CN215799990U - Electroplating bath capable of maintaining pH value balance - Google Patents
Electroplating bath capable of maintaining pH value balance Download PDFInfo
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- CN215799990U CN215799990U CN202121586248.2U CN202121586248U CN215799990U CN 215799990 U CN215799990 U CN 215799990U CN 202121586248 U CN202121586248 U CN 202121586248U CN 215799990 U CN215799990 U CN 215799990U
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- cathode
- palladium
- electroplating
- anode
- flying
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- 238000009713 electroplating Methods 0.000 title claims abstract description 97
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 148
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 74
- 238000007747 plating Methods 0.000 claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims description 5
- 239000012528 membrane Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 28
- 238000000034 method Methods 0.000 abstract description 25
- 229910052759 nickel Inorganic materials 0.000 abstract description 14
- 239000000126 substance Substances 0.000 abstract description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 6
- 239000001257 hydrogen Substances 0.000 abstract description 6
- 229910052739 hydrogen Inorganic materials 0.000 abstract description 6
- 239000002253 acid Substances 0.000 abstract description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 5
- 239000001301 oxygen Substances 0.000 abstract description 5
- 229910052760 oxygen Inorganic materials 0.000 abstract description 5
- 210000005056 cell body Anatomy 0.000 description 14
- 238000009434 installation Methods 0.000 description 8
- 230000033001 locomotion Effects 0.000 description 4
- 210000004027 cell Anatomy 0.000 description 3
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 229910001453 nickel ion Inorganic materials 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model provides an electroplating bath for maintaining pH value balance, and belongs to the technical field of electroplating equipment. An electroplating bath for maintaining pH balance comprises a bath body, an anode copper bar group and a cathode palladium flying group; according to the utility model, the anode copper bar group with the anode piece and the cathode palladium flying with the cathode piece are arranged on the tank body with the electroplating cavity, the area of the cathode piece is larger than that of the corresponding anode piece, and the area ratio range of the cathode piece to the anode piece is 3:2-2:1, so that oxygen precipitated from the anode and hydrogen precipitated from the cathode can be basically kept in balance, the pH value balance of an electroplating solution is maintained, the problems that the pH value of the electroplating solution needs to be constantly monitored and acid substances need to be added for multiple times to adjust the pH value in the electroplating process are avoided, the operation is simple, the work load is lighter, in addition, the edge of the cathode piece is arranged outside the anode piece in an oblique opposite state, the problem that the plating layer at the edge grows too large due to the current edge effect is avoided, the product quality is ensured, and the subsequent utilization of a nickel plating process is facilitated.
Description
Technical Field
The utility model relates to the technical field of electroplating equipment, in particular to an electroplating bath for maintaining pH value balance.
Background
Nickel plating is a common electroplating process, and a nickel-containing plating layer can be plated on a substrate to be plated, so as to improve chemical properties such as corrosion resistance of related products.
The nickel plating process takes nickel-containing resources such as nickel rods and the like as anodes, and takes a substrate to be plated as a cathode to be electrolyzed in an electroplating solution containing nickel salt, and a uniform and compact nickel plating layer is deposited on the substrate to be plated as the cathode. However, in order to maintain the pH of the plating solution within a desired range in the actual plating process, it is necessary to constantly monitor the pH change of the plating solution, which is a troublesome operation process and heavy workload. In addition, during the electroplating process, a small amount of oxygen is also separated out while nickel ions are generated by the anode during the reaction, while a small amount of hydrogen is also separated out while nickel ions are reduced to nickel by the cathode during the reaction, and in order to ensure that the cathode can be completely covered by the anode, the area of the anode is larger than the volume of the cathode, so that more hydrogen is separated out, the pH value of the electroplating solution is increased, an operator needs to frequently add acid substances such as sulfuric acid during the electroplating process, so as to maintain the pH value of the electroplating solution within the electroplating requirement range, further complicating the operation process, and increasing the work load of the operator. In addition, due to the current edge effect, the plating layer deposited on the cathode grows too much at the edge of the cathode, which affects the quality of the product and is not beneficial to the subsequent utilization of the nickel plating process.
Disclosure of Invention
Aiming at the problems in the prior art, the present invention aims to provide an electroplating bath for maintaining a pH balance, wherein the area ratio of a cathode piece to an anode piece is set to be 3:2-2:1, so that the area of the cathode piece is larger than that of the anode piece, oxygen separated from an anode and hydrogen separated from a cathode can be kept in balance, the pH balance of an electroplating solution is maintained, the problems that the pH of the electroplating solution needs to be constantly monitored and acidic substances need to be frequently added in the electroplating process are solved, the operation process is simplified, the work load of an operator is reduced, in addition, the edge of the cathode is positioned outside the anode, the current edge effect is avoided, the problem that a plating layer at the edge of the cathode grows too large is prevented, the product quality is ensured, and the subsequent utilization of a nickel plating process is facilitated.
The specific technical scheme is as follows:
a plating cell for maintaining pH balance, characterized by comprising:
the device comprises a tank body, a first electrode and a second electrode, wherein the tank body is provided with an electroplating cavity with an upper opening;
the anode copper bar group is arranged at the upper opening of the electroplating cavity and is provided with a plurality of anode pieces which extend into the electroplating cavity and are arranged at intervals along one direction;
the cathode flying palladium is arranged on an upper opening of the electroplating cavity, a cathode flying palladium is arranged between every two adjacent anode pieces, and each cathode flying palladium is provided with a cathode piece which extends into the electroplating cavity and is positioned between every two adjacent anode pieces;
the area ratio of the cathode member to the anode member ranges from 3:2 to 2: 1.
The electroplating bath for maintaining the pH balance is characterized in that the area ratio of the cathode piece to the anode piece is 7: 4.
The electroplating bath for maintaining the pH value balance further comprises a plurality of groups of palladium flying seats, one group of palladium flying seats corresponds to one cathode palladium flying seat, one group of palladium flying seats comprises two palladium flying seats, the two palladium flying seats in the same group are respectively arranged on two sides of the upper opening of the electroplating cavity and correspond to each other, and two ends of the cathode palladium flying seats are respectively arranged on the two palladium flying seats in the same group.
The electroplating bath for maintaining the pH value balance further comprises a support frame, the support frame is of a frame structure, the support frame is arranged above the upper opening of the electroplating cavity in a surrounding mode, and the palladium flying seats are arranged on the support frame.
The electroplating bath for maintaining the pH value balance further comprises a sliding frame, the sliding frame is of a frame structure and is arranged above the upper opening of the electroplating cavity in a surrounding mode, the sliding frame is arranged on the bath body in a sliding mode and moves in the horizontal plane along the arrangement direction perpendicular to the anode pieces, and the supporting frame is installed on the sliding frame.
The electroplating bath for maintaining the pH value balance is characterized in that a plurality of supporting pulleys are arranged between the sliding frame and the bath body, the supporting pulleys are uniformly arranged at two ends of an upper opening of an electroplating cavity of the bath body, the axial direction of each supporting pulley is consistent with the arrangement direction of the anode pieces, and the bottom of the sliding frame is slidably arranged on the supporting pulleys.
In the electroplating bath for maintaining the pH balance, the support frame is a conductive structure, and an insulating pad is arranged between the support frame and the sliding frame.
The electroplating bath for maintaining the pH value balance is characterized in that a lifting driver is arranged between the support frame and the bath body, the lifting driver is vertically arranged, a main body of the lifting driver is fixedly arranged on the bath body, and the lifting driver is located below the support frame and is connected to the support frame through a driving shaft.
In the electroplating bath for maintaining the pH balance, the anode member is a titanium basket, and the cathode member is a metal plate substrate.
In the electroplating bath for maintaining the pH balance, a membrane is attached to the surface of the cathode opposite to the anode, and a plurality of growth holes are formed in the membrane.
The positive effects of the technical scheme are as follows:
according to the electroplating bath for maintaining the pH value balance, the area of the cathode piece is larger than that of the anode piece, the area ratio of the cathode piece to the anode piece is controlled to be 3:2-2:1, oxygen precipitated from the anode and hydrogen precipitated from the cathode can be basically maintained in balance in the electroplating process, so that the pH value balance of an electroplating solution is maintained, and the problems that the pH value of the electroplating solution needs to be monitored constantly and acid substances need to be added for multiple times to adjust the pH value in the electroplating process are solved.
Drawings
FIG. 1 is a block diagram of an embodiment of an electroplating cell of the present invention that maintains pH balance;
fig. 2 is a schematic view of the assembly of the cathode member and the anode member in accordance with a preferred embodiment of the present invention.
In the drawings: 1. a trough body; 11. an electroplating chamber; 2. an anode copper bar group; 21. an anode member; 3. cathode palladium flying; 31. a cathode member; 311. a diaphragm; 3111. a growing hole; 4. a palladium flying base; 5. a support frame; 6. a sliding frame; 7. a support pulley; 8. an insulating pad.
Detailed Description
In order to make the technical means, the creation features, the achievement purposes and the effects of the present invention easy to understand, the following embodiments specifically describe the technical solutions provided by the present invention with reference to fig. 1 to 2, but the following contents are not to be taken as limitations of the present invention.
FIG. 1 is a block diagram of an embodiment of an electroplating cell of the present invention that maintains pH balance; fig. 2 is a schematic view of the assembly of the cathode member and the anode member in accordance with a preferred embodiment of the present invention. As shown in fig. 1 and fig. 2, the plating tank for maintaining pH balance provided in this embodiment includes: the device comprises a tank body 1, an anode copper bar group 2, cathode flying palladium 3, an anode piece 21 arranged on the anode copper bar group 2 and a cathode piece 31 arranged on the cathode flying palladium 3.
Specifically, cell body 1 is the cuboid structure, and cell body 1 has one and takes upper portion open-ended electroplating chamber 11, adds electroplating solution to electroplating chamber 11 through the upper portion opening in, has also made things convenient for operating personnel to arrange negative pole piece 31 and positive pole piece 21 in electroplating chamber 11 simultaneously, and structural design is more reasonable.
Specifically, anode copper bar group 2 sets up in the upper portion opening part of electroplating chamber 11, anode copper bar group 2 is located electroplating chamber 11's top promptly, and, be provided with a plurality of anode pieces 21 that stretch into in electroplating chamber 11 on anode copper bar group 2, a plurality of anode pieces 21 that stretch into in electroplating chamber 11 promptly support installation and subsequent electrically conductive through anode copper bar group 2, and, a plurality of anode pieces 21 are arranged along a direction interval on the anode copper bar, arrange more anode pieces 21 in limited electroplating chamber 11 space, the interval between anode pieces 21 comes to provide the condition for arranging of follow-up cathode piece 31 in electroplating chamber 11 simultaneously.
Specifically, a plurality of cathode flying palladium 3 are arranged on the upper opening of the electroplating cavity 11, and the cathode flying palladium 3 and the anode copper bar group 2 have a height difference in the vertical direction, so that the cathode flying palladium 3 and the anode copper bar group 2 are conveniently separated from each other. And, in vertical direction, all be provided with a cathode between two adjacent anode pieces 21 and fly palladium 3, simultaneously, each cathode flies to all be provided with on the palladium 3 and stretches into and electroplate the chamber 11 and be located the cathode piece 31 between two adjacent anode pieces 21, cathode piece 31 flies palladium 3 through the cathode and supports and install on electroplating chamber 11 promptly, and fly palladium 3 through the cathode and carry out electrically conductive to cathode piece 31, and also make the both sides of each cathode piece 31 all have corresponding anode piece 21, better satisfy the electroplating process demand, structural design is more reasonable.
Specifically, the area ratio of the cathode member 31 to the anode member 21 is in the range of 3:2-2:1, so that the area of the cathode member 31 is larger than that of the anode member 21, and the edge of the cathode member 31 extends out of the anode member 21, so that the oxygen gas separated out from the anode and the hydrogen gas separated out from the cathode can be basically kept in balance in the electroplating process, thereby maintaining the balance of the pH value of the electroplating solution, avoiding the problems that the pH value of the electroplating solution needs to be monitored constantly and acid substances need to be added for multiple times to adjust the pH value in the electroplating process, reducing the operation steps, being more convenient to operate and lightening the work load of an operator. In addition, when the edge of the cathode member 31 is outside the anode member 21, the edge of the cathode member 31 is in an oblique state with the anode member 21, so that the problem that the plating layer grown on the edge of the cathode member 31 is excessively grown due to the current edge effect is avoided, the product quality is ensured, and the subsequent utilization of the nickel plating process is facilitated.
More specifically, the area ratio of the cathode member 31 to the anode member 21 is 7:4, so that the pH balance condition can be better met in the electroplating process, meanwhile, the waste problem caused by the overlarge cathode member 31 is avoided, and the structural design is more reasonable.
More specifically, still be provided with a plurality of groups on the cell body 1 and fly palladium seat 4, and a set of palladium seat 4 that flies corresponds a negative pole and flies palladium 3, and each negative pole flies palladium 3 and all has a corresponding a set of palladium seat 4 to support it promptly, satisfies the negative pole and flies the demand that palladium 3 stably installed. In addition, each group of the palladium flying seats 4 includes two palladium flying seats 4, and the two palladium flying seats 4 in the same group are respectively arranged on two sides of the upper opening of the electroplating cavity 11 and correspond to each other, so that conditions are provided for positioning and supporting two ends of a cathode palladium flying 3 by the two palladium flying seats 4 in the same group. When the two ends of the cathode flying palladium 3 are respectively arranged on the two flying palladium seats 4 in the same group, at the moment, the flying palladium seats 4 are provided with upper grooves, the end heads of the cathode flying palladium 3 are arranged in the upper grooves of the flying palladium seats 4, the detachable connection of the cathode flying palladium 3 and the flying palladium seats 4 is realized, the taking of the cathode piece 31 on the subsequent cathode flying palladium 3 is convenient, meanwhile, the accurate positioning is also carried out on the position of the cathode flying palladium 3 arranged on the electroplating cavity 11, and the installation is more convenient.
More specifically, the upper portion open-ended top of cell body 1 still is provided with support frame 5, at this moment, support frame 5 is frame construction, the shape of the cell body 1 of cuboid has been adapted to, simultaneously, support frame 5 encloses the upper portion open-ended top of locating electroplating chamber 11, upper portion open-ended for electroplating chamber 11 leaves enough big space, the installation that has made things convenient for follow-up negative pole to fly palladium 3 and negative pole piece 31, and, it all sets up on support frame 5 to fly palladium seat 4, fly palladium seat 4 with a plurality of groups promptly and connect into an overall structure through support frame 5, the stability of flying palladium seat 4 installation has been guaranteed, and follow-up negative pole through flying palladium seat 4 installation flies the unity of palladium 3 action, thereby the uniformity of the product of same batch has been guaranteed.
More specifically, the sliding frame 6 is further arranged on the tank body 1, and at the moment, the sliding frame is of a frame structure and is arranged above the upper opening of the electroplating cavity 11 in a surrounding manner, so that the problem that the sliding frame 6 blocks the upper opening of the electroplating cavity 11 is avoided, and conditions are provided for the installation of the subsequent cathode flying palladium 3 and the cathode piece 31. And, the sliding frame 6 is slidably disposed on the tank body 1 and moves in the horizontal plane along the arrangement direction perpendicular to the plurality of anode pieces 21, and the support frame 5 is mounted on the sliding frame 6, that is, the sliding frame 6 can be used as a connection structure between the support frame 5 and the tank body 1, and the sliding frame 6 can drive the support frame 5 to move on the tank body 1, so that the movement of the cathode palladium flying 3 on the palladium flying seat 4 mounted on the support frame 5 is realized, the cathode piece 31 on the cathode palladium flying 3 can move in the electroplating cavity 11 relative to the anode pieces 21, and conditions are provided for meeting different electroplating requirements. It is worth pointing out that, be provided with flexible driver between frame 6 and the cell body 1, flexible driver can be for linear actuator such as cylinder, electric jar and pneumatic cylinder to install the cylinder body of flexible driver on the cell body 1, the telescopic shaft of flexible driver is installed on frame 6 slides, and telescopic motion through flexible driver drives frame 6 slides on cell body 1, thereby drives cathode piece 31 and removes in electroplating chamber 11, satisfies different electroplating demands.
More specifically, be provided with a plurality of supporting pulley 7 between frame 6 and the cell body 1 that slides, and, a plurality of supporting pulley 7 evenly set up in the open-ended both ends in upper portion of the electroplating chamber 11 of cell body 1, and simultaneously, the axial of supporting pulley 7 is unanimous with a plurality of anode 21's the direction of arranging, it is perpendicular to make supporting pulley 7's the direction of arranging of a plurality of anode 21, make supporting pulley 7's the direction of rolling unanimous with the moving direction of frame 6 that slides, and, the bottom cunning of frame 6 that slides is located on supporting pulley 7, for the removal of frame 6 that slides on cell body 1 of frame through supporting pulley 7 provides the direction promptly, and also reduced friction loss, structural design is more reasonable.
More specifically, the support frame 5 is a conductive structure, and the palladium flying base 4 and the cathode palladium flying base 3 form a conductive whole through the support frame 5, so as to meet the conductive requirements of the cathode members 31. And, be provided with insulating pad 8 between support frame 5 and the frame 6 that slides, prevented support frame 5 and conducted to the cell body 1 through the frame 6 that slides and the safety risk that exists, the safety guarantee nature is higher.
In addition, except that above-mentioned installation that sets up the frame 6 that slides and realize supporting frame 5 supports, still provide another kind and install the structure that supports supporting frame 5 through the lift driver, this moment, be provided with the lift driver between supporting frame 5 and the cell body 1, and the lift driver is vertical to be arranged and its main part fixed mounting on cell body 1, the lift driver is located the below of supporting frame 5 and its drive shaft connection on supporting frame 5, make and to drive supporting frame 5 through the lift driver and carry out elevating movement on vertical direction, thereby make the negative pole piece 31 that flies on palladium seat 4 installation of flying on the supporting frame 5 negative pole flies palladium 3 can carry out elevating movement in electroplating chamber 11, thereby made things convenient for the operator to lay and taken negative pole piece 31, conveniently take out the product that electroplates, structural design is more reasonable. It is worth pointing out that the drive shaft of the lifting drive is also insulated from the support frame 5, which also improves safety.
More specifically, the anode member 21 is a titanium basket, and the cathode member 31 is a metal plate, so that the basic requirements of the nickel electroplating process are met, and conditions are provided for ensuring the normal operation of the electroplating process.
More specifically, a layer of diaphragm 311 is attached to the surface of the cathode 31 facing the anode 21, that is, a layer of diaphragm 311 covers the surface of the metal plate serving as the cathode 31 corresponding to the anode 21, and the diaphragm 311 is provided with a plurality of growth holes 3111, that is, only the growth holes 3111 left by the diaphragm 311 on the cathode 31 are plated, so that the requirement of producing the cake-shaped nickel material is met, and the structural design is more reasonable.
The electroplating bath for maintaining the pH balance provided in this embodiment includes a bath body 1, an anode copper bar group 2, and a cathode palladium 3; by arranging the anode copper bar group 2 and the cathode flying palladium 3 on the tank body 1 with the electroplating cavity 11, arranging a plurality of anode pieces 21 extending into the electroplating cavity 11 on the anode copper bar group 2, arranging a plurality of cathode pieces 31 extending into the electroplating cavity 11 on the cathode flying palladium 3, wherein the area of each cathode piece 31 is larger than that of the corresponding anode piece 21, and the area ratio range of the cathode pieces and the anode pieces is 3:2-2:1, the oxygen precipitated from the anode and the hydrogen precipitated from the cathode can be basically balanced in the electroplating process, so that the pH value balance of the electroplating solution is maintained, the problems that the pH value of the electroplating solution needs to be monitored constantly and acid substances need to be added for multiple times to adjust the pH value in the electroplating process are solved, the operation steps are simple, the work burden of an operator is effectively relieved, in addition, the edge of each cathode piece 31 is arranged outside the anode piece 21 and in an oblique state, the problem of overlarge growth of the plating layer at the edge due to the current edge effect is avoided, the product quality is ensured, and the subsequent utilization of a nickel plating process is facilitated.
While the utility model has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the utility model.
Claims (10)
1. A plating cell for maintaining pH balance, comprising:
the device comprises a tank body, a first electrode and a second electrode, wherein the tank body is provided with an electroplating cavity with an upper opening;
the anode copper bar group is arranged at an upper opening of the electroplating cavity and is provided with a plurality of anode pieces which stretch into the electroplating cavity and are arranged at intervals along one direction;
the plurality of cathode flying palladium are arranged on an upper opening of the electroplating cavity, one cathode flying palladium is arranged between every two adjacent anode pieces, and each cathode flying palladium is provided with a cathode piece which extends into the electroplating cavity and is positioned between every two adjacent anode pieces;
the area ratio of the cathode member to the anode member ranges between 3:2 and 2: 1.
2. The plating cell of claim 1, wherein the cathode member and the anode member have an area ratio of 7: 4.
3. The plating tank for maintaining pH balance as claimed in claim 1, further comprising a plurality of groups of palladium flying bases, wherein one group of palladium flying bases corresponds to one cathode palladium flying base, one group of palladium flying bases comprises two palladium flying bases, the two palladium flying bases in the same group are respectively disposed on two sides of the upper opening of the plating chamber and correspond to each other, and two ends of the cathode palladium flying bases are respectively mounted on the two palladium flying bases in the same group.
4. The electroplating bath for maintaining the pH balance as claimed in claim 3, further comprising a support frame, wherein the support frame is a frame structure, the support frame is enclosed above the upper opening of the electroplating chamber, and the palladium flying seats are all arranged on the support frame.
5. The plating tank for maintaining the pH balance as claimed in claim 4, further comprising a sliding frame, wherein the sliding frame is of a frame structure and is arranged above the upper opening of the plating chamber, the sliding frame is arranged on the tank body in a sliding manner and moves in a horizontal plane along a direction perpendicular to the arrangement direction of the anode pieces, and the support frame is arranged on the sliding frame.
6. The electroplating bath for maintaining the pH value balance as claimed in claim 5, wherein a plurality of supporting pulleys are arranged between the sliding frame and the bath body, the supporting pulleys are uniformly arranged at two ends of an upper opening of the electroplating cavity of the bath body, the axial direction of the supporting pulleys is consistent with the arrangement direction of the anode pieces, and the bottom of the sliding frame is slidably arranged on the supporting pulleys.
7. The plating bath for maintaining pH balance as claimed in claim 5 or 6, wherein the support frame is a conductive structure, and an insulating pad is disposed between the support frame and the sliding frame.
8. The plating bath for maintaining the pH balance as claimed in claim 4, wherein a lifting driver is disposed between the support frame and the bath body, the lifting driver is vertically disposed and a main body of the lifting driver is fixedly mounted on the bath body, the lifting driver is located below the support frame and a driving shaft of the lifting driver is connected to the support frame.
9. The plating cell of claim 1, wherein the anode member is a titanium basket and the cathode member is a metal plate substrate.
10. The plating bath for maintaining pH balance of claim 1, wherein a membrane is attached to the surface of the cathode facing the anode, and the membrane has a plurality of elongated holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121586248.2U CN215799990U (en) | 2021-07-13 | 2021-07-13 | Electroplating bath capable of maintaining pH value balance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121586248.2U CN215799990U (en) | 2021-07-13 | 2021-07-13 | Electroplating bath capable of maintaining pH value balance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215799990U true CN215799990U (en) | 2022-02-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121586248.2U Active CN215799990U (en) | 2021-07-13 | 2021-07-13 | Electroplating bath capable of maintaining pH value balance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215799990U (en) |
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2021
- 2021-07-13 CN CN202121586248.2U patent/CN215799990U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A Electroplating Bath for Maintaining pH Balance Effective date of registration: 20231024 Granted publication date: 20220211 Pledgee: Zhejiang Tailong Commercial Bank Co.,Ltd. Ningbo Yuyao sub branch Pledgor: Ningbo Haiqiang Equipment Technology Co.,Ltd. Registration number: Y2023980062389 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20220211 Pledgee: Zhejiang Tailong Commercial Bank Co.,Ltd. Ningbo Yuyao sub branch Pledgor: Ningbo Haiqiang Equipment Technology Co.,Ltd. Registration number: Y2023980062389 |