CN215812912U - Semiconductor aging test frame body - Google Patents
Semiconductor aging test frame body Download PDFInfo
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- CN215812912U CN215812912U CN202122054490.1U CN202122054490U CN215812912U CN 215812912 U CN215812912 U CN 215812912U CN 202122054490 U CN202122054490 U CN 202122054490U CN 215812912 U CN215812912 U CN 215812912U
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
Abstract
The application relates to a semiconductor aging test frame body which comprises a first mounting frame, wherein the first mounting frame is vertically arranged in a cabinet body and divides the cabinet body into a first temperature area for accommodating an aging test board and a second temperature area for accommodating a test core board; a plurality of windows and a plurality of horizontal through plates are arranged on the first mounting frame from top to bottom, one end of each through plate is used for butting the test core plate, and the other end of each through plate penetrates through the window and is used for butting the aging test plate; an air inlet and an air outlet are formed between the two adjacent through plates and on the side wall of the first mounting frame, and a first heater is arranged in a space formed by the two adjacent through plates. The method and the device can solve the problem that in the related technology, when high-temperature testing is carried out, the high temperature of the aging area can flee to the service area, and the operation of the service area is influenced; when a low temperature test is performed, a problem of dew condensation occurs in a service area.
Description
Technical Field
The application relates to the technical field of high and low temperature aging tests of semiconductor integrated circuits, in particular to a semiconductor aging test frame body.
Background
The semiconductor memory has certain failure probability, the relation between the failure probability and the use times accords with the characteristic of a bathtub curve, the failure probability of the memory is high when the semiconductor memory is used, the failure probability is greatly reduced after the semiconductor memory is used for a certain number of times, and the failure probability of the memory is increased until the semiconductor memory is close to or reaches the service life of the semiconductor memory. To date, no memory manufacturer has struggled to ignore the failure problem of semiconductor memories, and generally has accelerated the occurrence of memory failure probability by a burn-in Test (TDBI) and has directly entered the product stability period to solve the problem.
The general scheme of the chip semiconductor aging test is to supply a power supply signal and a test signal to a tested chip semiconductor, and continuously work the tested chip semiconductor for a set time at high and low temperatures or normal temperature, wherein the process is called aging (burn-in), so that the failure of a semiconductor memory is accelerated, and a good product is screened out. Because of the wide variety of chip semiconductors, wide application, large quantity, high performance and wide working temperature range, an aging test system with flexible capacity, good expandability, wide temperature range, rich functions, high architecture reliability and high cost performance is required to meet the practical application.
In the related art, the burn-in test cabinet has two temperature zones, wherein the burn-in test board is placed in the burn-in zone to perform high and low temperature tests on the chip semiconductor, the high and low temperatures are usually-10 ℃ to 150 ℃, and the test core board is placed in the service zone and needs to be kept at a normal temperature state. The inventor researches and discovers that the method still has a plurality of defects, such as: when high-temperature test is carried out, the high temperature of the aging area can flee to the service area, and the operation of the service area is influenced; when a low temperature test is performed, condensation may be generated in a service area.
Disclosure of Invention
The embodiment of the application provides a semiconductor aging test frame body, which aims to solve the problem that in the related technology, when high-temperature test is carried out, the high temperature of an aging area can flee to a service area, and the operation of the service area is influenced; when a low temperature test is performed, a problem of dew condensation occurs in a service area.
The embodiment of the application provides a semiconductor aging test support body, it includes:
the first mounting frame is vertically arranged in the cabinet body and divides the cabinet body into a first temperature zone for accommodating the aging test board and a second temperature zone for accommodating the test core board; wherein the content of the first and second substances,
a plurality of windows and a plurality of horizontal through plates are arranged on the first mounting frame from top to bottom, one end of each through plate is used for butting the test core plate, and the other end of each through plate penetrates through the window and is used for butting the aging test plate;
an air inlet and an air outlet are formed between the two adjacent through plates and on the side wall of the first mounting frame, and a first heater is arranged in a space formed by the two adjacent through plates.
In some embodiments, the first mounting frame includes a first plate and two second plates arranged opposite to each other at an interval, one end of each of the two second plates is fixed on the same wall surface of the first plate, the first plate is located between the first temperature zone and the second plate, and the window is located on the first plate;
one of the two second plates is provided with the air inlet, and the other second plate is provided with the air outlet.
In some embodiments, a plurality of first guide grooves are formed in the two second plates from top to bottom, and two ends of the through plate are movably connected to the first guide grooves of the two second plates respectively.
In some embodiments, a wall surface of the first plate close to the first temperature zone is provided with a first mounting hole;
the straight-through plate is provided with a mounting strip, and the mounting strip is positioned on the end face of the straight-through plate opposite to the second plate;
the tail end of the mounting bar extends towards the second plate on the side where the mounting bar is located to form an extending portion, a second mounting hole is formed in the extending portion, the aperture of the second mounting hole is larger than that of the first mounting hole, and a first fastener penetrates through the second mounting hole and is in threaded connection with the first mounting hole, so that the through plate is fixed on the first plate.
In some embodiments, a fixing frame is detachably mounted on the wall surface of the first plate close to the first temperature zone, a small back plate is detachably arranged on the fixing frame, and the through plate is butted with the small back plate to connect the burn-in test plate; wherein the content of the first and second substances,
a third mounting hole is formed in the fixing frame;
and a fourth mounting hole is formed in the small back plate, the aperture of the third mounting hole is not smaller than that of the fourth mounting hole, and a second fastener is screwed in the fourth mounting hole and can penetrate through the third mounting hole to abut against the first plate.
In some embodiments, the second board further has a plurality of first positioning pins and fifth mounting holes, the first positioning pins correspond to the positioning holes on the large back plate for positioning, and the fifth mounting holes are used for fixing the large back plate, wherein the large back plate is used for butting the through board to connect the through board to the test core board.
In some embodiments, the first heater is in the form of a band and is laid around or S-shaped on the through-plate.
In some embodiments, the power line of the first heater is routed through the air inlet or the air outlet.
In some embodiments, a plurality of first limit blocks are arranged on the through plate, and an accommodating space for accommodating the first heater is formed between the first limit blocks and the through plate;
the first heater is fixed on the through plate through the first limiting block.
In some embodiments, the first stopper is L-shaped or U-shaped.
The beneficial effect that technical scheme that this application provided brought includes:
the embodiment of the application provides a semiconductor aging test frame body, wherein an air inlet and an air outlet are respectively connected with an air inlet pipeline and an air outlet pipeline, and when a high-temperature test is carried out, dry gas is input through the air inlet pipeline and the air inlet, so that hot gas diffused from a first temperature zone to a first mounting frame is taken away, and the influence on the operation of a service area due to the fact that the hot gas enters a second temperature zone is prevented; when the low-temperature test is carried out, the heater is started, so that the temperature of the first mounting frame area is improved, the cold air of the first temperature area is prevented from entering the second temperature area, and condensation in the service area is avoided.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic view of an aging test cabinet according to an embodiment of the present disclosure;
FIG. 2 is a schematic view of another perspective view of a burn-in test cabinet according to an embodiment of the present disclosure;
FIG. 3 is a schematic layout view of a first mounting frame and a burn-in board according to an embodiment of the present disclosure;
fig. 4 is a schematic view of a first mounting frame according to an embodiment of the present application;
FIG. 5 is a schematic view of a second perspective of the first mount provided in an embodiment of the present application;
FIG. 6 is a schematic view of a first mounting bracket provided in an embodiment of the present application with a through plate mounted thereon;
FIG. 7 is a schematic view of a first heater installation provided by an embodiment of the present application;
fig. 8 is a schematic view of a third perspective view of the first mounting frame according to the embodiment of the present application;
FIG. 9 is a partial schematic view of FIG. 8 at A;
fig. 10 is a partial schematic view of fig. 8 at B.
In the figure: 1. a cabinet body; 2. a first mounting bracket; 20. a window; 21. a through plate; 210. mounting a bar; 211. a second mounting hole; 212. a first fastener; 213. a first stopper; 22. an air inlet; 23. an air outlet; 24. a first heater; 25. a first plate; 250. a first mounting hole; 26. a second plate; 260. a first guide groove; 261. a first positioning pin; 262. a fifth mounting hole; 27. a third plate; 3. an aging test board; 30. a fixing frame; 31. a small back plate; 310. a fourth mounting hole; 311. a second fastener; 313. a sixth mounting hole; 4. and testing the core board.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, 2, 3, 4, and 5, an embodiment of the present disclosure provides a semiconductor aging test rack, where the aging test rack includes a rack body 1, the rack body includes a first mounting rack 2, the first mounting rack 2 is vertically assembled in the rack body 1, and divides the rack body 1 into two temperature zones, where the first temperature zone is used to accommodate an aging test board 3, the second temperature zone is used to accommodate a test core board 4, the first mounting rack 2 is provided with a plurality of windows 20 and a plurality of through boards 21 arranged horizontally from top to bottom, one through board 21 corresponds to one window 20, one end of each through board 21 is used to butt-joint the test core board 4, and the other end of each through board passes through the window 20 and is used to butt-joint the aging test board 3; an air inlet 22 and an air outlet 23 are arranged between two adjacent through plates 21 and on the side wall of the first mounting frame 2, and a first heater 24 is arranged in a space formed by the two adjacent through plates 21.
In the embodiment, the air inlet 22 and the air outlet 23 are respectively connected to an air inlet pipeline and an air outlet pipeline, and when a high-temperature test is performed, dry gas (such as air and the like) is input through the air inlet pipeline via the air inlet 22, so that hot gas diffused from the first temperature region to the first mounting frame 2 is taken away, and the influence on the operation of a service area due to the fact that the hot gas enters the second temperature region is prevented; when the low temperature test is performed, the first heater 24 is turned on, so that the temperature of the area of the first mounting frame 2 is increased, the cold air of the first temperature area is prevented from entering the second temperature area, and the condensation in the service area is avoided.
Referring to fig. 4 and 5, in some preferred embodiments, the first mounting frame 2 includes a first plate 25 and two second plates 26 arranged opposite to and spaced apart from each other, one end of each of the two second plates 26 is fixed on the same wall of the first plate 25, the first plate 25 is located between the first temperature zone and the second plate 26, the window 20 is located on the first plate 25, and the first plate 25 and the second plates 26 are assembled together, so that the first mounting frame is convenient to manufacture, low in cost, light in weight, and convenient to transport and transfer; one of the two second plates 26 has the air inlet 22, and the other second plate 26 has the air outlet 23, and for convenience of management, all the air inlets 22 are formed in one of the second plates 26, and all the air outlets 23 are formed in the other second plate 26.
Referring to fig. 5, 6 and 7, in some preferred embodiments, a plurality of first guide grooves 260 are formed in the two second plates 26 from top to bottom, the first guide grooves 260 of the two second plates 26 correspond to each other one by one, and both ends of the straight plate 21 are movably connected to the first guide grooves 260 of the two second plates 26, respectively, so that the straight plate 21 can be easily inserted and removed through the first guide grooves 260.
Alternatively, rollers may be provided at both ends of the through plate 21, and the rollers roll in the first guide groove 260, which has smaller frictional resistance than the sliding manner. It is of course also possible to provide rollers in the first guide groove 260, on which the ends of the through-plate 21 roll.
Alternatively, the guide groove structure may be disposed on the through plate 21, and the second plate 26 is disposed with a guide rail, so that the through plate 21 can be inserted and pulled out through the cooperation of the guide groove structure and the guide rail.
Referring to fig. 7, 8 and 9, in some preferred embodiments, a first mounting hole 250 is formed in a wall surface of the first plate 25 close to the first temperature zone, a mounting bar 210 is arranged on the through plate 21, the mounting bar 210 is located on an end surface of the through plate 21 opposite to the second plate 26, and the mounting bar 210 can slide in the first guide groove 260 to realize insertion and extraction of the through plate 21; the tail end of the mounting bar 210 extends towards the second plate 26 on the side of the mounting bar 210 to form an extending part, a second mounting hole 211 is formed in the extending part, the aperture of the second mounting hole 211 is larger than that of the first mounting hole 250, and the first fastener 212 penetrates through the second mounting hole 211 and is screwed on the first mounting hole 250, so that the through plate 21 is fixed on the first plate 25.
When the installation is carried out, the through plate 21 slides into the corresponding first guide groove 260 through the corresponding window 20 and the mounting bars 210 at the two ends along the direction from the first temperature zone to the second temperature zone until the second mounting hole 211 is aligned with the corresponding first mounting hole 250, the first fastener 212 can pass through the second mounting hole 211 and then is screwed on the first mounting hole 250, and the end of the first fastener 212 is tightly attached or abutted to the extending part, so that the through plate 21 is fixed on the first plate 25; because the through plate 21 is in butt joint with the large back plate and is connected with the test core plate 4 through the large back plate, when the through plate 21 needs to be pulled out of the large back plate, the first fastener 212 is firstly taken down, then the screw rod matched with the second mounting hole 211 is used and is screwed on the second mounting hole 211, the screw rod is matched with the second mounting hole 211, the diameter of the screw rod is larger than the diameter of the first mounting hole 250, the screw rod can be abutted against the first plate 25, and in the process of screwing the screw rod, the through plate 21 is driven to move towards the first temperature region, so that the purpose of pulling the through plate 21 is realized, because of the existence of parts such as the aging test plate 3, the operation space is small, and compared with the direct pulling, the method is labor-saving and convenient to operate.
Referring to fig. 5, the second plate 26 is further provided with a plurality of first positioning pins 261 and fifth mounting holes 262, the first positioning pins 261 correspond to positioning holes on the large back plate, so that the large back plate can be positioned when being mounted on the second plate 26, and the fifth mounting holes 262 are used for fixing the large back plate, wherein the large back plate is used for butting the through plate 21, so that the through plate 21 is connected with the test core plate 4.
Referring to fig. 8 and 10, in some preferred embodiments, a fixing frame 30 is detachably mounted on the wall surface of the first plate 25 close to the first temperature range, for example, by screws, a small back plate 31 is detachably disposed on the fixing frame 30, specifically, a sixth mounting hole 313 is disposed on the small back plate 31, the small back plate 31 is fixed on the fixing frame 30 by the sixth mounting hole 313 and adapted screws, and the through plate 21 is abutted with the small back plate 31 to connect the burn-in board 3; wherein, the fixing frame 30 is provided with a third mounting hole (not shown in the figure), the backboard 31 is provided with a fourth mounting hole 310, the fourth mounting hole 310 is opposite to the third mounting hole, the aperture of the third mounting hole is not smaller than the aperture of the fourth mounting hole 310, and the second fastening member 311 is screwed in the fourth mounting hole 310 and can pass through the third mounting hole to abut against the first plate 25.
When the backboard 31 needs to be detached from the through plate 21, the screws between the fixing frame 30 and the first plate 25 are firstly detached, the second fastening piece 311 is screwed on the fourth mounting hole 310, the second fastening piece 311 is screwed, because the aperture of the third mounting hole is not smaller than that of the fourth mounting hole 310, the second fastening piece 311 can pass through the third mounting hole and abut against the first plate 25, and in the process of screwing the second fastening piece 311, the fixing frame 30 is driven to drive the backboard 31 to move towards the first temperature zone, so that the purpose of pulling the backboard 31 is realized, because of the existence of parts such as the aging test board 3, the operation space is narrow, compared with the direct pulling by hand, the mode is labor-saving and the operation is convenient.
Referring to fig. 7, in some preferred embodiments, the first heater 24 is in a band shape and is circumferentially or S-shaped laid on the through plate 21 so that the first heater 24 covers the through plate 21 as much as possible, in order to effectively enlarge the heating area and ensure uniform heating. Preferably, the first heater 24 is detachably laid on the through plate 21.
In some preferred embodiments, the power cord of the first heater 24 is routed through the air inlet 22 or the air outlet 23, and additional perforations are avoided by utilizing existing vent routing.
Referring to fig. 7, in some preferred embodiments, a plurality of first stoppers 213 are disposed on the through plate 21, an accommodating space for accommodating the first heater 24 is formed between the first stoppers 213 and the through plate 21, the first heater 24 is fixed on the through plate 21 by the first stoppers 213, and the first stoppers 213 are L-shaped or U-shaped.
Referring to fig. 5, a plurality of third plates 27 are further provided between the first plate 25 and the two second plates 26 to structurally reinforce the first mount 2, the third plates 27 being spaced apart from each other from top to bottom. Meanwhile, the test core board 4 is made to be as large as possible between the adjacent two third boards 27, and for the adjacent two third boards 27, if the test core board 4 is not present, the insulating material is filled between the two third boards 27.
In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
It is noted that, in the present application, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The utility model provides a semiconductor aging testing support body which characterized in that, it includes:
the first mounting frame (2) is vertically assembled in the cabinet body (1) and divides the cabinet body (1) into a first temperature zone for accommodating the aging test board (3) and a second temperature zone for accommodating the test core board (4); wherein the content of the first and second substances,
a plurality of windows (20) and a plurality of through plates (21) which are horizontally arranged are arranged on the first mounting frame (2) from top to bottom, one end of each through plate (21) is used for butting the test core plate (4), and the other end of each through plate passes through the window (20) and is used for butting the aging test plate (3);
an air inlet (22) and an air outlet (23) are formed between the two adjacent through plates (21) and on the side wall of the first mounting frame (2), and a first heater (24) is arranged in a space formed by the two adjacent through plates (21).
2. The semiconductor burn-in test rack of claim 1, wherein:
the first mounting frame (2) comprises a first plate (25) and two second plates (26) which are opposite and arranged at intervals, one ends of the two second plates (26) are fixed on the same wall surface of the first plate (25), the first plate (25) is located between the first temperature zone and the second plates (26), and the window (20) is located on the first plate (25);
one of the two second plates (26) is provided with the air inlet (22), and the other second plate (26) is provided with the air outlet (23).
3. The semiconductor burn-in test rack of claim 2, wherein:
a plurality of first guide grooves (260) are formed in the two second plates (26) from top to bottom, and two ends of the through plate (21) are movably connected to the first guide grooves (260) of the two second plates (26) respectively.
4. The semiconductor burn-in test rack of claim 2, wherein:
a first mounting hole (250) is formed in the wall surface, close to the first temperature zone, of the first plate (25);
a mounting strip (210) is arranged on the through plate (21), and the mounting strip (210) is positioned on the end surface of the through plate (21) opposite to the second plate (26);
the tail end of the mounting bar (210) extends towards the second plate (26) on the side where the mounting bar (210) is located to form an extending portion, a second mounting hole (211) is formed in the extending portion, the aperture of the second mounting hole (211) is larger than that of the first mounting hole (250), and a first fastener (212) penetrates through the second mounting hole (211) and is in threaded connection with the first mounting hole (250), so that the through plate (21) is fixed on the first plate (25).
5. The semiconductor burn-in test rack of claim 2, wherein:
a fixed frame (30) is detachably mounted on the wall surface of the first plate (25) close to the first temperature area, a small back plate (31) is detachably arranged on the fixed frame (30), and the through plate (21) is butted with the small back plate (31) to be connected with the aging test plate (3); wherein the content of the first and second substances,
a third mounting hole is formed in the fixing frame (30);
the small back plate (31) is provided with a fourth mounting hole (310), the aperture of the third mounting hole is not smaller than that of the fourth mounting hole (310), and a second fastener (311) is screwed in the fourth mounting hole (310) and can penetrate through the third mounting hole to abut against the first plate (25).
6. The semiconductor burn-in test rack of claim 2, wherein:
still be equipped with a plurality of first locating pin (261) and fifth mounting hole (262) on second board (26), locating pin (261) correspond with the locating hole on the big backplate to fix a position, fifth mounting hole (262) are used for fixing big backplate, wherein, big backplate is used for butt joint through-plate (21), so that through-plate (21) are connected with test core plate (4).
7. The semiconductor burn-in test rack of claim 1, wherein:
the first heater (24) is in a strip shape and is laid on the through plate (21) in a surrounding manner or in an S shape.
8. The semiconductor burn-in test rack of claim 7, wherein:
the power line of the first heater (24) is routed through the air inlet (22) or the air outlet (23).
9. The semiconductor burn-in test rack of claim 7, wherein:
a plurality of first limiting blocks (213) are arranged on the through plate (21), and an accommodating space for accommodating the first heater (24) is formed between the first limiting blocks (213) and the through plate (21);
the first heater (24) is fixed on the through plate (21) through the first limiting block (213).
10. The semiconductor burn-in test rack of claim 9, wherein:
the first limiting block (213) is L-shaped or U-shaped.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121359818 | 2021-06-18 | ||
| CN2021213598184 | 2021-06-18 |
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|---|---|
| CN215812912U true CN215812912U (en) | 2022-02-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122044138.XU Active CN215812910U (en) | 2021-06-18 | 2021-08-27 | Frame body that ageing testing board used |
| CN202122058614.3U Active CN215812914U (en) | 2021-06-18 | 2021-08-27 | Aging testing cabinet and rack structure thereof |
| CN202111000529.XA Pending CN113835014A (en) | 2021-06-18 | 2021-08-27 | Automatic plugging and unplugging equipment |
| CN202122054490.1U Active CN215812912U (en) | 2021-06-18 | 2021-08-27 | Semiconductor aging test frame body |
| CN202122058612.4U Active CN215728313U (en) | 2021-06-18 | 2021-08-27 | Board card plug-pull mechanism and aging test cabinet |
| CN202122054489.9U Active CN215813167U (en) | 2021-06-18 | 2021-08-27 | Board card plugging mechanism of semiconductor test equipment |
| CN202122058615.8U Active CN215813109U (en) | 2021-06-18 | 2021-08-27 | Aging test cabinet |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122044138.XU Active CN215812910U (en) | 2021-06-18 | 2021-08-27 | Frame body that ageing testing board used |
| CN202122058614.3U Active CN215812914U (en) | 2021-06-18 | 2021-08-27 | Aging testing cabinet and rack structure thereof |
| CN202111000529.XA Pending CN113835014A (en) | 2021-06-18 | 2021-08-27 | Automatic plugging and unplugging equipment |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122058612.4U Active CN215728313U (en) | 2021-06-18 | 2021-08-27 | Board card plug-pull mechanism and aging test cabinet |
| CN202122054489.9U Active CN215813167U (en) | 2021-06-18 | 2021-08-27 | Board card plugging mechanism of semiconductor test equipment |
| CN202122058615.8U Active CN215813109U (en) | 2021-06-18 | 2021-08-27 | Aging test cabinet |
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| JP3786325B2 (en) * | 1997-12-02 | 2006-06-14 | エスペック株式会社 | Connector attachment / detachment device |
| JP5179041B2 (en) * | 2006-10-24 | 2013-04-10 | 日本エンジニアリング株式会社 | Object moving device |
| KR100929219B1 (en) * | 2007-02-09 | 2009-12-01 | 주식회사 씨어테크 | Board detachable device |
| CN105098565B (en) * | 2015-08-14 | 2017-04-05 | 京东方科技集团股份有限公司 | Grafting tool and realize display floater and adapter autopatching method |
| CN211626860U (en) * | 2020-03-09 | 2020-10-02 | 深圳市奥宇达电子有限公司 | Crystal oscillator detection jig convenient to operate |
| CN112068016A (en) * | 2020-10-12 | 2020-12-11 | 东莞阿李自动化股份有限公司 | Self-plugging type capacity grading cabinet |
| CN215812910U (en) * | 2021-06-18 | 2022-02-11 | 武汉精鸿电子技术有限公司 | Frame body that ageing testing board used |
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2021
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Also Published As
| Publication number | Publication date |
|---|---|
| CN215812910U (en) | 2022-02-11 |
| CN113835014A (en) | 2021-12-24 |
| CN215813109U (en) | 2022-02-11 |
| CN215812914U (en) | 2022-02-11 |
| CN215813167U (en) | 2022-02-11 |
| CN215728313U (en) | 2022-02-01 |
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