CN215835790U

CN215835790U - Paster device is used in electronic components production

Info

Publication number: CN215835790U
Application number: CN202121850922.3U
Authority: CN
Inventors: 陈馨
Original assignee: Dongguan Yingze Electronic Technology Co ltd
Current assignee: Dongguan Yingze Electronic Technology Co ltd
Priority date: 2021-08-09
Filing date: 2021-08-09
Publication date: 2022-02-15
Anticipated expiration: 2031-08-09

Abstract

The utility model discloses a chip mounting device for electronic component production, which comprises a supporting plate, a supporting table, a feeding slide rail, a chip mounting material box supporting frame, a chip mounting material box cover and a material box, wherein the supporting table is arranged on the upper side of the supporting plate, a plate is arranged on the upper side of the supporting table, the feeding slide rail is arranged on the upper side of the plate, laser is arranged on the outer side of the middle part of the feeding slide rail, a feeding slide rail groove is arranged in the feeding slide rail, a chip mounting frame supporting frame is arranged between the two plates, stop blocks are arranged at two ends of the chip mounting frame supporting frame, a slide groove is arranged on the inner side of the chip mounting frame supporting frame, a relay is arranged on the rear side of the stop blocks, a spring is arranged on the rear side of the relay, a magnet is arranged at one end of the spring, and a chip mounting frame is arranged on the rear side of the magnet. Has the advantages that: the distance that the paster removed has been reduced, once can adorn the subsides to multiple paster, has improved the efficiency of paster, has reduced staff's intensity of labour.

Description

Paster device is used in electronic components production

Technical Field

The utility model relates to the field of electronic component processing, in particular to a chip mounting device for electronic component production.

Background

The placement machine is also called a surface mounting system, and is a device which is configured behind a dispensing machine or a screen printing machine in a production line and accurately places surface mounting components on a PCB (printed circuit board) pad by moving a mounting head. The method is divided into manual operation and full-automatic operation. The full-automatic chip mounter is used for realizing full-automatic component mounting at high speed and high precision, and is the most critical and complex equipment in the whole SMT production. Chip mounters are main devices in SMT production lines, have been developed from early low-speed mechanical chip mounters to high-speed optical centering chip mounters, and have been developed towards multifunctional and flexible connection modularization. The existing paster device sucks a paster on a feeder through a suction nozzle, and then moves to the upper side of a unit plate through an X-axis slide bar and a Y-axis slide bar so as to carry out paster, and a large amount of time is wasted in the moving process, so that the working efficiency is reduced.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problems, an object of the present invention is to provide a die bonding apparatus for producing an electronic component.

The utility model realizes the purpose through the following technical scheme:

a chip mounting device for producing electronic components comprises a support plate, a support table, a feeding slide rail, a chip mounting material box support frame, a chip mounting material box cover and a material box, wherein the support table is arranged on the upper side of the support plate, a plate is arranged on the upper side of the support table, the feeding slide rail is arranged on the upper side of the plate, laser is arranged on the outer side of the middle of the feeding slide rail, a feeding slide rail groove is arranged in the feeding slide rail, a chip mounting frame support frame is arranged between the two plates, stop blocks are arranged at two ends of the chip mounting frame support frame, a slide groove is arranged on the inner side of the chip mounting frame support frame, a relay is arranged on the rear side of the stop blocks, a spring is arranged on the rear side of the relay, a magnet is arranged at one end of the spring, a chip mounting frame is arranged on the rear side of the magnet, a chip placing groove is arranged in the chip mounting frame, a rubber bag is arranged on the lower side of the chip mounting frame, a connecting shaft is arranged between the two chip mounting frames, the patch storage rack is characterized in that the material box is arranged above the patch storage rack, the patch storage box is arranged above the material box, the patch storage box support frame is arranged above the patch storage box, the patch box cover is arranged on the upper side of the patch storage box support frame, the cylinder is arranged in the middle of the two support tables, the thrust disc is arranged above the cylinder, and the jacking block is arranged on the upper side of the thrust disc.

In the structure, the material loading slide rail drives materials to move forward from left to right in the material loading slide rail groove, required patches can be placed according to requirements after the patch bin cover is opened, the patches are controlled to enter and exit below the bin, the patches are discharged inside the patch placing groove, the relay is adsorbed when being powered on, the magnet compresses the spring to enable the patch placing frame to move forward and release during power failure, the patch placing frame moves backward, patches are put in different positions, the patch placing frame moves to accelerate the progress of the patches in turn, the cylinder is started, the cylinder presses upwards the jacking blocks, the jacking blocks with different heights are upwards opposite to the patch placing frame to extrude the patches, so that the patches are adhered to the material body, and the cylinder is started alternately.

Preferably, the patch box cover is hinged to the patch placing box, the patch placing box is welded to the patch box support frame, and the patch box is welded to the patch placing box.

Preferably, the plate is connected with the feeding slide rail through screws, the plate is connected with the supporting table through screws, and the supporting table is connected with the supporting plate in a matched mode.

Preferably, the stopper is welded to the patch holder support frame, the relay is connected to the stopper through a screw, and the relay is connected to the spring through a V-shaped hook.

Preferably, the cylinder is welded with the thrust disc, the thrust disc is welded with the jacking block, and the cylinder is connected with the support plate through bolts.

Preferably, the size of the patch placing groove is the same as that of the patch, the patch placing frame is in threaded connection with the connecting shaft, and two sides of the patch placing frame are arranged in the sliding groove to slide.

Preferably, the distance between the feeding slide rails is equal to the width of the fed materials, the laser is in threaded connection with the feeding slide rails, and the laser cannot exceed the inner sides of the feeding slide rails but needs to penetrate through the feeding slide rails.

Compared with the prior art, the utility model has the following beneficial effects:

the feeding of multiple patches is carried out through the workbin once, the distance that the patches moved is reduced through the setting, the multiple patches can be mounted and pasted once, the efficiency of the patches is improved, and the labor intensity of workers is reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of a first structure of a chip mounting device for electronic component production according to the present invention;

fig. 2 is a schematic front view of a chip mounting device for electronic component production according to the present invention;

fig. 3 is a left side view structural schematic diagram of a chip mounting device for electronic component production according to the present invention;

fig. 4 is a schematic view of a first structure of a chip mounting mechanism of a chip mounting device for electronic component production according to the present invention;

fig. 5 is a second structural schematic diagram of a chip mounting mechanism of the chip mounting device for producing electronic components according to the utility model.

The reference numerals are explained below:

1. a support plate; 2. a support table; 3. a feeding slide rail; 4. a patch material box support frame; 5. sticking a sheet material box cover; 6. a material box; 7. a board; 8. a feeding slide rail groove; 9. a spring; 10. a magnet; 11. placing a patch rack; 12. jacking the block; 13. a thrust disc; 14. a cylinder; 15. a patch placement frame support frame; 16. laser; 17. a patch placing groove; 18. a rubber bag; 19. a patch placing bin; 20. a connecting shaft; 21. a chute; 22. a relay; 23. and a stop block.

Detailed Description

The utility model will be further described with reference to the accompanying drawings in which:

as shown in fig. 1-5, a chip mounting device of a chip mounting device for electronic component production comprises a support plate 1, a support table 2, a feeding slide rail 3, a chip mounting box support frame 4, a chip mounting box cover 5, and a box 6, wherein the support table 2 is arranged on the upper side of the support plate 1, a plate 7 is arranged on the upper side of the support table 2, the feeding slide rail 3 is arranged on the upper side of the plate 7, the feeding slide rail 3 can automatically advance materials to relieve labor force, a laser 16 is arranged on the outer side of the middle part of the feeding slide rail 3, the laser 16 is used for determining the position of the materials to judge whether an air cylinder 14 can move upwards, a feeding slide rail groove 8 is arranged inside the feeding slide rail 3, a chip mounting frame support frame 15 is arranged between the two plates 7, two ends of the chip mounting frame support frame 15 are provided with stop blocks 23, the inner side of the chip mounting frame 15 is provided with a slide groove 21 to enable the chip mounting frame 11 to smoothly slide, a relay 22 is arranged on the rear side of the stop blocks 23, relay 22 rear side sets up spring 9, spring 9 controls the removal of paster rack 11, spring 9 directly sets up magnet 10, magnet 10 rear side sets up paster rack 11, paster rack 11 is inside to be set up paster standing groove 17, paster rack 11 downside sets up rubber bag 18, rubber bag 18 makes things convenient for jack-up piece 12 to jack-up smoothly, two paster rack 11's centre sets up even axle 20, paster rack 11 top sets up workbin 6, workbin 6 dress blocks the paster, workbin 19 is placed to the setting paster 6 top, the workbin 19 top is placed to the paster sets up paster

workbin support frame

4, 4 upsides of paster workbin support frame set up paster case lid 5, workbin lid 5 prevents the ash that falls on the paster, set up cylinder 14 in the middle of two brace tables 2, cylinder 14 plays the effect of upwards pushing up, cylinder 14 top sets up thrust disc 13, thrust disc 13 upside sets up jack-up piece 12.

In the structure, material loading slide rail 3 drives the material and turns right from a left side and gos forward in material loading slide rail groove 8, can place required paster as required after paster workbin lid 5 opens, the business turn over of the control paster of workbin 6 below, the paster is emitted in the paster standing groove 17 of the inside of paster rack 11, electromagnet 10 compresses spring 9 when relay 22 switches on, make paster rack 11 remove forward, release during the outage, make paster rack 11 remove backward, the paster is put in to different positions, move the progress of accelerating the paster in turn through two paster racks 11, start cylinder 14, upwards jack-up piece 12, jack-up piece 12 of co-altitude upwards extrudees paster rack 11, thereby make the paster glue on the material body, cylinder 14's start is gone on in turn.

Preferably, a patch box cover 5 is hinged with a patch placing box 19, the patch placing box 19 is welded with a patch box support frame 4, a box 6 is welded with the patch placing box 19, a plate 7 is in screwed connection with a feeding slide rail 3, the plate 7 is in screwed connection with a support table 2, the support table 2 is in matched connection with a support plate 1, a stop block 23 is welded with a patch placing frame support frame 15, a relay 22 is in screwed connection with the stop block 23, the relay 22 is in screwed connection with a spring 9 by using a V-shaped hook, an air cylinder 14 is welded with a thrust disc 13, the thrust disc 13 is welded with a jacking block 12, the air cylinder 14 is in bolted connection with the support plate 1, the size of a patch placing groove 17 is the same as that of a patch, the patch placing frame 11 is in threaded connection with a connecting shaft 20, two sides of the patch placing frame 11 are arranged in a sliding groove 21 to slide, the distance between the feeding slide rails 3 is equal to the width of the fed materials, a laser 16 is in threaded connection with the feeding slide rails 3, the laser 16 can not go beyond the inner side of the feeding slide rail 3, but needs to pass through.

The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed.

Claims

1. The utility model provides a paster device is used in electronic components production which characterized in that: the automatic feeding device comprises a supporting plate (1), a supporting table (2), a feeding slide rail (3), a patch material box supporting frame (4), a patch material box cover (5) and a material box (6), wherein the supporting table (2) is arranged on the upper side of the supporting plate (1), a plate (7) is arranged on the upper side of the supporting table (2), the feeding slide rail (3) is arranged on the upper side of the plate (7), a laser (16) is arranged on the outer side of the middle part of the feeding slide rail (3), a feeding slide rail groove (8) is arranged in the feeding slide rail (3), a patch placing frame supporting frame (15) is arranged between the two plates (7), two ends of the patch placing frame supporting frame (15) are provided with a stop block (23), a slide groove (21) is arranged on the inner side of the patch placing frame (15), a relay (22) is arranged on the rear side of the stop block (23), and a spring (9) is arranged on the rear side of the relay (22), a magnet (10) is arranged at one end of the spring (9), a patch placing frame (11) is arranged at the rear side of the magnet (10), a patch placing groove (17) is arranged in the patch placing rack (11), a rubber bag (18) is arranged at the lower side of the patch placing rack (11), a connecting shaft (20) is arranged between the two patch placing racks (11), the material box (6) is arranged above the patch placing frame (11), the patch placing material box (19) is arranged above the material box (6), the patch box supporting frame (4) is arranged above the patch placing box (19), the upper side of the patch material box support frame (4) is provided with the patch material box cover (5), the middle of the two support tables (2) is provided with an air cylinder (14), a thrust disc (13) is arranged above the air cylinder (14), and a jacking block (12) is arranged on the upper side of the thrust disc (13).

2. A chip mounting device for electronic component production according to claim 1, wherein: the patch placing box cover (5) is connected with the patch placing box (19) in a hinge mode, the patch placing box (19) is welded with the patch box supporting frame (4), and the box (6) is welded with the patch placing box (19).

3. A chip mounting device for electronic component production according to claim 1, wherein: the plate (7) is in screw connection with the feeding slide rail (3), the plate (7) is in screw connection with the supporting table (2), and the supporting table (2) is in fit connection with the supporting plate (1).

4. A chip mounting device for electronic component production according to claim 1, wherein: the stop block (23) is welded with the patch placing frame support frame (15), the relay (22) is in screw connection with the stop block (23), and the relay (22) is connected with the spring (9) through a V-shaped hook.

5. A chip mounting device for electronic component production according to claim 1, wherein: the cylinder (14) is welded with the thrust disc (13), the thrust disc (13) is welded with the jacking block (12), and the cylinder (14) is connected with the support plate (1) through bolts.

6. A chip mounting device for electronic component production according to claim 1, wherein: the size of the patch placing groove (17) is the same as that of a patch, the patch placing frame (11) is in threaded connection with the connecting shaft (20), and two sides of the patch placing frame (11) are arranged in the sliding groove (21) to slide.

7. A chip mounting device for electronic component production according to claim 1, wherein: the distance between the feeding slide rails (3) is equal to the width of the fed materials, the laser (16) is in threaded connection with the feeding slide rails (3), and the laser (16) cannot exceed the inner sides of the feeding slide rails (3) but needs to penetrate through the inner sides.