CN215496673U

CN215496673U - Chip jointing device with aligning and bonding assembly

Info

Publication number: CN215496673U
Application number: CN202121753949.0U
Authority: CN
Inventors: 朱彩萍; 朱赞纯
Original assignee: Shenzhen Ruierkai Technology Co ltd
Current assignee: Shenzhen Ruierkai Technology Co ltd
Priority date: 2021-07-30
Filing date: 2021-07-30
Publication date: 2022-01-11
Anticipated expiration: 2031-07-30

Abstract

The utility model relates to the technical field of chip jointing devices, and discloses a chip jointing device with an alignment bonding assembly, which comprises a bonding machine and a bonding seat arranged at the lower end of the bonding machine, wherein a bonding component is arranged at the lower end of the bonding machine, a placing groove is formed in the upper end of the bonding seat, an air groove is formed in the inner cavity of the bonding seat, a clamping rod penetrates through one side of the inner cavity wall of the air groove, an air pipe is arranged on the outer surface of the bonding seat, one end of the air pipe is connected with the bottom surface of the air groove, the other end of the air pipe is connected with the bonding machine, a first reset spring is sleeved on the outer surface of the clamping rod, a first telescopic groove is formed in the inner cavity wall of the placing groove, one end of the first reset spring is inserted into the first telescopic groove, the pressure of the inner cavity of the air groove is increased, so that four groups of clamping rods can simultaneously extend out to clamp a chip, and the chip can be aligned with the bonding component, and the bonding component can conveniently bond the chip.

Description

Chip jointing device with aligning and bonding assembly

Technical Field

The utility model relates to the technical field of chip bonding devices, in particular to a chip bonding device with an alignment bonding assembly.

Background

The chip is an integrated circuit or microcircuit, and a gold wire can be bonded and connected with the chip through a bonding machine in the chip manufacturing process, so that a miniaturized circuit is formed.

When present chip need bond, the chip is placed in centre gripping inslot cavity, and the centre gripping arm that centre gripping inslot cavity both sides set up carries out the centre gripping to the chip through motor drive centre gripping arm mostly, but in the centre gripping in-process, motor drive structure can only realize two-way or realize the three-dimensional centre gripping through more complex construction, makes the alignment bonding improve the complexity of centre gripping.

The problems described above are addressed. To this end, a chip bonding apparatus with an aligned bond assembly is proposed.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a chip jointing device with an alignment bonding assembly, when a chip needs to be bonded, the chip is placed in an inner cavity of a placing groove, gas in an external gas source enters the inner cavity of an air groove through an air pipe, the pressure of the inner cavity of the air groove is increased, four groups of clamping rods can simultaneously extend out to clamp the chip, so that the chip can be aligned with a bonding component, the bonding component is convenient to bond the chip, and the problems in the background art are solved.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a chip jointing device with aim at bonding subassembly, is provided with the bonding seat including bonding machine and bonding machine lower extreme, and the bonding machine lower extreme is provided with the bonding part, the standing groove has been seted up to bonding seat upper end, and the gas tank has been seted up to bonding seat inner chamber, and gas tank inner chamber wall one side is run through and is provided with the supporting rod, and bonding seat surface is provided with the trachea, and trachea one end links to each other with the gas tank bottom surface, and the trachea other end links to each other with the bonding machine.

Preferably, the outer surface of the clamping rod is sleeved with a first return spring, a first telescopic groove is formed in the wall of the inner cavity of the placing groove, and one end of the first return spring is inserted into the first telescopic groove.

Preferably, the inner cavity of the clamping rod is provided with a second telescopic groove, the inner cavity of the second telescopic groove is provided with a second return spring, and one end of the second return spring is provided with a retraction plate.

Preferably, the lower end of one side of the clamping rod is provided with a groove, and the inner cavity wall of the groove is penetrated by the retraction plate.

Preferably, the upper end of the retraction plate is provided with a connecting rod, the other end of the connecting rod is provided with a movable plate, and the surface of the movable plate is provided with an inclined plane groove.

Preferably, the upper end of the inner cavity wall of the groove is provided with a lower pressing rod, the upper end of the outer surface of the lower pressing rod is provided with a limiting rod, and the tail end of the limiting rod is inserted into the inclined plane groove.

Preferably, the retraction plate and the hold-down bar are members made of a rubber material.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the chip jointing device with the alignment bonding assembly, when the chip needs to be bonded, the chip is placed in the inner cavity of the placing groove, gas in an external gas source enters the inner cavity of the gas groove through the gas pipe, the pressure of the inner cavity of the gas groove is increased, four groups of clamping rods can simultaneously extend out to clamp the chip, and therefore the chip can be aligned to the bonding component, and the bonding component can conveniently bond the chip.

2. The utility model provides a chip jointing device with an alignment bonding assembly, wherein when four groups of clamping rods position and clamp a chip, a retraction plate retracts towards one side, the retraction plate retracts and drives a connecting rod arranged at the upper end, a moving plate arranged at one side of the connecting rod moves towards one side, an inclined groove formed in the surface of the moving plate can enable a limiting rod to move downwards, and when the limiting rod moves downwards, a pressing rod can press down the surface of the chip, so that the clamping rods can press down and fix the chip while clamping.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of a bonding base structure according to the present invention;

FIG. 3 is a front internal view of a bonding pad according to the present invention;

fig. 4 is an enlarged schematic view of a portion a in fig. 3 according to the present invention.

In the figure: 1. a bonding machine; 11. a bonding member; 2. a bonding seat; 21. a placement groove; 22. a first telescopic slot; 23. a clamping rod; 231. a first return spring; 232. a second telescopic slot; 233. a retraction plate; 234. a second return spring; 235. a connecting rod; 236. moving the plate; 237. an inclined plane groove; 238. a lower pressure lever; 239. a limiting rod; 24. a groove; 25. an air tank; 3. the trachea.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, a chip bonding apparatus with an alignment bonding assembly includes a bonding machine 1 and a bonding base 2 disposed at a lower end of the bonding machine 1, and a bonding component 11 disposed at a lower end of the bonding machine 1.

Referring to fig. 2-3, a placing groove 21 is formed at the upper end of the bonding base 2, an air groove 25 is formed in the inner cavity of the bonding base 2, a clamping rod 23 penetrates through one side of the inner cavity wall of the air groove 25, an air pipe 3 is arranged on the outer surface of the bonding base 2, one end of the air pipe 3 is connected with the bottom surface of the air groove 25, the other end of the air pipe 3 is connected with the bonding machine 1, a first return spring 231 is sleeved on the outer surface of the clamping rod 23, a first telescopic groove 22 is formed in the inner cavity wall of the placing groove 21, one end of the first return spring 231 is inserted into the first telescopic groove 22, when the chip needs to be bonded, the chip is placed in the inner cavity of the placing groove 21, the gas in the external gas source enters the inner cavity of the gas groove 25 through the gas pipe 3, the pressure intensity of the inner cavity of the gas groove 25 is increased, so that the four groups of clamping rods 23 can simultaneously extend out, the chip is clamped so that the chip can be aligned with the bonding component 11, and the bonding component 11 is convenient for bonding the chip.

Referring to fig. 3-4, a second retractable groove 232 is formed in an inner cavity of the clamping rod 23, a second return spring 234 is disposed in an inner cavity of the second retractable groove 232, a retraction plate 233 is disposed at one end of the second return spring 234, a groove 24 is formed at a lower end of one side of the clamping rod 23, a wall of the inner cavity of the groove 24 is penetrated by the retraction plate 233, a link 235 is disposed at an upper end of the retraction plate 233, a moving plate 236 is disposed at the other end of the link 235, a slope groove 237 is formed on a surface of the moving plate 236, a lower pressing rod 238 is disposed at an upper end of the wall of the inner cavity of the groove 24, a limit rod 239 is disposed at an upper end of the outer surface of the lower pressing rod 238, the retraction plate 233 and the lower pressing rod 238 are members made of a rubber material, the retraction plate 233 retracts to one side while the four groups of clamping rods 23 position and clamp the chip, the retraction plate 233 drives the link 235 disposed at the upper end while retracting plate 235 moves to one side, the inclined groove 237 formed on the surface of the moving plate 236 enables the limit rod 239 to move downwards, and the downward pressing rod 238 can press down the surface of the chip while the limit rod 239 moves downwards, so that the chip can be pressed and fixed while the clamping rod 23 clamps the chip.

The working principle is as follows: when the chip needs to be bonded, the chip is placed in the inner cavity of the placing groove 21, gas in an external gas source enters the inner cavity of the gas groove 25 through the gas pipe 3, the pressure of the inner cavity of the gas groove 25 is increased to enable the four groups of clamping rods 23 to simultaneously extend out to clamp the chip, so that the chip can be aligned to the bonding part 11, the bonding part 11 is convenient to bond the chip, when the four groups of clamping rods 23 position and clamp the chip, the retraction plate 233 retracts towards one side and simultaneously drives the connecting rod 235 arranged at the upper end, the moving plate 236 arranged at one side of the connecting rod 235 moves towards one side, the inclined plane groove 237 formed in the surface of the moving plate 236 can enable the limiting rod 239 to move downwards, and when the limiting rod 239 moves downwards, the lower pressing rod 238 can press down on the surface of the chip.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A chip jointing device with an alignment bonding assembly comprises a bonding machine (1) and a bonding seat (2) arranged at the lower end of the bonding machine (1), wherein a bonding part (11) is arranged at the lower end of the bonding machine (1), and is characterized in that: the bonding seat is characterized in that a placing groove (21) is formed in the upper end of the bonding seat (2), an air groove (25) is formed in the inner cavity of the bonding seat (2), a clamping rod (23) penetrates through one side of the wall of the inner cavity of the air groove (25), an air pipe (3) is arranged on the outer surface of the bonding seat (2), one end of the air pipe (3) is connected with the bottom surface of the air groove (25), and the other end of the air pipe (3) is connected with the bonding machine (1).

2. The die bonding apparatus with aligned bond assembly of claim 1, wherein: the outer surface of the clamping rod (23) is sleeved with a first return spring (231), a first telescopic groove (22) is formed in the inner cavity wall of the placing groove (21), and one end of the first return spring (231) is inserted into the first telescopic groove (22).

3. The die bonding apparatus with aligned bond assembly of claim 2, wherein: the inner cavity of the clamping rod (23) is provided with a second telescopic groove (232), the inner cavity of the second telescopic groove (232) is provided with a second return spring (234), and one end of the second return spring (234) is provided with a retraction plate (233).

4. The die bonding apparatus with aligned bond assembly of claim 3, wherein: the lower end of one side of the clamping rod (23) is provided with a groove (24), and the inner cavity wall of the groove (24) is penetrated by a retraction plate (233).

5. The die bonding apparatus with aligned bond assembly of claim 4, wherein: the upper end of the retraction plate (233) is provided with a connecting rod (235), the other end of the connecting rod (235) is provided with a moving plate (236), and the surface of the moving plate (236) is provided with an inclined plane groove (237).

6. The die bonding apparatus with aligned bond assembly of claim 5, wherein: the upper end of the inner cavity wall of the groove (24) is provided with a lower pressure rod (238), the upper end of the outer surface of the lower pressure rod (238) is provided with a limit rod (239), and the tail end of the limit rod (239) is inserted into the inclined plane groove (237).

7. The die bonding apparatus with aligned bond assembly of claim 6, wherein: the retraction plate (233) and the lower press bar (238) are members made of a rubber material.