CN215855792U - Picosecond laser blast apparatus and system - Google Patents
Picosecond laser blast apparatus and system Download PDFInfo
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- CN215855792U CN215855792U CN202121343020.0U CN202121343020U CN215855792U CN 215855792 U CN215855792 U CN 215855792U CN 202121343020 U CN202121343020 U CN 202121343020U CN 215855792 U CN215855792 U CN 215855792U
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Abstract
The application discloses picosecond laser explodes a mouthful equipment and system. The picosecond laser fryer apparatus comprising: the device comprises a laser, a rotary fire head, a first lifting mechanism and a fixing mechanism for fixing a glass vessel; the rotary fire head is positioned above the fixing mechanism, and the first lifting mechanism is connected with the rotary fire head so that the first lifting mechanism drives the rotary fire head to extend into or be far away from the glassware fixed on the fixing mechanism; the laser is arranged on one side of the fixing mechanism, and the emitting head of the laser is aligned with the glassware fixed on the fixing mechanism. The cutting method and the cutting device solve the technical problem that chips and micro-cracks are generated in the glassware cutting process in the related technology.
Description
Technical Field
The application relates to the technical field of mechanical equipment, in particular to picosecond laser frying equipment and a picosecond laser frying system.
Background
Conventional glass cutting means, which employ cemented carbide or diamond cutters, are widely used in many applications. However, scoring and cutting glassware in the glassware making process by this method has certain drawbacks that result in chipping, chipping and microcracking of the glassware in the removed portion, which reduces the strength of the cut edge, and yield loss due to mechanical forces on the thin glass is a negative factor.
Aiming at the problem of generating scraps and micro cracks in the cutting process of glassware in the related art, no effective solution is provided at present.
Disclosure of Invention
It is a primary object of the present application to provide a picosecond laser fry port apparatus and system to address the problem of chipping and microcracking during glassware cutting in the related art.
To achieve the above object, in a first aspect, the present application provides a picosecond laser fryer apparatus.
The picosecond laser fryer apparatus according to the present application comprises: the device comprises a laser, a rotary fire head, a first lifting mechanism and a fixing mechanism for fixing a glass vessel;
the rotary fire head is positioned above the fixing mechanism, and the first lifting mechanism is connected with the rotary fire head so that the first lifting mechanism drives the rotary fire head to extend into or be far away from the glassware fixed on the fixing mechanism;
the laser is arranged on one side of the fixing mechanism, and the emitting head of the laser is aligned with the glassware fixed on the fixing mechanism.
Optionally, the system further comprises a second lifting mechanism;
the second lifting mechanism is connected with the emitting head of the laser, so that the second lifting mechanism changes the horizontal height of the emitting head of the laser, and the position of the emitting head of the laser, which is aligned with the glassware, is adjusted.
Optionally, the second lifting mechanism is a lead screw lifting mechanism.
Optionally, the fixing mechanism includes a turntable and a plurality of fixing tools arranged on the turntable and used for fixing the glassware.
Optionally, the fixing tool is an elastic holding tool.
Optionally, the glass cutting device further comprises a finger cylinder for clamping the cutting part of the glass, and the finger cylinder is fixed above the fixing mechanism.
Optionally, the first lifting mechanism comprises one of a lead screw lifting mechanism, an air cylinder, a hydraulic cylinder or a linear motor.
Optionally, the laser is a picosecond laser.
In a second aspect, the present application also provides a picosecond laser fryer system comprising the picosecond laser fryer apparatus described above.
In the embodiment of the application, a picosecond laser frying device is provided, which comprises the following components: the device comprises a laser, a rotary fire head, a first lifting mechanism and a fixing mechanism for fixing a glass vessel; the rotary fire head is positioned above the fixing mechanism, and the first lifting mechanism is connected with the rotary fire head so that the first lifting mechanism drives the rotary fire head to extend into or be far away from the glassware fixed on the fixing mechanism; the laser is arranged on one side of the fixing mechanism, and the emitting head of the laser is aligned with the glassware fixed on the fixing mechanism. The glass ware is fixed through a fixing mechanism, then the glass ware is cut through a transmitting head of a laser, a rotating fire head is used for spraying fire at a cutting part, the glass ware is cut through the laser, different from a traditional mechanical cutting tool, the energy of a laser beam is used for cutting the glass in a non-contact mode, the energy is used for heating a specified part of a workpiece to reach a predefined temperature, the rapid heating process is followed by rapid cooling, a vertical stress band is generated in the glass, a crack without chips or cracks appears in the direction, and the crack is generated only due to heating and is not generated due to mechanical reasons, so that the chips and the microcracks do not appear; thereby solving the technical problem of generating scraps and micro cracks in the cutting process of glassware in the related technology. Meanwhile, the cutting part directly enters the drying edge through the rotary fire head, the original grinding and drying processes are reduced, the labor and the processes are greatly saved, compared with manual blowing, the consistency of glassware products is greatly improved, and the labor cost can be saved by more than 50%.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, serve to provide a further understanding of the application and to enable other features, objects, and advantages of the application to be more apparent. The drawings and their description illustrate the embodiments of the invention and do not limit it. In the drawings:
FIG. 1 is a schematic structural diagram of a picosecond laser fryer apparatus according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of another view angle of a picosecond laser fryer apparatus according to an embodiment of the present application.
Detailed Description
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In this application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," "secured," and the like are to be construed broadly. For example, "connected" may be a fixed connection, a detachable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In addition, the term "plurality" shall mean two as well as more than two.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
As shown in fig. 1 and 2, the embodiment of the present application provides a picosecond laser fryer comprising a laser 1, a rotating fire head 3, a first lifting mechanism 7 and a fixing mechanism for fixing a glass vessel 2;
the rotary fire head 3 is positioned above the fixing mechanism, and the first lifting mechanism 7 is connected with the rotary fire head 3, so that the first lifting mechanism 7 drives the rotary fire head 3 to extend into or be far away from the glassware 2 fixed on the fixing mechanism;
the laser 1 is arranged on one side of the fixing mechanism, and the emitting head 11 of the laser 1 is aligned with the glassware 2 fixed on the fixing mechanism.
Specifically, the glassware 2 is fixed through a fixing mechanism, then the glassware 2 is cut through an emitting head 11 of a laser 1, a rotary fire head 3 is used for spraying fire at a cutting part 21 (namely, a flame is blasted through the rotary fire head 3), the laser 1 is used for cutting the glassware 2, and different from a traditional mechanical cutting tool, the energy of a laser beam is used for cutting glass in a non-contact mode, the energy is used for heating a specified part of a workpiece to reach a predefined temperature, and the rapid heating process is followed by rapid cooling to generate a vertical stress band in the glass, so that a crack without chips or cracks appears in the direction, and the crack is generated only due to heating and is not generated due to mechanical reasons, so that no chips or microcracks appear; therefore, the technical problems of chipping and microcracks generated in the cutting process of the glassware 2 in the related technology are solved, meanwhile, the cutting part directly enters the drying edge through the rotary fire head 3, the original grinding and drying processes are reduced, manpower and processes are greatly saved, and compared with manual blowing, the consistency of the glassware 2 product is greatly improved.
Optionally, a second lifting mechanism 6 is further included;
the second lifting mechanism 6 is connected with the emitting head 11 of the laser 1, so that the second lifting mechanism 6 changes the horizontal height of the emitting head 11 of the laser 1, and the emitting head 11 of the laser 1 is adjusted to be aligned with the position of the glassware 2.
Wherein the horizontal height of the emitting head 11 of the laser 1 can be changed through the second lifting mechanism 6, so as to adjust the position of the emitting head 11 of the laser 1 aligned with the glass vessel 2.
Specifically, the second lifting mechanism 6 is a screw lifting mechanism.
Optionally, the fixing mechanism includes a turntable 4 and a plurality of fixing tools 41 arranged on the turntable 4 for fixing the glassware 2.
Wherein, fixed frock 41 can be the elasticity and hold the frock tightly.
Specifically, carousel 4 is through rotating, and fixed glassware 2 removes to rotatory flame 3 below on every fixed frock 41, later, rotatory flame 3 stretches into this glassware 2 through first elevating system 7, and rotatory flame 3 can often burn, and the gas is normally opened, through control oxygen on-off control firepower size, later, highly debugged laser 1's transmission head 11 is to this glassware 2 cuts.
Optionally, a finger cylinder 5 for clamping the cutting part 21 of the glass vessel 2 is further included, the finger cylinder 5 being fixed above the fixing mechanism.
Specifically, the cutting portion 21 (cap) of the glass vessel 2 is held by the finger cylinder 5, and the cutting portion 21 (cap) is discarded.
Optionally, the first lifting mechanism 7 includes one of a screw lifting mechanism, an air cylinder, a hydraulic cylinder, or a linear motor.
Alternatively, the laser 1 may be a picosecond laser. The picosecond laser is a high frequency laser which can better cut the glassware 2.
Based on the same technical concept, the application also provides a picosecond laser frying system which comprises the picosecond laser frying device.
The picosecond laser fryer system can control all parts of the picosecond laser fryer device to work in a coordinated mode through the controller.
In the embodiment of the application, a picosecond laser frying device is provided, which comprises the following components: the device comprises a laser 1, a rotary fire head 3, a first lifting mechanism 7 and a fixing mechanism for fixing a glass vessel 2; the rotary fire head 3 is positioned above the fixing mechanism, and the first lifting mechanism 7 is connected with the rotary fire head 3, so that the first lifting mechanism 7 drives the rotary fire head 3 to extend into or be far away from the glassware 2 fixed on the fixing mechanism; the laser 1 is arranged on one side of the fixing mechanism, and the emitting head 11 of the laser 1 is aligned with the glassware 2 fixed on the fixing mechanism. Wherein, adopt the laser 1 to cut the glassware 2, different from the traditional mechanical cutting tool, the energy of the laser beam cuts the glass in a non-contact way, the energy heats the appointed part of the work piece, make it reach the temperature that is predefined, the fast cooling is carried on immediately after the course of this fast heating, make the glass produce the stress zone of vertical direction, a crack without chip or crackle appears in this direction, because the crack is produced only because of being heated, but not the mechanical reason, so will not have chip and microcrack to appear; thereby solving the technical problem of the scrap and the micro-crack generated in the cutting process of the glassware 2 in the prior art. Meanwhile, the cutting part directly enters the drying edge through the rotary fire head 3, the original grinding and drying processes are reduced, the labor and the processes are greatly saved, compared with manual blowing, the consistency of the glassware 2 product is greatly improved, and the labor cost can be saved by more than 50%.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (9)
1. A picosecond laser fryer apparatus, comprising: the device comprises a laser, a rotary fire head, a first lifting mechanism and a fixing mechanism for fixing a glass vessel;
the rotary fire head is positioned above the fixing mechanism, and the first lifting mechanism is connected with the rotary fire head so that the first lifting mechanism drives the rotary fire head to extend into or be far away from the glassware fixed on the fixing mechanism;
the laser is arranged on one side of the fixing mechanism, and the emitting head of the laser is aligned with the glassware fixed on the fixing mechanism.
2. The picosecond laser fryer apparatus according to claim 1, further comprising a second lift mechanism;
the second lifting mechanism is connected with the emitting head of the laser, so that the second lifting mechanism changes the horizontal height of the emitting head of the laser, and the position of the emitting head of the laser, which is aligned with the glassware, is adjusted.
3. The picosecond laser fryer apparatus according to claim 2, wherein the second lifting mechanism is a lead screw lifting mechanism.
4. The picosecond laser fryer apparatus of claim 1, wherein the fixture comprises a turntable and a plurality of fixtures disposed on the turntable for holding glassware.
5. The picosecond laser fryer apparatus of claim 4, wherein the fixture is a resilient clasping fixture.
6. The picosecond laser fryer apparatus according to claim 1, further comprising a finger cylinder for gripping the cutting portion of the glassware, the finger cylinder being secured over the securing mechanism.
7. The picosecond laser fryer apparatus of claim 1, wherein the first lift mechanism comprises one of a lead screw lift mechanism, a pneumatic cylinder, a hydraulic cylinder, or a linear motor.
8. The picosecond laser fryer apparatus according to claim 1, wherein the laser is a picosecond laser.
9. A picosecond laser fryer system comprising the picosecond laser fryer apparatus of any of claims 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121343020.0U CN215855792U (en) | 2021-06-16 | 2021-06-16 | Picosecond laser blast apparatus and system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121343020.0U CN215855792U (en) | 2021-06-16 | 2021-06-16 | Picosecond laser blast apparatus and system |
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| CN215855792U true CN215855792U (en) | 2022-02-18 |
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| CN202121343020.0U Active CN215855792U (en) | 2021-06-16 | 2021-06-16 | Picosecond laser blast apparatus and system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114560627A (en) * | 2022-04-11 | 2022-05-31 | 祁县喜福来玻璃器皿有限公司 | Automatic cutting system for glass cup cap opening |
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2021
- 2021-06-16 CN CN202121343020.0U patent/CN215855792U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114560627A (en) * | 2022-04-11 | 2022-05-31 | 祁县喜福来玻璃器皿有限公司 | Automatic cutting system for glass cup cap opening |
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