solutions of the present invention that are made by using the contents of the specification and the drawings or directly/indirectly applied to other related technical fields are included in the scope of the present invention.

Claims (7)

1.一种升压电感器,其特征在于,包括:1. A boost inductor, characterized in that, comprising: 壳体,其设有容纳槽;a casing, which is provided with an accommodating groove; 电感器主体,包括磁环和线圈,该线圈沿所述磁环的高度方向缠绕,并沿所述磁环的圆周方向延伸;所述磁环容纳于所述容纳槽,并凸伸所述容纳槽的开口;所述磁环与所述容纳槽的内壁设有散热部,该散热部接触所述电感器主体和所述壳体,并将所述电感器主体所产生的热量以所述壳体的延伸方向和所述容纳槽的开口方向散发。The inductor main body includes a magnetic ring and a coil, the coil is wound along the height direction of the magnetic ring and extends along the circumferential direction of the magnetic ring; the magnetic ring is accommodated in the accommodating groove and protrudes from the accommodating groove The opening of the slot; the magnetic ring and the inner wall of the accommodating slot are provided with a heat dissipation part, the heat dissipation part contacts the inductor main body and the casing, and dissipates the heat generated by the inductor main body to the casing. The extension direction of the body and the opening direction of the accommodating groove are distributed. 2.如权利要求1所述的升压电感器,其特征在于,所述壳体包括:2. The boost inductor of claim 1, wherein the housing comprises: 圆形支架,其向外凸设有多个散热凸台,多个所述散热凸台沿所述圆形支架的圆周方向间隔布置;a circular support with a plurality of heat-dissipating bosses protruding outward, and the plurality of heat-dissipating bosses are arranged at intervals along the circumferential direction of the circular support; 底盘,连接所述圆形支架的底部,并承接所述电感器主体,以吸收所述圆形支架和所述电感器主体的热量。The chassis is connected to the bottom of the circular support and supports the inductor body, so as to absorb the heat of the circular support and the inductor body. 3.如权利要求2所述的升压电感器,其特征在于,相邻的两所述散热凸台设有散热腔,该散热腔向外延伸;相邻的两所述散热凸台相对地倾斜布置,并形成夹角。3 . The boost inductor of claim 2 , wherein two adjacent heat dissipation bosses are provided with a heat dissipation cavity, and the heat dissipation cavity extends outward; and two adjacent heat dissipation bosses are opposite to each other. 4 . Arranged obliquely and formed an included angle. 4.如权利要求3所述的升压电感器,其特征在于,所述散热凸台沿高度方向设有多个散热槽,多个所述散热槽连通所散热腔。4 . The boost inductor according to claim 3 , wherein the heat dissipation boss is provided with a plurality of heat dissipation grooves along the height direction, and the plurality of heat dissipation grooves communicate with the heat dissipation cavity. 5 . 5.如权利要求2所述的升压电感器,其特征在于,所述底盘的底部设有散热胶,该散热胶相对于所述电感器主体。5 . The boost inductor of claim 2 , wherein the bottom of the chassis is provided with heat-dissipating glue, and the heat-dissipating glue is opposite to the inductor body. 6 . 6.如权利要求1所述的升压电感器,其特征在于,所述散热部填充所述容纳槽,并连通所述磁环、所述线圈和壳体,且固定所述磁环和所述线圈;所述散热部为树脂胶。6 . The boost inductor according to claim 1 , wherein the heat dissipation part fills the accommodating groove, communicates with the magnetic ring, the coil and the casing, and fixes the magnetic ring and the housing. 7 . the coil; the heat dissipation part is resin glue. 7.如权利要求1所述的升压电感器,其特征在于,所述线圈呈扁平状,并套设于所述磁环外,所述线圈抵接所述磁环和所述壳体。7 . The boost inductor according to claim 1 , wherein the coil has a flat shape and is sleeved outside the magnetic ring, and the coil abuts against the magnetic ring and the housing. 8 .
CN202122131713.XU 2021-09-06 2021-09-06 boost inductor Active CN215868878U (en)

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CN202122131713.XU CN215868878U (en) 2021-09-06 2021-09-06 boost inductor

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CN202122131713.XU CN215868878U (en) 2021-09-06 2021-09-06 boost inductor

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