CN215847582U - Retaining ring for chemical mechanical polishing - Google Patents
Retaining ring for chemical mechanical polishing Download PDFInfo
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- CN215847582U CN215847582U CN202120070274.3U CN202120070274U CN215847582U CN 215847582 U CN215847582 U CN 215847582U CN 202120070274 U CN202120070274 U CN 202120070274U CN 215847582 U CN215847582 U CN 215847582U
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Abstract
The utility model provides a retaining ring for chemical mechanical polishing, which comprises a first ring body and a second ring body; the first ring body and the second ring body are bonded through a bonding agent; the first ring body is provided with a groove, and the groove is provided with a first side bonding surface and a first step horizontal bonding surface; an annular boss is arranged on the second ring body, and the outer diameter of the bottom of the annular boss is smaller than that of the top of the annular boss; the annular boss is provided with a second side surface bonding surface and a second step horizontal bonding surface; a dovetail groove is formed in the second step horizontal bonding surface; the diameter of the groove is the same as the outer diameter of the top of the annular boss; the annular boss is inserted into the groove. According to the utility model, the bonding structure between the two ring bodies is improved, so that the bonding strength between the two ring bodies is enhanced, and the quality of the retaining ring is improved; the design of the bonding structure does not need complex operation, has simple structure and small workload, and is beneficial to industrial application.
Description
Technical Field
The utility model belongs to the technical field of chemical mechanical polishing, and particularly relates to a retaining ring for chemical mechanical polishing.
Background
Chemical mechanical polishing is a process commonly used in semiconductor manufacturing to planarize or polish layers of material deposited on a wafer. In the chemical mechanical polishing process, in order to prevent the wafer from flying out during the chemical mechanical polishing, a retaining ring needs to be fixed on a carrier head of the chemical mechanical polishing device.
In the prior art, the retaining ring generally comprises an annular base plate connected to the carrier head, and also comprises a resin ring bonded to the annular base plate. Wherein, cyclic annular base plate includes cyclic annular base plate adhesive surface and cyclic annular base plate installation face, and resin includes resin ring adhesive surface and resin ring grinding surface. The mounting surface of the annular base disc is connected with the carrying head, the adhesive surface of the annular base disc is adhered with the adhesive surface of the resin ring, and the abrasive surface of the resin ring is contacted with the abrasive disc. During the grinding of the wafer, the wafer is surrounded by the retaining ring, and the resin ring participates in the grinding together with the wafer. The processing procedure of the wafer has high requirements on precision, in the processing procedure, once the bonding of the resin ring and the annular base plate is in a problem, the polishing precision is seriously influenced, and the repair cost is increased, so that how to ensure the bonding strength between the resin ring and the annular base plate is extremely important.
CN111823131A discloses a bonding structure of a retaining ring for semiconductor chemical mechanical polishing, the bonding structure includes a first ring body and a second ring body bonded to each other, the cross section of the bonding surface of the first ring body is L-shaped, grooves are arranged on the bonding surface of the first ring body at intervals, and the bonding surface of the second ring body is matched with the bonding surface of the first ring body. In the bonding structure, the bonding surfaces of the two ring bodies are not tightly attached to the part without the groove, so that sufficient space is not provided for the bonding agent, glue is easily overflowed in the bonding process, the bonding agent of the tightly attached part is less, and the stability is poor.
CN101934495A discloses a retaining ring for embedded chemical mechanical polishing, which comprises a rigid ring and an elastic ring, wherein the rigid ring is a circular ring with a rectangular or square axial cross section, the diameter of the annular groove on the upper surface of the elastic ring is the same as that of the rigid ring, and the shape and size of the axial cross section are the same, the rigid ring of the retaining ring is embedded into the annular groove of the elastic ring by an embedded bonding method and is bonded by an adhesive. The retaining ring adopts an embedded mode, is not favorable for repair after being damaged, and increases the cost.
In summary, how to provide a retaining ring with a simple structure and a strong bonding structure is a problem to be solved.
SUMMERY OF THE UTILITY MODEL
Aiming at the problems in the prior art, the utility model aims to provide a retaining ring for chemical mechanical polishing, which enhances the bonding strength between two ring bodies and improves the quality of the retaining ring by improving the bonding structure between the two ring bodies; the design of the bonding structure does not need complex operation, has simple structure and small workload, and is beneficial to industrial application.
In order to achieve the purpose, the utility model adopts the following technical scheme:
the utility model provides a retaining ring for chemical mechanical polishing, which comprises a first ring body and a second ring body; the first ring body and the second ring body are bonded through a bonding agent;
a groove taking the circle center as the center is formed in one side of the bonding surface of the first ring body; a first side surface bonding surface and a first step horizontal bonding surface are arranged on the groove;
one side of the bonding surface of the second ring body is provided with an annular boss taking the circle center as the center; the outer diameter of the bottom of the annular boss is smaller than that of the top of the annular boss; the annular boss is provided with a second side surface bonding surface and a second step horizontal bonding surface; a dovetail groove is formed in the second step horizontal bonding surface;
the diameter of the groove is the same as the outer diameter of the top of the annular boss; the annular boss is inserted into the groove.
In the utility model, the top of the annular boss refers to a surface which is in contact with the bottom surface of the groove.
According to the utility model, by designing that the outer diameter of the bottom of the annular boss is smaller than that of the top of the annular boss and arranging the dovetail groove, the using amount of glue is increased, the bonding strength is improved, the risk of falling off between the first ring body and the second ring body in the using process is reduced, the repair cost is reduced, meanwhile, in later-stage use, the quality of a ground product can be improved, and the method has a better industrial application prospect.
In the utility model, the outer diameter of the bottom of the annular boss is smaller than that of the top of the annular boss, namely the axial section of the annular boss is trapezoidal, and a gap is formed between two side bonding surfaces after the annular boss is inserted into the groove, so that the using amount of glue is increased, and the bonding strength is improved.
The following technical solutions are preferred technical solutions of the present invention, but not limited to the technical solutions provided by the present invention, and technical objects and advantageous effects of the present invention can be better achieved and achieved by the following technical solutions.
As a preferable technical scheme of the utility model, the first ring body is made of plastic.
The plastic comprises a PPS material or a PEEK material.
As a preferable technical scheme of the utility model, the second ring body is made of stainless steel.
As a preferable technical solution of the present invention, an elliptical cylindrical groove and a cylindrical groove are respectively provided at both ends of the ring body in a diameter direction of a side of the first ring body contacting the polishing pad. According to the utility model, the mounting direction can be determined by the design of the two grooves with different shapes, and mounting dislocation can be effectively prevented.
In a preferred embodiment of the present invention, an outer edge of the first ring member on the bonding surface side is an inclined surface.
The outer diameter of the bottom of the inclined plane is smaller than the maximum diameter of the first ring body.
In the utility model, the design of the inclined surface in the first ring body can reduce the resistance of the product during grinding.
As a preferable technical solution of the present invention, the first side bonding surface and the first step horizontal bonding surface are provided with a communicating groove.
The depth of the communicating groove is 0.1 to 0.2mm, for example, 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, or 0.2mm, but is not limited to the values listed, and other values not listed in the range of the values are also applicable.
When the communication groove exists, the depth of the groove is the same as the height of the annular boss.
According to the utility model, the depth of the groove of the first ring body is the same as the height of the annular boss of the second ring body through the arrangement of the communicating groove, so that the using amount of glue is increased, the bonding strength is improved, and the glue overflow phenomenon of the outer edge bonding part of the first ring body and the second ring body is improved.
As a preferred technical scheme of the utility model, the depth of the groove is lower than the height of the annular boss.
The depth of the groove is 0.1-0.2 mm lower than the height of the annular boss, such as 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, or 0.2mm, but not limited to the values listed, and other values not listed in the range of values are also applicable.
In the utility model, under the condition of not arranging the communicating groove, the depth of the groove of the first ring body is lower than the height of the annular boss of the second ring body to increase the tiny gap, thereby increasing the glue consumption and improving the bonding strength.
In a preferred embodiment of the present invention, the dovetail grooves are symmetrically arranged about the center of the circle, and at least 4, for example, 4, 6, 8, 10, or 12 dovetail grooves are provided along the diameter direction, but the present invention is not limited to the above-mentioned numerical values, and other numerical values not listed in the numerical value range are also applicable.
In the utility model, a plurality of groups of dovetail grooves can be arranged on the circular ring along the diameters in different directions so as to increase the bonding strength.
In the utility model, the second step horizontal bonding surfaces comprise two, namely, dovetail grooves can be arranged on two surfaces, and a dovetail groove can also be arranged on one surface.
In a preferred embodiment of the present invention, the depth of the dovetail groove is 0.5 to 0.6mm, for example, 0.5mm, 0.52mm, 0.54mm, 0.56mm, 0.58mm, or 0.6mm, but the present invention is not limited to the above-mentioned values, and other values not listed in the above-mentioned range are also applicable.
In the utility model, the depth of the dovetail groove needs to be controlled. If the depth is too deep, the strength of the stainless steel part is reduced, and the overall weight of the retaining ring is also influenced; if the depth is too shallow and the glue consumption is too little, the effect of increasing the bonding strength cannot be achieved.
As a preferable technical scheme of the utility model, the cross section of the dovetail groove is in an inverted trapezoid shape.
The width of the top side of the inverted trapezoid is 3.5-4 mm, such as 3.5mm, 3.6mm, 3.7mm, 3.8mm, 3.9mm, or 4mm, but not limited to the values listed, and other values not listed in the range of values are also applicable.
The width of the bottom edge of the inverted trapezoid is 0.2mm smaller than the width of the top edge.
In the utility model, the dovetail grooves in the same plane are arranged at equal intervals, so that the bonding effect is more uniform.
Compared with the prior art, the utility model has the following beneficial effects:
(1) according to the retaining ring for chemical mechanical polishing, the matching structure of the first ring body and the second ring body is improved, particularly the size matching is carried out, so that the glue using amount is increased, the uniform distribution of the glue between the first ring body and the second ring body is met, the contact area between the retaining ring and the glue is greatly increased due to the design of the dovetail groove, the bonding surface is tightly combined, the bonding strength of the first ring body and the second ring body is improved, the stability of the retaining ring is improved, the falling risk is reduced, the repair cost is reduced, and meanwhile, the quality of a ground product can be improved in later use;
(2) the bonding structure designed by the utility model is simple, the workload is small, and the industrial application prospect is better.
Drawings
FIG. 1 is a schematic structural view of a retainer ring provided in example 1 of the present invention;
FIG. 2 is a schematic structural view of a first ring body provided in example 1 of the present invention;
FIG. 3 is a schematic structural view of a second ring body provided in example 1 of the present invention;
FIG. 4 is a schematic structural view of a retainer ring provided in embodiment 2 of the present invention;
FIG. 5 is a schematic structural view of a first ring body provided in example 2 of the present invention;
FIG. 6 is a schematic structural view of a second ring body provided in example 2 of the present invention;
the connecting structure comprises a first ring body, a second ring body, a groove, a first side surface bonding surface, a first step horizontal bonding surface, a 6-elliptic cylindrical groove, a 7-cylindrical groove, an 8-annular boss, a 9-second side surface bonding surface, a 10-second step horizontal bonding surface, a 11-dovetail groove and a 12-communicating groove.
Detailed Description
In order to better illustrate the present invention and facilitate the understanding of the technical solutions of the present invention, the following embodiments are only simple examples of the present invention and do not represent or limit the scope of the present invention, which is defined by the claims.
The utility model provides a retaining ring for chemical mechanical polishing, which comprises a first ring body 1 and a second ring body 2; the first ring body 1 and the second ring body 2 are bonded through an adhesive;
a groove 3 taking the circle center as the center is arranged on one side of the bonding surface of the first ring body 1; a first side bonding surface 4 and a first step horizontal bonding surface 5 are arranged on the groove 3;
one side of the bonding surface of the second ring body 2 is provided with an annular boss 8 taking the circle center as the center; the outer diameter of the bottom of the annular boss 8 is smaller than that of the top; the annular boss 8 is provided with a second side bonding surface 9 and a second step horizontal bonding surface 10; a dovetail groove 11 is arranged on the second step horizontal bonding surface 10;
the diameter of the groove 3 is the same as the outer diameter of the top of the annular boss 8; the annular boss 8 is inserted into the groove 3.
The following are typical but non-limiting examples of the utility model:
example 1:
the embodiment provides a retaining ring for chemical mechanical polishing, and the structural schematic diagram of the retaining ring for chemical mechanical polishing is shown in fig. 1.
The retaining ring for chemical mechanical polishing comprises a first ring body 1 and a second ring body 2; the first ring body 1 and the second ring body 2 are bonded through an adhesive;
a groove 3 taking the circle center as the center is arranged on one side of the bonding surface of the first ring body 1; a first side bonding surface 4 and a first step horizontal bonding surface 5 are arranged on the groove 3; the schematic structural diagram of the first ring body is shown in fig. 2.
One side of the bonding surface of the second ring body 2 is provided with an annular boss 8 taking the circle center as the center; the outer diameter of the bottom of the annular boss 8 is smaller than that of the top; the annular boss 8 is provided with a second side bonding surface 9 and a second step horizontal bonding surface 10; a dovetail groove 11 is arranged on the second step horizontal bonding surface 10; the structural schematic diagram of the second ring body is shown in fig. 3.
The diameter of the groove 3 is the same as the outer diameter of the top of the annular boss 8; the annular boss 8 is inserted into the groove 3.
The first ring body 1 is made of PPS material; the second ring body 2 is made of stainless steel.
An elliptic cylindrical groove 6 and a cylindrical groove 7 are respectively arranged at two ends of the first ring body 1 along the diameter direction of one side contacted with the grinding pad.
The outer edge of one side of the bonding surface of the first ring body 1 is an inclined surface;
the outer diameter of the bottom of the inclined plane is smaller than the maximum diameter of the first ring body 1.
The first side bonding surface 4 and the first step horizontal bonding surface 5 are provided with communicating grooves 12; the depth of the communication groove 12 is 0.2 mm; the depth of the groove 3 is the same as the height of the annular boss 8.
The dovetail grooves 11 are symmetrically arranged about the circle center and are 4 in the diameter direction, the dovetail grooves 11 are respectively located on two surfaces of the second step horizontal bonding surface 10, and each surface is provided with 2 dovetail grooves.
The depth of the dovetail groove 11 is 0.6 mm.
The cross section of the dovetail groove 11 is in an inverted trapezoid shape; the width of the top edge of the inverted trapezoid is 3.96 mm; the width of the bottom edge of the inverted trapezoid is 3.79 mm.
Example 2:
the embodiment provides a retaining ring for chemical mechanical polishing, and the structural schematic diagram of the retaining ring for chemical mechanical polishing is shown in fig. 4.
The retaining ring for chemical mechanical polishing comprises a first ring body 1 and a second ring body 2; the first ring body 1 and the second ring body 2 are bonded through an adhesive;
a groove 3 taking the circle center as the center is arranged on one side of the bonding surface of the first ring body 1; a first side bonding surface 4 and a first step horizontal bonding surface 5 are arranged on the groove 3; the schematic structural diagram of the first ring body is shown in fig. 5.
One side of the bonding surface of the second ring body 2 is provided with an annular boss 8 taking the circle center as the center; the outer diameter of the bottom of the annular boss 8 is smaller than that of the top; the annular boss 8 is provided with a second side bonding surface 9 and a second step horizontal bonding surface 10; a dovetail groove 11 is arranged on the second step horizontal bonding surface 10; the structural schematic diagram of the second ring body is shown in fig. 6.
The diameter of the groove 3 is the same as the outer diameter of the top of the annular boss 8; the annular boss 8 is inserted into the groove 3.
The first ring body 1 is made of PEEK material; the second ring body 2 is made of stainless steel.
An elliptic cylindrical groove 6 and a cylindrical groove 7 are respectively arranged at two ends of the first ring body 1 along the diameter direction of one side contacted with the grinding pad.
The outer edge of one side of the bonding surface of the first ring body 1 is an inclined surface;
the outer diameter of the bottom of the inclined plane is smaller than the maximum diameter of the first ring body 1.
The depth of the groove 3 is 0.1mm lower than the height of the annular boss.
The dovetail grooves 11 are symmetrically arranged around the circle center and are 8 in the diameter direction, and the dovetail grooves 11 are all located on the outer edge horizontal plane of the second step horizontal bonding surface 10.
The depth of the dovetail groove 11 is 0.5 mm.
The cross section of the dovetail groove 11 is in an inverted trapezoid shape; the width of the top edge of the inverted trapezoid is 3.5 mm; the width of the bottom side of the inverted trapezoid is 3.3 mm.
Example 3:
the present embodiment provides a retainer ring for chemical mechanical polishing, which includes a first ring body 1 and a second ring body 2; the first ring body 1 and the second ring body 2 are bonded through an adhesive;
a groove 3 taking the circle center as the center is arranged on one side of the bonding surface of the first ring body 1; a first side bonding surface 4 and a first step horizontal bonding surface 5 are arranged on the groove 3;
one side of the bonding surface of the second ring body 2 is provided with an annular boss 8 taking the circle center as the center; the outer diameter of the bottom of the annular boss 8 is smaller than that of the top; the annular boss 8 is provided with a second side bonding surface 9 and a second step horizontal bonding surface 10; a dovetail groove 11 is arranged on the second step horizontal bonding surface 10;
the diameter of the groove 3 is the same as the outer diameter of the top of the annular boss 8; the annular boss 8 is inserted into the groove 3.
The first ring body 1 is made of PEEK material; the second ring body 2 is made of stainless steel.
An elliptic cylindrical groove 6 and a cylindrical groove 7 are respectively arranged at two ends of the first ring body 1 along the diameter direction of one side contacted with the grinding pad.
The outer edge of one side of the bonding surface of the first ring body 1 is an inclined surface;
the outer diameter of the bottom of the inclined plane is smaller than the maximum diameter of the first ring body 1.
The depth of the groove 3 is 0.2mm lower than the height of the annular boss 9.
The dovetail grooves 11 are symmetrically arranged around the circle center and are 10 in the diameter direction, and the dovetail grooves 11 are all located on the outer edge horizontal plane of the second step horizontal bonding surface 10.
The depth of the dovetail groove 11 is 0.55 mm.
The cross section of the dovetail groove 11 is in an inverted trapezoid shape; the width of the top edge of the inverted trapezoid is 4 mm; the width of the bottom side of the inverted trapezoid is 3.8 mm.
Example 4:
the present embodiment provides a retainer ring for chemical mechanical polishing, which includes a first ring body 1 and a second ring body 2; the first ring body 1 and the second ring body 2 are bonded through an adhesive;
a groove 3 taking the circle center as the center is arranged on one side of the bonding surface of the first ring body 1; a first side bonding surface 4 and a first step horizontal bonding surface 5 are arranged on the groove 3;
one side of the bonding surface of the second ring body 2 is provided with an annular boss 8 taking the circle center as the center; the outer diameter of the bottom of the annular boss 8 is smaller than that of the top; the annular boss 8 is provided with a second side bonding surface 9 and a second step horizontal bonding surface 10; a dovetail groove 11 is arranged on the second step horizontal bonding surface 10;
the diameter of the groove 3 is the same as the outer diameter of the top of the annular boss 8; the annular boss 8 is inserted into the groove 3.
The first ring body 1 is made of PPS material; the second ring body 2 is made of stainless steel.
An elliptic cylindrical groove 6 and a cylindrical groove 7 are respectively arranged at two ends of the first ring body 1 along the diameter direction of one side contacted with the grinding pad.
The outer edge of one side of the bonding surface of the first ring body 1 is an inclined surface;
the outer diameter of the bottom of the inclined plane is smaller than the maximum diameter of the first ring body 1.
The first side bonding surface 4 and the first step horizontal bonding surface 5 are provided with communicating grooves 12; the depth of the communication groove 12 is 0.1 mm; the depth of the groove 3 is the same as the height of the annular boss 8.
The dovetail grooves 11 are symmetrically arranged about the circle center and are 8 in the diameter direction, the dovetail grooves 11 are respectively located on two surfaces of the second step horizontal bonding surface 10, and each surface is provided with 4 dovetail grooves.
The depth of the dovetail groove 11 is 0.6 mm.
The cross section of the dovetail groove 11 is in an inverted trapezoid shape; the width of the top edge of the inverted trapezoid is 3.7 mm; the width of the bottom side of the inverted trapezoid is 3.5 mm.
Comparative example 1:
this comparative example provides a retainer ring for chemical mechanical polishing, which is similar to the retainer ring structure of example 1 except that: the second step horizontal bonding surface 10 is not provided with a dovetail groove 11.
Comparative example 2:
this comparative example provides a retainer ring for chemical mechanical polishing, which is similar to the retainer ring structure of example 2 except that: the bottom outer diameter of the annular boss 8 is equal to the top outer diameter, that is, after the annular boss 8 is inserted into the groove 3, no gap exists between the first side bonding surface 4 and the second side bonding surface 9.
The retainer rings obtained in examples 1 to 4 and comparative examples 1 to 2 were subjected to a desoldering test of the first ring body and the second ring body, and the required torsion was measured, and the measurement results are shown in table 1.
TABLE 1 torsion required for desoldering of the retaining ring obtained in examples 1-4 and comparative examples 1-2
| torque/Nm required for desoldering | |
| Example 1 | 2.4 |
| Example 2 | 2.5 |
| Example 3 | 2.1 |
| Example 4 | 2.3 |
| Comparative example 1 | 1.3 |
| Comparative example 2 | 1.6 |
As can be seen from Table 1, the holding rings obtained in examples 1 to 4 have a large torque required for desoldering, which is more than 2.1Nm, and can ensure the service life of the holding ring when used in an actual production process; the retaining ring obtained in the comparative example 1-2 has a desoldering phenomenon under the action of the torsion of less than 1.6Nm, has short service life and is not beneficial to industrial application.
It can be seen from the above embodiments and comparative examples that the retaining ring for chemical mechanical polishing of the present invention improves the fitting structure of the first ring body and the second ring body, especially the fitting of the sizes thereof, to increase the amount of glue and satisfy the uniform distribution of the glue between the first ring body and the second ring body, and the dovetail groove design greatly increases the contact area with the glue, so that the bonding surface is tightly bonded, the bonding strength of the first ring body and the second ring body is improved, and the stability of the retaining ring is improved; the retaining ring for chemical mechanical polishing does not have complex structural change, so that complex operation is not needed, the structure is simple, the workload is low, meanwhile, the maintenance cost is reduced, and the industrial application is facilitated.
The applicant states that the present invention is described in detail by the above embodiments, but the present invention is not limited to the above detailed structure, that is, it is not meant that the present invention must be implemented by relying on the above detailed structure. It should be understood by those skilled in the art that any modification of the present invention, and the addition of equivalent or complementary structures, selection of specific means, etc., to the disclosed structure, falls within the scope of the present invention and its disclosure.
Claims (9)
1. A retainer ring for chemical mechanical polishing, characterized in that the retainer ring for chemical mechanical polishing comprises a first ring body and a second ring body; the first ring body and the second ring body are bonded through a bonding agent;
a groove taking the circle center as the center is formed in one side of the bonding surface of the first ring body; a first side surface bonding surface and a first step horizontal bonding surface are arranged on the groove;
one side of the bonding surface of the second ring body is provided with an annular boss taking the circle center as the center; the outer diameter of the bottom of the annular boss is smaller than that of the top of the annular boss; the annular boss is provided with a second side surface bonding surface and a second step horizontal bonding surface; a dovetail groove is formed in the second step horizontal bonding surface;
the diameter of the groove is the same as the outer diameter of the top of the annular boss; the annular boss is inserted into the groove;
the first side bonding surface and the first step horizontal bonding surface are provided with communicating grooves;
the depth of the communication groove is 0.1-0.2 mm;
when the communication groove exists, the depth of the groove is the same as the height of the annular boss.
2. The retainer ring for chemical mechanical polishing according to claim 1, wherein the first ring member is made of plastic; the plastic comprises a PPS material or a PEEK material.
3. The retainer ring for chemical mechanical polishing as set forth in claim 1, wherein the second ring member is made of stainless steel.
4. The retainer ring for chemical mechanical polishing according to claim 1, wherein the first ring body is provided with an elliptic cylindrical groove and a cylindrical groove at both ends of the ring body in a diameter direction on a side thereof contacting the polishing pad, respectively.
5. The retainer ring for chemical mechanical polishing according to claim 1, wherein an outer edge of a bonding surface side of the first ring body is a slope;
the outer diameter of the bottom of the inclined plane is smaller than the maximum diameter of the first ring body.
6. The retainer ring for chemical mechanical polishing according to claim 1, wherein a depth of the groove is lower than a height of the annular boss;
the depth of the groove is 0.1-0.2 mm lower than the height of the annular boss.
7. The retainer ring for chemical mechanical polishing according to claim 1, wherein the dovetail grooves are symmetrically arranged about a center of the circle and are at least 4 in a diameter direction.
8. The retainer ring for chemical mechanical polishing according to claim 1, wherein the dovetail groove has a depth of 0.5 to 0.6 mm.
9. The retainer ring for chemical mechanical polishing according to claim 1, wherein the cross section of the dovetail groove is an inverted trapezoid;
the width of the top edge of the inverted trapezoid is 3.5-4 mm; the width of the bottom edge of the inverted trapezoid is 0.2mm smaller than the width of the top edge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120070274.3U CN215847582U (en) | 2021-01-12 | 2021-01-12 | Retaining ring for chemical mechanical polishing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120070274.3U CN215847582U (en) | 2021-01-12 | 2021-01-12 | Retaining ring for chemical mechanical polishing |
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| Publication Number | Publication Date |
|---|---|
| CN215847582U true CN215847582U (en) | 2022-02-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120070274.3U Active CN215847582U (en) | 2021-01-12 | 2021-01-12 | Retaining ring for chemical mechanical polishing |
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| CN (1) | CN215847582U (en) |
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- 2021-01-12 CN CN202120070274.3U patent/CN215847582U/en active Active
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