CN215815790U - Semiconductor packaging device for integrated circuit production - Google Patents
Semiconductor packaging device for integrated circuit production Download PDFInfo
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- CN215815790U CN215815790U CN202121878611.8U CN202121878611U CN215815790U CN 215815790 U CN215815790 U CN 215815790U CN 202121878611 U CN202121878611 U CN 202121878611U CN 215815790 U CN215815790 U CN 215815790U
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Abstract
The utility model discloses a semiconductor packaging device for integrated circuit production, which comprises a body, wherein the body is placed above a bracket, a base is arranged above the body, a lower board collecting seat is arranged above the base, and a connecting groove is formed in the lower board collecting seat; and the upper plate collecting seat is arranged above the lower plate collecting seat and is connected with the upper plate collecting seat, and a transmission belt is arranged above the upper plate collecting seat. This semiconductor packaging device for integrated circuit production receives the influence of upper and lower collection seat at the in-process that uses and can advance line location to upper and lower collection seat, is simultaneously at the in-process that uses because be fixed connection between lower collection seat and the base, when the encapsulation completion after, the semiconductor integrated board can be quick withdraw from to be convenient for the operator takes out the integrated board, the in-process that uses simultaneously receives fixture's influence can also carry out a preliminary location to the packaging process, thereby be convenient for encapsulate.
Description
Technical Field
The utility model relates to the technical field of packaging devices, in particular to a semiconductor packaging device for integrated circuit production.
Background
The semiconductor packaging device can be used in the production process of an integrated circuit, for example, a chip packaging device with application number of CN202022163942.5, comprises a packaging device main body, a chip main body and a sealing cover, wherein radiating pipes are respectively installed on the base surface and the back surface of the packaging device main body, pins are embedded and installed on two sides of the packaging device main body, a welding block is arranged at the top of one end of each pin, which is positioned in the packaging device main body, a radiating base is installed at the center of the bottom end in the packaging device main body, an installation base is installed at the top of the radiating base, the bottom end of the installation base penetrates through the inside of the radiating base and is provided with a radiating groove, the chip main body is fixedly installed in the top end of the installation base, the two sides of the chip main body are connected to the top of the welding block through connecting wires, the whole device is simple in structure and convenient for quick packaging and use, and has a radiating structure which is convenient for efficient radiating use when the packaged chip is used, and has high stability and practicability, has certain popularization value.
The device is convenient for quick packaging and use, but does not have a positioning function, and is inconvenient for packaging integrated boards of different scales in the using process.
We have therefore proposed a semiconductor packaging apparatus for integrated circuit production in order to solve the problems set forth above.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a semiconductor package device for integrated circuit production, which solves the problem of the prior art that the prior semiconductor package device does not have the initial positioning function during the positioning process of the lower board.
In order to achieve the purpose, the utility model provides the following technical scheme: a semiconductor package device for integrated circuit production, comprising;
the body is placed above the bracket, the base is arranged above the body, the lower plate collecting seat is arranged above the base, and the connecting groove is formed in the lower plate collecting seat;
the upper plate collecting seat is arranged above the lower plate collecting seat, is connected with the upper plate collecting, and is provided with a transmission belt above the upper plate collecting seat;
the clamping mechanism is connected with the telescopic rod, is arranged above the lower plate collecting seat and is provided with a connecting block below;
the supporting mechanism is arranged in the lower collecting plate seat, the telescopic rod is adopted to be connected with the lower collecting plate seat before the supporting mechanism is arranged, the surface of the supporting mechanism is made of an anti-static material, and the supporting mechanism is matched with the extension block for use.
Adopt above-mentioned technical scheme for the device receives the influence of upper and lower collection seat at the in-process that uses and can advance line location to upper and lower collection seat, and the in-process that uses simultaneously is because not fixed connection between lower collection seat and the base, and after the encapsulation was accomplished, the semiconductor integrated board can be quick withdraw from, thereby the operator of being convenient for takes out the integrated board, and the in-process that uses simultaneously receives fixture's influence and can also carry out a preliminary location to the packaging in-process, thereby be convenient for encapsulate.
Further, the lower part of the lower collecting plate seat is fixedly connected with the connecting block, the connecting block is connected with the guide block through the telescopic spring, the guide block is hollow, and the induction blocks are symmetrically arranged inside the guide block.
By adopting the technical scheme, when the integrated board is placed on the lower integrated board seat, the integrated board can be automatically retracted under the influence of weight so as to start packaging.
Furthermore, the guide block is used with the guide way cooperation, and the guide block is connected with the telescopic link to the central line of guide block and the central line of guide way coincide each other, and the internal diameter of guide way is greater than the external diameter of guide block simultaneously, is provided with the stopper in the guide way moreover.
By adopting the technical scheme, the lower collecting plate seat can move back and forth along the base conveniently.
Further, hold up mechanism and lower header seat swing joint, and the bracket mechanism is the quadrangle structural design to hold up the mechanism surface and adopt flexible antistatic material preparation to form, the effect that the height that holds up the mechanism simultaneously received the telescopic link can be adjusted.
By adopting the technical scheme, the integrated board is convenient to support under the effect of the supporting mechanism, so that the integrated board and the die are convenient to mount and dismount.
Furthermore, the horizontal side of the supporting mechanism is provided with an extension groove, a positioning block is fixedly connected in the extension groove, the central line of the positioning block and the central line of the extension block coincide with each other, and the extension block is a hollow block.
By adopting the technical scheme, the extension block can be positioned and guided.
Furthermore, the extension block is matched with the extension groove for use, the center line of the extension block is overlapped with the center line of the extension groove, the extension block is designed in an L-shaped structure, and meanwhile, the protruding part of the extension block and the supporting mechanism are located on the same horizontal line.
By adopting the technical scheme, the size of the extension plate can be adjusted, so that the intercommunicated integrated plates can be supported and placed conveniently.
Compared with the prior art, the utility model has the beneficial effects that: the semiconductor packaging device for integrated circuit production is influenced by the upper and lower collecting seats in the using process, so that the upper and lower collecting seats can be quickly positioned, meanwhile, the lower collecting seat is not fixedly connected with the base in the using process, after the packaging is finished, the semiconductor integrated board can be quickly withdrawn, so that an operator can conveniently take out the integrated board, and simultaneously, the influence of the clamping mechanism in the using process can also be used for preliminarily positioning in the packaging process, so that the packaging is convenient;
1. the supporting mechanism is provided with the extending groove and the extending block, so that the effective acting area of the supporting mechanism can be adjusted within a certain range according to actual requirements under the action of the extending groove and the extending block, thereby facilitating the supporting and placing of different integrated boards and further increasing the application range of the device;
2. be provided with guide block and guide way, under the mating reaction of guide way and guide block for the device can receive the effect of telescopic link to carry out the back-and-forth movement under the in-process manifold base that uses, thereby be convenient for take out the manifold plate that encapsulates, increased the portability of device.
Drawings
FIG. 1 is a schematic view of the main sectional structure of the present invention;
FIG. 2 is a schematic top view of the lower plate assembly of the present invention;
FIG. 3 is an enlarged view of the structure at A in FIG. 1 according to the present invention;
fig. 4 is a schematic view of an extension block mounting structure of the present invention.
In the figure: 1. a body; 2. a base; 3. an upper plate collecting seat; 4. a lower header base; 5. a clamping mechanism; 6. connecting grooves; 7. a lifting mechanism; 8. connecting blocks; 9. an induction block; 10. a limiting block; 11. a guide block; 12. a guide groove; 13. positioning blocks; 14. an extension groove; 15. an extension block.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a semiconductor packaging device for integrated circuit production comprises a body 1, wherein the body 1 is placed above a bracket, a base 2 is arranged above the body 1, a lower board collecting seat 4 is arranged above the base 2, and a connecting groove 6 is arranged in the lower board collecting seat 4, so that the device can package an upper board collecting plate and a lower board collecting plate under the influence of the upper board collecting seat 3 and the lower board collecting seat 4 in the using process;
specifically, as shown in fig. 1-3, an upper board collecting seat 3 is installed above a lower board collecting seat 4, the upper board collecting seat 3 is connected with an upper board collecting plate, a transmission belt is installed above a higher-level board seat, a guide block 11 is used in cooperation with a guide groove 12, the guide block 11 is connected with a telescopic rod, the center line of the guide block 11 is coincident with the center line of the guide groove 12, the inner diameter of the guide groove 12 is larger than the outer diameter of the guide block 11, a limit block 10 is arranged in the guide groove 12, the integrated board can be clamped under the influence of weight induction in the using process, a clamping mechanism 5 is connected with the telescopic rod, the clamping mechanism 5 is installed above the lower board collecting seat 4, a connecting block 8 is installed below the clamping mechanism 5, the lower board collecting seat 4 is fixedly connected with the connecting block 8, and the connecting block 8 is connected with the guide block 11 through a telescopic spring, the guide block 11 is hollow, and the induction blocks 9 are symmetrically arranged inside the guide block 11, so that the integrated board can be jacked up under the action of the supporting mechanism 7 during packaging, and the packaging is facilitated;
specifically, as shown in fig. 2 and 4, the supporting mechanism 7 is installed in the lower collecting plate seat 4, the supporting mechanism 7 is connected with the lower collecting plate seat 4 by a telescopic rod, the surface of the supporting mechanism 7 is made of an antistatic material, the supporting mechanism 7 is used in cooperation with the extension block 15, the supporting mechanism 7 is movably connected with the lower collecting plate seat 4, the bracket mechanism is in a quadrilateral structure design, the surface of the supporting mechanism 7 is made of a flexible antistatic material, the height of the supporting mechanism 7 can be adjusted by the action of the telescopic rod, the horizontal plane of the supporting mechanism 7 is provided with the extension groove 14, the extension groove 14 is internally and fixedly connected with the positioning block 13, the central line of the positioning block 13 is coincident with the central line of the extension block 15, the extension block 15 is a hollow block, the extension block 15 is used in cooperation with the extension groove 14, and the central line of the extension block 15 is coincident with the central line of the extension groove 14, and the extension block 15 is designed to be in an L-shaped structure, and the protruding part of the extension block 15 is positioned at the same horizontal line with the lifting mechanism 7, so that the packaging of the integrated board is facilitated.
The working principle is as follows: when the semiconductor packaging device for producing the integrated circuit is used, the device is firstly placed at a proper position, an upper integrated board is placed in an upper integrated board seat 3, a lower integrated board seat 4 can be pushed out under the action of a telescopic rod in the process of mounting the lower integrated board, so that the lower integrated board can be conveniently placed in the lower integrated board seat 4, when the lower integrated board seat 4 is placed, the lower integrated board seat 4 can move downwards due to the self weight of an integrated board body 1, a sensing block 9 senses the lower integrated board seat, the telescopic rod is recycled, a lifting mechanism 7 supports the integrated board in the packaging process, a clamping mechanism 5 clamps the integrated board under the action of the telescopic rod, the phenomenon of position deviation in the packaging process is prevented, the processing accuracy of the lower integrated board seat is effectively guaranteed, and the lower integrated board seat 4 pops up after the packaging is completed, thereby being convenient for taking out the integrated plate after the processing is finished.
To thereby carry out a series of tasks, the contents of which are not described in detail in the present specification are prior art well known to those skilled in the art.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the utility model can be made, and equivalents and modifications of some features of the utility model can be made without departing from the spirit and scope of the utility model.
Claims (6)
1. A semiconductor packaging device for integrated circuit production, characterized in that: comprises the following steps of;
the body is placed above the bracket, the base is arranged above the body, the lower plate collecting seat is arranged above the base, and the connecting groove is formed in the lower plate collecting seat;
the upper plate collecting seat is arranged above the lower plate collecting seat, is connected with the upper plate collecting, and is provided with a transmission belt above the upper plate collecting seat;
the clamping mechanism is connected with the telescopic rod, is arranged above the lower plate collecting seat and is provided with a connecting block below;
the supporting mechanism is arranged in the lower collecting plate seat, the telescopic rod is adopted to be connected with the lower collecting plate seat before the supporting mechanism is arranged, the surface of the supporting mechanism is made of an anti-static material, and the supporting mechanism is matched with the extension block for use.
2. A semiconductor package device for integrated circuit fabrication as recited in claim 1, wherein: the lower end of the lower collecting plate seat is fixedly connected with the connecting block, the connecting block is connected with the guide block through the telescopic spring, the guide block is hollow, and the induction blocks are symmetrically arranged inside the guide block.
3. A semiconductor package device for integrated circuit fabrication as recited in claim 2, wherein: the guide block is used with the guide way cooperation, and the guide block is connected with the telescopic link to the central line of guide block and the central line of guide way coincide each other, and the internal diameter of guide way is greater than the external diameter of guide block simultaneously, is provided with the stopper in the guide way moreover.
4. A semiconductor package device for integrated circuit fabrication as recited in claim 1, wherein: the supporting mechanism is movably connected with the lower collecting plate seat, the bracket mechanism is in a quadrilateral structure design, the surface of the supporting mechanism is made of flexible anti-static materials, and the height of the supporting mechanism can be adjusted under the action of the telescopic rod.
5. The semiconductor package device for integrated circuit fabrication as recited in claim 4, wherein: the horizontal side of the supporting mechanism is provided with an extension groove, a positioning block is fixedly connected in the extension groove, the central line of the positioning block and the central line of the extension block coincide with each other, and the extension block is a hollow block.
6. The semiconductor package device for integrated circuit fabrication as recited in claim 5, wherein: the extension block is matched with the extension groove for use, the center line of the extension block is overlapped with that of the extension groove, the extension block is designed in an L-shaped structure, and meanwhile, the protruding part of the extension block and the supporting mechanism are located on the same horizontal line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121878611.8U CN215815790U (en) | 2021-08-12 | 2021-08-12 | Semiconductor packaging device for integrated circuit production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121878611.8U CN215815790U (en) | 2021-08-12 | 2021-08-12 | Semiconductor packaging device for integrated circuit production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215815790U true CN215815790U (en) | 2022-02-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121878611.8U Active CN215815790U (en) | 2021-08-12 | 2021-08-12 | Semiconductor packaging device for integrated circuit production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215815790U (en) |
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2021
- 2021-08-12 CN CN202121878611.8U patent/CN215815790U/en active Active
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